CN206989552U - A kind of semiconductor freezer - Google Patents
A kind of semiconductor freezer Download PDFInfo
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- CN206989552U CN206989552U CN201720910756.9U CN201720910756U CN206989552U CN 206989552 U CN206989552 U CN 206989552U CN 201720910756 U CN201720910756 U CN 201720910756U CN 206989552 U CN206989552 U CN 206989552U
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- casing
- semiconductor
- chilling plate
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- semiconductor chilling
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Abstract
The utility model discloses a kind of semiconductor freezer, including refrigerator doors, casing and refrigerating plant, the side of chamber door and casing is flexibly connected;Refrigerating plant includes battery, semiconductor chilling plate and nano-fluid cooling mechanism, and semiconductor chilling plate is connected with battery and nano-fluid cooling mechanism respectively, during semiconductor chilling plate is arranged on the inwall of casing;Nano-fluid cooling mechanism includes circulation pipe and the medium storage bin for storage nano fluid, and circulation pipe is connected with medium storage bin and forms loop, and circulation pipe is connected with semiconductor chilling plate.Semiconductor freezer of the present utility model uses heat eliminating medium of the nano-fluid as semiconductor chilling plate hot junction, instead of air-cooled cooling, nano-fluid be it is uniform, stably, the novel heat exchange medium of high heat conduction, effectively solve the problems, such as semiconductor freezer heat dispersal situations difference, improve the refrigeration of semiconductor freezer.
Description
Technical field
Household appliance technical field is the utility model is related to, more particularly to a kind of semiconductor freezer.
Background technology
Refrigerator is to maintain a kind of refrigeration plant of constant low temperature, and one kind makes food or other articles keep constant low temperature
The product for civilian use of cold conditions.According to《2013-2017 China refrigerator industry market is looked forward to the prospect reports with Analysis of Investment Opportunities》Statistical
Analysis, according to the difference of classification, operation principle has following several refrigerator:Compressed steam refrigeration device:This kind of refrigerator is provided by motor
Mechanical energy, by compressor to refrigeration system work done, refrigeration system utilizes lower boiling refrigerant, absorbs heat during carburation by evaporation
Principle made of, its advantage is long lifespan, easy to use, and it is a kind of to belong to this for 91~95% refrigerator in the world;It is absorption
Refrigerator:This kind of refrigerator can be molten using ammonia-water-hydrogen mixing by the use of thermal source (such as coal gas, kerosene, electricity) as power
Liquid reaches the purpose of refrigeration in continuous absorption-diffusion process, and its shortcoming is that efficiency is low, and cooling is slow, is gradually eliminated;
Chemical refrigerator:It is using some chemical dissolutions when water strong endothermic and obtain the refrigerator of refrigeration;Electric and magnetic oscillation
Formula refrigerator:It is to make this power with electromagnetic vibration machine to drive the refrigerator of compressor.Its principle, structure and compressed steam refrigeration device base
This is identical.
Borne semiconductor refrigerator is also referred to as electronic refrigerator, is a kind of production entirely different with general refrigerator on refrigeration principle
Product, it passes through highly effective ring bilayer heat pipe heat radiation and conduction technique and automatic pressure-transforming Variable flow control technology with a block semiconductor chip
Refrigeration is realized, is called world's minimum " compressor ".Semiconductor freezer is without mechanical transmission component, no abrasion, noiseless, life-span
It is long;And without chiller refrigeration (compression and absorption be required for), definitely environmental protection;Semiconductor freezer efficiency high simultaneously, power consumption
Measure low.But semiconductor freezer is because cooling piece simultaneously radiating, and heat production is more, heat dispersal situations are poor, cause semiconductor freezer
Refrigeration declines.
Therefore, how to improve in the prior art, the present situation of semiconductor freezer heat dispersal situations difference, improve semiconductor freezer refrigeration
Effect, it is those skilled in the art's urgent problem to be solved.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor freezer, to solve the above-mentioned problems of the prior art, changes
Kind semiconductor freezer heat dissipating state, makes the refrigeration of semiconductor freezer get a promotion.
