CN207053619U - Image sensing module, camera module and mobile electronic terminal - Google Patents
Image sensing module, camera module and mobile electronic terminal Download PDFInfo
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- CN207053619U CN207053619U CN201720543787.5U CN201720543787U CN207053619U CN 207053619 U CN207053619 U CN 207053619U CN 201720543787 U CN201720543787 U CN 201720543787U CN 207053619 U CN207053619 U CN 207053619U
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- image sensing
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- filter
- sensing module
- filter unit
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Abstract
The utility model discloses a kind of image sensing module, camera module and mobile electronic terminal.Described image sensing module includes image sensing unit and filter unit, described image sensing unit is used to receive optical image signal in the first direction and the optical image signal is converted into electricity picture signal, the filter unit is used to carry out colour filter processing to the optical image signal of incidence along a first direction, wherein, the filter unit fits in described image sensing unit by adhesive layer.
Description
Technical field
It the utility model is related to camera technology field, more particularly to a kind of optical filtering technique being applied in camera technique.
Background technology
Camera (Camera) is also known as camera computer, computer eye etc., it as a kind of image or video input apparatus,
Widely applied to video conference, tele-medicine and monitoring etc. in real time.In recent years since, with the hair of Internet technology
Exhibition, the continuous improvement of network speed, along with the ripe of photosensitive imaging device technology and it is largely used in the manufacture of camera, leads to
Letter both sides can carry out image, the talk for having sound and communication by camera in network each other, in addition, people can also incite somebody to action
It is used for current various popular digital images, sound processing, and more and more important work is played in the live and work of people
With.
Current camera technology has been widely used in display device field of terminal, such as mobile phone, notebook and family expenses/
Business television field.With the increase of display device slimming demand, the slimming demand of camera is also urgently to be resolved hurrily at present
The problem of.
Utility model content
To solve aforementioned technical problem, the utility model provides a kind of image sensing module of slimming.
Further, there is provided a kind of camera module for including foregoing image sensing module.
Further, there is provided a kind of mobile electronic terminal for including foregoing camera module.
A kind of image sensing module, including image sensing unit and filter unit, described image sensing unit are used for along the
One direction receives optical image signal and the optical image signal is converted into electricity picture signal, and the filter unit is used
In the optical image signal progress colour filter processing to incidence along a first direction, wherein, the filter unit is pasted by adhesive layer
Together in described image sensing unit.
Further, the filter unit includes substrate and filter coating, and the substrate is smalt, and the substrate includes two
Individual relative surface, the filter coating are attached between one of surface of the substrate and the adhesive layer, the optical filtering
Film is used to filter out infrared ray and ultraviolet.
Further, the filter unit also includes antireflective coating, and the antireflective coating is arranged at another of substrate
Surface, for reducing the reflection to optical image signal.
Further, the sensing module also includes circuit substrate, and multiple conducting wires are provided with the circuit substrate,
Described image sensing unit is arranged in the circuit substrate, and the multiple input/output terminals of described image sensing unit pass through respectively
Multiple conductive pins are electrically connected with the conducting wire, and the multiple conductive pin is located at the side of described image sensing unit
Edge.
Further, the multiple conductive pin extends from surface of the described image sensing unit away from the circuit substrate
To the circuit substrate.
Further, the conductive pin receives the face of optical imagery relative to described image sensing unit in a first direction
With the first height, the filter unit receives optics in the first direction with adhesive layer relative to described image sensing unit
The face of image has the second height, and first height is more than or equal to the second height.
Further, the conductive pin is conductive gold thread.
A kind of camera module, it is characterised in that including foregoing image sensing module and lens assembly, the lens assembly edge
The first direction is arranged at the side of the filter unit, and has first between the filter unit and the lens assembly
Spacing.
Further, the camera module also includes driving module, and the driving module is used to drive the lens assembly
Move in a first direction, to adjust first spacing.
A kind of electronic apparatus, including foregoing camera module.
Compared to prior art, filter unit is attached directly to image sensing unit surface in image sensing module, namely
It is so that filter unit reduces with image sensing unit gap, so as to reach the slimming of image sensing module ripple.
Further, when image sensing module combines with lens assembly, it is only necessary to consider conductive pin in image sensing module
Size along a first direction, that is to say filter unit and image sensing unit and be not take up image sensing module along first
The size in direction, so as to effectively reduce the volume of camera module and size.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, is not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the dimensional decomposition structure diagram of camera module in the embodiment of the utility model one.
Fig. 2 is the top view of camera module shown in Fig. 1.
Fig. 3 is the cross-sectional view along III-III lines of camera module shown in Fig. 2.
Fig. 4 is the planar structure schematic diagram of image sensing module shown in Fig. 1.
Fig. 5 is cross-sectional view of the image sensing module along X-X lines shown in Fig. 4.
Fig. 6 is the decomposition texture schematic diagram of image sensing module shown in Fig. 4.
Fig. 7 is the cross-sectional view of filter unit shown in Fig. 5.
Fig. 8 is the planar structure schematic diagram of mobile terminal in the embodiment of the utility model one
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Also referring to Fig. 1-2, wherein, Fig. 1 is the dimensional decomposition structure of camera module in the embodiment of the utility model one
Schematic diagram, Fig. 2 are the top view of camera module shown in Fig. 1.
As shown in figure 1, camera module 10 includes lens assembly 11, drive component 12 and image sensing module 13.Wherein,
Lens assembly 11 is included along the incidence surface 111 and exiting surface 113 set perpendicular to first direction D, wherein, incidence surface 111 is used for
Light is obtained from first direction D, lens assembly 11 is emitted after handling the light of acquisition from exiting surface 113.Light
Optical imagery is formed from after the incidence of incidence surface 111 and is emitted from exiting surface 1113.It should be noted that camera module 10 also wraps
Housing (not shown) is included to be used to house the lens assembly 11, drive component 12 and image sensing module 13.Wherein, first party
It is the incident direction of light transmission to D.
Image sensing module 13 is arranged at the D along a first direction of lens assembly 11 side of exiting surface 113, and image sense
Survey module 13 and be spaced the first spacing (not indicating) with camera module 10.Image sensing module is used to be emitted received from lens assembly 11
Optical imagery, and optical imagery is converted into electricity picture signal, and by described image signal transacting for figure can be carried out
Display signal as shown in, and signal output will be shown.
Drive component 12 couples with lens assembly 11, for driving lens assembly 11 to be moved in a first direction on D, so as to adjust
The size of first spacing between whole lens assembly 11 and image sensing module 13.It that is to say that lens assembly 11 is used to adjust lens group
Focal length between part 11 and image sensing module 13.
Referring to Fig. 3, it is the cross-sectional view along III-III lines of camera module as shown in Figure 2.
As shown in figure 3, lens assembly 11 is with image sensing module 13, the distance stacking of interval first is set on D in a first direction
Put, drive component 12 engages with the part of lens assembly 11, so as to drive lens assembly 11 in a first direction on D relative to image sense
Survey module 13 to move, and then adjust the size of the first distance.
Specifically, lens assembly 11 includes multiple blooming pieces 110 being stacked and the fixed blooming piece 110
Diaphragm fixed mount 112, the blooming piece 110 are used to form optical picture after being handled from the incident light of incidence surface 111
Picture, and be emitted the optical imagery from exiting surface 113.Diaphragm fixed mount 112 is used to form accommodation space fixation simultaneously
House the multiple blooming piece 110 and be engaged with drive component 12.
Also referring to Fig. 4-6, wherein, Fig. 4 be image sensing module 13 as shown in Figure 1 planar structure schematic diagram, Fig. 5
Cross-sectional view of the module along X-X lines is sensed for Fig. 4 described images, Fig. 6 is the decomposition that Fig. 4 described images sense module
Structural representation.
As in Figure 3-5, image sensing module 13 includes circuit substrate 131, image sensing unit 133 and filter unit
135.Wherein, the filter unit 135, image have just surveyed unit 133 and circuit substrate 131 D are stacked gradually along a first direction
Set.Filter unit 135 is used for the non-visible portion for filtering out optical imagery, and image sensing unit 133 is used for optical imagery
The electric signal of corresponding optical imagery is converted to, for purposes of illustration only, the electric signal of optical imagery is subsequently referred to as electricity picture signal.
Wherein, image sensing unit 133 is fixed on the surface of circuit substrate 131, and filter unit 135 passes through transparent adhesive layer 134 (Fig. 5)
It is bonded in the surface of image sensing unit 133.
Specifically, referring to Fig. 7, it is the cross-sectional view of filter unit as shown in Figure 5.Filter unit 135 is used
In the reception optical imagery of lens assembly 11 from the first distance of interval, and optical filtering processing is carried out to the optical imagery, mainly
To filter out the non-visible portion in optical imagery, such as infrared ray and ultraviolet.
Specifically, filter unit 135 also includes substrate 1351, antireflective coating 1352 and filter coating 1353, wherein, subtract
Reflectance coating 1352 is respectively arranged on two relative surfaces in base 1351 with filter coating 1353.In the present embodiment, base
1351 be smalt, for filtration fraction infrared ray, and in transmission-cut-off transition region transmissivity T=50% wavelength for 650 ±
10nm, and this wavelength will not produce any movement because the angle of incidence of light of optical imagery changes, to obtain homogeneous color
Image.Antireflective coating 1352 is used to reducing reflection to optical image signal, filter coating 1353 be used to filtering out infrared ray with it is ultraviolet
Line.
Image sensing unit 133 includes relative sensing face 133a and stationary plane 133b, wherein, sensing face 133 is used to connect
Optical imagery is received, that is to say that sensing face 133a is set adjacent to filter unit 135;Stationary plane 133b is fixed on circuit base for abutting
On plate 131.Meanwhile corresponding sensing face 133a, in addition to image sensing area 133a and around being arranged at image sensing area 133a
Ports zone 133b.
Wherein, described image sensing area 133a is provided with multiple integrated Photosensing Units (not shown), the light sensing
Element is used to convert optical signals to electric signal, and thus, image sensing unit 133 will be passed through by multiple Photosensing Units to filter
Optical imagery after processing is converted to electricity picture signal.In the present embodiment, image sensing unit 133 is IC chip,
Such as image sensing chip, such as charge coupling device (Charge-coupled Device, CCD) and CMOS
Semiconductor devices (Complementary Metal-Oxide Semiconductor, CMOS).Image sensing unit 133 is whole
Body is rectangle.
It should be noted that image sensing unit 133 also includes multiple integrated circuits as Electric signal processing, such as count
Word processing device (DSP), compressed encoding processor, power circuit, circuit central processor (CPU), internal memory (RAM) and flash memory
(Flash) etc., the present embodiment is no longer described in detail.
It is preferred that the size of filter unit 135 and sensing area 133a size are essentially identical, and pass through adhesive layer 134
Directly it is bonded in the corresponding sensing area 133a surfaces of image sensing unit 133.In the present embodiment, adhesive layer 134 is transparent optics
Glue (Optically Clear Adhesive, OCA).Thus, filter unit 135 can be with the gapless of image sensing unit 133
Ground fitting is fixed, and is effectively reduced the optical imagery light losing after the optical filtering of filter unit 135 processing, is improved optical imagery
Light utilization.
As shown in figure 3, ports zone 133d is located at the peripheral position at image sensing area 133c edges, it is correspondingly arranged on multiple defeated
Enter/output end 1331.The ports zone 133d is around described image sensing area 133c.Refer to Fig. 4-5, the multiple input/
Integrated circuit in output end 1331 and image sensing unit 133 is electrically connected with, for from external reception driving power signal with
And output numeral or the electricity picture signal of simulation.The multiple input/output terminal 1331 is spaced a predetermined distance and mutually exhausted
Edge is uniformly distributed in the ports zone 133d of image sensing unit 133.
Circuit substrate 131 is provided with multiple conducting wire (not shown), and for carrying simultaneously still image sensing unit
133.Circuit substrate 131 also includes multiple conductive pins 1311, and the multiple conductive pin is used to image sense be electrically connected
The multiple input/output terminals 1331 and conducting wire surveyed in unit 133, wherein, the correspondence image sense of conductive pin position 1311
The position for surveying the ports zone 133b of unit 133 is electrically connected with multiple input/output terminals 1331.
Conductive pin 1311 extends to described from the ports zone 133d in the sensing face 133a of described image sensing unit 133
The surface of circuit substrate 131, and overall curved shape.In the present embodiment, conductive pin 1331 is conductive gold thread.
Specifically, as shown in figure 4, conductive pin 1331 in a first direction D relative to image sensing unit 133 sensing face
133a has the first height H1, the filter unit 135 and adhesive layer 134 in a first direction D relative to image sensing unit
There is 133 sensing face 133a the second height H2, the first height H1 to be more than or equal to the second height H2.In other words,
Conductive pin 1331 is relative to the height of circuit substrate 131 or equal to more than filter unit 135 and proposition sensing unit 133
Relative to the height of circuit substrate 131.
Thus, compared to prior art, due to directly being bonded between filter unit 135 and image sensing unit 133, not
Vacant gap be present so that the D in the first direction of image sensing module 13 size reduces to greatest extent.When image sensing mould
When group 13 combines with lens assembly 11, it is only necessary to consider the chi of the D in the first direction of conductive pin 1311 in image sensing module 13
It is very little, it that is to say filter unit 135 and image sensing unit 133 and be not take up the D in the first direction of image sensing module 13 chi
It is very little, so as to effectively reduce camera module 10 D volumes and size in the first direction.
It is preferred that when image sensing module 13 combines with lens assembly 11, if lens assembly 13 only corresponds to filter unit
135 position, and not face conductive pin 1311, then it can further reduce the D in the first direction of camera module 10 chi
It is very little.
Referring to Fig. 8, Fig. 8 is the planar structure schematic diagram of mobile electronic terminal 600 in the embodiment of the utility model one.Such as
Shown in Fig. 8, mobile electronic terminal 600 is provided with camera module 10 as shown in Figure 1.Wherein, the mobile electronic terminal 600 can
Think mobile phone, tablet personal computer, notebook computer etc..
Embodiments described above, the restriction to the technical scheme protection domain is not formed.It is any in above-mentioned implementation
Modifications, equivalent substitutions and improvements made within the spirit and principle of mode etc., should be included in the protection model of the technical scheme
Within enclosing.
Claims (10)
1. a kind of image sensing module, it is characterised in that including image sensing unit and filter unit, described image sensing unit
For receiving optical image signal in the first direction and the optical image signal being converted into electricity picture signal, the filter
Light unit is used to carry out colour filter processing to the optical image signal of incidence along a first direction, and the filter unit passes through viscous
Close layer and fit in described image sensing unit.
2. image sensing module according to claim 1, it is characterised in that the filter unit includes substrate with filtering
Film, the substrate are smalt, and the substrate includes two relative surfaces, and the filter coating is attached at the substrate wherein
Between one surface and the adhesive layer, the filter coating is used to filter out infrared ray and ultraviolet.
3. image sensing module according to claim 2, it is characterised in that the filter unit also includes antireflective coating,
The antireflective coating is arranged at another surface of substrate, for reducing the reflection to optical image signal.
4. image sensing module according to claim 1, it is characterised in that the sensing module also includes circuit substrate,
Multiple conducting wires are provided with the circuit substrate, described image sensing unit is arranged in the circuit substrate, the figure
The multiple input/output terminals of picture sensing unit are electrically connected with by multiple conductive pins and the conducting wire respectively, the multiple
Conductive pin is located at the edge of described image sensing unit.
5. image sensing module according to claim 4, it is characterised in that the multiple conductive pin is from described image sense
Survey surface of the unit away from the circuit substrate and extend to the circuit substrate.
6. image sensing module according to claim 5, it is characterised in that the conductive pin in a first direction relative to
The face that described image sensing unit receives optical imagery has the first height, and the filter unit is with adhesive layer in the first party
There is the second height to the face that optical imagery is received relative to described image sensing unit, first height is more than or equal to the
Two height.
7. image sensing module according to claim 4, it is characterised in that the conductive pin is conductive gold thread.
8. a kind of camera module, it is characterised in that including the image sensing module and mirror as described in claim 1-7 any one
Head assembly, the lens assembly are arranged at the side of the filter unit, and the filter unit and institute along the first direction
Stating between lens assembly has the first spacing.
9. camera module according to claim 8, it is characterised in that the camera module also includes driving module, described
Driving module is used to drive the lens assembly to move in a first direction, to adjust first spacing.
10. a kind of mobile electronic terminal, it is characterised in that including camera module as claimed in claim 9.
Priority Applications (1)
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CN201720543787.5U CN207053619U (en) | 2017-05-15 | 2017-05-15 | Image sensing module, camera module and mobile electronic terminal |
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CN201720543787.5U CN207053619U (en) | 2017-05-15 | 2017-05-15 | Image sensing module, camera module and mobile electronic terminal |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110213473A (en) * | 2019-07-08 | 2019-09-06 | Oppo(重庆)智能科技有限公司 | The production method of camera module, electronic device and camera module |
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2017
- 2017-05-15 CN CN201720543787.5U patent/CN207053619U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110213473A (en) * | 2019-07-08 | 2019-09-06 | Oppo(重庆)智能科技有限公司 | The production method of camera module, electronic device and camera module |
CN110213473B (en) * | 2019-07-08 | 2021-02-23 | Oppo(重庆)智能科技有限公司 | Camera module, electronic device and manufacturing method of camera module |
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CP03 | Change of name, title or address |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: 523860 No. 18 Wusha Haibin Road, Chang'an Town, Dongguan City, Guangdong Province Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180227 |
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CF01 | Termination of patent right due to non-payment of annual fee |