CN207022283U - A kind of single-chip microcomputer compound circuit harden structure - Google Patents
A kind of single-chip microcomputer compound circuit harden structure Download PDFInfo
- Publication number
- CN207022283U CN207022283U CN201720899059.8U CN201720899059U CN207022283U CN 207022283 U CN207022283 U CN 207022283U CN 201720899059 U CN201720899059 U CN 201720899059U CN 207022283 U CN207022283 U CN 207022283U
- Authority
- CN
- China
- Prior art keywords
- substrate
- wire casing
- copper foil
- chip microcomputer
- radome
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of single-chip microcomputer compound circuit harden structure,Including substrate,Copper foil is also installed with upper surface of base plate,The copper foil is perforated provided with lead,And lead perforation runs through copper foil,Support is additionally provided between adjacent lead perforation,The support is fixedly mounted on substrate in inverted u-shaped,The support both sides are installed with screened film,There is dielectric in shielding film outer surface also even application,The substrate back is also installed with stiffener,Power supply wire casing and ground wire casing are additionally provided with inside substrate,The lead perforation is installed with pin radome close to substrate side,And inside pin radome insertion substrate,Adhesion gum layer is filled with inside the pin radome,The shielding action between electronic component and the interference performance of anti-potential difference can be improved,Flow conductivity is improved while the installation of other elements of circuit board is not influenceed.
Description
Technical field
Circuit board technology field is the utility model is related to, specially a kind of single-chip microcomputer compound circuit harden structure.
Background technology
Single-chip microcomputer printed circuit board is singlechip group into circuit element and the supporter of device, and it provides circuit element and device
Electrical connection between part.When making the board structure of circuit of single-chip microcomputer, it is necessary to which what is considered is the layout and interference work of circuit
With.Interference effect is mainly reflected in the interference of electromagnetic interference and potential difference in the circuit board.And for large volume and big matter
For the electronic component of amount, it is also necessary in view of the enabling capabilities of circuit board, the electricity for enough enabling capabilities can not be provided
For the plate of road, larger electronic component is installed and just seems cumbersome.And in existing board structure of circuit, it is impossible at the same it is simultaneous
Effect that is anti-interference and improving flow conductivity is cared for, the load position that often all structures are all relied on substrate or copper foil is empty
Between, it is impossible to actual bearing capacity is reasonably improved using three-dimensional space.
The content of the invention
In order to overcome the shortcomings of prior art, the utility model provides a kind of single-chip microcomputer compound circuit harden structure, energy
The shielding action between electronic component and the interference performance of anti-potential difference are enough improved, in the peace for the other elements for not influenceing circuit board
Flow conductivity is improved while dress, can effectively solve the problem that the problem of background technology proposes.
Technical scheme is used by the utility model solves its technical problem：A kind of single-chip microcomputer compound circuit harden structure,
Including substrate, copper foil is also installed with upper surface of base plate, the copper foil is perforated provided with lead, and lead perforation runs through copper
Paper tinsel, support is additionally provided between adjacent lead perforation, the support is fixedly mounted on substrate in inverted u-shaped, the support
Both sides are installed with screened film, have dielectric in shielding film outer surface also even application, the substrate back is also fixed
Stiffener is installed, power supply wire casing and ground wire casing are additionally provided with inside substrate, the lead perforation is fixed close to substrate side
Pin radome is installed, and inside pin radome insertion substrate, adhesion gum is filled with inside the pin radome
Layer.
As a kind of technical scheme for having choosing of the utility model, the copper foil is in lattice-shaped, and between adjacent copper foil grid
Be smaller than lead perforation internal diameter.
As a kind of technical scheme for having choosing of the utility model, the lead perforation pattern is in line cross-shaped distribution,
And the straight line where the arrangement of lead perforation pattern direction turning point is arc.
As a kind of technical scheme for having choosing of the utility model, the quantity of the stiffener is two groups, two groups of stiffener phases
Mutually vertical intertexture rectangular in form.
As a kind of technical scheme for having choosing of the utility model, the power supply wire casing and ground wire casing are distributed in base in Tian-shaped
On plate, and the width of power supply wire casing and ground wire casing is 0.02-0.3mm, and the power supply wire casing and ground wire casing are distributed side by side.
Compared with prior art, the beneficial effects of the utility model are：
(1), on the one hand can be in order to the peace of other circuit structures by the copper foil of the lattice-shaped set in upper surface of base plate
Dress, still further aspect also help discharge copper foil and substrate between adhesive by thermogenetic escaping gas, in emission gases
While can also improve the lost effect of heat；
(2) by setting the lead perforation with arcuate structure to reduce the transmitting of high frequency noise, and worn in lead
The pin radome and adhesion gum layer that bore end adds can prevent that connecting overflowing for electromagnetic signal dissipates, and produces to other electron component
Raw electromagnetic interference；
(3) electronic component of large volume and big quality is further supported by support, at the same time can also be
Screened film and dielectric provide carrier, it is possible to increase the interference performance of shielding action and anti-potential difference between electronic component；
(4) the power supply wire casing and ground wire casing further installed by inline mode can provide for power and ground
Broader embedded position, but also the installation of other elements of circuit board is not influenceed.
Brief description of the drawings
Fig. 1 is overall structure diagram of the present utility model；
Fig. 2 is the utility model section structural representation；
In figure：1- substrates；2- copper foils；3- leads are perforated；4- supports；5- screened films；6- dielectrics；7- stiffeners；8-
Power supply wire casing；9- ground wire casing；10- pin radomes；11- adhesion gum layers.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
The explanation of following embodiment is refer to the attached drawing, can be to the particular implementation implemented to example the utility model
Example.The direction and position term that the utility model is previously mentioned, for example, " on ", " in ", " under ", "front", "rear", "left", "right", "
It is interior ", " outer ", " side " etc., be only the direction and position with reference to annexed drawings.Therefore, the direction and position term used is to use
To illustrate and understand the utility model, and it is not used to limit the utility model.
Embodiment：
As depicted in figs. 1 and 2, the utility model provides a kind of single-chip microcomputer compound circuit harden structure, including substrate 1,
The upper surface of substrate 1 is also installed with copper foil 2, and the copper foil 2 is provided with lead perforation 3, and lead perforation 3 runs through copper foil 2, institute
State lead perforation 3 to be arranged in a straight line cross-shaped distribution, and be in lead straight line where the arrangement of 3 orientation turning points of perforating
Arc, in adjacent arranged in a straight line, feedback coupling can be prevented, and the arcuate structure having, high-frequency noise can be reduced
Transmitting, support 4 is additionally provided between adjacent lead perforation 3, the support 4 is fixedly mounted on substrate 1 in inverted u-shaped, institute
State the both sides of support 4 and be installed with screened film 5, also even application has dielectric 6, the substrate 1 in the outer surface of screened film 5
The back side is also installed with stiffener 7, and the quantity of the stiffener 7 is two groups, and two groups of stiffeners 7 are mutually perpendicular to interweave rectangular
Shape, the mechanical strength of substrate 1 is improved, prevents to rupture.
Power supply wire casing 8 and ground wire casing 9 are additionally provided with inside substrate 1, the power supply wire casing 8 and ground wire casing 9 are in Tian-shaped point
On substrate 1, and the width of power supply wire casing 8 and ground wire casing 9 be 0.02-0.3mm to cloth, the power supply wire casing 8 and wire casing 9 it is arranged side by side
Distribution, there is provided sufficiently wide cable embedded groove, it is possible to increase the flow conductivity of wire, the lead perforation 3 is close to the side of substrate 1
Pin radome 10 is installed with, and pin radome 10 is embedded in inside substrate 1, is filled inside the pin radome 10
It is filled with adhesion gum layer 11.
Preferably, the copper foil 2 is in lattice-shaped, and is smaller than the interior of lead perforation 3 between the grid of adjacent copper foil 2
Footpath, while the application of lead perforation 3 is not influenceed, it is possible to increase the heat dispersion of copper foil 2, but also copper foil 2 can be prevented
Incidental copper foil 2 expands and obscission after long-time is heated.
In summary, it is of the present utility model to be mainly characterized by：
(1), on the one hand can be in order to the peace of other circuit structures by the copper foil of the lattice-shaped set in upper surface of base plate
Dress, still further aspect also help discharge copper foil and substrate between adhesive by thermogenetic escaping gas, in emission gases
While can also improve the lost effect of heat；
(2) by setting the lead perforation with arcuate structure to reduce the transmitting of high frequency noise, and worn in lead
The pin radome and adhesion gum layer that bore end adds can prevent that connecting overflowing for electromagnetic signal dissipates, and produces to other electron component
Raw electromagnetic interference；
(3) electronic component of large volume and big quality is further supported by support, at the same time can also be
Screened film and dielectric provide carrier, it is possible to increase the interference performance of shielding action and anti-potential difference between electronic component；
(4) the power supply wire casing and ground wire casing further installed by inline mode can provide for power and ground
Broader embedded position, but also the installation of other elements of circuit board is not influenceed.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and
And in the case of without departing substantially from spirit or essential attributes of the present utility model, it can realize that this practicality is new in other specific forms
Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new
The scope of type limits by appended claims rather than described above, it is intended that the equivalency fallen in claim is contained
All changes in justice and scope are included in the utility model.Any reference in claim should not be considered as limitation
Involved claim.
Claims (5)
1. a kind of single-chip microcomputer compound circuit harden structure, including substrate (1), copper foil is also installed with substrate (1) upper surface
(2), the copper foil (2) is provided with lead perforation (3), and lead perforation (3) runs through copper foil (2), it is characterised in that：Adjacent
Support (4) is additionally provided between lead perforation (3), the support (4) is fixedly mounted on substrate (1) in inverted u-shaped, the support
(4) both sides are installed with screened film (5), and in screened film (5) outer surface, also even application has dielectric (6), the base
Plate (1) back side is also installed with stiffener (7), and power supply wire casing (8) and ground wire casing (9) are additionally provided with inside substrate (1), described
Lead perforation (3) is installed with pin radome (10) close to substrate (1) side, and pin radome (10) is embedded in substrate
(1) it is internal, it is filled with adhesion gum layer (11) inside the pin radome (10).
A kind of 2. single-chip microcomputer compound circuit harden structure according to claim 1, it is characterised in that：The copper foil (2) is in grid
Trellis, and the internal diameter for being smaller than lead perforation (3) between adjacent copper foil (2) grid.
A kind of 3. single-chip microcomputer compound circuit harden structure according to claim 1, it is characterised in that：The lead perforates (3)
Be arranged in a straight line cross-shaped distribution, and the straight line where the arrangement of lead perforation (3) orientation turning point is arc.
A kind of 4. single-chip microcomputer compound circuit harden structure according to claim 1, it is characterised in that：The stiffener (7)
Quantity is two groups, and two groups of stiffeners (7) are mutually perpendicular to intertexture rectangular in form.
A kind of 5. single-chip microcomputer compound circuit harden structure according to claim 1, it is characterised in that：The power supply wire casing (8)
It is distributed in ground wire casing (9) in Tian-shaped on substrate (1), and the width of power supply wire casing (8) and ground wire casing (9) is 0.02-
0.3mm, the power supply wire casing (8) and ground wire casing (9) and column distribution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720899059.8U CN207022283U (en) | 2017-07-24 | 2017-07-24 | A kind of single-chip microcomputer compound circuit harden structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720899059.8U CN207022283U (en) | 2017-07-24 | 2017-07-24 | A kind of single-chip microcomputer compound circuit harden structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207022283U true CN207022283U (en) | 2018-02-16 |
Family
ID=61481940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720899059.8U Expired - Fee Related CN207022283U (en) | 2017-07-24 | 2017-07-24 | A kind of single-chip microcomputer compound circuit harden structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207022283U (en) |
-
2017
- 2017-07-24 CN CN201720899059.8U patent/CN207022283U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180216 Termination date: 20200724 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |