CN206864438U - A kind of laminar structure of substrate baking - Google Patents
A kind of laminar structure of substrate baking Download PDFInfo
- Publication number
- CN206864438U CN206864438U CN201720660125.6U CN201720660125U CN206864438U CN 206864438 U CN206864438 U CN 206864438U CN 201720660125 U CN201720660125 U CN 201720660125U CN 206864438 U CN206864438 U CN 206864438U
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- China
- Prior art keywords
- substrate
- big sheet
- sheet copper
- plastic packaging
- briquetting
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Abstract
It the utility model is related to a kind of laminar structure of substrate baking, include baking framework, bottom surface in baking framework is provided with a piece of big sheet copper, multiple plastic packaging substrates are provided with the big sheet copper, multiple big sheet coppers are additionally provided with the substrate of plastic packaging of top layer, multiple briquettings are provided with the big sheet copper of top layer, the edge of multiple briquettings aligns, and is placed in the middle of big sheet copper；The laminar structure of the substrate baking of the utility model, can solve the general sex chromosome mosaicism of thin chip and the package substrate thickness of relatively thin chip by briquetting；And avoid the incomplete problem of stress caused by briquetting directly acts on substrate；The weight of briquetting is discharged into by whole real estate by big sheet copper, makes each point pressure equal, obtains effect of optimization, having broken briquetting must be with the existing law of substrate size identical.
Description
Technical field
It the utility model is related to a kind of laminar structure of substrate baking.
Background technology
Except this main flow wafer supplied materials type of full-wafer, because of the needs in market, still there is 40% sorting chip to need to be sealed
Specification product is dressed up, its appearance requirement, sometimes even can be tighter because of the difference of application market at least as conventional products
Lattice.
Full-wafer can wear into required thickness depending on the lamination number of plies, and therefore caused sorting chip just correspond to it is a variety of
Different-thickness；General thickness is 200um~280um, and relatively thin chip thickness is 130~200um, thin chip thickness is 40~
120um；General thickness chip can continue to use existing encapsulating material and structural parameters completely；Relatively thin chip is also applied for existing envelope
Package material and structural parameters, but need to carry out Flue curing parameter optimization during toasting after plastic packaging.
But for thin chip, increase pad can cause material cost to rise 30%, cause capacity loss 40%；It is long-range to consider
Development, to remove pad, it is necessary to develop brand-new die cavity, the substrate thickness of design ideal, selects most suitably used plastic packaging resin, and
The laminar structure of its baking of optimization design.
Utility model content
The purpose of the utility model is to provide a kind of laminar structure of substrate baking for overcome the deficiencies in the prior art.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of laminar structure of substrate baking, comprising
Framework is toasted, the bottom surface toasted in framework is provided with a piece of big sheet copper, and multiple plastic packaging substrates are provided with the big sheet copper,
Multiple big sheet coppers are additionally provided with the substrate of plastic packaging of top layer, multiple briquettings, multiple pressures are provided with the big sheet copper of top layer
The edge alignment of block, it is placed in the middle of big sheet copper.
Preferably, the number of the substrate of plastic packaging is 9 to 15.
Preferably, the number of the big sheet copper on the upside of the substrate of plastic packaging is 9 to 15.
Preferably, the area of the big sheet copper is more than plastic packaging substrate, and the area of briquetting is less than plastic packaging substrate.
Preferably, the area of the briquetting is the 70% of plastic packaging substrate.
Due to the utilization of above-mentioned technical proposal, the utility model has following advantages compared with prior art：
The laminar structure of the substrate baking of the utility model, can solve thin chip and relatively thin chip by briquetting
The general sex chromosome mosaicism of package substrate thickness；And avoid the incomplete problem of stress caused by briquetting directly acts on substrate；It is logical
The weight of briquetting is discharged into whole real estate by excessive sheet copper, makes each point pressure equal, is obtained effect of optimization, has been broken briquetting
Must be with the existing law of substrate size identical.
Brief description of the drawings
Technical solutions of the utility model are described further below in conjunction with the accompanying drawings：
Accompanying drawing 1 is a kind of schematic diagram of the laminar structure of substrate baking described in the utility model.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment the utility model is described in further detail.
As shown in figure 1, a kind of laminar structure of substrate baking described in the utility model, includes baking framework 10, baking
Bottom surface in framework 10 is provided with a piece of big sheet copper 8, and 9 to 15 plastic packaging substrates 7, top layer are provided with the big sheet copper 8
The substrate of plastic packaging 7 on be additionally provided with 9 to 15 big sheet copper 8, be provided with 3 briquettings 9 on the big sheet copper 8 of top layer, each
3 kilograms or so of 9 weight of briquetting, the edge of 3 briquettings 9 is in alignment with each other, on the position for the middle for being placed in big sheet copper 8.
Wherein, the area of the big sheet copper 8 is more than plastic packaging substrate 7, and the area of briquetting 9 is the 70% of plastic packaging substrate 7
Left and right, depending on the requirement of the quantity of big sheet copper 8 and briquetting 9 with substrate slip flexibility and single product tin ball coplane degree.
It the above is only concrete application example of the present utility model, do not form any limit to the scope of protection of the utility model
System.All technical schemes formed using equivalent transformation or equivalent replacement, all fall within the utility model rights protection scope it
It is interior.
Claims (5)
- A kind of 1. laminar structure of substrate baking, it is characterised in that：Include baking framework（10）, toast framework（10）Interior bottom surface It is provided with a piece of big sheet copper（8）, the big sheet copper（8）On be provided with multiple plastic packaging substrates（7）, the plastic packaging substrate of top layer （7）On be additionally provided with multiple big sheet coppers（8）, the big sheet copper of top layer（8）On be provided with multiple briquettings（9）, multiple briquettings（9） Edge alignment, be placed in big sheet copper（8）Middle.
- 2. the laminar structure of substrate baking according to claim 1, it is characterised in that：The plastic packaging substrate（7） Number is 9 to 15.
- 3. the laminar structure of substrate baking according to claim 1, it is characterised in that：The plastic packaging substrate（7）Upside Big sheet copper（8）Number be 9 to 15.
- 4. the laminar structure of substrate baking according to claim 1, it is characterised in that：The big sheet copper（8）Area More than plastic packaging substrate（7）, briquetting（9）Area be less than plastic packaging substrate（7）.
- 5. the laminar structure of substrate baking according to claim 4, it is characterised in that：The briquetting（9）Area for Plastic packaging substrate（7）70%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720660125.6U CN206864438U (en) | 2017-06-08 | 2017-06-08 | A kind of laminar structure of substrate baking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720660125.6U CN206864438U (en) | 2017-06-08 | 2017-06-08 | A kind of laminar structure of substrate baking |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206864438U true CN206864438U (en) | 2018-01-09 |
Family
ID=60831318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720660125.6U Active CN206864438U (en) | 2017-06-08 | 2017-06-08 | A kind of laminar structure of substrate baking |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206864438U (en) |
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2017
- 2017-06-08 CN CN201720660125.6U patent/CN206864438U/en active Active
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