CN206961091U - For preparing the structure of ultrathin touch sensor - Google Patents
For preparing the structure of ultrathin touch sensor Download PDFInfo
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- CN206961091U CN206961091U CN201720284008.4U CN201720284008U CN206961091U CN 206961091 U CN206961091 U CN 206961091U CN 201720284008 U CN201720284008 U CN 201720284008U CN 206961091 U CN206961091 U CN 206961091U
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Abstract
The utility model provides a kind of structure for being used to prepare ultra-thin Sensor, and the first glass sensor substrate is provided with sensor region, and the second glass sensor substrate is provided with sensor region；First glass sensor substrate is bonded with the second glass sensor substrate so that sensor region is relative, and sticky object is glue.Outer rim arrangement of the described glue along sensor region.The first described glass sensor substrate and the second glass sensor substrate are the glass substrate that thickness is more than 0.2mm.With the relative structure being bonded with glue of sensor patterns, when for downstream process be thinned, structural defence Sensor, avoid oozing acid corrosion Sensor effective districts in thinning process by using by two panels glass sensor substrate；Also the adhesion between reinforcing glass Sensor, Sensor support force is improved, the breakage rate in thinning process is greatly reduced, lifted and yield rate is thinned, reduce the cost that processing Sensor is thinned.
Description
Technical field
Sensor preparation fields are the utility model is related to, particularly a kind of structure for being used to prepare ultrathin touch sensor.
Background technology
As the intelligent mobile terminal equipments such as mobile phone, flat board develop to light, thin, fashion-orientation, particularly embedded In-
Cell/On-Cell, and the popularization of external hanging type GFF capacitance touch technologies, touch-control display module more and more thinner, client is to TP
Sensor thickness requirement also more and more higher.
Touch screen moves towards the structures such as lighter, thinner OGS/GFF/In-cell/On-cell from G+G structures.Though OGS is through two
By force, three strongest ones' working process, can still there is certain strength problem.Particularly large-size screen monitors Phoblet mobile phones are straight if screen ruptures
Connect influence touch controllable function.And GFF transmitances and sensitivity are then not so good as G+G and OGS；In-cell, On-cell then with high definition when
Display interference can be caused for 2k-4k screen arrival touch control lines.Display Technique can only then use external hanging type or embedded according to OLED
Formula On-Cell formula touch-controls, and In-cell can not be used.
Embedded In-Cell/On-Cell processing procedures are complicated, and cost remains high, and with ultra-narrow frame, FHD（It is full HD）
Trend, display lines are more and more, circuit the more does the more thin, pixel the more is done the more high, processed the difficulty of display portion very
Greatly, it is then more difficult that In-Cell/On-Cell is processed under the conditions of more fine definition.Meanwhile circuit it is excessively intensive when touch-control line
Road can interfere to display, and as a result In-Cell/On-Cell limitation will be more and more obvious.External hanging type GFF is limited by material
Material limitation, process temperatures can not use high temperature, and ito surface resistance is difficult to very low；Entire volume procedure for processing causes Sensor lines simultaneously
Wide, line-spacing is also difficult to further to run business into particular one small, causes GFF technologies to be applicable only to low-end mobile phone, flat board.For ultra-narrow frame,
FHD（It is full HD）High definition is shown, and the popularization of OLED Display Techniques, considers OLED yield factors, part OLED producers and hand
Machine terminal can select On-Cell touch technologies, and part then directly selects G+G external hanging type touch technologies, and OLED is shown and touch-control
Separate machined, each ensure yield, and then ensure overall yield.So as to propose certain need to ultra-thin touch-control Sensor thickness
Ask.
For processes such as the plated film in Sensor processing procedures, gluing, exposure, development, etchings, having to the thickness of glass must
Ask.When thickness of glass it is thin to a certain extent when, processing procedure breakage rate can be higher.According to the ultra-thin glass of below 0.2mm thickness
Sensor is directly processed, then yield is difficult to controlled.Glass is thinner simultaneously, and the cost of glass itself is higher.
Sensor is made on lower-cost heavy sheet glass by elder generation, carries out that processing is thinned again, then can be by glass thinning
To required thickness, meet the needs of ultra-thin Sensor, it is possible to increase yield, and reduce production cost.
