CN207009471U - Die bond chip tool - Google Patents
Die bond chip tool Download PDFInfo
- Publication number
- CN207009471U CN207009471U CN201720990817.7U CN201720990817U CN207009471U CN 207009471 U CN207009471 U CN 207009471U CN 201720990817 U CN201720990817 U CN 201720990817U CN 207009471 U CN207009471 U CN 207009471U
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- CN
- China
- Prior art keywords
- plate
- chip
- die bond
- pipe
- jig plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a kind of die bond chip tool, belong to diode packaging technology field, including jig plate, it is characterized in that, jig plate side is provided with the pumping mouth of pipe, jig plate is internally provided with the gas circuit being connected with the pumping mouth of pipe, tool plate surface is provided with working panel, flange is provided with working panel outer rim, the working panel surface is provided with the chip slot of predetermined number, chip trench bottom is provided with the stomata being connected with the gas circuit of predetermined number, and vibrating mechanism is connected with the outside of the jig plate；Can automatic open close, automaticity is high, substantially increases the accuracy of operating efficiency and die bond, reduces the damage rate of equipment.
Description
Technical field
It the utility model is related to diode packaging technology field, and in particular to one kind is used in diode package die bond process
Pick up the die bond chip tool of chip.
Background technology
Die bond is the very important process together of diode package, and traditional die bond process is typically in paste solder printing process
Carry out afterwards, existing proposition will put the integrated operation of tin cream die bond, but need largely to dissipate coremaking piece by default position
Pickup is put to uniform template, then the chip in template is transferred in frame structure using integrated operation equipment, in view of
The special nature of chip, the pickup of prior art generally use manual operation, operating efficiency is extremely low, and chip is shifting after pickup
During be easy to shift, influence the accuracy of die bond.
The content of the invention
In order to solve the above problems, the utility model provides the die bond that a kind of automaticity is high, is capable of automatic open close
Chip tool, the accuracy of operating efficiency and die bond is substantially increased, reduce the damage rate of equipment.
The utility model is that technical scheme is used by solving its technical problem：Die bond chip tool, including jig plate,
Characterized in that, jig plate side is provided with the pumping mouth of pipe, jig plate is internally provided with the gas circuit being connected with the pumping mouth of pipe, controlled
Tool plate surface is provided with working panel, flange is provided with working panel outer rim, the working panel surface is provided with present count
The chip slot of amount, chip trench bottom are provided with the stomata being connected with the gas circuit of predetermined number, connected on the outside of the jig plate
It is connected to vibrating mechanism；The intraoral end of exhaust tube is relatively set with limiting plate and portable plate, and the portable plate is with jig plate to cut with scissors
The mode connect is connected, and described limiting plate one end is fixedly connected with jig plate, and the limiting plate other end points to portable plate and towards remote
The direction for being evacuated the mouth of pipe tilts.
Further, the distance of the limiting plate end away from portable plate hinged place is less than the length of the portable plate.
Further, it is provided with blast inductor on the inside of the limiting plate, blast inductor is with vibrating mechanism to electrically connect
Mode be connected.
Further, the pumping mouth of pipe is connected with negative pressure source.
Further, the vibrating mechanism is arranged to horizontal vibration mechanism.
The beneficial effects of the utility model are the working panel and flange of setting, working panel is formed concave structure,
Prevent chip pour into or vibration processes in pour down or forth；The chip slot of setting and its lower stomata and vibrating mechanism set, match somebody with somebody
The gas circuit that is connected with negative pressure is closed, scattered coremaking piece can be made to vacuumize and respectively enter chip slot under effect of vibration, and in core
It is fixed in film trap, the fast positioning of the chip of realization, substantially increase operating efficiency；The portable plate and limiting plate of setting can be real
The unlatching of path is now vacuumized, and makes portable plate be in contact with limiting plate to be formed with the close of certain negative pressure after end is vacuumized
Space is closed, certain suction-operated is played to chip, prevents pouring down or forth and shifting for jig plate transfer process chips, it is solid beneficial to improving
Brilliant accuracy；The blast inductor electrically connected with vibrating mechanism set automatic after chip adsorbs can close bobbing machine
Structure and negative pressure source, realize that core completely stops, avoid the waste of the energy and excessively vacuumize the damage to caused by equipment.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is A-A of the present utility model to cross section structure diagram；
Fig. 3 is mplifying structure schematic diagram at the utility model B；
Fig. 4 is the structural representation of the utility model chip slot.
In figure：1. jig plate, the 2. pumping mouths of pipe, 3. gas circuits, 4. working panels, 5. flanges, 6. chip slots, 7. stomatas, 8.
Vibrating mechanism, 9. portable plates, 10. limiting plates.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining this
Utility model, it is not used to limit the utility model.
As Figure 1-Figure 4, the utility model discloses a kind of die bond chip tool, including jig plate 1, jig plate 1 one
Side is provided with the pumping mouth of pipe 2, and jig plate 1 is internally provided with the gas circuit 3 being connected with the pumping mouth of pipe 2, outside by being evacuated the mouth of pipe 2
Vacuumizing can make to form negative pressure in gas circuit 3, be provided with flange 5 at the outer rim of working panel 4, outside the surface working panel 4 of jig plate 1
Flange 5 is provided with edge, working panel 4 is concave relative to flange 5, to prevent chip pouring down or forth on working panel 4,
The surface of working panel 4 is provided with the chip slot 6 of predetermined number, and the bottom of chip slot 6 is being provided with predetermined number with the gas
The stomata 7 that road 3 is connected, the size of chip slot 6 are adapted with chip, so that chip is smoothly fallen into chip slot 6, and are covered
Firmly stomata 7 forms confined space, the progress conveniently vacuumized, and the outside of jig plate 1 is connected with vibrating mechanism 8.
The pumping mouth of pipe 2 the inner described in the utility model is relatively set with limiting plate 10 and portable plate 9, the portable plate 9
It is connected in articulated manner with jig plate 1, described one end of limiting plate 10 is fixedly connected with jig plate 1, the other end of limiting plate 10
Point to portable plate 9 and tilted towards the direction away from the pumping mouth of pipe 2；It is in contact, takes out true with limiting plate 10 under the original state of portable plate 9
The dextrorotation of portable plate 9, which makes to be formed between gas circuit 3 and the pumping mouth of pipe 2, under dummy status vacuumizes path, and portable plate 9 is multiple after vacuumizing end
Position, and the left-handed of portable plate 9 is prevented in the presence of limiting plate 10, keep certain negative pressure in gas circuit 3.
Distance of the end of limiting plate 10 described in the utility model away from the hinged place of portable plate 9 is less than the length of the portable plate 9
Degree, can make limiting plate 10 play portable plate 9 and effectively limit its left-handed effect.
The inner side of limiting plate described in the utility model 10 is provided with blast inductor, blast inductor and vibrating mechanism 8 with
The mode of electrical connection is connected.
The pumping mouth of pipe 2 described in the utility model is connected with negative pressure source.
Vibrating mechanism 8 described in the utility model is arranged to horizontal vibration mechanism, to the chip on back work panel 4
Fall into chip slot 6.
Implementation process of the present utility model is：Scattered coremaking piece is poured into working panel 4, opens vibrating mechanism 8 and negative pressure
Source switch, portable plate 9 dextrorotation, which is opened gas circuit 3 and is evacuated between the mouth of pipe 2, vacuumizes path, is vacuumizing and horizontal vibration
Under effect, chip is finally fallen into chip slot 6 by working panel 4 and covers corresponding stomata 7, when equal in whole chip slots 6
After inserting chip, vacuumize that air pressure in path is excessive, the blast inductor on limiting plate 10 senses that blast exceedes and pre-seted, then
The vibrating mechanism 8 being electrically connected stops, and completes operation, simultaneously closes off negative pressure source, portable plate 9 be then reset to again with limiting plate
It is in contact, keeps certain negative pressure in path, certain suction-operated is played to chip, prevents pouring down or forth for chip.
The utility model makes working panel 4 form concave structure, prevents core by the working panel 4 and flange 5 of setting
Piece pour into or vibration processes in pour down or forth；The chip slot 6 of setting and its lower stomata 7 and vibrating mechanism 8 set, coordinate with
The connected gas circuit 3 of negative pressure, it can make to dissipate coremaking piece and vacuumize and respectively enterd under effect of vibration 6 in chip slot, and in chip
It is fixed in groove 6, the fast positioning of the chip of realization, substantially increase operating efficiency；The portable plate 9 and limiting plate 10 of setting can
The unlatching for vacuumizing path is realized, and makes portable plate 9 be in contact to be formed with certain negative with limiting plate 10 after end is vacuumized
The confined space of pressure, certain suction-operated is played to chip, prevent pouring down or forth and shifting for jig plate transfer process chips, be beneficial to
Improve the accuracy of die bond；The blast inductor electrically connected with vibrating mechanism 8 set automatic after chip adsorbs can close
Vibrating mechanism 8 and negative pressure source are closed, realizes that core completely stops, the waste of the energy is avoided and excessively vacuumizes the damage to caused by equipment.
Claims (5)
1. die bond chip tool, including jig plate（1）, it is characterised in that jig plate（1）Side is provided with the pumping mouth of pipe（2）, control
Has plate（1）It is internally provided with and the pumping mouth of pipe（2）The gas circuit being connected（3）, jig plate（1）Surface is provided with working panel（4）,
Working panel（4）Flange is provided with outer rim（5）, the working panel（4）Surface is provided with the chip slot of predetermined number（6）,
Chip slot（6）Bottom is being provided with predetermined number with the gas circuit（3）The stomata being connected（7）, the jig plate（1）Outside connects
It is connected to vibrating mechanism（8）；The pumping mouth of pipe（2）The inner is relatively set with limiting plate（10）And portable plate（9）, the portable plate
（9）With jig plate（1）It is connected in articulated manner, the limiting plate（10）One end and jig plate（1）It is fixedly connected, limiting plate
（10）The other end points to portable plate（9）And towards away from the pumping mouth of pipe（2）Direction tilt.
2. die bond chip tool according to claim 1, it is characterised in that the limiting plate（10）End is away from portable plate
（9）The distance of hinged place is less than the portable plate（9）Length.
3. die bond chip tool according to claim 1, it is characterised in that the limiting plate（10）Inner side is provided with blast
Inductor, blast inductor and vibrating mechanism（8）It is connected in a manner of electrical connection.
4. die bond chip tool according to claim 1, it is characterised in that the pumping mouth of pipe（2）It is connected with negative pressure source
Connect.
5. the die bond chip tool described in claim 1, it is characterised in that the vibrating mechanism（8）It is arranged to horizontal vibration machine
According to structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720990817.7U CN207009471U (en) | 2017-08-09 | 2017-08-09 | Die bond chip tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720990817.7U CN207009471U (en) | 2017-08-09 | 2017-08-09 | Die bond chip tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207009471U true CN207009471U (en) | 2018-02-13 |
Family
ID=61458976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720990817.7U Active CN207009471U (en) | 2017-08-09 | 2017-08-09 | Die bond chip tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207009471U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108565153A (en) * | 2018-06-10 | 2018-09-21 | 浙江博众电气有限公司 | A kind of package system of patch type touch-switch |
| CN111490041A (en) * | 2020-04-17 | 2020-08-04 | 宁波升谱光电股份有限公司 | Mini L ED dot matrix lighting equipment and manufacturing method thereof |
-
2017
- 2017-08-09 CN CN201720990817.7U patent/CN207009471U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108565153A (en) * | 2018-06-10 | 2018-09-21 | 浙江博众电气有限公司 | A kind of package system of patch type touch-switch |
| CN111490041A (en) * | 2020-04-17 | 2020-08-04 | 宁波升谱光电股份有限公司 | Mini L ED dot matrix lighting equipment and manufacturing method thereof |
| CN111490041B (en) * | 2020-04-17 | 2022-05-17 | 宁波升谱光电股份有限公司 | Mini LED dot matrix lighting equipment and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 273100 No. 166 Chunqiu East Road, Qufu City, Jining City, Shandong Province Patentee after: Shandong crystal guided microelectronic Limited by Share Ltd Address before: 273100 No. 166 Chunqiu East Road, Qufu City, Jining City, Shandong Province Patentee before: Shandong Jing Dao Microtronics A/S |