CN206891384U - A kind of detection means for integrated circuit packaging mould - Google Patents
A kind of detection means for integrated circuit packaging mould Download PDFInfo
- Publication number
- CN206891384U CN206891384U CN201720658051.2U CN201720658051U CN206891384U CN 206891384 U CN206891384 U CN 206891384U CN 201720658051 U CN201720658051 U CN 201720658051U CN 206891384 U CN206891384 U CN 206891384U
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- integrated circuit
- slideway
- photoelectric sensor
- circuit framework
- detection means
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Abstract
The utility model discloses a kind of detection means for integrated circuit packaging mould, including the slideway for being used to convey integrated circuit framework being located in encapsulating mould, monosymmetric in the slideway is installed with some to photoelectric sensor, two paired photoelectric sensors arrange in the form of being distributed up and down, position of the frame of the integrated circuit framework between paired photoelectric sensor, the frame of the integrated circuit framework is provided with positioning hole, photoelectric sensor is provided with to unthreaded hole, being oppositely arranged to unthreaded hole between two paired photoelectric sensors, the photoelectric sensor is connected by wire with control system.The utility model reduces the time of detection, improves the punching speed of system, so as to considerably improve the production efficiency of integrated circuit framework.
Description
Technical field
The encapsulation technology of integrated circuit framework is the utility model is related to, it is more particularly to a kind of to be used for integrated circuit packaging mould
Detection means.
Background technology
In traditional integrated circuit framework encapsulation technology, before encapsulating mould matched moulds, it is required for integrated circuit frame
The position of frame is positioned.In conventional art, be all often using detection pin come detect integrated circuit framework in encapsulating mould
In position it is whether correct.When being detected using detection pin, mould is set first to move to certain position, then by detecting pin
The positioning hole for importing framework detects whether feeding position is correct, and such system judges that the time whether framework is sent to position and needs prolongs
It is long, influence the punching speed of system.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of detection means for integrated circuit packaging mould,
The device can the position correctness be sent into mould of quick detection framework, save the time, improve the punching speed of system,
So as to the production efficiency considerably improved.
To achieve the above object, the utility model provides following technical scheme：One kind is used for integrated circuit packaging mould
Detection means, including be located in encapsulating mould and be used to convey the slideway of integrated circuit framework, the both sides pair in the slideway
Being installed with for claiming is some to photoelectric sensor, and two paired photoelectric sensors arrange in the form of being distributed up and down, described
Position of the frame of integrated circuit framework between paired photoelectric sensor, the frame of the integrated circuit framework are provided with
Positioning hole, photoelectric sensor are provided with to unthreaded hole, being oppositely arranged to unthreaded hole between two paired photoelectric sensors, the light
Electric transducer is connected by wire with control system.
Preferably, a pair of slideway cover plates are symmetrically installed with the both sides of slideway, the slideway cover plate is electric along integrating
The positioning hole distribution arrangement of road framework is set.
Preferably, photoelectric sensor is provided with 4 pairs, and one of them in each pair photoelectric sensor is fixedly mounted on slideway cover plate
Upper surface is arranged on the relevant position of slideway close to the edge of integrated circuit framework, another paired photoelectric sensor.
Preferably, slideway cover plate is being provided with the platform for overlapping integrated circuit framework close to the edge of integrated circuit framework
Rank.
Using above-mentioned technical proposal, the utility model instead of the feeding position of traditional detection pin detection integrated circuit framework
Put, when being detected using photoelectric sensor, as long as integrated circuit framework is sent in encapsulating mould, integrated circuit frame can be reflected at once
Position of the frame in encapsulating mould, then sends a signal to control system, is acted into next step.The utility model reduces inspection
The time of survey, the punching speed of system is improved, so as to considerably improve the production efficiency of integrated circuit framework.
Brief description of the drawings
Fig. 1 is the utility model structure diagram；
Fig. 2 is the distributing position schematic diagram of photoelectric sensor of the present utility model；
Fig. 3 is Fig. 2 right view.
Embodiment
Below in conjunction with the accompanying drawings, by the description to embodiment, the utility model is described further：
As shown in Figures 1 to 3, a kind of detection means for integrated circuit packaging mould of the utility model, including it is located at envelope
It is used to convey the slideway 1 of integrated circuit framework 4 in die-filling tool 2, monosymmetric in slideway 1 is installed with 4 pairs of photoelectricity
Sensor 3, two paired photoelectric sensors 3 arrange in the form of being distributed up and down, and the frame of integrated circuit framework 4 is positioned at paired
Photoelectric sensor 3 between position, the frame of integrated circuit framework 4 is provided with positioning hole 5, and photoelectric sensor 3 is provided with pair
Unthreaded hole 6, being oppositely arranged to unthreaded hole 6 between two paired photoelectric sensors 3, is symmetrically fixedly mounted on the both sides of slideway 1
There are a pair of slideway cover plates 7, positioning hole distribution arrangement of the slideway cover plate 7 along integrated circuit framework 4 is set.Slideway cover plate 7 is close
The edge of integrated circuit framework 4 is provided with the step 8 for being used for overlapping integrated circuit framework 4.In each pair photoelectric sensor 3 wherein
One is fixedly mounted on the upper surface of slideway cover plate 7 close to the edge of integrated circuit framework 4, another paired photoelectric sensor
3 are arranged on the relevant position of slideway 1.Photoelectric sensor 3 is connected by wire with control system.