Due to Sensor processing wire body more than G2.5 generation more than, typesetting as much as possible could effectively reduce simple grain Sensor
Cost.But glass is bigger, when chemical reduction to thickness is in below 0.2mm Sensor, glass breakage rate is also relative in thinning process
It is higher, influence ultra-thin Sensor processing yield.
The A of Chinese patent literature CN 105528129 describe a kind of GG structure touch-screens based on ultra-thin sensor
Preparation method, the scheme for preparing and being thinned after circuit is employed, that is, is existed after being thinned, then carry out cutting and easily cause glass breakage
The problem of, therefore the problem of yield is relatively low be present, and be difficult to below 0.2mm thickness.
The content of the invention
Technical problem to be solved in the utility model is to provide a kind of structure for being used to prepare ultrathin touch sensor, energy
Ultrathin touch sensor processing yield is enough lifted, the high problem of breakage rate in thinning process is solved, reduces processing cost, improve product
Quality.
In order to solve the above technical problems, technical scheme is used by the utility model：One kind is used to prepare ultra-thin touch-control
The structure of sensor, the first glass sensor substrate are provided with sensor region, and the second glass sensor substrate is provided with sensing
Device region；
First glass sensor substrate is bonded with the second glass sensor substrate so that sensor region is relative, and sticky object is water
Glue.
In preferable scheme, outer rim arrangement of the described glue along sensor region.
In preferable scheme, described glue is into " mouth " font.
In preferable scheme, described sensor region is multiple.
In preferable scheme, described glue is into " day " font or " mesh " font.
In preferable scheme, described sensor region is multiple, and arranged into array.
In preferable scheme, described glue is into sphere of movements for the elephants shape.
The first described glass sensor substrate and the second glass sensor substrate are the glass base that thickness is more than 0.2mm
Plate.
The first described glass sensor substrate and the second glass sensor substrate are the glass base that thickness is more than 0.55mm
Plate.
The utility model provides a kind of structure for being used to prepare ultrathin touch sensor, is passed by using by two sheet glass
Sensor substrate is with the relative structure being bonded with glue of sensor patterns, when for downstream process be thinned, the structural defence
Touch sensing, avoids oozing acid corrosion touch sensing effective district in thinning process；Also between reinforcing glass touch sensing
Adhesion, the support force of touch sensing is improved, the breakage rate in thinning process is greatly reduced, lifted and yield rate is thinned, reduced
The cost of processing touch sensing is thinned.
When ultrathin touch sensor uses G+G external hanging type touch technologies, cover plate can use the even more thin lids of 0.55mm
Plate, G+G are bonded glue 0.05 ~ 0.075mm of thickness, glass G Sensor using 0.2mm such as 0.09mm, 0.12mm, 0.15mm entirely
Sensor below thickness, then whole touch module thickness is below 0.85mmum.This thickness and current main flow In-Cell/
0.7mm glass cover-plate+0.125mm glues the thickness that thickness uses more in On-Cell or GFF touch control manners is quite even more thin.
Glass sensor G Sensor can be made lower using ripe high temperature film-plating process, the resistivity of conductive layer；
The Pattern processes of sensor pattern use monolithic glass gold-tinted process, and line width/line-spacing can be worked into 10um/10um even
It is finer；Glass processing procedure disappears, and shadow technique is more ripe, and Sensor is apparent to do better；Sensor reliabilities, sensitivity etc.
Aspect is also advantageous.To ensure that TP Sensor adapt to modern display and touch condition, TP Sensor intensity and globality
Can, particularly ultra-narrow frame, high definition are shown and OLED is shown, are had using the ultra-thin G+G touch technologies of below 0.2mm thickness
There are certain application and market prospects.
Brief description of the drawings
The utility model is described in further detail with reference to the accompanying drawings and examples：
Fig. 1 is cross-sectional structure schematic diagram of the present utility model.
Fig. 2 is " mouth " font schematic diagram after glass sensor substrate bonding in the utility model.
Fig. 3 is " day " font schematic diagram after glass sensor substrate bonding in the utility model.
Fig. 4 is " mesh " font schematic diagram after glass sensor substrate bonding in the utility model.
Fig. 5 is the sphere of movements for the elephants shape schematic diagram after glass sensor substrate bonding in the utility model.
In figure：First glass sensor substrate 1, the second glass sensor substrate 2, glue 3, sensor region 4.
Embodiment
Sensor：Sensor, this example middle finger are used for the touch sensing of digital display equipment.
TP Sensor：Tactile sensor, this example middle finger are used for the tactile sensor of digital display equipment, existing skill
ITO indium tin oxide layers are etched or printed using gold-tinted, laser, chemistry and printing process in art and form sensor.Preferably
For capacitance type sensor.
In-Cell：Refer to the scheme being embedded into touch sensing panel in liquid crystal pixel.
On-Cell：Refer to touch sensing panel being embedded between the colored filter substrate of display screen and polaroid
Scheme.
OGS：Full name One lass Solution：I.e. single glass solution.
GFF：Refer to that Cover Glass+Film Sensor+Film Sensor cover-plate glass senses with two membranes
Device solution.
G+G：Refer to Cover Glass+Cover Glass double glazed solutions, such as one layer of glass cover-plate, one layer of G
Sensor。
OLED：Organic Electricity laser display, OLED solution are self-luminous, wherein without liquid crystal pixel, therefore In- can not be used
Cell schemes.
G Sensor：Glass sensor.
Embodiment 1：
In Fig. 1 ~ 5, a kind of structure for being used to prepare ultrathin touch sensor, the first glass sensor substrate 1 is provided with
Sensor region 4, the second glass sensor substrate 2 are provided with sensor region 4；
First glass sensor substrate 1 is bonded with the second glass sensor substrate 2 so that sensor region 4 is relative, sticky object
For glue 3, as shown in fig. 1.Thus structure, formed and given mutual protection using the back side of two pieces of glass sensor substrates, utilize water
Glue 3 protects the gap between the first glass sensor substrate 1 and the second glass sensor substrate 2.Avoid for thinned etching
Liquid penetrates into, and protects sensor region 4, and the adhesion between reinforcing glass Sensor, improves Sensor support force, significantly drop
Breakage rate in low thinning process, lifted and yield rate is thinned, reduce the cost that processing Sensor is thinned.
In preferable scheme, outer rim arrangement of the described glue 3 along sensor region 4.
In preferable scheme, described glue 3 is into " mouth " font.As shown in Figure 2.
In preferable scheme, described sensor region 4 is multiple.
In preferable scheme, described glue 3 is into " day " font or " mesh " font.The glue adhesion zone of cut-off, energy are set
Enough further enhance the adhesion between glass Sensor.As shown in Fig. 3,4.
In preferable scheme, described sensor region 4 is multiple, and arranged into array.
In preferable scheme, described glue 3 is into sphere of movements for the elephants shape.As shown in Figure 5.
The first described glass sensor substrate 1 and the second glass sensor substrate 2 are the glass base that thickness is more than 0.2mm
Plate.
The first described glass sensor substrate 1 and the second glass sensor substrate 2 are the glass that thickness is more than 0.55mm
Substrate.
Embodiment 2：
A kind of structure for being used to prepare ultrathin touch sensor, comprises the following steps：
First, on the glass substrate of general thickness, in preferable scheme, the glass substrate of described general thickness is thickness
Glass substrate more than 0.2mm.
Sensor region 4 is prepared, obtains glass sensor substrate；In preferable scheme, the use of sensor region 4 is prepared
Method be etched using gold-tinted, laser beam marking, chemical etching or printing process etch to form sensor to ITO indium tin oxide layers
Region 4；
Or printed with printing process and to form sensor region 4.
2nd, by two panels glass sensor substrate, it is bonded with the pattern of sensor region 4 with glue 3 for sticky object is relative, water
Glue 3 forms closing along the outer rim of sensor region 4 outside sensor region 4, as shown in Figure 2；
In preferable scheme, described glue 3 is the glue of resistance to strong acid.It is preferred that the glue of resistance to strong acid using 3M.
In preferable scheme such as Fig. 3 ~ 5, according to the typesetting of sensor region 4, described glue 3 is into " mouth " font, " day "
Font, " mesh " font or sphere of movements for the elephants shape；Or the superposition of above shape.
3rd, the two panels glass sensor substrate after fitting is subjected to chemical reduction；
In preferable scheme, described chemical reduction is that the two panels glass sensor substrate after fitting is put into etching liquid
Immersion；
Etching liquid is one or more mixtures in hydrofluoric acid, the concentrated sulfuric acid, concentrated nitric acid or concentrated hydrochloric acid.
It is further preferred that the component of etching liquid is 180 ~ 190 parts of 70% concentrated sulfuric acid of mass percent by weight；
69% 1 ~ 4 part of concentrated nitric acid, 30% 3 ~ 4 parts of concentrated hydrochloric acid, 40% 50 ~ 100 parts of hydrofluoric acid.
The two panels glass sensor substrate after fitting is put into special basket tool, then placed into etching liquid first
Immersion；
By above step, ultra-thin Sensor is obtained.Method of the present utility model had both avoided Sensor effective districts,
Increase adhesive force between glass, and then reinforcing glass Sensor support force by way of adding many places glues bonding, reduce
Because glass bending comes to influence of the basket tool to thinned uniformity in thinning process.Decrease Sensor breakage rates.And operate
Also it is relatively simple, thinned mode is prepared ultra-thin Sensor below thickness 0.2mm and be provided with higher economy.Preferable scheme
In, thickness≤0.2mm of described ultra-thin touch sensing.In preferable scheme, described ultra-thin touch sensing
Thickness is 0.09 ~ 0.15mm.Such as three kinds of specifications such as 0.09 mm, 0.12 mm, 0.15 mm, commonly used value is higher, by
That client welcomes is 0.09 mm ultra-thin Sensor.
In preferable scheme, in addition to cutting step, obtain the ultra-thin Sensor of monolithic after cutting off glue 3.
Method of the present utility model solves that ultra-thin Sensor production difficulties are big, the high problem of cost；Avoid ultra-thin
The problem of Sensor directly processes Sensor and causes processing procedure damaged more and be difficult to volume production, makes ultra-thin Sensor processing can be big
Measure volume production.
The above embodiments are only optimal technical scheme of the present utility model, and are not construed as limit of the present utility model
System, the technical scheme that the scope of protection of the utility model should be recorded with claim, including the technical scheme that claim is recorded
The equivalents of middle technical characteristic are protection domain.Equivalent substitution i.e. within this range is improved, also in the utility model
Protection domain within.
Claims (9)
1. a kind of structure for being used to prepare ultra-thin Sensor, it is characterized in that：First glass sensor substrate（1）It is provided with sensor
Region（4）, the second glass sensor substrate（3）It is provided with sensor region（4）；
First glass sensor substrate（1）With the second glass sensor substrate（3）With sensor region（4）Relative fitting, bonding
Thing is glue（2）.
2. a kind of structure for being used to prepare ultra-thin Sensor according to claim 1, it is characterized in that：Described glue（2）
Along sensor region（4）Outer rim arrangement.
3. a kind of structure for being used to prepare ultra-thin Sensor according to claim 2, it is characterized in that：Described glue（2）
Into " mouth " font.
4. a kind of structure for being used to prepare ultra-thin Sensor according to claim 1, it is characterized in that：Described sensor regions
Domain（4）To be multiple.
5. a kind of structure for being used to prepare ultra-thin Sensor according to claim 4, it is characterized in that：Described glue（2）
Into " day " font or " mesh " font.
6. a kind of structure for being used to prepare ultra-thin Sensor according to claim 1, it is characterized in that：Described sensor regions
Domain（4）To be multiple, and arranged into array.
7. a kind of structure for being used to prepare ultra-thin Sensor according to claim 4, it is characterized in that：Described glue（2）
Into sphere of movements for the elephants shape.
8. a kind of structure for being used to prepare ultra-thin Sensor according to claim 1, it is characterized in that：The first described glass
Sensor base plate（1）With the second glass sensor substrate（3）It is more than 0.2mm glass substrate for thickness.
9. a kind of structure for being used to prepare ultra-thin Sensor according to claim 8, it is characterized in that：The first described glass
Sensor base plate（1）With the second glass sensor substrate（3）It is more than 0.55mm glass substrate for thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720284008.4U CN206961091U (en) | 2017-03-22 | 2017-03-22 | For preparing the structure of ultrathin touch sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720284008.4U CN206961091U (en) | 2017-03-22 | 2017-03-22 | For preparing the structure of ultrathin touch sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206961091U true CN206961091U (en) | 2018-02-02 |
Family
ID=61377267
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720284008.4U Active CN206961091U (en) | 2017-03-22 | 2017-03-22 | For preparing the structure of ultrathin touch sensor |
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| Country | Link |
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| CN (1) | CN206961091U (en) |
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