CN206980187U - A kind of lathe cooling emulsion defoaming device - Google Patents
A kind of lathe cooling emulsion defoaming device Download PDFInfo
- Publication number
- CN206980187U CN206980187U CN201720834829.0U CN201720834829U CN206980187U CN 206980187 U CN206980187 U CN 206980187U CN 201720834829 U CN201720834829 U CN 201720834829U CN 206980187 U CN206980187 U CN 206980187U
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- China
- Prior art keywords
- level
- buffer board
- limiter
- plate
- buffer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000839 emulsion Substances 0.000 title claims abstract description 34
- 238000001816 cooling Methods 0.000 title claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 230000003139 buffering effect Effects 0.000 claims abstract description 21
- 238000007599 discharging Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 3
- 230000001934 delay Effects 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 239000006260 foam Substances 0.000 abstract description 9
- 239000000126 substance Substances 0.000 abstract description 8
- 239000013530 defoamer Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 32
- 229910052742 iron Inorganic materials 0.000 description 16
- 230000000694 effects Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 3
- 241000894006 Bacteria Species 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000004945 emulsification Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Auxiliary Devices For Machine Tools (AREA)
Abstract
The utility model discloses a kind of lathe cooling emulsion defoaming device, it includes liquid discharging box, the bottom of the liquid discharging box is equidistantly provided with multiple nuts along its position of center line, mounting hole is machined with the bottom plate of liquid discharging box where the nut, mounted in pairs has first-level buffer plate, level 2 buffering plate, three-level buffer board and level Four buffer board to the position where the mounting hole respectively;Two block buffering plates of mounted in pairs make it open certain angle by the way that limiter is spacing, and the limiter is pressed abd fixed on the top of buffer board by lock-screw.The utility model reaches the purpose of defoaming, instead of chemical defoamer, reduce the production of chemicals and the pollution to environment by suppressing foam Production conditions.
Description
Technical field
A kind of lathe cooling emulsion defoaming device is the utility model is related to, suitable for machine tooling field.
Background technology
Using emulsion than wide, most of processing method that emulsion produces foam passes through addition for machine tooling cooling
The method of chemical defoamer eliminates;The negative interaction for adding chemical defoamer is exactly emulsion is grown bacterium, and shortening emulsion makes
Use the life-span;What is had can change the pH value of emulsion, have side effect to workpiece and human body;Mechanical defoaming focuses mostly in foam at present
The method for making lather collapse by mechanical device after generation realizes that some need separate electrical motor to drive, and some need to give birth in foam
Into regional seal, machine tooling field may not apply to.
Utility model content
The utility model reaches the purpose of defoaming, instead of chemical defoamer, reduce by suppressing foam Production conditions
The production of chemicals and the pollution to environment.
In order to solve the above-mentioned technical problem, the utility model proposes following technical scheme:A kind of lathe cooling emulsion disappears
Bulb apparatus, it includes liquid discharging box, and the bottom of the liquid discharging box is equidistantly provided with multiple nuts, the spiral shell along its position of center line
Mounting hole is machined with the bottom plate of liquid discharging box where female, mounted in pairs has first-level buffer to the position where the mounting hole respectively
Plate, level 2 buffering plate, three-level buffer board and level Four buffer board;Two block buffering plates of mounted in pairs make it by the way that limiter is spacing
Certain angle is opened, the limiter is pressed abd fixed on the top of buffer board by lock-screw.
The position that the nut interior is engaged with lock-screw is provided with sealing ring.
The direction that the first-level buffer plate, level 2 buffering plate, three-level buffer board and level Four buffer board flow down along emulsion
Arrangement, and according to installing respectively from low to high successively.
Stopper slot is machined with the two side of the limiter, the stopper slot is with being engaged positioning at the top of buffer board.
Mounting hole is machined with the top of the limiter, the mounting hole is engaged with lock-screw, can be along locking
Screw slides, and changes the bumper angle of buffer board.
The utility model has the advantages that:
1st, by using above-mentioned defoaming device, in the course of work, according to the size of iron filings, how much buffer angle is adjusted, when
When iron filings particle is larger, lock-screw is unclamped, promotes limiter to be moved to liquid outlet direction, limiter drive first-level buffer plate,
Level 2 buffering plate, three-level buffer board and level Four buffer board slide in stopper slot, and buffer angle diminishes, and is advantageous to chip removal;Work as iron filings
When smaller, less, opposite direction promotes limiter, and buffer angle can become big, be advantageous to defoam;Also can be as needed, individually adjust not
It is different with group buffer board buffer angle, optimize defoaming characteristics;After adjustment, lock-screw;Coolant is into liquid outlet
When, because iron filings density is big, focus mostly in emulsion bottom, therefore big portion is split to iron filings both sides flute position in the first order
Into chip cleaner, while the emulsion discharged is less, and big portion's emulsion delays by first-level buffer plate, level 2 buffering plate, three-level
Kinetic energy becomes very small after punching and level Four buffer board, is not enough to bring more air generation foam into, therefore obtain in actual applications
Good using effect is arrived.
2nd, existing chemical debubbling method is substituted by using the method for physics, effectively solves chemical defoamer and brought
Emulsion grow bacterium, emulsion service life shorten the problem of, and make its pH value keep it is constant, avoid to workpiece and people
Side effect caused by body.
3rd, this defoaming device reduces energy loss, simplifies structure, reduce making peace without extra drive device
Dress up this.
4th, good position-limiting action can be played by the limiter being separately provided, ensure that by way of individually controlling
The angular adjustment of the buffer board of mounted in pairs is realized, and then changes its bumper angle, reaches different defoaming effects.
5th, the regulation of buffer board angle can be easily realized by the mounting hole on the limiter.
Brief description of the drawings
The utility model is described in further detail with reference to the accompanying drawings and examples.
Fig. 1 is lathe cooling emulsion defoaming device layout.
Fig. 2 is lathe cooling emulsion defoaming device sectional view.
Fig. 3 is the lathe cooling emulsion defoaming device shrinkage limit location drawing.
In figure:Liquid discharging box 1, lock-screw 2, limiter 3, first-level buffer plate 4, level 2 buffering plate 5, three-level buffer board 6,
Level Four buffer board 7, nut 8, sealing ring 9, stopper slot 10, mounting hole 11.
Embodiment
Embodiment of the present utility model is described further below in conjunction with the accompanying drawings.
Embodiment 1:
As Figure 1-3, a kind of lathe cooling emulsion defoaming device, it includes liquid discharging box 1, the bottom of the liquid discharging box 1
Portion is equidistantly provided with multiple nuts 8 along its position of center line, and installation is machined with the bottom plate of the place liquid discharging box 1 of nut 8
Hole, mounted in pairs has first-level buffer plate 4, level 2 buffering plate 5, three-level buffer board 6 and four to the position where the mounting hole respectively
Level buffer board 7;Two block buffering plates of mounted in pairs make it open certain angle by the way that limiter 3 is spacing, and the limiter 3 is logical
Cross the top that lock-screw 2 is pressed abd fixed on buffer board.In the course of work, the emulsion with iron filings flows from the top of liquid discharging box 1
Under, successively by first-level buffer plate 4, level 2 buffering plate 5, three-level buffer board 6 and level Four buffer board 7, during flowing down, greatly
Kinetic energy becomes very small after portion's emulsion passes through buffer board, is not enough to bring more air generation foam into, so as to play defoaming
Purpose.
Further, the position that the inside of nut 8 is engaged with lock-screw 2 is provided with sealing ring 9.By described
Sealing ring 9 can play good sealing function, the problem of preventing leakage.
Further, the first-level buffer plate 4, level 2 buffering plate 5, three-level buffer board 6 and level Four buffer board 7 are along emulsification
Direction arrangement under liquid stream, and according to installing respectively from low to high successively.Ensure by using mounting means from low to high
Defoaming effect.
Further, stopper slot 10, the top of the stopper slot 10 and buffer board are machined with the two side of the limiter 3
Portion is engaged positioning.When promoting limiter 3, described buffer board can be driven around lock-screw 2 by stopper slot 10
Main axis, and then bumper angle is changed, reach different defoaming purposes.
Further, the top of the limiter 3 is machined with mounting hole 11, and the mounting hole 11 matches with lock-screw 2
Close, can be slided along lock-screw 2, change the bumper angle of buffer board.
Further, such as Fig. 3, by by first-level buffer plate 4, level 2 buffering plate 5, three-level buffer board 6 and level Four buffer board 7
It is limited in inside the U-type groove of limiter 3, its bumper angle is reached minimum, finally realize that its is spacing.
Embodiment 2:
Using the debubbling method of any one lathe cooling emulsion defoaming device, it comprises the following steps:
Step1:According to the size of iron filings, how much buffer angle is adjusted, when iron filings particle is larger, unclamps lock-screw 2, push away
Dynamic limiter 3 moves to liquid outlet direction, and limiter 3 drives first-level buffer plate 4, level 2 buffering plate 5, three-level buffer board 6 and four
Level buffer board 7 slides in stopper slot 10, and buffer angle diminishes, and is advantageous to chip removal;
Step2:When iron filings are smaller, less, opposite direction promotes limiter 3, and buffer angle can become big, be advantageous to defoam,
Can be as needed, individually adjust different groups of buffer board buffer angles not, optimize defoaming characteristics, after adjustment, lock-screw 2 is
Can;
Step3:Coolant, because iron filings density is big, focuses mostly in emulsion bottom when entering liquid outlet, therefore big portion exists
The first order is split entering chip cleaner to iron filings both sides flute position, while the emulsion discharged is less, and big portion's emulsion exists
Kinetic energy becomes very small after first-level buffer plate 4, level 2 buffering plate 5, three-level buffer board 6 and level Four buffer board 7, is not enough to band
Enter more air generation foam, reach defoaming purpose.
Utility model works principle and the course of work:
First, mounting hole is drilled out successively at the middle part of liquid discharging box 1, nut 8 is welded on liquid discharging box lower curtate, and complete in welding
Load close circle 9 in nut afterwards;One group of first-level buffer plate 4, level 2 buffering plate 5, three-level buffer board 6 and 7 two pieces of level Four buffer board,
It is relative to overlay the upper installing hole position of liquid discharging box 1, the stopper slot of limiter 3 is respectively clamped on the buffer board of both sides, inserts locking screw
Nail 2, and fasten, that is, complete the installation of one group of buffer board;Other groups of buffer boards are installed respectively from low to high successively;
In the course of work, according to the size of iron filings, how much buffer angle is adjusted, when iron filings particle is larger, unclamp locking screw
Nail 2, limiter 3 is promoted to be moved to liquid outlet direction, limiter 3 drives first-level buffer plate 4, level 2 buffering plate 5, three-level buffer board
6 and level Four buffer board 7 slided in stopper slot, buffer angle diminishes, and is advantageous to chip removal;
When iron filings are smaller, less, opposite direction promotes limiter 3, and buffer angle can become big, be advantageous to defoam;Also can basis
Need, individually adjust different groups of buffer board buffer angles differences, optimize defoaming characteristics;After adjustment, lock-screw 2;It is cold
But liquid, because iron filings density is big, is focused mostly in emulsion bottom when entering liquid outlet, therefore big portion is split to iron in the first order
Bits both sides flute position enters chip cleaner, while the emulsion discharged is less, big portion's emulsion process first-level buffer plate 4,
Kinetic energy becomes very small after level 2 buffering plate 5, three-level buffer board 6 and level Four buffer board 7, is not enough to bring more air generation bubble into
Foam, therefore good using effect has been obtained in actual applications.
By above-mentioned description, those skilled in the art completely can be without departing from this item utility model technological thought
In the range of, various changes and amendments are carried out all within the scope of protection of the utility model.It is of the present utility model not most
Matters, belong to the common knowledge of those skilled in the art.
Claims (5)
- A kind of 1. lathe cooling emulsion defoaming device, it is characterised in that:It includes liquid discharging box(1), the liquid discharging box(1)Bottom Portion is equidistantly provided with multiple nuts along its position of center line(8), the nut(8)Place liquid discharging box(1)Bottom plate on process There is mounting hole, mounted in pairs has first-level buffer plate to the position where the mounting hole respectively(4), level 2 buffering plate(5), three-level delays Punching(6)With level Four buffer board(7);Two block buffering plates of mounted in pairs pass through limiter(3)It is spacing it is opened certain angle Degree, the limiter(3)Pass through lock-screw(2)It is pressed abd fixed on the top of buffer board.
- A kind of 2. lathe cooling emulsion defoaming device according to claim 1, it is characterised in that:The nut(8)It is interior Portion and lock-screw(2)The position being engaged is provided with sealing ring(9).
- A kind of 3. lathe cooling emulsion defoaming device according to claim 1, it is characterised in that:The first-level buffer plate (4), level 2 buffering plate(5), three-level buffer board(6)With level Four buffer board(7)The direction flowed down along emulsion is arranged, and is pressed According to installing respectively from low to high successively.
- A kind of 4. lathe cooling emulsion defoaming device according to claim 1, it is characterised in that:The limiter(3) Two side on be machined with stopper slot(10), the stopper slot(10)Positioning is engaged with the top of buffer board.
- A kind of 5. lathe cooling emulsion defoaming device according to claim 1, it is characterised in that:The limiter(3) Top be machined with mounting hole(11), the mounting hole(11)With lock-screw(2)It is engaged, can be along lock-screw(2) Slide, change the bumper angle of buffer board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201720834829.0U CN206980187U (en) | 2017-07-11 | 2017-07-11 | A kind of lathe cooling emulsion defoaming device |
Applications Claiming Priority (1)
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CN201720834829.0U CN206980187U (en) | 2017-07-11 | 2017-07-11 | A kind of lathe cooling emulsion defoaming device |
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Publication Number | Publication Date |
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CN206980187U true CN206980187U (en) | 2018-02-09 |
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ID=61404652
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CN201720834829.0U Expired - Fee Related CN206980187U (en) | 2017-07-11 | 2017-07-11 | A kind of lathe cooling emulsion defoaming device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107281785A (en) * | 2017-07-11 | 2017-10-24 | 宜昌长机科技有限责任公司 | A kind of lathe cooling emulsion defoaming device and debubbling method |
-
2017
- 2017-07-11 CN CN201720834829.0U patent/CN206980187U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107281785A (en) * | 2017-07-11 | 2017-10-24 | 宜昌长机科技有限责任公司 | A kind of lathe cooling emulsion defoaming device and debubbling method |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180209 |
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CF01 | Termination of patent right due to non-payment of annual fee |