CN206879226U - A kind of high-density interconnected circuit board DES production systems - Google Patents
A kind of high-density interconnected circuit board DES production systems Download PDFInfo
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- CN206879226U CN206879226U CN201720845667.0U CN201720845667U CN206879226U CN 206879226 U CN206879226 U CN 206879226U CN 201720845667 U CN201720845667 U CN 201720845667U CN 206879226 U CN206879226 U CN 206879226U
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Abstract
The utility model discloses a kind of high-density interconnected circuit board DES production systems, including main support and the conveying assembly being arranged at the top of main support, also include reaction component, washing component and the air-dried component being successively set between the side wall of main support, conveying assembly includes blowing framework that can up and down with left and right activity, reaction component includes reactive tank, described washing component includes multi-level water washing trough, air-dries the blower duct that component includes being evenly distributed on two relative inner walls of main support.The structure setting of this high-density interconnected circuit board DES production systems is reasonable, by setting continuous reaction component, washing component and air-dried component, improves the efficiency of etching producing line；In addition, by setting up air-suction duct etc., reach the effect of defoaming, while realize the recycling of solution.
Description
Technical field
Wiring board processing technique field is the utility model is related to, more specifically, it relates to a kind of high density interconnected circuit
Plate DES production systems.
Background technology
High-density interconnection circuit board (HDI) refers to aperture in below 6mil, and the ring footpath (Hole Pad) of orifice ring is in 0.25mm
Micro- guide hole of following person, contactor density in 130 point/square more than, wiring density when 117 point/square more than, between its line width
Away from the circuit board in below 3mil/3mil.High density interconnecting circuit board (HDI) manufacture is with fastest developing speed in printed circuit board industry
A field, embodied a concentrated reflection of present PCB state-of-the-art technologies, high density interconnecting circuit board has that small volume, speed is fast, frequency
High advantage, it is the main spare part of personal computer, portable computer, mobile phone and personal digital assistant.HDI circuit boards can
Realize that random layer interconnects, there is lot of advantages, develop very fast.
Need to carry out acid etching (Developing in the preparation technology of high-density interconnection circuit board (HDI) wiring board
Etching $ Stripping), vehicle economy S techniques.So-called DES techniques are the copper corrosion that will be exposed using etching liquid after development
Fall, so as to form line pattern.High-density interconnection circuit board (HDI) is set because configuration density is high to DES producing lines
It is standby to require higher.In existing high-density interconnection circuit board (HDI) wiring board DES producing lines, etching separates with washing equipment, influences
The preparation efficiency of wiring board；In addition, easily producing substantial amounts of bubble in etching process, these bubbles are attached to PCB surface suppression
System etching is normally carried out, and causes the uneven of etching.
Utility model content
In view of the above, the technical problems to be solved in the utility model is：A kind of high-density interconnected circuit board DES is provided
Production system, enhanced etching uniformity, improve the efficiency for etching producing line.
In order to solve the above technical problems, the utility model adopts the following technical scheme that：
A kind of high-density interconnected circuit board DES production systems, including main support and the conveying that is arranged at the top of main support
Component, in addition to reaction component, washing component and the air-dried component being successively set between the side wall of main support；
Described conveying assembly includes blowing framework that can up and down with left and right activity；Described reaction component, including reaction
Groove, the reactive tank are arranged between the side wall of main support；Described washing component, including multi-level water washing trough, the multi-level water
Washing trough is arranged between the side wall of main support；Described air-dried component, including it is evenly distributed on two relative inner walls of main support
On blower duct.
Further, described conveying assembly also includes lift cylinder, moving slide block and feeder motor, on the top of main support
Tracks are provided with side, the moving slide block is movably arranged in tracks, and the lift cylinder is arranged on motion and slided
On block, the lift cylinder is arranged on the top margin of main support and is connected to moving slide block by screw mandrel, and the discharging frame frame is set
In the bottom of the cylinder rod of lift cylinder.
Further, described reaction component also includes air-suction duct and induced-draught fan, and the air-suction duct is circumferentially positioned at
The top of reactive tank, it is distributed with air-suction duct madial wall toward the suction nozzle in reactive tank, it is described to be arranged in induced-draught fan
In the side wall of air-suction duct, the air-suction duct is communicated in reactive tank by flexible pipe and induced-draught fan.
Using above-mentioned technical proposal, caused bubble in reactive tank is drawn into air-suction duct by induced-draught fan, then
It is back to by flexible pipe in reactive tank, reaches the effect of defoaming, while realizes the recycling of solution.
Further, the blower duct of two inner sidewall upper portions and the blower duct of bottom for being distributed in main support are arranged to
The warp architecture of relative tilt.
Using above-mentioned technical proposal, improve to blowing framework interior lines road plate cleaning effect.
Further, the bottom of reactive tank is provided with ultrasonic oscillation device.
Using above-mentioned technical proposal, the uniformity of solution in reactive tank is improved, improves the effect of reaction.
Further, it is provided with a ultrasonic oscillation device per the bottom of one-level tank in multi-level water washing trough.
Using above-mentioned technical proposal, the cleanliness factor of cleaning is improved using multi-level water washing trough, ultrasonic oscillation device is set up and enters one
Step improves cleaning performance.
The utility model provides a kind of high-density interconnected circuit board DES production systems, has the advantages that：
The structure setting of this high-density interconnected circuit board DES production systems is reasonable, by setting continuous reaction component, water
Component and air-dried component are washed, improves the efficiency of etching producing line；In addition, by setting up air-suction duct etc., reach the effect of defoaming, together
The recycling of Shi Shixian solution.
Described above is only the general introduction of technical solutions of the utility model, in order to better understand skill of the present utility model
Art means, and being practiced according to the content of specification, with preferred embodiment of the present utility model and coordinate accompanying drawing detailed below
Describe in detail bright as after.
Brief description of the drawings
Fig. 1 is the utility model embodiment overall structure diagram；
Fig. 2 is the utility model embodiment overall structure front view；
Fig. 3 is the utility model embodiment overall structure left view；
Fig. 4 is reaction component mplifying structure schematic diagram in the utility model embodiment two；
Fig. 5 is reaction component sectional view in Fig. 4.
Description of reference numerals：1st, main support；2nd, conveying assembly；3rd, reaction component；4th, component is washed；5th, component is air-dried；101、
Blowing framework；102nd, reactive tank；103rd, multi-level water washing trough；104th, blower duct；105th, lift cylinder；106th, moving slide block；
107th, feeder motor；108th, air-suction duct；109th, induced-draught fan；110th, suction nozzle；111st, ultrasonic oscillation device.
Embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below
Embodiment is used to illustrate the utility model, but is not limited to the scope of the utility model.
Embodiment 1
Referring to Fig. 1 to Fig. 3, a kind of high-density interconnected circuit board DES productions described in the preferred embodiment of the utility model one
System, including main support 1 and the conveying assembly 2 for being arranged on the top of main support 1, in addition to it is successively set on the side of main support 1
Reaction component 3, washing component 4 and air-dried component 5 between wall；
Described conveying assembly 2 includes blowing framework 101 that can up and down with left and right activity；Described conveying assembly 2 also wraps
Lift cylinder 105, moving slide block 106 and feeder motor 107 are included, tracks, the fortune are provided with the top margin of main support 1
Movable slider 106 is movably arranged in tracks, and the lift cylinder 105 is arranged on moving slide block 106, the lift cylinder
105 are arranged on the top margin of main support 1 and are connected to moving slide block 106 by screw mandrel, and the blowing framework 101 is arranged on lifting air
The bottom of the cylinder rod of cylinder 105；
Described reaction component 3, including reactive tank 102, the reactive tank 102 are arranged between the side wall of main support 1；Institute
The washing component 4 stated, including multi-level water washing trough 103, the multi-level water washing trough 103 are arranged between the side wall of main support 1；It is described
Air-dried component 5, including the blower duct 104 being evenly distributed on 1 two relative inner walls of main support.
The structure setting of this high-density interconnected circuit board DES production systems is reasonable, by set continuous reaction component 3,
Washing component 4 and air-dried component 5, improve the efficiency of etching producing line, and etching effect is good.
Embodiment 2
The present embodiment is transformed on the basis of embodiment 1.Referring to Fig. 1 to Fig. 3, a kind of high density interconnected circuit
Plate DES production systems, including main support 1 and the conveying assembly 2 for being arranged on the top of main support 1, in addition to it is successively set on master
Reaction component 3, washing component 4 and air-dried component 5 between the side wall of support 1；
Described conveying assembly 2 includes blowing framework 101 that can up and down with left and right activity；Described reaction component 3, including
Reactive tank 102, the reactive tank 102 are arranged between the side wall of main support 1；Described washing component 4, including multi-level water washing trough
103, the multi-level water washing trough 103 is arranged between the side wall of main support 1；Described air-dried component 5, including it is evenly distributed on master
Blower duct 104 on 1 two relative inner walls of support.
In this preferred embodiment, described conveying assembly 2 also includes lift cylinder 105, moving slide block 106 and conveying electricity
Machine 107, tracks are provided with the top margin of main support 1, the moving slide block 106 is movably arranged in tracks, institute
State lift cylinder 105 to be arranged on moving slide block 106, the lift cylinder 105 is arranged on the top margin of main support 1 and passes through screw mandrel
Moving slide block 106 is connected to, the blowing framework 101 is arranged on the bottom of the cylinder rod of lift cylinder 105.
Referring to Fig. 4 and Fig. 5, described reaction component 3 also includes air-suction duct 108 and induced-draught fan 109, the air-suction duct
108 are circumferentially positioned at the top of reactive tank 102, are distributed with the madial wall of air-suction duct 108 toward the air draught in reactive tank 102
Mouth 110, described to be arranged in induced-draught fan 109 in the side wall of air-suction duct 108, the air-suction duct 108 passes through flexible pipe and air draught
Machine 109 is communicated in reactive tank 102.Caused bubble in reactive tank 102 is drawn into air-suction duct 108 by induced-draught fan 109,
Then it is back to by flexible pipe in reactive tank 102, reaches the effect of defoaming, while realizes the recycling of solution.
In this preferred embodiment, the blower duct 104 of two inner sidewall upper portions and the blower duct 104 of bottom are distributed in
The warp architecture of relative tilt is arranged to, is improved to wiring board cleaning effect in blowing framework 101.In the bottom of reactive tank 102
Ultrasonic oscillation device 111 is provided with, improves the uniformity of solution in reactive tank 102, improves the effect of reaction.In multi-level water washing trough
A ultrasonic oscillation device 111 is provided with per the bottom of one-level tank in 103, cleaning is improved using multi-level water washing trough 103
Cleanliness factor, set up ultrasonic oscillation device 111 and further improve cleaning performance.
The structure setting of this high-density interconnected circuit board DES production systems is reasonable, by set continuous reaction component 3,
Washing component 4 and air-dried component 5, improve the efficiency of etching producing line；In addition, by setting up air-suction duct 108 etc., reach defoaming
Effect, while realize the recycling of solution.
Described above, only specific embodiment of the present utility model, the scope of protection of the utility model are not limited to
This, any one skilled in the art is in the technical scope that the utility model discloses, the change that can readily occur in
Or replace, it should all cover within the scope of protection of the utility model.Therefore, the scope of protection of the utility model should be with right
It is required that the protection domain defined is defined.
Claims (5)
1. a kind of high-density interconnected circuit board DES production systems, including main support and the conveying group that is arranged at the top of main support
Part, it is characterised in that：Also include reaction component, washing component and the air-dried component being successively set between the side wall of main support；
Described conveying assembly includes blowing framework that can up and down with left and right activity, and described conveying assembly also includes lifting air
Cylinder, moving slide block and feeder motor, are provided with tracks on the top margin of main support, and the moving slide block is movably arranged on fortune
On dynamic rail road, the lift cylinder is arranged on moving slide block, and the lift cylinder is arranged on the top margin of main support and passes through silk
Bar is connected to moving slide block, and the discharging frame frame is arranged on the bottom of the cylinder rod of lift cylinder；
Described reaction component, including reactive tank, the reactive tank are arranged between the side wall of main support；Described washing group
Part, including multi-level water washing trough, the multi-level water washing trough are arranged between the side wall of main support；Described air-dried component, including it is equal
The even blower duct being distributed on two relative inner walls of main support.
2. high-density interconnected circuit board DES production systems according to claim 1, it is characterised in that：Described reaction group
Part also includes air-suction duct and induced-draught fan, and the air-suction duct is circumferentially positioned at the top of reactive tank, in air-suction duct madial wall
It is distributed with toward the suction nozzle in reactive tank, described to be arranged in induced-draught fan in the side wall of air-suction duct, the air-suction duct
Reactive tank is communicated in by flexible pipe and induced-draught fan.
3. high-density interconnected circuit board DES production systems according to claim 1, it is characterised in that：It is distributed in main support
The blower duct of two inner sidewall upper portions and the blower duct of bottom be arranged to the warp architecture of relative tilt.
4. the high-density interconnected circuit board DES production systems according to any one of claims 1 to 3, it is characterised in that：Anti-
The bottom of groove is answered to be provided with ultrasonic oscillation device.
5. the high-density interconnected circuit board DES production systems according to any one of claims 1 to 3, it is characterised in that：More
In level rinsing bowl a ultrasonic oscillation device is provided with per the bottom of one-level tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720845667.0U CN206879226U (en) | 2017-07-12 | 2017-07-12 | A kind of high-density interconnected circuit board DES production systems |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720845667.0U CN206879226U (en) | 2017-07-12 | 2017-07-12 | A kind of high-density interconnected circuit board DES production systems |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206879226U true CN206879226U (en) | 2018-01-12 |
Family
ID=61330100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720845667.0U Active CN206879226U (en) | 2017-07-12 | 2017-07-12 | A kind of high-density interconnected circuit board DES production systems |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206879226U (en) |
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2017
- 2017-07-12 CN CN201720845667.0U patent/CN206879226U/en active Active
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