CN206877980U - A kind of pin transformational structure of electronic component - Google Patents
A kind of pin transformational structure of electronic component Download PDFInfo
- Publication number
- CN206877980U CN206877980U CN201720622838.3U CN201720622838U CN206877980U CN 206877980 U CN206877980 U CN 206877980U CN 201720622838 U CN201720622838 U CN 201720622838U CN 206877980 U CN206877980 U CN 206877980U
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- pin
- pin groove
- conversion support
- vertical
- horizontal
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Abstract
The utility model discloses a kind of pin transformational structure of electronic component, including DIP components and conversion support, DIP components are provided with pin, by surface bending of the segment section of pin along conversion support and it is fixed on using automated machine on conversion support, the segment section of pin is set to be located at the bottom of conversion support, this part that pin is located at conversion support bottom is defined as welding section, the surface of welding section is higher than the lower surface of conversion support, DIP components are made to be changed to the encapsulation of SMT technologies, effectively improve the compactedness and reliability of product, it is widely portable to transform the DIP components of all size, and then substantially reduce production cost, improve product quality and production efficiency.
Description
Technical field
It the utility model is related to a kind of semiconductor devices, the pin transformational structure of particularly a kind of electronic component.
Background technology
It is increasingly mature with automatic producing technology and SMT paster process technologies, in the production process of electronic product
SMD components more and more are used, SMT technologies can not only improve the compactedness and reliability of product, additionally it is possible to improve life
Efficiency is produced, but in the prior art, some electronic components still can not be made at present due to reasons such as its processing procedure, structure, characteristics
SMD component structures, such as the electrochemical capacitor of some high voltages, Large Copacity；Piezo-resistance of high-voltage value etc..Some high-voltage devices
Part, although the product for having SMD on the market is supplied, the DIP products of same parameter are compared, its price will be higher by three times or so, because
This exerts a certain influence to production efficiency and cost.
The content of the invention
For overcome the deficiencies in the prior art, the utility model, which provides one kind and can transform DIP components as, to be applied to
SMT technology patterns, the DIP versatile, production cost is low, production efficiency is high and SMD pins transformational structure.
Technical scheme is used by the utility model solves its technical problem：
A kind of pin transformational structure of electronic component, including DIP components and conversion support, the DIP components are set
There is a pin, the surface bending of the segment section of the pin along the conversion support, make the segment section of pin positioned at the conversion branch
The bottom of frame, this part that the pin is located at the conversion support bottom are defined as welding section, and the surface of the welding section is high
In the lower surface of the conversion support.
There are four kinds of embodiments in the utility model, the conversion support of the first embodiment is stand type support, described turn
The side wall for changing support is provided with vertical pin groove, and bottom is provided with horizontal pin groove, the bottom of the vertical pin groove with it is described
Horizontal pin groove connection, the pin is close to the vertical pin groove and horizontal pin groove bending, and is embedded in the vertical pin
In groove and horizontal pin groove；The welding section is located at the part in the horizontal pin groove, the surface of the welding section for pin
Higher than the lower surface of the conversion support.
The conversion support of second of embodiment is stand type support, and the conversion support, which is provided with, allows the pin to pass through
Through hole, the bottom of the conversion support is provided with horizontal pin groove, and side wall is provided with vertical pin groove, the horizontal pin groove
One end connected with the lower end of the through hole, the other end connects with the lower end of the vertical pin groove；The pin is described in
It is close to the horizontal pin groove and vertical pin groove bending after through hole, and in the horizontal pin groove and vertical pin groove；
The welding section is the part that pin is located in the horizontal pin groove, and the surface of the welding section is higher than the conversion support
Lower surface.
The bottom of the conversion support is provided with inclined plane part, and the inclined plane part overlaps with the throughhole portions.
The conversion support of the third embodiment is Horizontal support, and the side wall of the conversion support is provided with vertical pin
Groove, bottom are provided with horizontal pin groove, and the lower end of the vertical pin groove connects with the horizontal pin groove, and the pin is close to
The vertical pin groove and horizontal pin groove bending, and in vertical the pin groove and horizontal pin groove；The welding section
It is located at the part in the horizontal pin groove for pin, the surface of the welding section is higher than the lower surface of the conversion support.
