CN207014766U - New carrier band mould - Google Patents
New carrier band mould Download PDFInfo
- Publication number
- CN207014766U CN207014766U CN201720595249.0U CN201720595249U CN207014766U CN 207014766 U CN207014766 U CN 207014766U CN 201720595249 U CN201720595249 U CN 201720595249U CN 207014766 U CN207014766 U CN 207014766U
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- CN
- China
- Prior art keywords
- carrier band
- die ontology
- fin
- face
- outer circumference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a kind of new carrier band mould, including die ontology, die ontology is in annular shape, die ontology outer circumference face is provided with multiple tracks annular ridge, fin outer circumference face is the arc surface of flat smooth, the equally distributed projection of rounded array is provided between adjacent twice fin, it is each raised perpendicular with the cross section transverse of per pass fin, set by the circular array that projection is formed and die ontology coaxial line, raised height is less than or equal to the height of fin, two neighboring raised and adjacent twice fin is around one pocket forming tank of composition, two side end faces of die ontology or so are installation end face.The beneficial effects of the utility model are：When being molded carrier band using the carrier tape mould, carrier band width is significantly reduced, and so as to which makrolon conductive particle dosage be greatly reduced, and then effectively reduces the manufacturing cost of carrier band；Because raw material dosage reduces, carrier band thickness can suitably increase in original basis, and then strengthen protective capability of the carrier band to electronic component.
Description
Technical field
Carrier band production equipment technology is the utility model is related to, more particularly, to a kind of new carrier band mould.
Background technology
Carrier band is mainly used in electronic component attachment industry, and it coordinates cover strip to use, can be by resistance, electric capacity, crystal
The carrying of the electronic components such as pipe, diode is accommodated in the pocket of carrier band, and forms closure by sealing cover strip above carrier band
The packaging of formula, for protecting electronic component not contaminated in transit and damaging.Because polycarbonate material has machine
The advantages such as tool intensity is high, the transparency is good, good stability of the dimension, glass transition temperature height and heat resistance are good, so wide
It is general to be used as carrier band preparing raw material.
However, because PC conductive particles involve great expense, so the cost for carrying finished product can be caused also higher.So, in order to
The cost of carrier band finished product is reduced, traditional solution make from the thickness of material here to be started with to reduce cost, that is, is reduced
The thickness of carrier band.But this settling mode has limitation, if because carrier band thickness is too small, it can be made to lose to electronics
The defencive function of component.
In addition, led again because preparing the tiny pocket for needing to carry both sides when carrying by being molded using traditional moulds
Draw, so the width of carrier band is not smaller than the spacing of both sides tiny pocket forming tank, can not be smooth if carrier band forming width is too small
The tiny pocket of traction is molded, and then the Forming Quality that can be carried to whole piece has undesirable effect.
As can be seen here, a kind of new carrier band mould how is worked out, possesses simple in construction and carrier band forming width office
It is sex-limited small so as to reduce the advantages of carrying manufacturing cost, it is current those skilled in the art's urgent problem to be solved.
The content of the invention
In order to solve the above problems, the utility model provides a kind of new carrier band mould.
A kind of new carrier band mould of the utility model, including die ontology, the die ontology are described in annular shape
Multiple tracks annular ridge is fixedly installed on die ontology outer circumference face, the outer circumference face of the fin is the circle of flat smooth
Cambered surface, be provided with the equally distributed projection of rounded array between fin described in adjacent twice, it is each it is described it is raised with described in per pass
The cross section transverse of fin is perpendicular, is set by the circular array that the projection is formed and the die ontology coaxial line, described convex
The height risen is less than or equal to the height of the fin, and fin described in two neighboring described raised and adjacent twice, which surrounds, forms one
Two side end faces of pocket forming tank, the die ontology or so are installation end face.
Further, the material of the die ontology is stainless steel material.
Further, fin described in multiple tracks is equally distributed on the die ontology outer circumference face.
Further, the pilot hole for being fixedly connected with mould installion support is offered on the installation end face.
Further, the die ontology draws transmission assembly equipped with carrier band, and the carrier band draws institute in transmission assembly
Apply the direction of tractive force towards the middle position in the die ontology outer circumference face.
A kind of new carrier band mould of the utility model, compared with prior art with advantages below：
Tiny pocket forming tank described in the new carrier band mould at left and right sides of die ontology is changed to planar structure,
Change the force application location of traction carrier band simultaneously, i.e., force is drawn by the tiny pocket taken shape in originally close to carrier band left and right sides edge
Point is transferred to carrier band middle part, so just without continuing to be molded tiny pocket structure on carrier band, so the forming width of carrier band
Can be against the limitation of tiny pocket forming tank position in traditional moulds.Therefore, the carrier tape mould shaping after being improved using structure is carried
During band, the width of carrier band can be substantially reduced, so as to which the dosage of expensive makrolon conductive particle be greatly reduced, and then
Effectively reduce the manufacturing cost of carrier band.Further, since carrier band raw material dosage is greatly reduced, so carrier band thickness can be in original base
Suitably increase on plinth, and then strengthen protective capability of the carrier band to electronic component.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is not carry out the improved carrier tape mould structural representation of structure.
In figure：1st, die ontology, 2, fin, 3, raised, 4, pocket forming tank, 5, installation end face, 6, tiny pocket forming tank.
Embodiment
In order to be better understood from the utility model, enter traveling one to the utility model with reference to specific embodiments and the drawings
The description of step.
As shown in figure 1, a kind of new carrier band mould, including die ontology 1, the die ontology 1 is in annular shape.For
The mechanical strength of the raising die ontology 1, so as to extend its service life, so by the die ontology 1 be designed as by
Stainless steel material is process.
Multiple tracks annular ridge 2 is fixedly installed on the outer circumference face of die ontology 1, to separate the adjacent pocket in left and right
Forming tank 4.The outer circumference face of the fin 2 is the arc surface of flat smooth, then is to be stripped work when being molded and carrying
What is carried out is more smooth.Fin 2 described in multiple tracks is equally distributed on the outer circumference face of die ontology 1.The design is root
Designed according to the size that electronic component is placed in bag.And the quantity of the fin 2 is also according to the actual requirements and carries out phase
The design answered, the quantity of fin 2 is four in the present embodiment.
Rounded array equally distributed raised 3 is provided between fin 2 described in adjacent twice.Each described raised 3 with it is every
The cross section transverse of fin 2 is perpendicular described in road.Set by raised 3 circular array formed and the coaxial line of die ontology 1
Put, raised 3 height be less than or equal to the fin 2 height, two neighboring described raised 3 and adjacent twice described in fin
2 around one pocket forming tank 4 of composition.The size of the pocket forming tank 4 needs also exist for specific according to the electronic component of carrying
Size carries out relevant design.
In order that the die ontology 1 and mould installion support assembly manipulation are more convenient, so by the die ontology 1
The side end face of left and right two is designed as installing end face 5.In order to further improve installation effectiveness, so being opened on the installation end face 5
Provided with the pilot hole for being fixedly connected with mould installion support.
Because the carrier tape mould is compared with traditional moulds, the associated mechanisms for eliminating left and right sides tiny pocket forming tank 6 are set
Meter is specifically shown in Fig. 1 and 2, so needing to change traditional carrier band mode of traction.Therefore, the carrier band that the die ontology 1 is equipped with is led
Draw transmission assembly and apply the direction of tractive force and be located at the middle position in the outer circumference face of die ontology 1, rather than it is described
The left and right sides of carrier band.Because tiny pocket hitch structure is not present at left and right sides of the carrier band being molded now.
Exactly because above-mentioned improvement just causes the forming width of carrier band from the position of tiny pocket forming tank 6 in traditional moulds
Limitation.It can be seen that when the carrier tape mould shaping after being improved using structure is carried, the width of carrier band can be substantially reduced, so as to significantly drop
The dosage of the expensive makrolon conductive particle of low price, and then effectively reduce the manufacturing cost of carrier band.Such as produced before improving
The raw material of makrolon conductive particle is 40.2g needed for 2m carrier bands, and improves makrolon conductive particle needed for kind 2m carrier bands
Raw material be 34.7g.
In addition, because carrier band raw material dosage is greatly reduced, carrier band thickness can suitably increase on the original basis
Add, and then strengthen protective capability of the carrier band to electronic component.Thickness before wherein carrier band improves is 0.237mm, and after improving
0.250mm can then be increased to.
Embodiment of the present utility model is described in detail above, but the content is only of the present utility model preferable
Embodiment, it is impossible to be considered as being used to limit practical range of the present utility model.All impartial changes made according to the scope of the utility model
Change and improvement etc., all should still be belonged within this patent covering scope.
Claims (5)
1. a kind of new carrier band mould, including die ontology (1), it is characterised in that：The die ontology (1) is in annulus
Shape, multiple tracks annular ridge (2), the outer circumference of the fin (2) are fixedly installed on die ontology (1) the outer circumference face
Face is the arc surface of flat smooth, and the equally distributed projection (3) of rounded array is provided between fin (2) described in adjacent twice,
Set by the circular array that raised (3) are formed and the die ontology (1) coaxial line, each raised (3) and per pass
The cross section transverse of the fin (2) is perpendicular, it is described projection (3) height be less than or equal to the fin (2) height, adjacent two
For fin (2) described in individual raised (3) and adjacent twice around a pocket forming tank (4) is formed, the die ontology (1) is left
Right two side end faces are installation end face (5).
2. new carrier band mould according to claim 1, it is characterised in that：The material of the die ontology (1) is
Stainless steel material.
3. new carrier band mould according to claim 1, it is characterised in that：Fin described in multiple tracks (2) equidistantly divides
It is distributed on the die ontology (1) outer circumference face.
4. new carrier band mould according to claim 1, it is characterised in that：Offered on installation end face (5)
For the pilot hole being fixedly connected with mould installion support.
5. the new carrier band mould according to any one in claim 1-4, it is characterised in that：The die ontology
(1) transmission assembly is drawn equipped with carrier band, the carrier band traction transmission assembly applies the direction of tractive force towards the mould
The middle position in body (1) outer circumference face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720595249.0U CN207014766U (en) | 2017-05-25 | 2017-05-25 | New carrier band mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720595249.0U CN207014766U (en) | 2017-05-25 | 2017-05-25 | New carrier band mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207014766U true CN207014766U (en) | 2018-02-16 |
Family
ID=61475761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720595249.0U Expired - Fee Related CN207014766U (en) | 2017-05-25 | 2017-05-25 | New carrier band mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207014766U (en) |
-
2017
- 2017-05-25 CN CN201720595249.0U patent/CN207014766U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180216 |