CN206983319U - A kind of damping layer punching machine of embedded co-curing composite - Google Patents
A kind of damping layer punching machine of embedded co-curing composite Download PDFInfo
- Publication number
- CN206983319U CN206983319U CN201720914659.7U CN201720914659U CN206983319U CN 206983319 U CN206983319 U CN 206983319U CN 201720914659 U CN201720914659 U CN 201720914659U CN 206983319 U CN206983319 U CN 206983319U
- Authority
- CN
- China
- Prior art keywords
- perforation
- poor glue
- damping
- prepreg
- glue prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
This application discloses a kind of damping layer punching machine of embedded co-curing composite, the punching machine includes the backing plate of the poor glue prepreg of pedestal, cylinder, connector, movable table, placement with damping diaphragm, binder discharging flat board, spring and perforated template with some through holes.Used by the proposition of novel perforations equipment, poor glue prepreg with damping diaphragm is on the premise of hardly reinforcing material is damaged, the poor glue prepreg with damping diaphragm of perforation has been produced, further enhancing the mechanical property and its processing efficiency of embedded co-curing perforation damp composite material.
Description
Technical field
The application belongs to structure function technical field of composite materials, and in particular to a kind of embedded co-curing perforation damping is multiple
The poor glue prepreg punching machine with damping diaphragm of condensation material.
Background technology
Composite makes it in high-tech areas such as Aeronautics and Astronautics because itself has very high specific strength and specific stiffness
Obtain more and more extensive application.Embedded co-curing perforation damp composite material is exactly in existing high performance composites
Basis on, damping material is embedded so that this new material both maintained original fibrous composite intensity and
Rigidity, excellent damping vibration attenuation performance is made it have again, so as to assign the synthesis mechanical property that structure other materials can not be taken into account
Energy.But up to the present, the manufacturing cost of embedded co-curing perforation damp composite material limits it still in higher level
Further apply.Trace it to its cause be typical autoclave method process embedded co-curing perforation damp composite material technique it is more multiple
Miscellaneous, equipment cost is higher.
Therefore, need to develop a kind of resistance that is easy and efficiently making embedded co-curing perforation damp composite material at present
Buddhist nun's layer punching machine, to improving crudy and its mechanical property, promoting it further extensively using significant.
Utility model content
The problem of difficult, the purpose of the application are prepared for embedded co-curing perforation damp composite material in the prior art
It is to provide a kind of damping layer punching machine of embedded co-curing perforation damp composite material.
To achieve these goals, the technical scheme that the application uses is as follows：
A kind of poor glue prepreg punching machine with damping diaphragm, is characterized in：The punching machine include pedestal, cylinder,
The backing plate of the poor glue prepreg of connector, movable table, placement with damping diaphragm, the binder discharging with some through holes are put down
Plate, spring and perforated template, wherein,
The cylinder is arranged on pedestal, and the movable table is connect by connector and cylinders, and cylinder can drive
Movable table makees the movement of above-below direction；The backing plate is placed on movable table；The binder discharging flat board is arranged on
Between backing plate and perforated template, and the movement of above-below direction can be made relative to backing plate and perforated template；The binder discharging flat board with
Spring is provided between perforated template, binder discharging flat board makees the movement of above-below direction by the spring relative to perforated template；It is described
Perforated template is provided with the perforation nail being engaged with the through hole on binder discharging flat board, and the perforation nail is cone column combination body, i.e.,
By the cylinder being connected with perforated template and bullet on the cylinder is set to combine.
Preferably, the material of backing plate can be cork or flexible plastic or foamed material, can be regularly replaced after failure.By band
The poor glue prepreg of damping diaphragm is laid on the backing plate of movable table, and the poor glue prepreg with damping diaphragm is perforated,
Require that the poor glue prepreg perforation with damping diaphragm can not destroy the fiber of individual layer prepreg in perforation, ensure band damping diaphragm
Poor glue prepreg performance it is hardly destroyed, the poor glue prepreg perforation purpose with damping diaphragm is in resin importing process
In, the resin of flowing is passed through well from the upper and lower of whole damping diaphragm so that resin completely homogeneously infiltrates whole insertion
The poor glue prepreg of formula co-curing perforation damp composite material.