To achieve the above object, the utility model provides following scheme:The utility model provides a kind of semiconductor freezer,
Including refrigerator doors, casing and refrigerating plant, the side of the chamber door and the casing is flexibly connected;
The refrigerating plant includes battery, semiconductor chilling plate and nano-fluid cooling mechanism, the semiconductor refrigerating
Piece is connected with the battery and the nano-fluid cooling mechanism respectively, and the semiconductor chilling plate is arranged at the casing
In on inwall;The nano-fluid cooling mechanism includes circulation pipe and the medium storage bin for storage nano fluid, described to follow
Endless tube is connected with the medium storage bin and forms loop, and the circulation pipe is connected with the semiconductor chilling plate.
Preferably, semiconductor freezer also includes backboard, and the backboard is connected with the casing and forms refrigerator back cavity, described
Backboard is respectively arranged at the relative both sides of the casing with the refrigerator doors, and the nano-fluid cooling mechanism is arranged at described
In refrigerator back cavity.
Preferably, heat emission hole is opened up on the backboard, the backboard is detachably connected with the casing.
Preferably, semiconductor freezer also includes finned tube, and the finned tube abuts with the semiconductor chilling plate, the wing
Piece pipe is S-shaped or spiral yarn shaped setting.
Preferably, semiconductor freezer also includes fan, and the fan is connected with the battery, the fan and described half
Conductor cooling piece is respectively arranged at the both sides of the finned tube.
Preferably, semiconductor freezer also includes circulating pump, and the circulating pump is connected with the medium storage bin, described to follow
Ring pump is connected with the battery.
Preferably, the circulation pipe and the semiconductor chilling plate connecting place be S-shaped or spiral yarn shaped arrangement.
Preferably, the refrigerator doors, the casing are hollow-core construction, filling-foam in the refrigerator doors, the casing
Agent filler, handle is set in the refrigerator doors, a side and the casing of the refrigerator doors connect with hinge, the refrigerator
Sealing joint strip is set between door and the casing.
Preferably, the bottom of the casing sets four supporting legs, and the supporting leg includes pillar and base, the pillar and institute
State casing to be fixedly connected, the pillar is detachably connected with the base.
Preferably, the base is hollow circular cone structure, and the base is threadedly coupled with the pillar, the pillar
Threaded portion the length base threaded portion length length, the bottom of the base sets the pad of annular.
The utility model achieves following beneficial effect relative to prior art:Semiconductor freezer of the present utility model, bag
Refrigerator doors, casing and refrigerating plant are included, refrigerating plant includes battery, semiconductor chilling plate and nano-fluid cooling mechanism, and half
Conductor cooling piece is connected with battery and nano-fluid cooling mechanism respectively, and semiconductor chilling plate is arranged in the inner chamber of casing;
Nano-fluid cooling mechanism includes circulation pipe and the medium storage bin for storage nano fluid, circulation pipe and medium storage bin phase
Connect and form loop, circulation pipe is connected with semiconductor chilling plate.Semiconductor freezer of the present utility model is made using nano-fluid
For the heat eliminating medium in semiconductor chilling plate hot junction, instead of air-cooled cooling, nano-fluid be it is uniform, stably, the new of high heat conduction change
Thermal medium, effectively solve the problems, such as semiconductor freezer heat dispersal situations difference, improve the refrigeration of semiconductor freezer.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description are only of the present utility model
Some embodiments, for those of ordinary skill in the art, without having to pay creative labor, can also basis
These accompanying drawings obtain other accompanying drawings.
Fig. 1 is the overall cross-sectional view of semiconductor freezer of the present utility model;
Fig. 2 is the cross-sectional view of the supporting leg of semiconductor freezer of the present utility model;
Wherein, 1 is refrigerator doors, and 2 be casing, and 3 be refrigerating plant, and 4 be battery, and 5 be semiconductor chilling plate, and 6 be nanometer
Fluid for radiating heat mechanism, 601 be circulation pipe, and 602 be nano-fluid storage bin, and 7 be backboard, and 8 be refrigerator back cavity, and 9 be finned tube, 10
It is circulating pump for fan, 11,12 be handle, and 13 be supporting leg, and 1301 be pillar, and 1302 be base, and 1303 be pad.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
The purpose of this utility model is to provide a kind of semiconductor freezer, to solve the above-mentioned problems of the prior art, changes
Kind semiconductor freezer heat dissipating state, makes the refrigeration of semiconductor freezer get a promotion.
To enable above-mentioned purpose of the present utility model, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings and tool
Body embodiment is described in further detail to the utility model.
Fig. 1 to Fig. 2 is refer to, Fig. 1 is the overall cross-sectional view of semiconductor freezer of the present utility model, and Fig. 2 is
The cross-sectional view of the supporting leg of semiconductor freezer of the present utility model.
The utility model provides a kind of semiconductor freezer, including refrigerator doors 1, casing 2 and refrigerating plant 3, chamber door 1 and casing
2 side is flexibly connected;
Refrigerating plant 3 includes battery 4, semiconductor chilling plate 5 and nano-fluid cooling mechanism 6, and semiconductor chilling plate 5 divides
It is not connected with battery 4 and nano-fluid cooling mechanism 6, semiconductor chilling plate 5 is arranged on the inwall of casing 2;Nano-fluid
Cooling mechanism 6 includes circulation pipe 601 and the medium storage bin 602 for storage nano fluid, circulation pipe 601 and medium storage bin
602 are connected and form loop, and circulation pipe 601 is connected with semiconductor chilling plate 5.
Semiconductor freezer of the present utility model uses semiconductor chilling plate 5 as refrigeration for refrigerator, and battery 4 is semiconductor refrigerating
Piece 5 provides power resources, the heating when turning cold after semiconductor chilling plate 5 is powered, and its cold end is used for the system of the inner chamber of casing 2
Cold, the hot junction of semiconductor chilling plate 5 is connected with the circulation pipe 601 of nano-fluid cooling mechanism 6, nano-fluid be it is uniform, stably,
The novel heat exchange medium of high heat conduction, nano-fluid constantly circulate, and are reached for what the hot junction of semiconductor chilling plate 5 was radiated
Purpose, effectively solve the problems, such as semiconductor freezer heat dispersal situations difference, improve the refrigeration of semiconductor freezer.In this specific implementation
In mode, circulation pipe 601 sets the pipeline of fin to be made using surface, and fin can increase circulation pipe 601 to greatest extent
Area of dissipation, improve radiating efficiency.
In other embodiments of the present utility model, battery 4 sets switch, and switch is arranged on casing 2, side
Convenient to operate person controls;Fan can also be set at medium storage bin 602, radiated to absorb the nano-fluid after heat,
Ensure that nano-fluid circulates in circulation pipe 601 constantly to radiate for the hot junction of semiconductor chilling plate 5.
Specifically, semiconductor freezer also includes backboard 7, and backboard 7 is connected with casing 2 and forms refrigerator back cavity 8, backboard 7 with
Refrigerator doors 1 are respectively arranged at the relative both sides of casing 2, and nano-fluid cooling mechanism 6 is arranged in refrigerator back cavity 8.In refrigerator
Rear portion backboard 7 is set, the refrigerator back cavity 8 with receiving space is formed between backboard 7 and casing 2, nano-fluid is radiated machine
Structure 6 is arranged in refrigerator back cavity 8, and appearance is neatly clean, and aesthetics is high, while the setting of backboard 7, is avoided and is removed in refrigerator transfer
Circulation pipe 601 is damaged during fortune, while avoids the dust stratification of nano-fluid cooling mechanism 6, influences normal work, mitigates cleaning burden.
Heat emission hole is opened up on backboard 7, it is ensured that backboard 7 does not interfere with the radiating work of nano-fluid cooling mechanism 6, meanwhile,
Backboard 7 is detachably connected with casing 1, convenient maintenance, the progress of maintenance work.
More specifically, semiconductor freezer also includes finned tube 9, finned tube 9 abuts with semiconductor chilling plate 5, between finned tube 9
The contact area for increasing the cold end of semiconductor chilling plate 5 and the cavity medium of casing 2 is connect, is made caused by the cold end of semiconductor chilling plate 5
Cold energy faster, is more uniformly delivered in the cavity of casing 2.In present embodiment, the S-shaped distribution of finned tube 9 is set
In the cold end of semiconductor chilling plate 5, the finned tube 9 and the plate contact of the cold end of semiconductor chilling plate 5 of S-shaped distribution, and maximum limit
Degree ground increase cold energy and the contact area of the cavity medium of casing 2, it is that the cold end of semiconductor chilling plate 5 propagates cold energy, simultaneously
Reduce the space that finned tube 9 takes as far as possible;In other embodiments of the present utility model, finned tube 9 can also be set
Into shapes such as spiral yarn shaped or " returning " fonts.
