CN207011179U - Heat abstractor for Connectors for Active Phased Array Radar - Google Patents
Heat abstractor for Connectors for Active Phased Array Radar Download PDFInfo
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- CN207011179U CN207011179U CN201720588653.5U CN201720588653U CN207011179U CN 207011179 U CN207011179 U CN 207011179U CN 201720588653 U CN201720588653 U CN 201720588653U CN 207011179 U CN207011179 U CN 207011179U
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- heat
- radar
- dissipation tank
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- connectors
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Abstract
The utility model discloses the heat abstractor for Connectors for Active Phased Array Radar, described two and above semiconductor chilling plate is arranged at the inwall of radar front, and the cold end of semiconductor chilling plate is towards inside radar front；Described two and above semiconductor chilling plate hot junction is connected by heat pipe, and the end of heat pipe is stretched into heat dissipation tank；The heat dissipation tank is arranged at outside radar front, and heat pipe stretches on the part in heat dissipation tank and sets heat radiating fin；Air inlet fan and air-out fan are set on the heat dissipation tank, and air inlet fan and air-out fan are arranged oppositely；The air inlet fan and air-out fan are towards the face inside heat dissipation tank towards the fin end of heat radiating fin.The utility model is used for the heat abstractor of Connectors for Active Phased Array Radar, by the way that the heat of radar front is conducted to carrying out concentration radiating outside radar front, it need not be aerated on radar front, so that radar front is in enclosed environment, will not be corroded by external environment.
Description
Technical field
It the utility model is related to field of radar, and in particular to the heat abstractor for Connectors for Active Phased Array Radar.
Background technology
Any radar is in producing, transport, store and using, shadow of the temperature to radar system under certain environmental condition
Sound is particularly important.High and low temperature and its circulation can produce to most of electronic components in radar to be had a strong impact on, it can cause electronics
The failure of component, and then the failure of whole radar equipment is influenceed, this point shows the most prominent in Connectors for Active Phased Array Radar.
With the miniaturization of electronic component, microminaturization, the highly integrated and micro-group dress of integrated circuit, component, the hot-fluid of component
Density improves constantly, and thermal design is also faced with stern challenge.Modern electronic equipment thermal design using thermal conduction study and hydrodynamics as
Basis, with reference to electronic equipment telecommunication and the actual conditions of structure, it is aided with the means of advanced software emulation research and Thermal test, leads to
Cross and select suitable methods for cooling, create a good working environment for electronic equipment, it is ensured that heating element, complete machine or
System can be reliable and stable at a temperature of permission work.Connectors for Active Phased Array Radar is the huge electronic system of a complexity,
Be internally integrated all size, numerous electronic components of model, radar front as radar key equipment, it is necessary to have it is good
Sinking path.
Present radar front is radiated using air blast cooling more, and this mode radar front is not at sealed environment,
External environment erosion is highly susceptible to, especially the harsher sea of environment, wave and rainwater easily can pour in down a chimney from blower fan
Enter on radar front, so as to corrode radar front, radar effect is reduced, even more so that radar neutralization.
Utility model content
Technical problem to be solved in the utility model is that present radar front is radiated using air blast cooling more, this
Kind mode radar front is not at sealed environment, it is easy to is corroded by external environment, and it is an object of the present invention to provide being used for active phase
The heat abstractor of battle array radar, solves the above problems.
The utility model is achieved through the following technical solutions：
For the heat abstractor of Connectors for Active Phased Array Radar, including two and above semiconductor chilling plate, heat pipe, heat dissipation tank,
Heat radiating fin, air inlet fan and air-out fan；Described two and above semiconductor chilling plate is arranged at the inwall of radar front, and half
The cold end of conductor cooling piece is towards inside radar front；Described two and above semiconductor chilling plate hot junction passes through heat pipe string
Connection, and the end of heat pipe is stretched into heat dissipation tank；The heat dissipation tank is arranged at outside radar front, and heat pipe is stretched into heat dissipation tank
Heat radiating fin is set on part；Air inlet fan and air-out fan be set on the heat dissipation tank, and air inlet fan and air-out fan to
Set；The air inlet fan and air-out fan are towards the face inside heat dissipation tank towards the fin end of heat radiating fin.
In the prior art, radar front is radiated using air blast cooling more, and this mode radar front is not at sealing
Environment, it is easy to corroded by external environment, especially the harsher sea of environment, wave and rainwater can be easily from blower fans
Pour in down a chimney on radar front, so as to corrode radar front, radar effect is reduced, even more so that radar neutralization.
When the utility model is applied, caused heat in radar front, the cold end through semiconductor chilling plate absorbs, and transmits
To the hot junction of semiconductor chilling plate, for the heat transfer in hot junction to heat pipe, heat pipe transfers heat to the relatively low one end of heat pipe temperature,
One end i.e. in the heat dissipation tank, heat radiating fin is by the heat diffusion of heat pipe to fin end, and fin end is exactly the outward flange of heat radiating fin, air intake
Fan and air-out fan are formed on heat radiating fin forces air channel, heat radiating fin is radiated, it is achieved thereby that to radar front
Integral heat sink.The utility model is by the way that the heat of radar front is conducted to carrying out concentration radiating outside radar front, it is not necessary to
It is aerated on radar front, so that radar front is in enclosed environment, will not be corroded by external environment.
Further, the cross-sectional area at the fin end of the heat radiating fin is more than cross-sectional area of the heat radiating fin close to heat pipe section.
When the utility model is applied, the cross-sectional area at the fin end of heat radiating fin is more than heat radiating fin close to the cross section of heat pipe section
Product, so that the area of dissipation at fin end is bigger, radiating effect is more preferable.
Further, the material of the heat radiating fin uses copper.
Further, the semiconductor chilling plate uses semiconductor chilling plate of the limiting voltage for 11~16V.
Further, the hot junction of the semiconductor chilling plate is connected by thermal grease with heat pipe.
The utility model compared with prior art, has the following advantages and advantages：
The utility model is used for the heat abstractor of Connectors for Active Phased Array Radar, by the way that the heat of radar front is conducted to radar
Concentration radiating is carried out outside front, it is not necessary to be aerated on radar front, so that radar front is in enclosed environment
In, it will not be corroded by external environment.
Brief description of the drawings
Accompanying drawing described herein is used for providing further understanding the utility model embodiment, forms the one of the application
Part, the restriction to the utility model embodiment is not formed.In the accompanying drawings：
Fig. 1 is the utility model structure diagram.
Mark and corresponding parts title in accompanying drawing：
1- radar fronts, 2- semiconductor chilling plates, 3- heat pipes, 4- heat dissipation tanks, 5- heat radiating fins, 6- air inlet fans, 7- air-out
Fan.
Embodiment
For the purpose of this utility model, technical scheme and advantage is more clearly understood, with reference to embodiment and accompanying drawing,
The utility model is described in further detail, and exemplary embodiment of the present utility model and its explanation are only used for explaining this
Utility model, it is not intended as to restriction of the present utility model.
Embodiment
As shown in figure 1, the utility model is used for the heat abstractor of Connectors for Active Phased Array Radar, including two and with semiconductor-on-insulator
Cooling piece 2, heat pipe 3, heat dissipation tank 4, heat radiating fin 5, air inlet fan 6 and air-out fan 7；Described two and above semiconductor chilling plate
2 are arranged at the inwall of radar front 1, and the cold end of semiconductor chilling plate 2 is towards inside radar front 1；It is described two and more than
The hot junction of semiconductor chilling plate 2 is connected by heat pipe 3, and the end of heat pipe 3 is stretched into heat dissipation tank 4；The heat dissipation tank 4 is arranged at
Outside radar front 1, and heat pipe 3 stretches into setting heat radiating fin 5 on the part in heat dissipation tank 4；Air intake wind is set on the heat dissipation tank 4
Fan 6 and air-out fan 7, and air inlet fan 6 and air-out fan 7 are arranged oppositely；The air inlet fan 6 and air-out fan 7 towards dissipate
Face inside hot tank 4 is towards the fin end of heat radiating fin 5.The cross-sectional area at the fin end of the heat radiating fin 5 is more than heat radiating fin 5 close to heat
The cross-sectional area of tube portion.The material of the heat radiating fin 5 uses copper.The semiconductor chilling plate 2 use limiting voltage for 11~
16V semiconductor chilling plate.The hot junction of the semiconductor chilling plate 2 is connected by thermal grease with heat pipe 3.
When the present embodiment is implemented, caused heat in radar front 1, the cold end through semiconductor chilling plate 2 absorbs, and transmits
To the hot junction of semiconductor chilling plate 2, for the heat transfer in hot junction to heat pipe 3, it is relatively low that heat pipe 3 transfers heat to the temperature of heat pipe 3
One end, i.e. one end in heat dissipation tank 4, for heat radiating fin 5 by the heat diffusion of heat pipe to fin end, fin end is exactly the outer of heat radiating fin 5
Edge, air inlet fan 6 and air-out fan 7 are formed on heat radiating fin 5 forces air channel, and heat radiating fin 5 is radiated, it is achieved thereby that
To the integral heat sink of radar front 1.The utility model is carried out by the way that the heat of radar front 1 is conducted to the outside of radar front 1
Concentrate radiating, it is not necessary to it is aerated on radar front 1, will not be by so that radar front 1 is in enclosed environment
External environment corrodes.
Above-described embodiment, the purpose of this utility model, technical scheme and beneficial effect are entered
One step describes in detail, should be understood that and the foregoing is only specific embodiment of the present utility model, is not used to limit
Determine the scope of protection of the utility model, it is all within the spirit and principles of the utility model, any modification for being made, equally replace
Change, improve, should be included within the scope of protection of the utility model.
Claims (5)
1. the heat abstractor for Connectors for Active Phased Array Radar, it is characterised in that including two and above semiconductor chilling plate (2),
Heat pipe (3), heat dissipation tank (4), heat radiating fin (5), air inlet fan (6) and air-out fan (7)；Described two and above semiconductor refrigerating
Piece (2) is arranged at the inwall of radar front (1), and the cold end of semiconductor chilling plate (2) is internal towards radar front (1)；It is described
The hot junction of two and above semiconductor chilling plate (2) is connected by heat pipe (3), and heat dissipation tank (4) is stretched into the end of heat pipe (3)
It is interior；The heat dissipation tank (4) is arranged at radar front (1) outside, and heat pipe (3) is stretched into set on the part in heat dissipation tank (4) and dissipated
Hot fin (5)；Air inlet fan (6) and air-out fan (7), and air inlet fan (6) and air-out fan are set on the heat dissipation tank (4)
(7) it is arranged oppositely；The air inlet fan (6) and air-out fan (7) are towards the internal face of heat dissipation tank (4) towards heat radiating fin (5)
Fin end.
2. the heat abstractor according to claim 1 for Connectors for Active Phased Array Radar, it is characterised in that the heat radiating fin
(5) cross-sectional area at fin end is more than cross-sectional area of the heat radiating fin (5) close to heat pipe section.
3. the heat abstractor according to claim 1 for Connectors for Active Phased Array Radar, it is characterised in that the heat radiating fin
(5) material uses copper.
4. the heat abstractor according to claim 1 for Connectors for Active Phased Array Radar, it is characterised in that the semiconductor system
Cold (2) use semiconductor chilling plate of the limiting voltage for 11~16V.
5. the heat abstractor according to claim 1 for Connectors for Active Phased Array Radar, it is characterised in that the semiconductor system
The hot junction of cold (2) is connected by thermal grease with heat pipe (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720588653.5U CN207011179U (en) | 2017-05-25 | 2017-05-25 | Heat abstractor for Connectors for Active Phased Array Radar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720588653.5U CN207011179U (en) | 2017-05-25 | 2017-05-25 | Heat abstractor for Connectors for Active Phased Array Radar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207011179U true CN207011179U (en) | 2018-02-13 |
Family
ID=61445672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720588653.5U Active CN207011179U (en) | 2017-05-25 | 2017-05-25 | Heat abstractor for Connectors for Active Phased Array Radar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207011179U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107041109A (en) * | 2017-05-25 | 2017-08-11 | 四川莱源科技有限公司 | Semiconductor system based on monitoring temperature |
| CN112038745A (en) * | 2020-08-17 | 2020-12-04 | 中国人民解放军空军工程大学 | Active phased array radar antenna array surface autonomous heat dissipation device based on Peltier effect |
-
2017
- 2017-05-25 CN CN201720588653.5U patent/CN207011179U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107041109A (en) * | 2017-05-25 | 2017-08-11 | 四川莱源科技有限公司 | Semiconductor system based on monitoring temperature |
| CN112038745A (en) * | 2020-08-17 | 2020-12-04 | 中国人民解放军空军工程大学 | Active phased array radar antenna array surface autonomous heat dissipation device based on Peltier effect |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181121 Address after: 610000 Xinchuang Road, West District, Chengdu High-tech Zone, Sichuan Province Patentee after: Sichuan Di Information Technology Co., Ltd. Address before: 610000 Longtan Industrial Park, two section of Chenghua District East Three Ring Road, Chengdu, Sichuan. Patentee before: SICHUAN LAIYUAN TECHNOLOGY CO., LTD. |
|
| TR01 | Transfer of patent right |