For the perforated template, the size than the poor glue prepreg perforation structure preferably with damping diaphragm is hole arrangement
On four angles of square, pitch-row 10mm, aperture 2mm；Certainly poor glue prepreg perforation structure with damping diaphragm
Size can also be hole arrangement on rectangular four angles, by convert the cornerwise direction of rectangle and its pitch-row realize it is whole
The anisotropy of body structural damping performance；Certainly the size of other perforation layout structures can be also designed as requested, obtained specific
Mechanical property outside the damping capacity of direction requirement and face, this forms resin nail work mainly due in damping diaphragm punch position
Result.
Compared with prior art, the technical scheme of the application has the advantages that：
Used by the proposition of novel perforations equipment, the poor glue prepreg with damping diaphragm is hardly damaging reinforcing material
On the premise of, the poor glue prepreg with damping diaphragm of perforation has been produced, further enhancing embedded co-curing perforation resistance
The mechanical property and its processing efficiency of damping composite material.
Brief description of the drawings
The Figure of description for forming the part of the application is used for providing further understanding of the present application, and the application's shows
Meaning property embodiment and its illustrate be used for explain the application, do not form the improper restriction to the application.
Fig. 1 is molded subtraction unit main structure figure；
Fig. 2 lays the lower mould schematic diagram after the poor glue prepreg in bottom；
Poor glue prepreg punching machines of the Fig. 3 with damping diaphragm；
Fig. 4 perforated templates；
Fig. 5 perforated template partial enlarged drawings；
Fig. 6 movable tables (contain backing plate)；
The poor glue prepreg with damping diaphragm of Fig. 7 perforation；
The poor glue prepreg partial enlarged drawing with damping diaphragm of Fig. 8 perforation；
The two-sided poor glue prepreg structure chart with damping diaphragm of Fig. 9 perforation；
Lower mould schematic diagram after Figure 10 laying perforation damping diaphragms；
Lower mould schematic diagram after Figure 11 laying poor glue prepregs in top；
The preforming schematic diagrames of Figure 12；
The embedded co-curing perforation damp composite material ply angles of Figure 13；
The cure profile figure of the embedded co-curing perforation damp composite material moldings of Figure 14；
The embedded co-curing perforation damp composite material mould pressing process flows of Figure 15；
Wherein：1st, resin, 2, resin ingress pipe, 3, valve, 4, upper mould, 5, vacuum tube, 6, vavuum pump, 7, resin trap
Device, 8, lay the composite structure of damping diaphragm, 9, lower mould, 10, the poor glue prepreg in bottom, 11, the band damping of perforation it is thin
The poor glue prepreg of film or the two-sided poor glue prepreg with damping diaphragm of perforation, 12, the poor glue prepreg in top, 13, sealing gasket
Block, 14, the poor glue prepreg of upper individual layer, 15, damping layer made from spread coating or spraying process, 16, the poor glue prepreg of lower individual layer, 17,
Pedestal, 18, cylinder, 19, connector, 20, movable table, 21, perforated template, 22, backing plate, 23, spring, 24, binder discharging
Flat board, 25, the poor glue prepreg with damping diaphragm of perforation, 26, vibrator, 27, amplifier, 28, signal generator.
Embodiment
The application is described further with reference to Fig. 1 to Figure 15 and embodiment：
By taking the composite structure with the poor glue prepreg of damping diaphragm of embedded perforation as an example, a kind of embedded co-curing is worn
The mainly poor glue prepreg processing including perforated tape damping diaphragm, the preimpregnation of poor glue of the die pressing manufacture craft of hole damp composite material
Material and perforated tape damping diaphragm poor glue prepreg lay, be preforming, vacuumizing and resin by injection, frequency sweep impulse standing eliminate
Bubble and Pin Jiao areas, relevant temperature and pressure, recovery room moderate pressure, die sinking taking-up test specimen are controlled according to curing process parameter.
Its primary structure including resin 1, resin ingress pipe 2, valve 3, upper mould 4, vacuum tube 5, vavuum pump 6, resin as shown in figure 1, receive
Storage 7, the composite structure 8 for laying damping diaphragm, lower mould 9, vibrator 26, amplifier 27 and signal generator 28.
When producing embedded co-curing perforation damp composite material with die pressing, be first according to composite structure rigidity,
Intensity, stability, damping, fatigue behaviour requirement, rationally design the laying direction of poor glue prepreg, the number of plies, ply stacking-sequence, laying
Laying position, the number of plies, direction and the thickness of thickness and the poor glue prepreg with damping diaphragm of perforation.Namely according to structure
Performance requirement, according to the ply stacking angle of poor glue prepreg, laying order and the laying number of plies, and by the band of the perforation of suitable thickness
The poor glue prepreg of damping diaphragm or the two-sided poor glue prepreg 11 with damping diaphragm of perforation are layed in the poor glue prepreg in top
12 and the poor glue prepreg 10 in bottom among.When embedded co-curing perforation damp composite material requirement have higher damping loss because
The period of the day from 11 p.m. to 1 a.m, the thickness and the number of plies of damping layer of perforating will suitably increase.
Before poor glue prepreg is laid, it is necessary to mould 4 and lower mould 9 in cleaning, it must ensure that die-face cleans free from admixture,
Then releasing agent is sprayed.
The poor glue prepreg of individual layer is laid to certain thickness according to certain ply stacking angle, laying order and the laying number of plies
The poor glue prepreg 10 in bottom, the poor glue prepreg 10 in bottom now is softer and has certain cohesive, can easily according under
The undulations of mould are routed in lower mould 9, as shown in Figure 2.By the poor glue prepreg 10 in bottom be routed in lower mould 9 after, it is necessary to
Under on poor glue prepreg 10 laying perforation the poor glue prepreg with damping diaphragm.
The making of the poor glue prepreg with damping diaphragm brush (spray) coating or continuous prepreg method, i.e., by damping material
Formation damping material solution in organic solvent is dissolved in by proper ratio, is applied with brush (spray) or infiltrates technique by the solution brush (spray)
Apply or infiltrate on the poor glue prepreg of individual layer, after the organic solvent volatilization in damping material solution, it is thin just to obtain band damping
The poor glue prepreg of film；If the damping area for the poor glue prepreg with individual layer damping diaphragm that two brushes (spray) are coated is bonded
The two-sided poor glue prepreg structure with damping diaphragm is just obtained together.Damping diaphragm brush (spray) is applied to the poor glue prepreg of individual layer
On the reason for be that unvulcanized damping diaphragm is especially soft, viscosity is big, can not be laid immediately on upper and lower part prepreg it
In, and be used to brushing (spray) and apply or the poor glue prepreg of individual layer of infiltration damping diaphragm can play a part of bearing medium, it can make
Unvulcanized damping diaphragm is obtained, it is smoothly routed on the poor glue prepreg in bottom by and can after perforation, while ensures to damp
The curing temperature of film and time and resin cure temperature and time consistency.
Because damping diaphragm does not have gas permeability in itself, for mobility of the reinforced resin in poor glue prepreg, ensure
The full whole die cavity of resin filling, here using the method for the poor glue prepreg perforation with damping diaphragm.Poor glue with damping diaphragm
Repaved after prepreg perforation between the poor glue prepreg in upper and lower part, allow liquid resin in the poor glue prepreg in top with
Smooth flow between the poor glue prepreg in portion, so as to fill up whole die cavity, it ensure that the dimensional accuracy and crudy of obtained structure.
Fig. 3 is the poor glue prepreg punching machine with damping diaphragm, and the punching machine includes pedestal 17, cylinder 18, connection
Part 19, movable table 20, perforated template 21, backing plate 22, spring 23 and the binder discharging flat board 24 with several through holes.
Wherein, the cylinder 18 is arranged on pedestal 17, and the movable table 20 is connected by connector 19 with cylinder 18, cylinder
18 can drive movable table 20 to make the movement of above-below direction；The backing plate 22 is placed on movable table 20；The binder
Discharging flat board 24 is arranged between backing plate 22 and perforated template 21, and backing plate 22 and perforated template 21 can make above-below direction relatively
Movement；Spring 23 is provided between the binder discharging flat board 24 and perforated template 21, binder discharging flat board 24 passes through the spring
23 make the movement of above-below direction relative to perforated template 21；The perforated template 21 is provided with and the through hole phase on binder discharging flat board
The perforation nail of cooperation.The material of backing plate 22 can be cork or soft plastic material or foamed material, can be regularly replaced after failure.
Fig. 4, Fig. 5 are respectively perforated template and perforated template partial enlarged drawing, there is series of rules distribution on the flat board of perforated template 21
Perforation nail.Fig. 6 is movable table 20, and backing plate 22 is laid on movable table 20, and the poor glue with damping diaphragm is pre-
Leaching material or the two-sided poor glue prepreg structure with damping diaphragm are laid on backing plate 22, and movable table 20 passes through connector 19
It is connected with cylinder 18, cylinder 18 drives movable table 20 to move upwards, until the poor glue prepreg with damping diaphragm touches
The lower surface of binder discharging flat board 24.Movable table 20 is continued up, the forced compression of spring 23, while binder discharging is put down
The poor glue prepreg of the holddown belt damping diaphragm of plate 24 simultaneously moves upwardly together, until the perforation in perforated template 21 is followed closely through binder
Through hole on discharging flat board 24 simultaneously pierces through the poor glue prepreg with damping diaphragm, and now the poor glue prepreg with damping diaphragm is worn
Casement plate 21 pricks out the aperture of regular distribution, and damping diaphragm by the fiber of individual layer prepreg and thereon is extruded into around hole,
After dimensionally stable to be perforated, keep a period of time after, movable table 20 is fallen, take out perforation with the poor of damping diaphragm
Glue prepreg or the two-sided poor glue prepreg 11 with damping diaphragm of perforation.
Perforation nail in punching machine is a kind of cone column combination body, i.e., by bottom be bullet of the band compared with Small Taper and
The assembly that the cylinder on top combines, the size than the poor glue prepreg perforation structure preferably with damping diaphragm is hole
It is laid out on four angles of square, pitch-row 10mm, aperture 2mm；Fig. 7 is that the band damping being placed on movable table 20 is thin
The poor glue prepreg 11 of film, Fig. 8 are the partial enlarged drawing of the poor glue prepreg with damping diaphragm, as can be seen from Figure 8 fiber
The fiber of resin individual layer prepreg is not pricked the perforation nail disconnected, design rule is distributed in perforated template 21 by perforated template 21
Purpose is：On the one hand it is that perforating for regular distribution is followed closely and can pass regular distribution on the poor glue prepreg 11 with damping diaphragm
Aperture；On the other hand it is to ensure not destroying the poor glue prepreg of individual layer while perforating on the poor glue prepreg 11 with damping diaphragm
On fiber, the fiber of the poor glue prepreg of individual layer is simply extruded into the both sides in hole, ensures the poor glue prepreg of individual layer and damping material
Performance be not destroyed.The two-sided poor glue prepreg structure with damping diaphragm of perforation is as shown in figure 9, it is by two brushes (spray)
The damping area of the poor glue prepreg with individual layer damping diaphragm 15 coated fits together what perforation formed, i.e. the poor glue of upper individual layer
Prepreg 14, the lower poor glue prepreg 16 of individual layer perforate what is formed with damping diaphragm 15 therein is clipped in.
The purpose of two-sided poor glue prepreg perforate to the poor glue prepreg with damping diaphragm or with damping diaphragm is：Make tree
Fat 1 can pass through the poor glue prepreg with damping diaphragm or two-sided poor with damping diaphragm after entering the poor glue prepreg 12 in top
The hole of glue prepreg enters the poor glue prepreg 10 in bottom, or conversely so that resin 1 can complete wetting it is whole embedded common
Solidification perforation damp composite material preform.
The two-sided poor glue preimpregnation with damping diaphragm perforated shown in poor the glue prepreg 25 or Fig. 9 with damping diaphragm of perforation
After the structure fabrication of material is good, the upper surface for being close to the poor glue prepreg 10 in bottom is routed in lower mould 9.Lay damping
The lower die structure of layer is as shown in Figure 10.The poor glue prepreg with damping diaphragm of perforation is laid on the poor glue prepreg 10 in bottom
Or, it is necessary to carry out the laying of the poor glue prepreg in top after the two-sided poor glue prepreg structure with damping diaphragm of perforation.Top is poor
The laying of glue prepreg 12 is identical with the laying method of the poor glue prepreg 10 in bottom.Generally, the poor glue prepreg 12 in top
Laying direction and the number of plies it is identical with the laying direction of the poor glue prepreg 10 in bottom and the number of plies, can also be fitted certainly according to structural requirement
When each layer direction, the number of plies and the gross thickness of the poor glue prepreg 12 in adjustment top and the poor glue prepreg 10 in bottom.It should be noted that
Due to needing the band to the poor glue prepreg 10 in bottom, the poor glue prepreg with damping diaphragm of perforation or perforation to hinder in mold process
The poor glue prepreg 12 of two-sided poor glue prepreg and top of Buddhist nun's film is imposed severe pressure, i.e., compaction treatment is carried out to it, therefore
The poor glue prepreg in bottom, the gross thickness of the poor glue prepreg of damping diaphragm and top after laying should be greater than composite finished product
Thickness, performance in fig. 11 be the poor glue prepreg 12 in top upper surface height higher than seal block 13 upper surface height
Degree.
After the poor glue prepreg 12 in top is laid, preforming processing need to be carried out.Mould 4 will be gone up to depress, carried out just
Die closing operation is walked, and applies certain pressure, seals mould, and makes the poor glue prepreg 10 in bottom, the band damping diaphragm of perforation
Poor glue prepreg or the poor glue prepreg 12 of two-sided poor glue prepreg 11 and top with damping diaphragm of perforation fill out as much as possible
Full die cavity.Schematic diagram after preforming is as shown in figure 12.
After preforming, vacuumize process need to be carried out to moulding system.The purpose vacuumized is negative to make mould inside holding
Pressure, so that resin 1 can smoothly flow into and be full of die cavity.As shown in figure 1, opening vavuum pump 6, it is set to pass through the He of resin trap 7
Vacuum tube 5 carries out vacuumize process to mould, and resin trap 7 act as preventing resin from flowing into vavuum pump 6.Treat that vacuum reaches
To after setting value, valve 3 is opened, resin 1 is entered the composite structure 8 for laying damping diaphragm through ingress pipe 2 and upper mould 4
In, it is specific as shown in figure 13.Usually, the vacuum tube 5 and resin ingress pipe 2 being connected with cushion block 13 should be in symmetrical cloth on mould
Put, so that the resin flow resistance in mould is basically identical, make the poor glue prepreg in resin infiltration upper and lower part more uniform；For
Asymmetrical molds, should also try one's best dispersed placement resin ingress pipe and vacuum tube.The quantity of resin ingress pipe and vacuum tube can root
It is arranged according to being actually needed, is only illustrated in Fig. 1 by taking a resin ingress pipe and two vacuum tubes as an example.
Due to the effect of mould precompressed and the air impermeability of damping diaphragm, resin flow resistance is added, therefore in resin
After the completion of introducing technology, frequency sweep vibrations to stand, the perforation damping diaphragm composite preform constructions institute to having infiltrated resin
Frequency sweep is carried out in system to impulse, the vibration exciter position that impulses is applied to mould lower surface and is located at system center of gravity, and frequency is from five hertz
To 10,000 hertz, amplitude continues 5-8 minutes, then stands 3-5 minutes, repeat said process two to five times, allow in 0.1-2mm
Resin is full of whole product in uniform mixing in damping diaphragm composite material preformed body of perforating, and eliminates the bubble of the inside and poor glue
Area, stop frequency sweep vibrations, the number of plies of general damping diaphragm insertion of perforating is more, and preform is thicker, and vibration exciter impulses and continued
Take large values, otherwise get the small value with time of repose.
Resin used in resin used in poor glue prepreg and introducing technology is same resin in the application, the curing molding mistake
Range request composite resin can have consistent solid (sulphur) to change parameter, including the pressure that solid (sulphur) is changed with visco-elastic damping material
Power, temperature and solid (sulphur) change time etc., so just it can be made to form inierpeneirating network structure in the technical process of co-curing, together
When co-curing before will be along perforation upper and lower part fibre with liquid resin in the adjacent reinforcing material of perforation damping diaphragm prepreg
Tie up material resin insertion to get up, formed " resin nail ", the composite layer adjacent with perforation damping diaphragm prepreg is coupled
Come, collective effect is followed closely by inierpeneirating network structure and resin, so that the structure has good Coating combination performance.Solidification process
In, in the different periods, there is different requirements to pressure and temperature, to control temperature, the heater used in mould
It is evenly arranged, ensures that mold temperature is consistent everywhere；Room temperature is cooled to after end, discharges pressure, taking-up test specimen can obtain embedding
Enter formula co-curing perforation damp composite material structural test piece, specific implementation process uses 160 DEG C of co-curing reaction curves such as
Shown in Figure 14；Whole technological process is as shown in figure 15.
Need to illustrate, when making the embedded co-curing damp composite material test specimen of complicated shape, it is necessary to right
Damping diaphragm is perforated, otherwise resin can not the whole poor glue prepreg of homogeneous immersion, cause waste product.
Damping material component, the pressure of the technical process are applied with reference to specific embodiment and temperature controlled processes enter
Row explanation.
Embedded co-curing perforation damp composite material mainly includes for the particular/special requirement of visco-elastic damping layer：
1st, temperature requirement, the curing temperature of damping layer must be identical with the solidification temperature of glass-epoxy.
2nd, the requirement of hardening time, the prepreg with damping layer and the poor glue prepreg of fibrous epoxy resin are compound, in fiber
In Curing Process of Epoxy, damping layer must be completed to vulcanize.Epoxy resin cure temperature is 155-160 DEG C of medium temperature, during solidification
Between about 2-3 hours.This requires that damping diaphragm curing temperature and time are consistent with epoxy resin cure temperature and time, and not
Recovery or undercure phenomenon can occur, otherwise influence the mechanical property of total.According to requirements above, the present embodiment
Die pressing manufacture craft priority selection 1 shown in damping material component.
The damping material component of table 1
The poor glue prepreg of embedded co-curing composite of the present embodiment uses commercially available 2070CN epoxy resin as base
Body, the poor glue prepreg of glass fabric of epoxy resin is mutually made using glass fabric as enhancing, resin content in 15%-20%,
In order to lay in a mold.
The laying poor glue prepreg in bottom --- the poor glue with damping diaphragm of perforation is cut according to designed ply stacking-sequence
Prepreg --- the poor glue prepreg in top, after matched moulds precompressed, vavuum pump is opened, makes to be always maintained at 0.08~0.095MPa in mould
Negative pressure, importing resin material is 2070CN epoxy resin, and liquid resin must be allowed to reach the viscosity of requirement before importing, will be set
Fat is uniformly introduced into the poor glue prepreg of upper and lower part.
Due to the effect of mould precompressed and the air impermeability of damping diaphragm, increased in the respective regions of complex-shaped die cavity
Add resin flow resistance, easily formed bubble and Pin Jiao areas, after the completion of resin introducing technology, frequency sweep vibrations to stand, it is right
System where having infiltrated the perforation damping diaphragm composite preform constructions of resin carries out frequency sweep and impulsed, and vibration exciter impulses position
It is applied to mould lower surface and is located at system center of gravity, mould where the preform to having infiltrated resin carries out frequency sweep and impulsed, first
First signal generator 28 sends swept-frequency signal, and system is impulsed by amplifier 27 and vibration exciter 26, and frequency is from five hertz to one
Ten thousand hertz, amplitude continues 5 minutes in 0.1~2mm, then stands 4 minutes, repeats said process three times, allows resin to be hindered in perforation
Uniformly mixing is full of whole product in Buddhist nun's film composite material preform, eliminates bubble and the Pin Jiao areas of the inside, stops frequency sweep
Vibrations, the number of plies of general damping diaphragm insertion of perforating is more, and preform is thicker, and vibration exciter impulses and continues to take with time of repose
Big value, on the contrary get the small value；
After completing frequency sweep vibrations standing, it is consistent that forming process requires that matrices of composite material can have with visco-elastic damping material
Solid (sulphur) change parameter, including solid (sulphur) pressure for changing, temperature and solid (sulphur) change time, so can just make it in co-curing
Technical process in formed inierpeneirating network structure and damping diaphragm punch position formed resin nail so that the structure has well
Coating combination performance.The curing process parameter of the composite of the present embodiment is as shown in figure 14, and 0.08 is always maintained in mould
~0.095MPa negative pressure, 5 atmospheric pressure of mould pressurizing maintenance intracavitary, make temperature from room temperature with 1~3 DEG C/min heating rate
Degree reach 150 DEG C be incubated 15 minutes, then with 1~3 DEG C/min heating rate make temperature reach 160 DEG C be incubated 3 hours, then with
Rate of temperature fall no more than 1.5 DEG C/min of rate of temperature fall is down to less than 60 DEG C, completes embedded co-curing perforation damping composite wood
The co-curing of material, the pressure in mould is finally shed, removes mould and auxiliary material, embedded co-curing is perforated and damps composite wood
Material is taken out, and the post processing such as trimming is carried out to it.Notice that the resin of the poor glue prepreg with damping diaphragm will be with die pressing importing
Resin is completely the same, and whole technological process is as shown in figure 15.
Comparative example 1：During experimental study, the application is investigated the prepreg using different resins content to insertion
The influence of formula co-curing perforation damp composite material mechanical property, controls other experimental conditions identical with the application's, passes through examination
Result discovery is tested, the embedded co-curing for using the prepreg (content is 25~35wt%) of normal contents resin to be prepared is worn
The up-to-standard rate of hole damp composite material is relatively low, uses poor glue prepreg to be prepared compared to the application embedded solid altogether
Change perforation damp composite material, the interlayer mechanical property low 10%~17% for the composite that the comparative example is prepared, mainly
That the resin nail dimension to be formed is less than normal, and it is unstable caused by, the particularly complicated respective regions of mold shape are especially apparent.
Comparative example 2：During experimental study, the application is investigated frequency sweep and impulses processing to the perforation of embedded co-curing
The influence degree of damp composite material mechanical property, control other experimental conditions identical with the application's, the comparative example is to obtaining
The preform of composite impulsed processing without frequency sweep, found by result of the test, frequency sweep impulses processing to embedded
The quality and mechanical property of co-curing perforation damp composite material have important influence, are impulsed the compound of processing without frequency sweep
Bubble in material is more, Pin Jiao areas easily occurs, or even the respective regions of mold shape complexity follow closely to be formed without resin, have a strong impact on
The quality of product and the qualification rate for reducing product.Impulsed the insertion that is prepared after processing using frequency sweep compared to the application
Formula co-curing is perforated damp composite material, and the interlayer mechanical property of the composite that the comparative example is prepared is low 12%~
23%.
Above-described embodiment is the preferable embodiment of the application, but presently filed embodiment is not by above-described embodiment
Limitation, it is other it is any without departing from spirit herein essence with made under principle change, modification, replacement, combine, simplification,
Equivalent substitute mode is should be, is included within the protection domain of the application.
Claims (5)
1. a kind of damping layer punching machine of embedded co-curing composite, it is characterized in that：The punching machine includes pedestal, gas
The backing plate of the poor glue prepreg of cylinder, connector, movable table, placement with damping diaphragm, the binder discharging with some through holes
Flat board, spring and perforated template, wherein,
The cylinder is arranged on pedestal, and the movable table is connect by connector and cylinders, and cylinder can drive activity
Workbench makees the movement of above-below direction；The backing plate is placed on movable table；The binder discharging flat board is arranged on backing plate
Between perforated template, and the movement of above-below direction can be made relative to backing plate and perforated template；The binder discharging flat board and perforation
Spring is provided between template, binder discharging flat board makees the movement of above-below direction by the spring relative to perforated template；The perforation
Template be provided be engaged with the through hole on binder discharging flat board perforation nail, it is described perforation nail for cone column combination body, i.e., by with
The connected cylinder of perforated template and the bullet of setting on the cylinder combine.
2. punching machine as claimed in claim 1, it is characterized in that：The material of backing plate is cork.
3. punching machine as claimed in claim 1, it is characterized in that：The material of backing plate is plastics.
4. punching machine as claimed in claim 1, it is characterized in that：The material of backing plate is foam.
5. punching machine as claimed in claim 1, it is characterized in that：For the perforated template, the poor glue with damping diaphragm is pre-
The size of leaching material perforation structure is hole arrangement on four angles of square, pitch-row 10mm, aperture 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720914659.7U CN206983319U (en) | 2017-07-26 | 2017-07-26 | A kind of damping layer punching machine of embedded co-curing composite |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720914659.7U CN206983319U (en) | 2017-07-26 | 2017-07-26 | A kind of damping layer punching machine of embedded co-curing composite |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206983319U true CN206983319U (en) | 2018-02-09 |
Family
ID=61417327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720914659.7U Expired - Fee Related CN206983319U (en) | 2017-07-26 | 2017-07-26 | A kind of damping layer punching machine of embedded co-curing composite |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206983319U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113246585A (en) * | 2021-04-30 | 2021-08-13 | 武汉纺织大学 | Perforating needle, system and method for manufacturing foam sandwich preformed body |
| CN114311400A (en) * | 2021-12-07 | 2022-04-12 | 何荣 | Carbon fiber reinforced thermoplastic prepreg balance adjusting device |
-
2017
- 2017-07-26 CN CN201720914659.7U patent/CN206983319U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113246585A (en) * | 2021-04-30 | 2021-08-13 | 武汉纺织大学 | Perforating needle, system and method for manufacturing foam sandwich preformed body |
| CN114311400A (en) * | 2021-12-07 | 2022-04-12 | 何荣 | Carbon fiber reinforced thermoplastic prepreg balance adjusting device |
| CN114311400B (en) * | 2021-12-07 | 2023-11-03 | 安徽赢碳新材料科技有限公司 | Carbon fiber reinforced thermoplastic prepreg balance adjusting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107283878A (en) | The die pressing manufacture craft of embedded co-curing perforation damp composite material | |
| JP5509212B2 (en) | Manufacturing of structural composite elements | |
| US11179901B2 (en) | Process and apparatus for molding composite articles | |
| CN1193870C (en) | Method and device for producing fibre-reinforced components using injection method | |
| CN103042700B (en) | Integrated forming method and device for segmented blade | |
| CN101801651A (en) | A method for producing a composite structure and a composite structure | |
| CN105365226B (en) | Soft mode mold closing fibre reinforced composites product processing unit (plant) and processing method | |
| CN107215039A (en) | A kind of core filled composite material and preparation method thereof | |
| CN101143492A (en) | Compression type RTM forming method | |
| CN108248161A (en) | A kind of method that foam-filled honeycomb prepares liquid condition shaping composite material sandwich | |
| CN104097329B (en) | A kind of method in composite foam sandwich construction shaping, foamed material being carried out resin infusion pretreatment | |
| CN206983319U (en) | A kind of damping layer punching machine of embedded co-curing composite | |
| CN103802333A (en) | Method for manufacturing electronic product composite material shell through resin transfer molding process | |
| CN1665676A (en) | Three-dimensional knit spacer fabric sandwich composite | |
| CN103042701A (en) | Integrated formation device and method for wind power blade | |
| CN103737946B (en) | A kind of forming method of two-ply foam sandwich structure polymer matrix composites | |
| CN104943200A (en) | Liquid molding method of resin-based composite material of interlayer thermoplasticity flow guide net | |
| CN110861318A (en) | Carbon fiber automobile front floor compression molding method | |
| CN105415706A (en) | Vacuum infusion one-time forming method for composite sandwich structure | |
| CN105751651A (en) | Production method of anti-layering foam sandwich composite plate | |
| CN106217904A (en) | The preparation facilities of a kind of extruded bright finish uniform thickness fiberglass test flat board and method | |
| JP2012513914A (en) | Process and apparatus for manufacturing composite structures | |
| CN102114689B (en) | Vacuum assisted forming method for integrally closing outer housing of composite material | |
| CN113059866A (en) | Composite material sandwich pipe and manufacturing method thereof | |
| CN107696522A (en) | A kind of carbon fibre fabric method for forming parts at band R angles |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180209 Termination date: 20190726 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |