CN207009411U - High-accuracy semiconductor production equipment pedestal - Google Patents
High-accuracy semiconductor production equipment pedestal Download PDFInfo
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- CN207009411U CN207009411U CN201720812639.9U CN201720812639U CN207009411U CN 207009411 U CN207009411 U CN 207009411U CN 201720812639 U CN201720812639 U CN 201720812639U CN 207009411 U CN207009411 U CN 207009411U
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- framework
- production equipment
- bottom girder
- semiconductor production
- top plate
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 9
- 239000010959 steel Substances 0.000 claims abstract description 9
- 238000009434 installation Methods 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 7
- 238000009423 ventilation Methods 0.000 claims description 2
- 238000012423 maintenance Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- 208000020442 loss of weight Diseases 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a kind of high-accuracy semiconductor production equipment pedestal, including：Top plate, frame structure and lower margin；Frame structure includes framework back timber, framework bottom girder and upright of frame；Framework back timber and framework bottom girder support to form frame structure by multiple upright of frame；Framework back timber upper surface is removably connected with top plate, and the mounting hole for mounting foot of rule setting is evenly equipped with framework bottom girder；Lower margin one end is bolted on the mounting hole of framework bottom girder, and the other end is fixed on the upper surface on floor.High-accuracy semiconductor production equipment pedestal described in the utility model, the characteristics of with versatility, light weight and associativity, by dismountable top plate, different pedestals can realize exchange, reduce the workload that pedestal makes, pedestal later period maintenance is convenient, the frame structure that frivolous square steel tube makes, both can guarantee that enough bearing capacities, and had had microvibration-preventing function, and can reasonably mitigates the weight of pedestal simultaneously, saves cost of manufacture.
Description
Technical field
Equipment base is the utility model is related to, specifically a kind of high-accuracy semiconductor production equipment pedestal.
Background technology
At present, there is overweight weight, movement difficulty, in-site installation inconvenience, versatility and associativity in semiconductor equipment pedestal
The problem of poor.
Although the base framework bearing capacity that thick steel square tube makes is enough, anti-microseism ability is poor, can not meet semiconductor
To the requirement of anti-microseism in equipment running process, and frame weight is overweight, and cost of manufacture is larger.
Top plate and the design of framework monoblock type so that pedestal difficulty in manufacturing process increases, and versatility and associativity
Extreme difference, in-site installation inconvenience, later period maintenance are difficult.In addition, the pedestal of fixed lower margin design, place bad adaptability.
Utility model content
According to technical problem set forth above, and a kind of high-accuracy semiconductor production equipment pedestal is provided, it is existing for solving
With the presence of semiconductor equipment pedestal weight is overweight, mobile difficult, in-site installation inconvenience, versatility and the problem of associativity difference.
The technological means that the utility model uses is as follows：
A kind of high-accuracy semiconductor production equipment pedestal, including：Top plate, frame structure and lower margin；Described frame structure
Including framework back timber, framework bottom girder and upright of frame；Described framework back timber and framework bottom girder is supported by multiple upright of frame
Form frame structure；Described framework back timber upper surface is removably connected with top plate, uniform regular on described framework bottom girder
The mounting hole for mounting foot set；Described lower margin one end is bolted on the mounting hole of framework bottom girder
On, the other end is fixed on the upper surface on floor.
As the square hole being machined with preferably described top plate for semiconductor equipment installation.
It is the framework that frivolous square steel tube is made as preferably described frame structure.
Fixation is bolted as preferably described framework back timber and top plate.
As the air vent that circle is evenly equipped with preferably described floor, when lower margin be located at the top in floor ventilation hole, tune
Installation site of the site preparation pin in framework bottom girder mounting hole.
Long 150mm, wide 100mm, the high 6mm support body formed as preferably described framework back timber for square tubes soldering；Institute
The framework bottom girder stated is long 100mm, wide 100mm, the high 6mm support body that square tubes soldering forms；Described upright of frame is square tube
Long 100mm, wide 100mm, the high 6mm support body being welded.
It is 180mm-220mm as the gap between the preferred adjacent mounting hole, the gap between the adjacent air vent is
700mm-800mm。
It is 200mm as the gap between the preferred adjacent mounting hole, the gap between the adjacent air vent is 750mm.
Compared with prior art, high-accuracy semiconductor production equipment pedestal described in the utility model, have versatility,
The characteristics of light weight and associativity, by dismountable top plate, different pedestals can realize exchange, reduce the work that pedestal makes
Amount, pedestal later period maintenance is convenient, the frame structure that frivolous square steel tube makes, both can guarantee that enough bearing capacities, and had had microvibration-preventing
Function, while and can reasonably mitigates the weight of pedestal, saves cost of manufacture；The lower margin of adjustment position, which is set, can meet different fields
Ground requirement.
High-accuracy semiconductor production equipment pedestal described in the utility model, in the case of requirement for bearing capacity is met, pedestal
Overall weight than conventional susceptor can loss of weight 20%, greatly save cost of manufacture.
Brief description of the drawings
The utility model is described in further detail with reference to the accompanying drawings and detailed description.
Fig. 1 is the utility model structure diagram.
Fig. 2 is the utility model top plate and framework dismounting schematic diagram.
Fig. 3 is the utility model lower margin structural representation.
Fig. 4-1 is that the utility model can adjust lower margin schematic diagram 1.
Fig. 4-2 is that the utility model can adjust lower margin schematic diagram 2.
Wherein：1st, pedestal, 10, top plate, 20, frame structure, 30, lower margin, 40, floor, 11, square hole, 21, framework top
Beam, 22, framework bottom girder, 23, upright of frame, 24, mounting hole, 41, air vent.
Embodiment
As shown in Fig. 1 to Fig. 3, a kind of high-accuracy semiconductor production equipment pedestal, pedestal 1 includes：Top plate 10, frame structure
20 and lower margin 30；Described frame structure 20 is the framework that frivolous square steel tube is made.
Described frame structure 20 includes framework back timber 21, framework bottom girder 22 and upright of frame 23；Described framework back timber
21 and framework bottom girder 22 by multiple upright of frame 23 support form frame structure 20.Described framework back timber 21, framework bottom girder
Korea Spro connects fixation between 22 and upright of frame 23.
The described upper surface of framework back timber 21 is removably connected with top plate 10, and described framework back timber 21 and top plate 10 pass through
Bolt connection is fixed.Described top plate 10 is made up of steel plate.
The square hole 11 for semiconductor equipment installation is machined with described top plate 10, for meeting semiconductor equipment
Installation requirements.
The mounting hole 24 for mounting foot 30 of rule setting is evenly equipped with described framework bottom girder 22；Described floor
The air vent 41 of circle is evenly equipped with 40.Described one end of lower margin 30 is bolted on the mounting hole of framework bottom girder 22
On 24, the other end is fixed on the upper surface on floor 40, as shown in Fig. 4-1 and Fig. 4-2.When lower margin 30 is located at the air vent 41 of floor 40
Top, adjustment lower margin 30 the mounting hole 24 of framework bottom girder 22 installation site.
Described framework back timber 21 is long 150mm, wide 100mm, the high 6mm support body that square tubes soldering forms；Described frame
Frame bottom girder 22 is long 100mm, wide 100mm, the high 6mm support body that square tubes soldering forms；Described upright of frame 23 welds for square tube
Long 100mm, wide 100mm, the high 6mm support body connect, to meet installation strength requirement.
Gap between the adjacent mounting hole 24 is 180mm-220mm, and the gap between the adjacent air vent 41 is
700mm-800mm.Preferably, the gap between the adjacent mounting hole 24 is 200mm, and the gap between the adjacent air vent 41 is
750mm, to meet adjustment requirement of the lower margin 30 on mounting hole 24, avoid air vent 41.
High-accuracy semiconductor production equipment pedestal described in the utility model, the top plate 10 is in rectangular configuration, top plate 10
It is dismountable so that pedestal difficulty in manufacturing process is reduced, and versatility and associativity are good, and in-site installation is convenient, later stage dimension
Repair simple.
Described frame structure 20 uses frivolous square steel tube light-weight design, on the framework bottom girder 22 of the frame structure 20
Provided with row's circular mounting hole 24；The lower margin 30 can adjust its position according to place situation on row's circular mounting hole.
Due to there is the air vent 41 of many circles in semiconductor equipment cell floor 40, so lower margin 30 is being pacified by adjustment
The position on hole 24 is filled, or by multiple lower margins 30 and for preventing lower margin 30 to be absorbed in air vent 41.
As shown in Fig. 4-1, when the face air vent 41 of lower margin 30 of installation site, dismounting are lower positioned at the ground of the top of air vent 41
Pin 30, it is re-installed on the mounting hole 24 of framework bottom girder 22, lower margin 30 is located at outside air vent 41, realizes that firm connection is solid
It is fixed.
High-accuracy semiconductor production equipment pedestal described in the utility model, there is versatility, light weight and associativity
Feature, by dismountable top plate 10, meet the requirement that different pedestals 1 exchange, reduce the workload that pedestal makes, be more convenient base
Seat later period maintenance；The frame structure 20 that frivolous square steel tube makes, both can guarantee that enough bearing capacities, and had had microvibration-preventing function, together
When and can reasonably mitigate the weight of pedestal, save cost of manufacture；The lower margin of adjustment position, which is set, can meet different site requirements.
It is described above, the only preferable embodiment of the utility model, but the scope of protection of the utility model is not
This is confined to, any one skilled in the art is in the technical scope that the utility model discloses, according to this practicality
New technical scheme and its utility model design are subject to equivalent substitution or change, should all cover in protection model of the present utility model
Within enclosing.
Claims (8)
- A kind of 1. high-accuracy semiconductor production equipment pedestal, it is characterised in that including：Top plate, frame structure and lower margin；Described frame structure includes framework back timber, framework bottom girder and upright of frame；Described framework back timber and framework bottom girder supports to form frame structure by multiple upright of frame；Described framework back timber upper surface is removably connected with top plate, and being used for for rule setting is evenly equipped with described framework bottom girder The mounting hole of mounting foot；Described lower margin one end is bolted on the mounting hole of framework bottom girder, and the other end is fixed on the upper table on floor Face.
- 2. high-accuracy semiconductor production equipment pedestal according to claim 1, it is characterised in that：The square hole for semiconductor equipment installation is machined with described top plate.
- 3. high-accuracy semiconductor production equipment pedestal according to claim 1 or 2, it is characterised in that：Described framework knot Structure is the framework that frivolous square steel tube is made.
- 4. high-accuracy semiconductor production equipment pedestal according to claim 1 or 2, it is characterised in that：Described framework back timber and top plate are bolted fixation.
- 5. high-accuracy semiconductor production equipment pedestal according to claim 1 or 2, it is characterised in that：The air vent of circle is evenly equipped with described floor, when lower margin is located at the top in floor ventilation hole, adjustment lower margin is in framework The installation site of bottom girder mounting hole.
- 6. high-accuracy semiconductor production equipment pedestal according to claim 1 or 2, it is characterised in that：Described framework back timber is long 150mm, wide 100mm, the high 6mm support body that square tubes soldering forms；Described framework bottom girder is long 100mm, wide 100mm, the high 6mm support body that square tubes soldering forms；Described upright of frame is long 100mm, wide 100mm, the high 6mm support body that square tubes soldering forms.
- 7. high-accuracy semiconductor production equipment pedestal according to claim 5, it is characterised in that：Gap between the adjacent mounting hole is 180mm-220mm, and the gap between the adjacent air vent is 700mm-800mm.
- 8. high-accuracy semiconductor production equipment pedestal according to claim 7, it is characterised in that：Gap between the adjacent mounting hole is 200mm, and the gap between the adjacent air vent is 750mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720812639.9U CN207009411U (en) | 2017-07-06 | 2017-07-06 | High-accuracy semiconductor production equipment pedestal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720812639.9U CN207009411U (en) | 2017-07-06 | 2017-07-06 | High-accuracy semiconductor production equipment pedestal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207009411U true CN207009411U (en) | 2018-02-13 |
Family
ID=61453392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720812639.9U Active CN207009411U (en) | 2017-07-06 | 2017-07-06 | High-accuracy semiconductor production equipment pedestal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207009411U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114809285A (en) * | 2022-03-18 | 2022-07-29 | 鞍钢重型机械有限责任公司 | Assembled floor iron and using method |
-
2017
- 2017-07-06 CN CN201720812639.9U patent/CN207009411U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114809285A (en) * | 2022-03-18 | 2022-07-29 | 鞍钢重型机械有限责任公司 | Assembled floor iron and using method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230516 Address after: No. 16, Zhenxing Street, Pulandian District, Dalian, Liaoning Province, 116000 Patentee after: Dalian Dituo Electronic Engineering Technology Co.,Ltd. Address before: 116000 16 Zhenxing street, Haiwan Industrial Zone, Pulandian District, Dalian, Liaoning Province Patentee before: DALIAN DEETOP HEAVY INDUSTRY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 16, Zhenxing Street, Pulandian District, Dalian, Liaoning Province, 116000 Patentee after: Dalian Dituo Precision Technology Co.,Ltd. Address before: No. 16, Zhenxing Street, Pulandian District, Dalian, Liaoning Province, 116000 Patentee before: Dalian Dituo Electronic Engineering Technology Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |