CN206851132U - A kind of good circuit board of thermal diffusivity - Google Patents
A kind of good circuit board of thermal diffusivity Download PDFInfo
- Publication number
- CN206851132U CN206851132U CN201720645481.0U CN201720645481U CN206851132U CN 206851132 U CN206851132 U CN 206851132U CN 201720645481 U CN201720645481 U CN 201720645481U CN 206851132 U CN206851132 U CN 206851132U
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- CN
- China
- Prior art keywords
- protective layer
- circuit board
- lower protective
- layer
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of good circuit board of thermal diffusivity,Including up-protective layer,Lower protective layer,Circuit board,Heat dissipating layer,Via and screw hole,The up-protective layer is surrounded by groove,Many individual vias are provided with the up-protective layer,It is and corresponding with the hole site excessively on circuit board,The lower protective layer is surrounded by tongue,And the tongue of lower protective layer is corresponding with the groove location of up-protective layer,Pit is provided among the lower protective layer,And in circuit board installation and pit,The heat dissipating layer is located at lower protective layer lower surface bottom,The heat dissipating layer includes copper pipe and heat conductive adhesive,The copper pipe is uniformly arranged in heat dissipating layer,And it is covered with heat conductive adhesive in the gap between copper pipe,The heat dissipating layer is fixed by heat conductive adhesive and lower protective layer,The up-protective layer on the inside of lower protective layer corner with being provided with screw hole,And it is provided with screw in screw hole,The utility model is simple in construction,Definite functions,It is adapted to be widely popularized.
Description
Technical field
It the utility model is related to a kind of circuit board, the good circuit board of more particularly to a kind of thermal diffusivity.
Background technology
Circuit board makes circuit miniaturization, directly perceivedization, batch production and optimization electrical appliance layout lifting for permanent circuit
Acting on, circuit board has already taken up important status in the electronics industry at present, in recent ten years, China's circuit board fabrication
Industry development is rapid, develops but have also discovered that many problems are to be solved therewith, the material of existing pcb board heat dissipating layer is mostly aluminium
Plate or ceramics, both thermal conductivity of material are poor so that the heat dissipating layer temperature of corresponding region is high immediately below element, remaining area
Domain temperature is low, causes element local temperature too high and cisco unity malfunction, and present circuit board is not effectively protected and arranged
Apply, it is easy to circuit board is damaged, therefore, a kind of it is proposed that good circuit board of thermal diffusivity.
Utility model content
Main purpose of the present utility model is to provide a kind of thermal diffusivity good circuit board can effectively solve background technology
The problem of middle.
To achieve the above object, the technical scheme that the utility model is taken is：
A kind of good circuit board of thermal diffusivity, including up-protective layer, lower protective layer, circuit board, heat dissipating layer, via and screw
Hole, the up-protective layer are surrounded by groove, are provided with many individual vias in the up-protective layer, and with the mistake hole position on circuit board
To put corresponding, the lower protective layer is surrounded by tongue, and the tongue of lower protective layer is corresponding with the groove location of up-protective layer,
Pit is provided among the lower protective layer, and in circuit board installation and pit, the heat dissipating layer is located at lower protective layer lower surface bottom
Portion, the heat dissipating layer include copper pipe and heat conductive adhesive, and the copper pipe is uniformly arranged in heat dissipating layer, and between copper pipe
It is covered with heat conductive adhesive in gap, the heat dissipating layer is fixed by heat conductive adhesive and lower protective layer, the up-protective layer
With being provided with screw hole on the inside of lower protective layer corner, and screw is provided with screw hole, the lower protective layer both sides are provided with mounting hole.
Further, the circuit board height is identical with the depth of pit.
Further, the mounting hole is the mounting hole being internally threaded.
Further, the up-protective layer uses the material of high-temperature insulation, and up-protective layer is that upper surface is printed on circuit
The up-protective layer of the circuit diagram of plate.
Further, the lower protective layer is using the good insulating materials of thermal conductivity.
Compared with prior art, the utility model has the advantages that：
1st, the utility model is provided with up-protective layer and lower protective layer, and pit is provided among lower protective layer, and circuit board is pacified
In dress and pit, and the tongue that the groove that up-protective layer is surrounded by can be surrounded by with lower protective layer mutually blocks, and on
Protective layer is provided with screw with being equipped with screw hole on the inside of lower protective layer surrounding in screw hole, makes up-protective layer and lower protective layer
Connection more consolidates, so as to protection circuit plate.
2nd, up-protective layer of the present utility model is the up-protective layer that surface is provided with board circuit figure, and is set in up-protective layer
Some vias are corresponding with the position of via on circuit board, are easy to weld.
3rd, the utility model is uniformly fixed with copper pipe in heat dissipating layer, it is known that copper has preferable thermal conductivity, and copper pipe
Between gap be full of thermal conductivity stick, thermal conductivity stick can not only fix copper pipe, and heat can also be distributed to each copper pipe
On, when there is air-flow in copper Bottomhole pressure, the heat in copper pipe can be taken away by air-flow, so as to reach the effect of radiating.
Brief description of the drawings
Fig. 1 is a kind of overall structure diagram of the good circuit board of thermal diffusivity of the utility model.
In figure：1st, up-protective layer；2nd, circuit board；3rd, lower protective layer；4th, heat dissipating layer；5th, groove；6th, tongue；7th, copper pipe；8、
Via；9th, screw hole；10th, screw；11st, mounting hole；12nd, heat conductive adhesive；13rd, pit.
Embodiment
Technological means, creation characteristic, reached purpose and effect to realize the utility model are easy to understand, below
With reference to embodiment, the utility model is expanded on further.
As shown in figure 1, the circuit board that a kind of thermal diffusivity is good, including up-protective layer 1, lower protective layer 3, circuit board 2, heat dissipating layer
4th, via 8 and screw hole 9, the up-protective layer 1 are surrounded by groove 5, many individual vias 8 are provided with the up-protective layer 1, and
Corresponding with the position of via 8 on circuit board 2, the lower protective layer 3 is surrounded by tongue 6, and the tongue 6 of lower protective layer 3 with
The position of groove 5 of up-protective layer 1 is corresponding, and pit 13, and the installation of circuit board 2 and pit 13 are provided among the lower protective layer 3
Interior, the heat dissipating layer 4 is located at the lower surface bottom of lower protective layer 3, and the heat dissipating layer 4 includes copper pipe 7 and heat conductive adhesive 12, institute
State copper pipe 7 to be uniformly arranged in heat dissipating layer 4, and be covered with heat conductive adhesive 12 in the gap between copper pipe 7, the heat dissipating layer
4 are fixed by heat conductive adhesive 12 and lower protective layer 3, and 3 four jiaos of inner sides of the up-protective layer 1 and lower protective layer are provided with screw hole
9, and screw 10 is provided with screw hole 9, the both sides of lower protective layer 3 are provided with mounting hole 11.
Wherein, the height of circuit board 2 is identical with the depth of pit 13.
Wherein, the mounting hole 11 is the mounting hole being internally threaded.
Wherein, the up-protective layer 1 uses the material of high-temperature insulation, and up-protective layer 1 is that upper surface is printed on circuit board 2
Circuit diagram up-protective layer.
Wherein, the lower protective layer 3 is using the good insulating materials of thermal conductivity.
It should be noted that the utility model is a kind of good circuit board of thermal diffusivity, provided with up-protective layer 1 and lower protective layer
3, and pit 13 is provided among lower protective layer 3, and in the installation of circuit board 2 and pit 13, and the groove that up-protective layer 1 is surrounded by
5 tongues 6 that can be surrounded by with lower protective layer 3 mutually block, and up-protective layer 1 on the inside of the surrounding of lower protective layer 3 with being equipped with
Screw hole 9, and screw 10 is provided with screw hole 9, up-protective layer 1 is connected with lower protective layer 3 more firm, so as to protect electricity
Road plate 2, and up-protective layer 1 be surface be provided with board circuit figure up-protective layer, and the via 8 being provided with up-protective layer 1 with
The position of via 8 is corresponding on circuit board 2, is easy to weld, and copper pipe 7 is uniformly fixed with heat dissipating layer 4, it is known that copper have compared with
Good thermal conductivity, and gap is full of thermal conductivity stick 12 between copper pipe 7, thermal conductivity stick 12 can not only fix copper pipe 7, may be used also
So that heat is distributed on each copper pipe 7, when there is air-flow to be flowed in copper pipe 7, the heat in copper pipe 7 can be taken away by air-flow
Amount, so as to reach the effect of radiating, and lower protective layer both sides are provided with mounting hole, are easily installed.
The advantages of general principle and principal character of the present utility model and the utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of the spirit and scope of the utility model is not departed from, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within claimed the scope of the utility model.The utility model
Claimed scope is by appended claims and its equivalent thereof.
Claims (5)
1. a kind of good circuit board of thermal diffusivity, including up-protective layer（1）, lower protective layer（3）, circuit board（2）, heat dissipating layer（4）, mistake
Hole（8）And screw hole（9）, it is characterised in that：The up-protective layer（1）It is surrounded by groove（5）, the up-protective layer（1）It is interior
Provided with many individual vias（8）, and and circuit board（2）On via（8）Position is corresponding, the lower protective layer（3）It is surrounded by
Tongue（6）, and lower protective layer（3）Tongue（6）With up-protective layer（1）Groove（5）Position is corresponding, the lower protective layer
（3）Centre is provided with pit（13）, and circuit board（2）Installation and pit（13）It is interior, the heat dissipating layer（4）Positioned at lower protective layer（3）
Lower surface bottom, the heat dissipating layer（4）Including copper pipe（7）And heat conductive adhesive（12）, the copper pipe（7）Uniformly it is arranged in
Heat dissipating layer（4）It is interior, and copper pipe（7）Between gap in be covered with heat conductive adhesive（12）, the heat dissipating layer（4）Pass through thermal conductivity
Adhesive（12）With lower protective layer（3）It is fixed, the up-protective layer（1）With lower protective layer（3）Screw hole is provided with the inside of corner
（9）, and screw hole（9）It is interior to be provided with screw（10）, the lower protective layer（3）Both sides are provided with mounting hole（11）.
A kind of 2. good circuit board of thermal diffusivity according to claim 1, it is characterised in that：The circuit board（2）Height with
Pit（13）Depth it is identical.
A kind of 3. good circuit board of thermal diffusivity according to claim 1, it is characterised in that：The mounting hole（11）For inside
If threaded mounting hole.
A kind of 4. good circuit board of thermal diffusivity according to claim 1, it is characterised in that：The up-protective layer（1）Using
The material of high-temperature insulation, and up-protective layer（1）Circuit board is printed on for upper surface（2）Circuit diagram up-protective layer.
A kind of 5. good circuit board of thermal diffusivity according to claim 1, it is characterised in that：The lower protective layer（3）Using
The good insulating materials of thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720645481.0U CN206851132U (en) | 2017-06-06 | 2017-06-06 | A kind of good circuit board of thermal diffusivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720645481.0U CN206851132U (en) | 2017-06-06 | 2017-06-06 | A kind of good circuit board of thermal diffusivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206851132U true CN206851132U (en) | 2018-01-05 |
Family
ID=60798916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720645481.0U Expired - Fee Related CN206851132U (en) | 2017-06-06 | 2017-06-06 | A kind of good circuit board of thermal diffusivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206851132U (en) |
-
2017
- 2017-06-06 CN CN201720645481.0U patent/CN206851132U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180105 Termination date: 20180606 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |