CN206976794U - Semiconductor laser sinters fixture - Google Patents
Semiconductor laser sinters fixture Download PDFInfo
- Publication number
- CN206976794U CN206976794U CN201720883270.0U CN201720883270U CN206976794U CN 206976794 U CN206976794 U CN 206976794U CN 201720883270 U CN201720883270 U CN 201720883270U CN 206976794 U CN206976794 U CN 206976794U
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- China
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- semiconductor laser
- fixture
- base
- sinters
- depression bar
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- Semiconductor Lasers (AREA)
- Laser Beam Processing (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of semiconductor laser sinters fixture, it is characterised in that bag base, the limit assembly on the base, some depression bars being connected with the limit assembly and the elastic component being arranged on the base；The depression bar is pressed against on the elastic component；The depression bar includes Cross slat and the lower press strip extended from one end of the Cross slat；The depression bar is articulated on the limit assembly；The limit assembly includes limit base, the positive stop strip on the limit base and the lock shaft being located on the limit base being fixed on the base.Semiconductor laser of the present utility model sinters side of the fixture by using depression bar described in the elastic component top pressure, the lower press strip of the other end of the depression bar is set to press the master chip of semiconductor laser on a heat sink with appropriate pressure, the master chip welding effect of semiconductor laser can be ensured, while be avoided that the master chip of semiconductor laser is damaged by excessive pressure.
Description
Technical field
Fixing device is the utility model is related to, fixture is sintered more particularly to a kind of semiconductor laser.
Background technology
One of sintering circuit is included in semiconductor laser production process, the main efficacy results of the sintering circuit are by laser
Master chip be welded on the radiator of heat sinking function.Semiconductor laser can directly affect in the crudy of sintering circuit
The heat dispersion of master chip.In sintering circuit, general utilization sinters fixture and fixes the master chip of laser on a heat sink,
Then sintering is realized.Typically the master chip of laser is fixed using the mode of screw pressurizing block for existing sintering fixture,
But the unmanageable pressure to master chip of screw is utilized, if screw is excessive to the pressure of master chip, master chip fragmentation can be made；
If screw to the insufficient pressure of master chip, can produce cavity between master chip and radiator, and cavity can make the radiating of master chip
Performance is affected.
Utility model content
Based on this, it is scattered to be pressed into semiconductor laser master chip with appropriate pressure that the utility model provides a kind of energy
Semiconductor laser sintering fixture on hot device.
In order to realize the purpose of this utility model, the utility model uses following technical scheme：
A kind of semiconductor laser sinters fixture, for when semiconductor laser is sintered, by semiconductor laser
Master chip with appropriate pressure pressing on a heat sink, it is characterised in that the semiconductor laser sintering fixture includes bottom
Seat, the limit assembly on the base, some depression bars being connected with the limit assembly and it is arranged on the base
Elastic component；The depression bar is pressed against on the elastic component；The depression bar includes Cross slat and prolonged from one end of the Cross slat
The lower press strip stretched.
Semiconductor laser of the present utility model sinters side of the fixture by using depression bar described in the elastic component top pressure,
The lower press strip of the other end of the depression bar is set to press the master chip of semiconductor laser on a heat sink with appropriate pressure, can
Ensure the master chip welding effect of semiconductor laser, while be avoided that the master chip of semiconductor laser by excessive pressure
And it is damaged.
In one of the embodiments, the depression bar is articulated on the limit assembly.
In one of the embodiments, the limit assembly includes being fixed on limit base on the base, installed in institute
State the positive stop strip on limit base and the lock shaft being located on the limit base.
In one of the embodiments, the Cross slat is provided with the horizontal crossover port run through；The Cross slat is with described
Crossover port is that separation is divided into pressure-bearing portion and pressure unit.
In one of the embodiments, the lower press strip extends vertically downward from one end of the pressure unit；It is described to push
The length of bar is set according to the vertical range between the upper surface of the master chip of the semiconductor laser and the crossover port；Institute
The lower end for stating lower press strip is provided with open slot.
In one of the embodiments, one end of the elastic component is connected to the upper surface of the base；The elastic component
Other end top pressure described in pressure-bearing portion.
In one of the embodiments, the elastic component is spring.
In one of the embodiments, the upside of the limit base is provided with two lock shaft blocks；The base is in two lock shafts
Some points of position blocks are provided between block；The lock shaft block be provided with extend transversely through both sides wear axis hole；Described point of position block is provided with two
The through axial bore that side is run through；Rod-putting slot is formed between described point of position block or between described point of position block and the lock shaft block.
In one of the embodiments, it is provided with the depression bar in the rod-putting slot.
In one of the embodiments, the axis of wearing axis hole, described point position block of the lock shaft through the lock shaft block
Hole and the crossover port of the depression bar.
Brief description of the drawings
Fig. 1 is that the semiconductor laser of a preferred embodiment of the present utility model sinters the schematic perspective view of fixture；
Schematic perspective view when Fig. 2 is the use of the semiconductor laser sintering fixture shown in Fig. 1；
Fig. 3 is the enlarged drawing at the circle A of the semiconductor laser sintering fixture shown in Fig. 2；
Fig. 4 is the side view of the semiconductor laser sintering fixture shown in Fig. 1；
Fig. 5 is the front view of the semiconductor laser sintering fixture shown in Fig. 1；
Fig. 6 is the decomposing schematic representation of the semiconductor laser sintering fixture shown in Fig. 1；
Fig. 7 is the circle B of the semiconductor laser sintering fixture shown in Fig. 4 enlarged diagram；
Fig. 8 is the decomposing schematic representation in another angle of the semiconductor laser sintering fixture shown in Fig. 1.
Embodiment
For the ease of understanding the utility model, the utility model will be described more fully below.But this practicality
It is new to realize in many different forms, however it is not limited to embodiment described herein.On the contrary, provide these implementations
The purpose of example is to make the understanding more thorough and comprehensive to disclosure of the present utility model.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.
Fig. 1 to Fig. 8 is referred to, is that the semiconductor laser of the better embodiment of the utility model one sinters fixture 100, uses
In when semiconductor laser is sintered, the master chip 801 of semiconductor laser is pressed against radiator with appropriate pressure
On 802, the radiator 802 is placed in encapsulating package 803.Semiconductor laser sintering fixture 100 includes base 10, installation
Limit assembly on the base 10, some depression bars 30 being connected with the limit assembly and it is arranged on the base 10
Elastic component 40；Specifically, the depression bar 30 is articulated on the limit assembly；The base 10 is used to carry encapsulating package
803；The downside of depression bar 30 described in the top pressure of elastic component 40；The depression bar 30 is used for the master chip 801 to semiconductor laser
Apply pressure vertically downward, make the master chip 801 of semiconductor laser reliably fit on radiator 802.
The semiconductor laser sintering fixture 100 also includes some fixtures.
The base 10 is horizontally disposed；The corner of the base 10 is arranged to chamfering；The upper surface of the base 10 is provided with
Holding tank 11.
The limit assembly includes being fixed on the limit base 50 on the base 10, the limit on the limit base 50
Position bar 60 and the lock shaft 70 being located on the limit base 50；The upside of the limit base 50 is provided with two lock shaft blocks 51；Two institutes
State the upside that lock shaft block 51 is separately positioned on the both ends of limit base 50；The lock shaft block 51 is provided with and extends transversely through wearing for both sides
Axis hole 53；The lock shaft block 51, which is provided with, to be run through from the side of lock shaft block 51 and together with the dead axle hole 54 for wearing axis hole 53；Institute
The upside for stating lock shaft block 51 is provided with screw 55.
The base 10 is provided with some points of position blocks 52 between the two lock shaft blocks 51；Each point position block 52 is parallel to each other
Ground is distributed between the two lock shaft blocks 51；Described point of position block 52 is provided with the through axial bore 57 that both sides are run through；It is described to wear axis hole 53
And the through axial bore 57 is using same horizontal line as axle；Between described point of position block 52 or described point of position block 52 and the lock shaft block 51 it
Between formed rod-putting slot 56.
The positive stop strip 60 is arranged on limit base 50 and is horizontally disposed with；Described 60 times middle side parts of positive stop strip are extended with down convex
Block 61；The both ends of positive stop strip 60 are respectively equipped with solid bar hole 62；The positive stop strip 60 is arranged on the upside of the limit base 50；Institute
Lower convex portion is stated between the two lock shaft blocks 51；The lower surface of the lower convex portion fits to the upside of point position block 52；Institute
It is corresponding with the screw 55 on the lock shaft block 51 to state solid bar hole 62；One fixture is connected to institute after passing through the solid bar hole 62
State in screw 55.
The diameter of the lock shaft 70 is corresponding with the size for wearing axis hole 53 of the lock shaft block 51；Meanwhile the lock
The diameter of dead axle 70 is corresponding with the size of the through axial bore 57 of described point of position block 52.
The depression bar 30 includes Cross slat 31 and from the vertically extending lower press strip 32 in one end of the Cross slat 31；It is described
Cross slat 31 is provided with the horizontal crossover port 33 run through；The Cross slat 31 is that separation is divided into pressure-bearing portion with the crossover port 33
34 and pressure unit 35；The lower press strip 32 extends vertically downward from one end of the pressure unit 35；The lower end of the lower press strip 32
Provided with open slot 36；The length of the lower press strip 32 of each depression bar 30 is according to the master chip 801 of corresponding semiconductor laser
Upper surface and the crossover port 33 between vertical range and set.
A depression bar 30 is provided with each rod-putting slot 56；Crossover port 33 and described point of position on the depression bar 30
Through axial bore 57 on block 52 axle centered on same horizontal line；The lock shaft 70 wears axis hole through the two lock shaft blocks 51
53rd, the crossover port 33 of the through axial bore 57 of described point of position block 52 and the depression bar 30；One fixture wears the dead axle hole
In 54；One end of fixture in the dead axle hole 54 extrudes the lock shaft 70 positioned at the part worn in axis hole 53, order
The lock shaft 70 is fixed on limit base 50；The depression bar 30 can rotate around the lock shaft 70.
The lower end of the elastic component 40 is arranged on the upper surface of the base 10；The upper end top pressure of the elastic component 40 is in institute
State the downside in the pressure-bearing portion 34 of Cross slat 31；Specifically, the elastic component 40 is spring；It is described in wherein a kind of embodiment
Base 10 is provided with some projections；The lower end of the spring is set on the projection of the base 10.
Encapsulating package 803 when in use, is first placed into the holding tank 11 by the semiconductor laser sintering fixture 100
In；Some radiators 802 for being provided with height step arrangement in the encapsulating package 803；The bottom shape of the holding tank 11
It is corresponding with the base plate configuration of the encapsulating package 803；The master chip 801 of the semiconductor laser is in the form of sheets；The semiconductor
The upper surface middle part of the master chip 801 of laser is provided with the luminous zone 84 of strip；The master chip 801 of the semiconductor laser divides
After not being placed on the corresponding radiator 802 in the encapsulating package 803, due to each radiator 802 height not
One, therefore the master chip 801 of each semiconductor laser is in different height.
The lower press strip 32 of each depression bar 30 is by the elastic force of the elastic component 40 by a semiconductor laser
Master chip 801 is pressed against on the corresponding radiator 802；It is installed in the master chip 801 of the semiconductor laser described
Before the lower section of lower press strip 32, the lifting of lower press strip 32 can be made by the upper surface in the pressure-bearing portion 34 for pressing the Cross slat 31,
The master chip 801 of the semiconductor laser is put on the corresponding radiator 802, unclamps the pressure-bearing of the Cross slat 31
Portion 34, the lower press strip 32 press to the master chip 801 of the semiconductor laser naturally under the elastic force effect of the spring
Upper surface；Luminous zone 84 on the master chip 801 of the semiconductor laser is damageable zone, the lower end of the lower press strip 32
Open slot 36 it is corresponding with the luminous zone 84 on the master chip 801 of the semiconductor laser, avoid the semiconductor laser
Damaged because of compression luminous zone 84 on the master chip 801 of device.
In the present embodiment, the position of the lower press strip 32 can be adjusted by the pressing in the pressure-bearing portion 34 to the depression bar 30,
It can be brought convenience for the placement of the master chip 801 of the semiconductor laser.
It is vertical between the master chip 801 of any semiconductor laser and the crossover port 33 of the corresponding lower press strip 32
Distance is absolute distance, because the length of each lower press strip 32 is set according to corresponding absolute distance, is pushed described in order
The lower end of bar 32 is pressed against the upper surface of the semiconductor laser master chip 801 with vertical pressure, avoids the semiconductor
Laser master chip 801 into the pressure of vertical relation because by not causing the upper of lower surface and radiator 802 with upper surface
Inclination angle is produced between surface and influences welding effect.
By the spring being adapted to from coefficient of elasticity, the depression bar 30 can be made to swash the semiconductor with appropriate pressure
The master chip 801 of light device is pressed against on the radiator 802, avoids the impaired of master chip.
In the present embodiment, by using the side of depression bar described in the elastic component top pressure, make the other end of the depression bar
Lower press strip is pressed the master chip of semiconductor laser on a heat sink with appropriate pressure, it is ensured that the master of semiconductor laser
Chip welding effect, while it is avoided that the master chip of semiconductor laser is damaged by excessive pressure.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of semiconductor laser sinters fixture, for when semiconductor laser is sintered, by semiconductor laser
Master chip with appropriate pressure pressing on a heat sink, it is characterised in that the semiconductor laser sintering fixture include base,
Limit assembly on the base, some depression bars being connected with the limit assembly and it is arranged on the base
Elastic component；The depression bar is pressed against on the elastic component；The depression bar includes Cross slat and extended from one end of the Cross slat
Lower press strip.
2. semiconductor laser according to claim 1 sinters fixture, it is characterised in that the depression bar is articulated in the limit
On hyte part.
3. semiconductor laser according to claim 2 sinters fixture, it is characterised in that the limit assembly includes fixing
Limit base on the base, the positive stop strip on the limit base and the lock shaft being located on the limit base.
4. semiconductor laser according to claim 3 sinters fixture, it is characterised in that the Cross slat is provided with level
The crossover port run through；The Cross slat is divided into pressure-bearing portion and pressure unit by separation of the crossover port.
5. semiconductor laser according to claim 4 sinters fixture, it is characterised in that the lower press strip is from the pressure
The one end in portion extends vertically downward；The lower end of the lower press strip is provided with open slot.
6. semiconductor laser according to claim 4 sinters fixture, it is characterised in that one end connection of the elastic component
To the upper surface of the base；Pressure-bearing portion described in the other end top pressure of the elastic component.
7. semiconductor laser according to claim 6 sinters fixture, it is characterised in that the elastic component is spring.
8. semiconductor laser according to claim 4 sinters fixture, it is characterised in that the upside of the limit base is provided with
Two lock shaft blocks；The base is provided with some points of position blocks between the two lock shaft blocks；The lock shaft block is provided with and extends transversely through two
Wear axis hole in side；Described point of position block is provided with the through axial bore that both sides are run through；Between described point of position block or described point of position block with it is described
Rod-putting slot is formed between lock shaft block.
9. semiconductor laser according to claim 8 sinters fixture, it is characterised in that is set in the rod-putting slot
State depression bar.
10. semiconductor laser according to claim 9 sinters fixture, it is characterised in that the lock shaft is through described
The crossover port for wearing axis hole, the through axial bore of described point of position block and the depression bar of lock shaft block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720883270.0U CN206976794U (en) | 2017-07-19 | 2017-07-19 | Semiconductor laser sinters fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720883270.0U CN206976794U (en) | 2017-07-19 | 2017-07-19 | Semiconductor laser sinters fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206976794U true CN206976794U (en) | 2018-02-06 |
Family
ID=61401694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720883270.0U Active CN206976794U (en) | 2017-07-19 | 2017-07-19 | Semiconductor laser sinters fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206976794U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110125778A (en) * | 2019-06-25 | 2019-08-16 | 广东鼎泰机器人科技有限公司 | A kind of four station type milling cutter |
-
2017
- 2017-07-19 CN CN201720883270.0U patent/CN206976794U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110125778A (en) * | 2019-06-25 | 2019-08-16 | 广东鼎泰机器人科技有限公司 | A kind of four station type milling cutter |
| CN110125778B (en) * | 2019-06-25 | 2024-05-14 | 广东鼎泰机器人科技有限公司 | Four-station milling cutter |
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| GR01 | Patent grant |