4 pairs of photoelectric sensors 3 of the present utility model are distributed in the both sides up and down of integrated circuit framework 4, and detection is integrated respectively
The right and left of the positioning hole of circuit frame 4, integrated circuit framework 4 are being transported to the lower mould 21 of encapsulating mould 2 by band
It is interior.When step pitch is sent more or is sent less, then at least have a pair of photoelectric sensors 3 can not be by carrying out thang-kng to unthreaded hole 6, this
When control system will shutdown inspection, when 4 pairs of 3 whole thang-kngs of photoelectric sensor, represent that integrated circuit framework 4 is sent into Encapsulation Moulds
Position in tool 2 is correct, now, the upper mould 22 of encapsulating mould and the normal matched moulds of the ability of lower mould 21, is punched out.Photoelectric sensing
The reaction time of device 3, in below 0.5ms, it is very short to detect the required time.
The utility model detects the right and left scope of the positioning hole of integrated circuit framework 4 using arrangement photoelectric sensor 3,
The sensitivity of photoelectric sensor 3 can be increased, reduce error.To the left and right of the positioning hole of 6 detection integrated circuit frameworks 4 of unthreaded hole
The 0.3mm on both sides scope.And detection range can be by finely tuning the position of photoelectric sensor 3, to reach detection sensitivity
Higher, test position range shorter, it is more accurate to detect.
Above-described is only preferred embodiment of the present utility model, it is noted that for the ordinary skill of this area
For personnel, on the premise of not departing from the utility model and creating design, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.
Claims (4)
1. a kind of detection means for integrated circuit packaging mould, including be located at integrated for conveying in encapsulating mould (2)
The slideway (1) of circuit frame (4), it is characterised in that：Monosymmetric in the slideway (1) is installed with some to photoelectricity
Sensor (3), two paired photoelectric sensors (3) arrange in the form of being distributed up and down, the side of the integrated circuit framework (4)
Position of the frame between paired photoelectric sensor (3), the frame of the integrated circuit framework (4) are provided with positioning hole (5),
Photoelectric sensor (3) is provided with to unthreaded hole (6), being oppositely arranged to unthreaded hole (6) between two paired photoelectric sensors (3),
The photoelectric sensor (3) is connected by wire with control system.
2. the detection means according to claim 1 for integrated circuit packaging mould, it is characterised in that：The slideway
(1) a pair of slideway cover plates (7) are symmetrically installed with both sides, the slideway cover plate (7) is along integrated circuit framework (4)
Positioning hole distribution arrangement is set.
3. the detection means according to claim 2 for integrated circuit packaging mould, it is characterised in that：The photoelectric transfer
Sensor (3) is provided with 4 pairs, and one of them in each pair photoelectric sensor (3) is fixedly mounted on slideway cover plate (7) upper surface close to collection
Into the edge of circuit frame (4), another paired photoelectric sensor (3) is arranged on the relevant position of slideway (1).
4. the detection means according to claim 3 for integrated circuit packaging mould, it is characterised in that：The slideway lid
Plate (7) is being provided with the step (8) for overlapping integrated circuit framework (4) close to the edge of integrated circuit framework (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720658051.2U CN206891384U (en) | 2017-06-08 | 2017-06-08 | A kind of detection means for integrated circuit packaging mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720658051.2U CN206891384U (en) | 2017-06-08 | 2017-06-08 | A kind of detection means for integrated circuit packaging mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206891384U true CN206891384U (en) | 2018-01-16 |
Family
ID=61317384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720658051.2U Active CN206891384U (en) | 2017-06-08 | 2017-06-08 | A kind of detection means for integrated circuit packaging mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206891384U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112974284A (en) * | 2021-04-15 | 2021-06-18 | 四川明泰微电子有限公司 | Integrated IC detection system |
-
2017
- 2017-06-08 CN CN201720658051.2U patent/CN206891384U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112974284A (en) * | 2021-04-15 | 2021-06-18 | 四川明泰微电子有限公司 | Integrated IC detection system |
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