The conversion support of 4th kind of embodiment is Horizontal support, and the conversion support, which is provided with, allows the pin to pass through
Breach, the side wall of the conversion support is provided with vertical pin groove, and bottom is provided with horizontal pin groove, the vertical pin groove
Upper end connected with the breach, lower end connects with the horizontal pin groove, the pin pass through be close to after the breach it is described
Vertical pin groove and horizontal pin groove bending, and in vertical the pin groove and horizontal pin groove；The welding section is to draw
Pin is located at the part in the horizontal pin groove, and the surface of the welding section is higher than the lower surface of the conversion support.
The bottom of above-mentioned four kinds of embodiment conversion supports may be provided with padded balance fulcrum.
Above-mentioned four kinds of embodiment conversion supports may be provided with to be housed for a part for the DIP components is embedded
Chamber.
The beneficial effects of the utility model are：The utility model adds conversion branch on the basis of original DIP components
Frame, by the pin bending of DIP components and it is fixed on using automated machine on conversion support, DIP components is changed to SMT skills
Art encapsulates, and effectively improves the compactedness and reliability of product, is widely portable to change the DIP components of all size
Make, and then substantially reduce production cost, improve product quality and production efficiency.
Brief description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the structural representation of the first embodiment；
Fig. 2 is the structural representation of the first embodiment conversion support；
Fig. 3 is the decomposing schematic representation of the first embodiment；
Fig. 4 is the structural representation of second of embodiment；
Fig. 5 is the structural representation of second of embodiment conversion support；
Fig. 6 is the decomposing schematic representation of second of embodiment；
Fig. 7 is the sectional view of second of embodiment；
Fig. 8 is the structural representation of the third embodiment；
Fig. 9 is one of structure chart of the third embodiment conversion support；
Figure 10 is the two of the structure chart of the third embodiment conversion support；
Figure 11 is the structural representation of the 4th kind of embodiment；
Figure 12 is one of structure chart of the 4th kind of embodiment conversion support；
Figure 13 is the two of the structure chart of the 4th kind of embodiment conversion support.
Embodiment
Referring to figs. 1 to Figure 13, a kind of electronic component DIP (inline package) and the Change-over knot of SMD (surface mount) pin
Structure, including DIP components 1 and conversion support 3, conversion support 3 can make adaptable size according to the specification of DIP components 1,
The DIP components 1 are provided with pin 2, using automated machine by surface of the segment section of pin 2 along the conversion support 3
Bending is simultaneously fixed on formation SMD components on conversion support, the segment section of pin 2 is located at the bottom of the conversion support 3, institute
State pin 2 and be located at this part of the bottom of conversion support 3 and be defined as welding section, the surface of the welding section is higher than the conversion
The lower surface of support 3, make the component of DIP welding procedures can only be used to be changed to SMT paster techniques originally, effectively improve production
The compactedness and reliability of product, it is widely portable to transform the DIP components of all size, and then substantially reduces production
Cost, improve product quality and production efficiency.
There are four kinds of embodiments in the utility model, referring to figs. 1 to Fig. 3, the conversion support 3 of the first embodiment is vertical
Formula support, the side wall of the conversion support 3 are provided with vertical pin groove 6A, and bottom is provided with horizontal pin groove 5A, described vertical
Pin groove 6A bottom connects with the horizontal pin groove 5A, and the pin 2 is close to the vertical pin groove 6A and horizontal pin
Groove 5A bendings, and in vertical the pin groove 6A and horizontal pin groove 5A；Furthermore, the pin 2 is from outside
First bending is in the vertical pin groove 6A, then bending is embedded in the horizontal pin groove 5A；The welding section is pin 2
Part in the horizontal pin groove 5A, the surface of the welding section are higher than the lower surface of the conversion support 3, are easy to paste
Made electrical contact with during piece with pcb board.
Reference picture 4 is to Fig. 7, and the conversion support 3 of second of embodiment is stand type support, and the conversion support 3 is provided with
Allow the through hole 4B that the pin 2 passes through, the bottom of the conversion support 3 is provided with horizontal pin groove 5B, and side wall is provided with perpendicular
To pin groove 6B, one end of the horizontal pin groove 5B connects with the lower end of the through hole 4B, the other end and the vertical pin
Groove 6B lower end connection；The pin 2 is close to the horizontal pin groove 5B and vertical pin groove successively after passing through the through hole 4B
6B bendings, and in the horizontal pin groove 5B and vertical pin groove 6B；The welding section is located at the transverse direction for pin 2 and drawn
Part in pin groove 5B, the surface of the welding section are higher than the lower surface of the conversion support 3, when being easy to paster and pcb board
Electrical contact.In the present embodiment, the bottom of the conversion support 3 is provided with inclined plane part 9, the inclined plane part 9 and the through hole 4B
Partially overlap, be easy to be positioned during machine punching press, improve product qualification rate.
Reference picture 8 is to Figure 10, and the conversion support 3 of the third embodiment is Horizontal support, the side wall of the conversion support 3
Vertical pin groove 6C is provided with, bottom is provided with horizontal pin groove 5C, and the lower end of the vertical pin groove 6C is drawn with the transverse direction
Pin groove 5C is connected, and the pin 2 is close to the vertical pin groove 6C and horizontal pin groove 5C bendings, and is embedded in the vertical pin
In groove 6C and horizontal pin groove 5C；The welding section is located at the part in the horizontal pin groove 5C, the welding section for pin 2
Surface be higher than the lower surface of the conversion support 3, made electrical contact with when being easy to paster with pcb board, form horizontal SMD components,
Adaptability is stronger, meets the production needs of different electronic products.
Reference picture 11 is to Figure 13, and the conversion support 3 of the 4th kind of embodiment is Horizontal support, and the conversion support 3 is set
There is the breach 4D for allowing the pin 2 to pass through, the side wall of the conversion support 3 is provided with vertical pin groove 6D, and bottom is provided with
Horizontal pin groove 5D, the upper end of the vertical pin groove 6D connect with the breach 4D, and lower end connects with the horizontal pin groove 5D
Logical, the pin 2 is close to the vertical pin groove 6D and horizontal pin groove 5D bendings after passing through the breach 4D, and embedded in described
In vertical pin groove 6D and horizontal pin groove 5D；The welding section is located at the part in the horizontal pin groove 5D, institute for pin 2
The surface for stating welding section is higher than the lower surface of the conversion support 3, is easy to make electrical contact with pcb board during paster, forms horizontal SMD
Component, adaptability is stronger, meets the production needs of different electronic products.
The bottom of above-mentioned four kinds of embodiment conversion supports 3 may be provided with padded fulcrum 8, on the one hand make bottom and pin
Height between 2 reaches balance, on the other hand makes have certain space to be used to weld around pin 2, is easy to scolding tin to circulate, makes
Solder joint is more firm.Above-mentioned four kinds of embodiment conversion supports 3 may be provided with the part insertion for the DIP components 1
Accommodating cavity 7, DIP components 1 fixed, effectively reduce product size, and certain to playing for DIP components 1
Packaging type protective effect.
Embodiment above can not limit the protection domain of the invention, and the personnel of professional skill field are not departing from
In the case of the invention general idea, the impartial modification and change done, the scope that the invention is covered is still fallen within
Within.
Claims (8)
1. a kind of pin transformational structure of electronic component, including DIP components (1), the DIP components (1) are provided with pin
(2), it is characterised in that it also includes conversion support (3), the surface of the segment section of the pin (2) along the conversion support (3)
Bending, makes the segment section of pin (2) be located at the bottom of the conversion support (3), and the pin (2) is located at the conversion support
(3) this part of bottom is defined as welding section, and the surface of the welding section is higher than the lower surface of the conversion support (3).
2. the pin transformational structure of electronic component according to claim 1, it is characterised in that the conversion support (3) is vertical
Formula support, the side wall of the conversion support (3) are provided with vertical pin groove (6A), and bottom is provided with horizontal pin groove (5A), institute
The bottom for stating vertical pin groove (6A) connects with the horizontal pin groove (5A), and the pin (2) is close to the vertical pin groove
(6A) and horizontal pin groove (5A) bending, and in vertical the pin groove (6A) and horizontal pin groove (5A)；The welding
Section is located at the part in the horizontal pin groove (5A) for pin (2), and the surface of the welding section is higher than the conversion support (3)
Lower surface.
3. the pin transformational structure of electronic component according to claim 1, it is characterised in that the conversion support (3) is vertical
Formula support, the conversion support (3) are provided with the through hole (4B) for allowing the pin (2) to pass through, the bottom of the conversion support (3)
Portion is provided with horizontal pin groove (5B), and side wall is provided with vertical pin groove (6B), one end of the horizontal pin groove (5B) and institute
The lower end connection of through hole (4B) is stated, the other end connects with the lower end of the vertical pin groove (6B)；The pin (2) is described in
It is close to the horizontal pin groove (5B) and vertical pin groove (6B) bending after through hole (4B), and is embedded in the horizontal pin groove (5B)
In vertical pin groove (6B)；The welding section is located at the part in the horizontal pin groove (5B), the welding for pin (2)
The surface of section is higher than the lower surface of the conversion support (3).
4. the pin transformational structure of electronic component according to claim 3, it is characterised in that the bottom of the conversion support (3)
Portion is provided with inclined plane part (9), and the inclined plane part (9) partially overlaps with the through hole (4B).
5. the pin transformational structure of electronic component according to claim 1, it is characterised in that the conversion support (3) is sleeping
Formula support, the side wall of the conversion support (3) are provided with vertical pin groove (6C), and bottom is provided with horizontal pin groove (5C), institute
The lower end for stating vertical pin groove (6C) connects with the horizontal pin groove (5C), and the pin (2) is close to the vertical pin groove
(6C) and horizontal pin groove (5C) bending, and in vertical the pin groove (6C) and horizontal pin groove (5C)；The welding
Section is located at the part in the horizontal pin groove (5C) for pin (2), and the surface of the welding section is higher than the conversion support (3)
Lower surface.
6. the pin transformational structure of electronic component according to claim 1, it is characterised in that the conversion support (3) is sleeping
Formula support, the conversion support (3) are provided with the breach (4D) for allowing the pin (2) to pass through, the side of the conversion support (3)
Wall is provided with vertical pin groove (6D), and bottom is provided with horizontal pin groove (5D), the upper end of the vertical pin groove (6D) and institute
Breach (4D) connection is stated, lower end connects with the horizontal pin groove (5D), and the pin (2) is close to after passing through the breach (4D)
The vertical pin groove (6D) and horizontal pin groove (5D) bending, and embedded in the vertical pin groove (6D) and horizontal pin groove
In (5D)；The welding section is the part that pin (2) is located in the horizontal pin groove (5D), and the surface of the welding section is higher than
The lower surface of the conversion support (3).
7. the pin transformational structure of electronic component according to any one of claims 1 to 6, it is characterised in that the conversion support
(3) bottom is provided with padded fulcrum (8).
8. the pin transformational structure of electronic component according to any one of claims 1 to 6, it is characterised in that the conversion support
(3) it is provided with for the embedded accommodating cavity (7) of a part for the DIP components (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720622838.3U CN206877980U (en) | 2017-05-31 | 2017-05-31 | A kind of pin transformational structure of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720622838.3U CN206877980U (en) | 2017-05-31 | 2017-05-31 | A kind of pin transformational structure of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206877980U true CN206877980U (en) | 2018-01-12 |
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ID=61337645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720622838.3U Expired - Fee Related CN206877980U (en) | 2017-05-31 | 2017-05-31 | A kind of pin transformational structure of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206877980U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493119A (en) * | 2018-05-11 | 2018-09-04 | 朱同江 | Production method of patch electronics components and products thereof |
-
2017
- 2017-05-31 CN CN201720622838.3U patent/CN206877980U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493119A (en) * | 2018-05-11 | 2018-09-04 | 朱同江 | Production method of patch electronics components and products thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180112 |