At the same time, semiconductor freezer also includes fan 10, and fan 10 is connected with battery 4, fan 10 and semiconductor system
Cold 5 both sides for being respectively arranged at finned tube 9, the setting of fan 10 accelerate cold energy caused by the cold end of semiconductor chilling plate 5
Transmission speed.Battery 4 is that fan 10 provides power resources, in other embodiments of the present utility model, electric power storage
Switch is set on the circuit that pond 4 is connected with fan 10, and switch is arranged on the madial wall of casing 2, is easy to control opening for fan 10
Stop, reasonable energy utilization.
More specifically, semiconductor freezer also includes circulating pump 11, circulating pump 11 is connected with medium storage bin 602, circulation
Pump 11 is connected with battery 4, and circulating pump 11 provides dynamic for the preferably circulation cooling of the nano-fluid in medium storage bin 602
Power.
Circulation pipe 601 and the connecting place of semiconductor chilling plate 5 are S-shaped or spiral yarn shaped arrangement, circulation pipe 601 store with medium
Case 602 is connected, meanwhile, the hot junction of circulation pipe 601 and semiconductor chilling plate 5 abuts against, preferably to take away semiconductor refrigerating
Heat caused by the hot junction of piece 5, the part that the hot junction of circulation pipe 601 and semiconductor chilling plate 5 abuts against is S-shaped or spiral yarn shaped cloth
Put, the circulation pipe 601 of S-shaped or spiral yarn shaped arrangement is in contact with the panel in the hot junction of semiconductor chilling plate 5, increases to greatest extent
Systemic circulation pipe 601 and the contact area in the hot junction of semiconductor chilling plate 5, increase nano-fluid and the hot junction of semiconductor chilling plate 5 indirectly
Contact area, to reach quick heat radiating, lift the purpose of refrigeration for refrigerator effect.
Further, refrigerator doors 1, casing 2 are hollow-core construction, filling-foam agent filler in refrigerator doors 1, casing 2, are subtracted
Lack refrigerator inside medium and external environment rate of heat exchange, handle 12 is set in refrigerator doors 1, facilitates the unlatching of refrigerator, refrigerator
One side of door 1 connects with hinge with casing 2, sets sealing joint strip between refrigerator doors 1 and casing 2, lifts semiconductor freezer
Refrigeration.
Further, the bottom of casing 2 sets four supporting legs 13, and supporting leg 13 includes pillar 1301 and base 1302, props up
Post 1301 is fixedly connected with casing 1302, and pillar 1301 is detachably connected with base 1302.The setting of supporting leg 13 facilitates refrigerator
Put, prevent from influenceing refrigerator doors 1 because of the frictional force between the thing such as refrigerator doors 1 and ground normally-open, or even damage refrigerator
Door 1.
Wherein, base 1302 is hollow circular cone structure, and base 1302 is threadedly coupled with pillar 1301, pillar 1301
The length of threaded portion compared with the threaded portion of base 1302 length grow, when refrigerator is placed, can according to place smooth degree,
By the length of the precession base 1302 of pillar 1301, supporting leg 13 is finely adjusted, the bottom of base 1302 sets the pad of annular
Piece 1303, prevents refrigerator from sliding, and lifts Consumer's Experience.
The one of semiconductor freezer of the present utility model, including refrigerator doors 1, casing 2 and refrigerating plant 3, chamber door 1 and casing 2
Side is flexibly connected;Refrigerating plant 3 includes battery 4, semiconductor chilling plate 5 and nano-fluid cooling mechanism 6, semiconductor chilling plate
5 are connected with battery 4 and nano-fluid cooling mechanism 6 respectively, and semiconductor chilling plate 5 is arranged on the inwall of casing 2;Nanometer stream
Body cooling mechanism 6 includes circulation pipe 601 and the medium storage bin 602 for storage nano fluid, and circulation pipe 601 stores with medium
Case 602 is connected and forms loop, and circulation pipe 601 is connected with semiconductor chilling plate 5.Semiconductor chilling plate 5 simultaneously becomes after being powered
Cold one side heating, its cold end are used for the refrigeration of the inner chamber of casing 2, and the cold end of semiconductor chilling plate abuts with finned tube 9, accelerate system
It is cold;The hot junction of semiconductor chilling plate 5 abuts with the circulation pipe 601 of built-in nano-fluid, and nano-fluid constantly circulates, and reaches
The purpose to be radiated for the hot junction of semiconductor chilling plate 5, effectively solve the problems, such as semiconductor freezer heat dispersal situations difference, improve half
The refrigeration of conductor refrigerator.
Apply specific case in the utility model to be set forth principle of the present utility model and embodiment, the above
The explanation of embodiment is only intended to help and understands method and its core concept of the present utility model;Meanwhile for the one of this area
As technical staff, according to thought of the present utility model, there will be changes in specific embodiments and applications.To sum up
Described, this specification content should not be construed as to limitation of the present utility model.
Claims (10)
- A kind of 1. semiconductor freezer, it is characterised in that:Including refrigerator doors, casing and refrigerating plant, the chamber door and the casing Side be flexibly connected;The refrigerating plant includes battery, semiconductor chilling plate and nano-fluid cooling mechanism, the semiconductor chilling plate point It is not connected with the battery and the nano-fluid cooling mechanism, the semiconductor chilling plate is arranged at the inwall of the casing In upper;The nano-fluid cooling mechanism includes circulation pipe and the medium storage bin for storage nano fluid, the circulation pipe It is connected with the medium storage bin and forms loop, the circulation pipe is connected with the semiconductor chilling plate.
- 2. semiconductor freezer according to claim 1, it is characterised in that:Also include backboard, the backboard and the casing It is connected and forms refrigerator back cavity, the backboard is respectively arranged at the relative both sides of the casing with the refrigerator doors, described to receive Rice fluid for radiating heat mechanism is arranged in the refrigerator back cavity.
- 3. semiconductor freezer according to claim 2, it is characterised in that:Heat emission hole, the backboard are opened up on the backboard It is detachably connected with the casing.
- 4. semiconductor freezer according to claim 1, it is characterised in that:Also include finned tube, the finned tube with it is described Semiconductor chilling plate abuts, and the finned tube is S-shaped or spiral yarn shaped setting.
- 5. semiconductor freezer according to claim 4, it is characterised in that:Also include fan, the fan and the electric power storage Pond is connected, and the fan and the semiconductor chilling plate are respectively arranged at the both sides of the finned tube.
- 6. semiconductor freezer according to claim 1, it is characterised in that:Also include circulating pump, the circulating pump with it is described Medium storage bin is connected, and the circulating pump is connected with the battery.
- 7. semiconductor freezer according to claim 1, it is characterised in that:The circulation pipe and the semiconductor chilling plate phase S-shaped or spiral yarn shaped arrangement at even.
- 8. semiconductor freezer according to claim 1, it is characterised in that:The refrigerator doors, the casing are hollow knot Structure, filling-foam agent filler in the refrigerator doors, the casing set handle in the refrigerator doors, and the one of the refrigerator doors Side is connected with hinge with the casing, and sealing joint strip is set between the refrigerator doors and the casing.
- 9. semiconductor freezer according to claim 1, it is characterised in that:The bottom of the casing sets four supporting legs, institute Stating supporting leg includes pillar and base, and the pillar is fixedly connected with the casing, and the pillar is detachably connected with the base.
- 10. semiconductor freezer according to claim 9, it is characterised in that:The base is hollow circular cone structure, institute State base to be threadedly coupled with the pillar, the length of the threaded portion of the length base of the threaded portion of the pillar Long, the bottom of the base sets the pad of annular.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201720910756.9U CN206989552U (en) | 2017-07-25 | 2017-07-25 | A kind of semiconductor freezer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720910756.9U CN206989552U (en) | 2017-07-25 | 2017-07-25 | A kind of semiconductor freezer |
Publications (1)
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CN206989552U true CN206989552U (en) | 2018-02-09 |
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ID=61416570
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CN201720910756.9U Expired - Fee Related CN206989552U (en) | 2017-07-25 | 2017-07-25 | A kind of semiconductor freezer |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113503670A (en) * | 2021-07-22 | 2021-10-15 | 顺德职业技术学院 | Multifunctional small-sized beverage storage refrigerator |
CN113551459A (en) * | 2021-07-22 | 2021-10-26 | 顺德职业技术学院 | Refrigerating chamber with adjustable refrigerating space |
-
2017
- 2017-07-25 CN CN201720910756.9U patent/CN206989552U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113503670A (en) * | 2021-07-22 | 2021-10-15 | 顺德职业技术学院 | Multifunctional small-sized beverage storage refrigerator |
CN113551459A (en) * | 2021-07-22 | 2021-10-26 | 顺德职业技术学院 | Refrigerating chamber with adjustable refrigerating space |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180209 Termination date: 20190725 |