CN207050741U - A kind of gyroscope based on semi circular shells harmonic oscillator - Google Patents
A kind of gyroscope based on semi circular shells harmonic oscillator Download PDFInfo
- Publication number
- CN207050741U CN207050741U CN201721025251.0U CN201721025251U CN207050741U CN 207050741 U CN207050741 U CN 207050741U CN 201721025251 U CN201721025251 U CN 201721025251U CN 207050741 U CN207050741 U CN 207050741U
- Authority
- CN
- China
- Prior art keywords
- harmonic oscillator
- semi
- cavity plate
- silicon substrate
- ring cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 33
- 239000010703 silicon Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 30
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 16
- 239000010432 diamond Substances 0.000 claims abstract description 16
- 230000004888 barrier function Effects 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 20
- 238000005516 engineering process Methods 0.000 abstract description 17
- 238000005530 etching Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 7
- 238000005336 cracking Methods 0.000 abstract description 6
- 230000010355 oscillation Effects 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000010408 film Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007511 glassblowing Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010892 electric spark Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Gyroscopes (AREA)
Abstract
The utility model discloses the gyroscope based on semi circular shells harmonic oscillator.Bottom electrode, insulating barrier, silicon substrate, harmonic oscillator, pedestal, electrod-array are provided with gyroscope；Pedestal is connected with the anchor end of harmonic oscillator, and electric signal is connected to the bottom electrode at the back side；Silicon substrate and pedestal form semi-ring cavity plate；Silicon substrate around harmonic oscillator top is adulterated by local ion, forms ring-type electrode array；The back side of silicon substrate is provided with the release aperture of annular array；Insulating barrier position is between silicon substrate and bottom electrode.The utility model introduces diamond simultaneously by using the design of harmonic oscillator, reduces the resonant frequency and cracking frequency of the antinode mode of oscillation of structure four, die-away time and quality factor is improved, so as to improve the zero offset stability of gyroscope；Designed micro spark process technology combination MEMS technology avoids H/R ratios in traditional isotropic etching technique from fixing difficult the problem of becoming.
Description
Technical field
The utility model belongs to MEMS (MEMS) sensor and micro-nano manufacturing field, more particularly to a kind of base
In semi circular shells harmonic oscillator, there is high quality factor and the gyroscope of high stability.
Background technology
Gyroscope is a kind of sensor for being used for measuring velocity of rotation or rotational angle, can be used together with GPS, there is provided essence
It is determined that position and navigation information.With reference to MEMS (MEMS) technology using micro manufacturing technique can reduce gyroscope size and
Power consumption.The precision of MEMS gyroscope reaches rate level, is widely used in automobile and consumer electronics system.Emerging MEMS systems
The technology of making is concentrated in the quality of Three-Dimensional Isotropic and the manufacture of the equally distributed miniature shell of rigidity, is realized with this humorous with hemisphere
The similar Three-dimensional Axisymmetric micro-structural of the gyro that shakes.The technology of preparing reported includes obtaining half ball impression by silicon isotropic etching
Modulus method [1] and glass blowing method [2] etc..Hemispherical Shell three-dimensional structure causes traditional MEMS two dimension manufacture to extend to three-dimensional manufacture,
MEMS processing effects are limited to crystallographic direction and the selectivity of mask material, it is difficult to high symmetrical half ball impression is obtained on chip
Mould, hemisphere shell structure asymmetry cause larger frequency to crack, and the hemispherical resonator using monocrystalline silicon or polysilicon as material
Quality factor q it is relatively low, influence die-away time and the bias stability of gyroscope.To overcome above mentioned problem, the utility model carries
Gyroscope based on semi circular shells harmonic oscillator and preparation method thereof is gone out, has been used on material and be based on chemical vapor deposition
The polycrystalline diamond films of (chemical vapor deposition, CVD) have more as harmonic oscillator compared to silicon materials
Good mechanical performance and higher quality factor；Semi-loop harmonic oscillator is devised in structure, compared to existing hemisphere
Harmonic oscillator structural advantage includes：(1) curved surface of semi-ring is longer so that the resonant frequency of semi circular shells is lower, it is easier to reduces frequency
Cracking, improve die-away time and quality factor；(2) depth H of semi-ring shell structure, radius R ratio excursions are big, vibration shape distribution
Optimization space is big, is advantageous to weaken interference of the ambient vibration to gyro；(3) edge of semi circular shells is farther far from pedestal, sound during resonance
Sound energy concentrates on shell edge, the more coupling effect of energy minimization oscillator and pedestal, reduces the energy loss at bearing end.In technique
On, combined using micro spark process technology and MEMS technology and prepare gyroscope, quantitative controllable three-dimensional micro Process semi-ring cavity plate is bent
The radius R in face, depth H, H/R ratios in traditional isotropic etching technique can be avoided to fix difficult the problem of becoming, be more beneficial for humorous
The parameters such as vibration frequency, quality factor and the angle gain factor are separately optimized.The utility model proposes based on semi circular shells resonance
The gyroscope of son can reduce the resonant frequency and cracking frequency of the antinode mode of oscillation of structure four, improve die-away time and quality
Factor, so as to improve the zero offset stability of gyroscope；Introduce micro spark process technology combination MEMS technology and avoid tradition
H/R ratios fix difficult the problem of becoming in isotropic etching technique, can make the depth H of semi circular shells harmonic oscillator, radius R ratios can
Control and excursion is big.
Citation：
[1]X.Gao,L.Sorenson,F.Ayazi,“3-D Micromachined hemispherical shell
resonators with integrated capacitive transducers”,IEEE MEMS conference 2012,
Paris,France,Jan 2012,165-171.
[2] Sergei A.Zotov, Alexander A.Trusov, and Andrei M.Shkel, " Three-
dimensional spherical shell resonator gyroscope fabricated using wafer-scale
glassblowing",Journal of Microelectromechanical Systems,VOL.21,NO.3,JUNE
2012,509-510.
The content of the invention
The utility model proposes a kind of gyroscope based on semi circular shells harmonic oscillator, preferably chemical vapour deposition diamond
Film devises the harmonic oscillator of semi-ring shell structure, can reduce resonant frequency and cracking frequency, improve die-away time as harmonic oscillator
And quality factor, so as to improve the zero offset stability of gyro；Combined and prepared using micro spark process technology and MEMS technology
Gyroscope, the radius R of quantitative controllable three-dimensional micro Process semi-ring cavity die camber, depth H, can avoid traditional isotropic etching technique
Middle H/R ratios fix difficult the problem of becoming, and can make that the depth H of semi circular shells harmonic oscillator, radius R ratios are controllable and excursion is big,
It is more beneficial for being separately optimized for the parameters such as resonant frequency, quality factor and the angle gain factor.
Technical scheme is used by the utility model solves its technical problem：
Based on the gyroscope of semi circular shells harmonic oscillator, bottom electrode, insulating barrier, silicon substrate, harmonic oscillator are provided with；Silicon substrate
Be machined with semi-ring cavity plate on body, semi-ring cavity plate center is pedestal, any one longitudinal cross-section of semi-ring cavity plate comprising two to
Upper shed and symmetrical semicircle centered on pedestal or half elliptic；Silicon substrate upper surface is circumferentially arranged along semi-ring cavity plate
There is the electrod-array of annular；The cross section of described harmonic oscillator is in " ω " shape to match with semi-ring cavity plate, and harmonic oscillator is placed in half
In ring cavity plate and its anchor end is fixed by pedestal and supported, and the upper surface of semi-ring cavity plate and the lower surface of harmonic oscillator are equidistant in structure
Place；The silicon substrate back side offers the release hole array of annular, release aperture connection semi-ring cavity plate and silicon substrate bottom surface；Pedestal with it is humorous
The anchor end of oscillator is connected, and electric signal is connected to the bottom electrode at the back side, an electrode as harmonic oscillator；Silicon substrate and bottom electricity
Insulating barrier is provided between pole.
Preferably, described harmonic oscillator deposit thickness scope is 200nm~20 μm, harmonic oscillator material is diamond thin
Or other conductive films.
Preferably, described bottom electrode is gold electrode.
Preferably, the depth H and radius R ratio ranges of described semi-ring cavity plate are 0.2~1, radius R magnitude range
For 0.5~2mm.
Preferably, semi-ring cavity plate upper surface and harmonic oscillator lower surface spacing be 0.5~4 μm.
Preferably, the quantity of electrode is 8,12,16,20 in described electrod-array.
Preferably, the quantity of release aperture is 2~20 in described release hole array, diameter range is 0.5~2mm.
Preferably, described insulating layer material is Si3N4 materials.
It can be seen from the above technical scheme that the beneficial effects of the utility model are：It is humorous to employ new semi circular shells
Oscillator design introduces diamond simultaneously, reduces the resonant frequency and cracking frequency of the antinode mode of oscillation of structure four, improves
Die-away time and quality factor, so as to improve the zero offset stability of gyroscope；Designed micro spark process technology combines
MEMS technology avoids H/R ratios in traditional isotropic etching technique from fixing difficult the problem of becoming, and can make semi circular shells harmonic oscillator
Depth H, radius R ratios are controllable and excursion is big.
Brief description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples
Fig. 1 is the structure sheaf schematic diagram of the gyroscope of semi circular shells harmonic oscillator in the utility model；
Fig. 2 is Fig. 1 A-A diagrammatic cross-sections；
Fig. 3 is the bottom electrode structure figure of gyroscope in the utility model；
Fig. 4 is the fundamental diagram of gyroscope in the utility model；
Fig. 5 is four antinode resonance mode schematic diagrames of harmonic oscillator in the utility model；
Fig. 6 is the preparation technology flow chart of gyroscope in the utility model；A) adulterate to form annular electrode for silicon in figure
Array；B) it is molded for semi-ring cavity plate；C) deposit and etch for silicon dioxide sacrificial layer；D) covered for diamond thin and silica
Film deposits；E) patterned for silicon dioxide mask layer, diamond etching, mask layer removes；F) it is backside deposition insulating barrier and set
Carve, deposition gold, discharge hole is released at the back side；G) to remove sacrifice layer, harmonic oscillator is discharged；
In figure：Bottom electrode 1, insulating barrier 2, silicon substrate 3, electrod-array 31, pedestal 32, release hole array 33, semi-ring are recessed
Mould 34, harmonic oscillator 4, anchor end 41.
Embodiment
The utility model is further elaborated and illustrated with reference to the accompanying drawings and detailed description.In the utility model
The technical characteristic of each embodiment can carry out respective combination on the premise of not colliding with each other.
As shown in figure 1, the gyroscope based on semi circular shells harmonic oscillator, including bottom electrode 1, insulating barrier 2, silicon substrate 3, electricity
Pole array 31, pedestal 32, release hole array 33, semi-ring cavity plate 34, harmonic oscillator 4 and anchor end 41.In the present embodiment, the material of insulating barrier 2
Expect for dielectric Si3N4.The material of harmonic oscillator 4 is preferably diamond thin, and diamond thin adulterates in deposition process situ,
With preferable electric conductivity.In other embodiments, other conductive films also may be selected in semi circular shells harmonic oscillator material, such as more
Crystal silicon, SiC etc..
The top of silicon substrate 3 is machined with semi-ring cavity plate 34, and the center of semi-ring cavity plate 34 is pedestal 32, semi-ring cavity plate 34 it is any one
Individual longitudinal cross-section includes two upward openings and symmetrical semicircle centered on pedestal 32 or half elliptic.The semi-ring
The structure of cavity plate 34 has higher symmetry, and can quantify the size for controlling cavity plate 34, is easy to batch machining.In a reality
Apply in example, the depth H of semi-ring cavity plate 34, radius R (if half elliptic, then R is oval major radius) ratio range can be
0.2~1, radius R magnitude range can be 0.5~2mm.The upper surface of silicon substrate 3 is circumferentially arranged annular along semi-ring cavity plate 34
Electrod-array 31, the quantity of electrode is 8,12,16,20 in electrod-array 31.
Harmonic oscillator 4 is Three-dimensional Axisymmetric semi-ring shell construction, and any cross section of harmonic oscillator 4 is in and the phase of semi-ring cavity plate 34
Matching " ω " shape, the surface area of the curved-surface structure is bigger, can reduce the antinode mode of oscillation of harmonic oscillator four resonant frequency and
Frequency is cracked, die-away time and quality factor are improved, so as to improve the zero offset stability of gyroscope.In one embodiment
In, the preferred diamond chemical deposition of harmonic oscillator 4 is formed, and is deposited the thickness range of semi circular shells harmonic oscillator film and can is
200nm~20 μm.Harmonic oscillator 4 is placed in semi-ring cavity plate 34 and support is fixed in its anchor end 41 by pedestal 32, semi-ring cavity plate 34 it is upper
Surface and the lower surface of harmonic oscillator 4 are spaced at equal intervals in structure, the upper surface of semi-ring cavity plate 34 and the lower surface of harmonic oscillator 4
Spacing is 0.5~4 μm.The back side of silicon substrate 3 offers the release hole array 33 of annular arrangement, and each release aperture connects semi-ring cavity plate
34 and the bottom surface of silicon substrate 3.The quantity for discharging release aperture in hole array 33 is 2~20, and diameter range is 0.5~2mm.Pedestal 32 with
The anchor end 41 of harmonic oscillator 4 is connected, and electric signal is connected to the bottom electrode 1 at the back side, as an electrode of harmonic oscillator 4, bottom electricity
Pole 1 can use gold electrode.The structure of bottom electrode 1 of the shown as gyroscope of harmonic oscillator in figure 3；It is illustrated above to release
Discharge hole array 33.In addition, insulating barrier 2 is provided between silicon substrate 3 and bottom electrode 1.
In Fig. 4, it show the fundamental diagram of the gyroscope of semi circular shells harmonic oscillator.Semi circular shells harmonic oscillator 4 is in electrode
Four antinode radial direction stationary wave vibrations (as shown in Figure 5) occur under the electrostatic force of array 31；When the external world has rotation to input, semi-ring
Shell harmonic oscillator 4 has rotational angle Φ around pedestal 32, because Coriolis effect, semi-ring housing of the standing wave pattern to harmonic oscillator 4
Produce the precession angle θ proportional and in opposite direction to corner, and the constant θ=K Φ of its relation.K is the angle gain factor, is
The structural constant of semi circular shells harmonic oscillator 4, is not influenceed by change of external conditions.Precession angle is measured by the sensing of electrod-array 31
θ, it is possible to calculate the rotational angle Φ of semi-ring housing 4, realize the direct measurement to rotational angle.
In Figure 5, it is illustrated that the FEM model to be established carries out model analysis to the structure of semi circular shells 4 and finds out interference oscilation type
Analyze the optimization balance of die-away time and the angle gain factor.For the frequency range of ambient vibration, finite element mould is established
The antinode resonant frequency of type analysis four and interfering frequency, the frequency and interference modal frequency of four antinode mode are being far above environment frequency
Rate, it is not easy to be disturbed by ambient vibration.With the depth H of semi circular shells 4 and radius R change, the frequency and interference mould of four antinode mode
State frequency interval has individual optimal value, it is possible thereby to instruct the design based on semi circular shells harmonic oscillator gyroscope, improves antivibration interference
Performance.
As shown in fig. 6, it is the micro-machined integrated technique of gyroscope based on semi circular shells harmonic oscillator, in one embodiment
Step is as follows：
1) boron atom is adulterated in the regional area of n-type silicon substrates 3 of low-resistivity, annular is formed in silicon substrate upper surface
Electrod-array 31, isolate electrode and matrix using the p-n junction that is formed between doped region and silicon substrate 3, the leakage property of p-n junction and
Electrode depth is the key of the step.
2) the first one-step forming of semi-ring cavity plate is first realized on silicon substrate with micro spark processing technology, is then thrown again with chemistry
Light technique is polished to the curved surface of semi-ring cavity plate 34.Symmetry, radius error and the surface flatness of cavity die camber 34 are the steps
Rapid key.The radius R of the curved surface of semi-ring cavity plate 34, depth H are quantitative controllable, and road is processed by micro spark drill-shape and drill bit
Line is determined, H/R ratios in traditional isotropic etching technique can be avoided to fix difficult the problem of becoming.
3) silica is deposited on semi-ring cavity plate 34 as sacrifice layer, the depositing diamond film on sacrifice layer, is used in combination
Silica is mask, is removed with chemically mechanical polishing (CMP) and reactive ion etching (RIE) technique beyond semi-ring die region
Diamond thin, only retain the diamond thin in semi-ring cavity plate 34 as harmonic oscillator 4.Neat (the nothing at the edge of harmonic oscillator 4
Flaw, without emitting edge) be the step key.
4) low stress dielectric layer Si is overleaf deposited3N4, and the patterning etching of release aperture is carried out, then sputter gold thin film
Contact to form bottom electrode 1 with silicon substrate 3, the electrode signal of harmonic oscillator 4 is connected to the silicon substrate back side.
5) structure of sacrifice layer release diamond semi circular shells harmonic oscillator 4 finally, is removed, avoids semi circular shells 4 and semi-ring cavity plate 34
Adhesive be crucial.The annular release aperture 33 at shell bottom to the matrix back side can aid in accelerating the etching of sacrificial layer material, shorten
The structure release time, alignment precision is without very high.
Semi-ring cavity plate 34 is formed using micro spark processing technology from front in the utility model, therefore radius parameter can be with
Controlled by electric spark tool dimension, so the depth H of harmonic oscillator 4, radius R ratios are controllable and excursion is big, utilize harmonic oscillator 4
Structural parameters are easily controlled, vibration shape distribution optimization space is greatly so as to weakening interference of the ambient vibration to gyroscope.The utility model
Employ new semi circular shells harmonic oscillator design while introduce diamond, reduce the resonance frequency of the antinode mode of oscillation of structure four
Rate and cracking frequency, improve die-away time and quality factor, so as to improve the zero offset stability of gyroscope.
Embodiment described above is a kind of preferable scheme of the present utility model, so itself and be not used to limit this practicality
It is new.Those of ordinary skill about technical field, can be with the case where not departing from spirit and scope of the present utility model
Make a variety of changes and modification.Therefore the technical scheme that all modes for taking equivalent substitution or equivalent transformation are obtained, all falls within
In the scope of protection of the utility model.
Claims (8)
- A kind of 1. gyroscope based on semi circular shells harmonic oscillator, it is characterised in that：Provided with bottom electrode, insulating barrier, silicon substrate, humorous Oscillator；It is machined with semi-ring cavity plate on silicon substrate, semi-ring cavity plate center is pedestal, any one longitudinal cross-section Jun Bao of semi-ring cavity plate Containing two upward openings and symmetrical semicircle centered on pedestal or half elliptic；Silicon substrate upper surface is along semi-ring cavity plate It is circumferentially arranged the electrod-array of annular；The cross section of described harmonic oscillator is in " ω " shape to match with semi-ring cavity plate, resonance Son is placed in semi-ring cavity plate and its anchor end is fixed by pedestal and supported, and the upper surface of semi-ring cavity plate and the lower surface of harmonic oscillator are in structure On be spaced at equal intervals；The silicon substrate back side offers the release hole array of annular, release aperture connection semi-ring cavity plate and silicon substrate bottom surface； Pedestal is connected with the anchor end of harmonic oscillator, and electric signal is connected to the bottom electrode at the back side, an electrode as harmonic oscillator；Silicon substrate Insulating barrier is provided between bottom electrode.
- 2. the gyroscope according to claim 1 based on semi circular shells harmonic oscillator, it is characterised in that：Described harmonic oscillator is sunk Product thickness range is 200nm~20 μm, and harmonic oscillator material is diamond thin or other conductive films.
- 3. the gyroscope according to claim 1 based on semi circular shells harmonic oscillator, it is characterised in that：Described bottom electrode It is gold electrode.
- 4. the gyroscope according to claim 1 based on semi circular shells harmonic oscillator, it is characterised in that：Described semi-ring cavity plate Depth H and radius R ratio ranges be 0.2~1, radius R magnitude range is 0.5~2mm.
- 5. the gyroscope according to claim 1 based on semi circular shells harmonic oscillator, it is characterised in that：The upper table of semi-ring cavity plate The spacing of face and the lower surface of harmonic oscillator is 0.5~4 μm.
- 6. the gyroscope according to claim 1 based on semi circular shells harmonic oscillator, it is characterised in that：Described electrod-array The quantity of middle electrode is 8,12,16,20.
- 7. the gyroscope according to claim 1 based on semi circular shells harmonic oscillator, it is characterised in that：Described release aperture battle array The quantity of release aperture is 2~20 in row, and diameter range is 0.5~2mm.
- 8. the gyroscope according to claim 1 based on semi circular shells harmonic oscillator, it is characterised in that：Described insulating barrier material Expect for Si3N4Material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721025251.0U CN207050741U (en) | 2017-08-16 | 2017-08-16 | A kind of gyroscope based on semi circular shells harmonic oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721025251.0U CN207050741U (en) | 2017-08-16 | 2017-08-16 | A kind of gyroscope based on semi circular shells harmonic oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207050741U true CN207050741U (en) | 2018-02-27 |
Family
ID=61502611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721025251.0U Active CN207050741U (en) | 2017-08-16 | 2017-08-16 | A kind of gyroscope based on semi circular shells harmonic oscillator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207050741U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115060293A (en) * | 2022-08-16 | 2022-09-16 | 中国船舶重工集团公司第七0七研究所 | Method for rapidly acquiring attenuation time constant of quartz harmonic oscillator |
-
2017
- 2017-08-16 CN CN201721025251.0U patent/CN207050741U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115060293A (en) * | 2022-08-16 | 2022-09-16 | 中国船舶重工集团公司第七0七研究所 | Method for rapidly acquiring attenuation time constant of quartz harmonic oscillator |
| CN115060293B (en) * | 2022-08-16 | 2022-11-25 | 中国船舶重工集团公司第七0七研究所 | Method for rapidly acquiring attenuation time constant of quartz harmonic oscillator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107560607A (en) | Gyroscope based on semi circular shells harmonic oscillator and preparation method thereof | |
| US5783749A (en) | Vibrating disk type micro-gyroscope | |
| US7401397B2 (en) | Method of producing an inertial sensor | |
| US8567247B2 (en) | Three-dimensional wafer-scale batch-micromachined sensor and method of fabrication for the same | |
| CN103322994B (en) | Silica-based super-thin micro-hemispherical resonator gyroscope of a kind of biplate integrated form and preparation method thereof | |
| US9448069B2 (en) | Microelectromechanical bulk acoustic wave devices and methods | |
| CN105424019B (en) | One kind is based on the molding micro hemispherical resonator gyro of borosilicate glass annealing and manufacturing method | |
| US6944931B2 (en) | Method of producing an integral resonator sensor and case | |
| CN103528576B (en) | Hemispherical resonance micro mechanical gyroscope and processing technology thereof | |
| US9429428B2 (en) | Environmentally robust micro-wineglass gyroscope | |
| US20070084042A1 (en) | Isolated planar mesogyroscope | |
| Xiao et al. | Fused silica micro shell resonator with T-shape masses for gyroscopic application | |
| Heidari et al. | Micromachined polycrystalline diamond hemispherical shell resonators | |
| CN105466405B (en) | A kind of hybrid hemispherical resonator gyroscope and its processing technology | |
| Cho et al. | A high-Q birdbath resonator gyroscope (BRG) | |
| US9702728B2 (en) | Method of fabricating micro-glassblown gyroscopes | |
| US10132632B2 (en) | Hemispherical resonance micromechanical gyroscope and processing method thereof | |
| CN107063224B (en) | SOI micro-hemispherical gyroscope sensitive structure | |
| Senkal et al. | 1 million Q-factor demonstrated on micro-glassblown fused silica wineglass resonators with out-of-plane electrostatic transduction | |
| CN105371832B (en) | A kind of polycyclic interior twin beams of disk isolates annulus resonant gyroscope and preparation method thereof | |
| CN207050741U (en) | A kind of gyroscope based on semi circular shells harmonic oscillator | |
| CN104197918B (en) | Semi-circular piezoelectric resonator gyroscope and preparation method thereof | |
| CN104897146A (en) | Out-plane piezoelectric type hemispheric micro-gyroscope and preparation method thereof | |
| CN106629576A (en) | Silicon-based MEMS dish top | |
| JP4698221B2 (en) | Separate planar gyroscope with internal radial sensing and actuation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |