CN206821074U - Miniature electronic part and to position mould - Google Patents

Abstract

The utility model miniature electronic part and the technical field for belonging to electronic component to position mould；Technical problem to be solved is：There is provided a kind of miniature electronic part and to position mould, manufacturing cost is cheap, and contraposition is accurate, greatlys save the time of contraposition, and avoids the movement after contraposition；The technical scheme used for：Miniature electronic part to position mould, bottom plate is square plate and its center is provided with the square hole for placing egative film, fixed pressure plate is right angle L shaped plate, and fixed pressure plate is bolted on one jiao of compression egative film of bottom plate, two interior right-angle sides of fixed pressure plate are absolute parallel in corresponding square hole side respectively, cover plate is provided with the square plate for being oriented to unfilled corner, cover plate is bolted on one jiao of bottom plate, cover plate is diagonally set with fixed pressure plate, the block of L-shaped is movably arranged on by self-adjusting spring and is oriented in unfilled corner, top plate is fixed on above cover plate and block, and top plate is provided with the breach of not limit stop and the activity of self-adjusting spring.

Description

Miniature electronic part and to position mould

Technical field

The utility model miniature electronic part and the technical field for belonging to electronic component to position mould, and in particular to Yi Zhongti The contraposition mould that the small electronic element of product and making element use.

Background technology

With the development of science and technology global electronic small product size constantly reduces, this requires all elements in circuit not only Compact structure must be possessed, also there is more superior performance.Generally pass through thick film screen printing and thin-film technique in the prior art Electronic element is made, electronic element greatly reduces component size, suitable for miniaturization of components, integrated requirement Very high electronics field.The electronic component conventional means of batch making micro volume is preset on one piece of big substrate Electronic component pattern array is, it is necessary to which the pattern on the egative film made is transferred on the substrate of bulk, and is ensured each small Cell all aligns precisely, can reach the effect of automatic aligning using the instrument of Large expensive, but in research and development test and small Manual-alignment turns into problem during batch making.

Utility model content

The utility model overcomes the shortcomings of the prior art, and technical problem to be solved is：A kind of micro electric is provided Subcomponent and to position mould, manufacturing cost is cheap, and contraposition is accurate, greatlys save the time of contraposition, and after avoiding contraposition It is mobile.

In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is：The contraposition mould of miniature electronic part Tool, including bottom plate, fixed pressure plate, cover plate, block, self-adjusting spring and top plate, bottom plate is square plate and its center is provided with and put The square hole of bottom set piece, the fixed pressure plate is right angle L shaped plate, and fixed pressure plate is bolted on one jiao of pressure of bottom plate Egative film in tight square hole, two interior right-angle sides of the fixed pressure plate are absolute parallel in corresponding square hole side, the lid respectively Plate is to be bolted on one jiao of bottom plate provided with the square plate for being oriented to unfilled corner, cover plate, and cover plate is diagonally set with fixed pressure plate And guiding unfilled corner is nearest apart from fixed pressure plate, the block of L-shaped is movably arranged on by self-adjusting spring to be oriented in unfilled corner, and is kept off Two outer right-angle sides of block are bonded with being oriented to the edge of unfilled corner respectively, and the top plate is fixed on above cover plate and block, and top plate It is provided with the breach of not limit stop and the activity of self-adjusting spring.

Non-porous backing board is fixedly installed below the bottom plate.

The block is made up of the guiding unfilled corner cutting material of cover plate.

The fixed pressure plate is provided with contraposition breach.

The contraposition breach is semicircle or triangle.

Use the miniature electronic part of contraposition Mold Making, including substrate, function line layer and electrode tip, the function Line layer is mated formation in upper surface of base plate, and the both ends of substrate and function line layer are clamped by electrode tip and fixed, and function Line layer is formed with electrode tip and electrically connected, and the lower surface of the function line layer is provided with first thermal insulation layer, the functional line The upper surface of road floor sets gradually second thermal insulation layer and protective layer.

The function line layer is that the copper foil being covered on substrate etches to be formed.

The middle part of the function line layer is snakelike circuit.

The utility model has the advantages that compared with prior art：

Miniature electronic part of the present utility model can be fabricated into very small volume, and provide largely make it is miniature The manual alignment mould used during electronic component, it is not necessary to buy the large-scale instrument of costliness, also can be time saving and energy saving reach is precisely solid Fixed contraposition.

Brief description of the drawings

The utility model is described in more detail below in conjunction with the accompanying drawings；

Fig. 1 is the structural representation to position mould of miniature electronic part provided by the utility model；

Fig. 2 is that bottom plate provided by the utility model combines scheme of installation with fixed pressure plate；

Fig. 3 is that the cover plate provided by the utility model to position mould combines scheme of installation with block；

Fig. 4 is the structural representation of miniature electronic part provided by the utility model；

Fig. 5 is the schematic diagram of the function line layer of single miniature electronic part provided by the utility model；

Fig. 6 is the board structure schematic diagram of miniature electronic part batch making provided by the utility model；

Fig. 7 is the chassis construction schematic diagram of miniature electronic part batch making provided by the utility model；

In figure：1 is substrate, and 2 be function line layer, and 3 be electrode tip, and 4 be first thermal insulation layer, and 5 be second thermal insulation layer, 6 It is bottom plate for protective layer, 7,8 be fixed pressure plate, and 9 be cover plate, and 10 be block, and 11 be self-adjusting spring, and 12 is are oriented to unfilled corner, 13 be top plate, and 14 be backing board, and 15 be contraposition breach.

Embodiment

It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer Accompanying drawing in type embodiment, the technical scheme in the embodiment of the utility model is clearly and completely described, it is clear that is retouched The embodiment stated is part of the embodiment of the present utility model, rather than whole embodiments；Based on the reality in the utility model Example is applied, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, is all belonged to In the scope of the utility model protection.

As Figure 1-3, miniature electronic part to position mould, including bottom plate 7, fixed pressure plate 8, cover plate 9, block 10th, self-adjusting spring 11 and top plate 13, bottom plate 7 is square plate and its center is provided with the square hole for placing egative film, described to be fixed and clamped Plate 8 is right angle L shaped plate, and fixed pressure plate 8 is bolted on one jiao of egative film compressed in square hole of bottom plate 7, described solid It is absolute parallel in corresponding square hole side respectively to determine two interior right-angle sides of pressure strip 8, the cover plate 9 is provided with being oriented to unfilled corner 12 Groove corresponding with the square hole of bottom plate 7 is arranged below in square plate and square plate, and cover plate 9 is bolted on one jiao of bottom plate 7, cover plate 9 Diagonally set with fixed pressure plate 8 and guiding unfilled corner 12 is nearest apart from fixed pressure plate 8, the block 10 of L-shaped passes through self-adjusting bullet Spring 11, which is movably arranged on, to be oriented in unfilled corner 12, and two outer right-angle sides of block 10 are bonded with being oriented to the edge of unfilled corner 12 respectively, The top plate 13 is fixed on above cover plate 9 and block 10, and top plate 13 is provided with limit stop 10 and self-adjusting spring 11 are not lived Dynamic breach.

The bottom plate 7 is fixedly installed non-porous backing board 14 below.

The block 10 is made up of the cutting material of guiding unfilled corner 12 of cover plate 9, saves manufacturing cost and does not influence using effect Fruit.

The fixed pressure plate 8 is provided with multiple contraposition breach 15, for examining whether egative film and substrate are forced into finger Positioning is put, and the contraposition breach 15 is easy to visual shape for semicircle or triangle etc..

It is described to position mould when in use, egative film is arranged in bottom plate 7, then compresses egative film with fixed pressure plate 8, and substrate puts A corner edge is spacing by fixed pressure plate 8 when putting, and diagonally by the clamping of block 10 on cover plate 9, realize precisely contraposition, self-adjusting Spring 11 make it that the clamping of block 10 is more flexible.Now testing crew is checked on egative film is to bit line and the loci on substrate No coincidence, on fixed pressure plate 8 X-axis and Y direction be provided with multiple contraposition breach 15 summit (i.e. semicircular summit or The pointed peak of person's triangle) whether bit line is aligned with egative film, this ensure that egative film and substrate are in X-axis and Y-axis two Do not offset, rotate on individual direction.

The procedure of processings such as label print, protective layer printing are can be applied in position mould in the utility model.

Using the miniature electronic part of contraposition Mold Making, as shown in figure 4, miniature electronic part, including substrate 1, function Line layer 2 and electrode tip 3, the function line layer 2 are mated formation surface on substrate 1, and the two of substrate 1 and function line layer 2 End is clamped by electrode tip 3 and fixed, and function line layer 2 is formed with electrode tip 3 and electrically connected, the function line layer 2 Lower surface be provided with first thermal insulation layer 4, the upper surface of the function line layer 2 sets gradually second thermal insulation layer 5 and protective layer 6。

The function line layer 2 is that the copper foil covered on substrate 1 etches to be formed.

Fig. 5 show the one of which topology view of function line layer 2, and the middle part of the function line layer 2 is serpentine Road.

The manufacturing process of the utility model miniature electronic part is as follows：

1. as shown in fig. 6, preparing one piece of substrate, dotted line is simulating cut line in figure, and one piece of substrate is divided into multiple lists Base board unit；

2. in substrate back printed back electrod-array, dry, print first thermal insulation layer array in substrate front side；

3. in the front covering copper foil or sputtering layers of copper of substrate, patch dry film (photoresistance), by the function line layer shown in Fig. 7 The use of graphic array egative film is aligned and fixed to position mould and a monoblock substrate, makes every base board unit and each work(on egative film Energy circuit layer pattern is corresponded without skew, is then exposed, is developed, by the layers of copper of the pattern transfer on egative film to substrate；

4. electroplating (rack plating) copper, function line layer is increased into required thickness, dry film (photoresistance) is removed, etches away except function Layers of copper beyond line pattern；

5. printing second thermal insulation layer above function circuit layer pattern, it is respectively arranged below above function line layer heat-insulated Layer, there is insulation, reduce the functions such as fuse protection time, the associativity of increase layers of copper and substrate, the explosion-proof arc extinguishing of buffering；

6. green oil printing increases adhesive force, then prints protective layer, dry solidification in the top of thermal insulation layer；

7. by a monoblock substrate cut it is electronic component bar according to longitudinal Virtual cropping line, termination sputtering termination electrode, according to Electronic component bar is cut into single electronic component by horizontal Virtual cropping line, carries out barrel plating, forms two end electrodes termination.

The function circuit layer pattern on Fig. 7 egative film is transferred to layers of copper on Fig. 6 monoblock substrates in wherein the 3rd step, so as to In etching functional line diagram shape, in functional line diagram shape cover tin layers, the subsequent action such as be finely adjusted to function line layer, It is required for aligning position mould using the utility model.

Finally it should be noted that：Various embodiments above is only to illustrate the technical solution of the utility model, rather than it is limited System；Although the utility model is described in detail with reference to foregoing embodiments, one of ordinary skill in the art should Understand：It can still modify to the technical scheme described in foregoing embodiments, either to which part or whole Technical characteristic carries out equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from this practicality newly The scope of each embodiment technical scheme of type.

Claims (8)

1. miniature electronic part to position mould, it is characterised in that：Including bottom plate (7), fixed pressure plate (8), cover plate (9), gear Block (10), self-adjusting spring (11) and top plate (13), bottom plate (7) is square plate and its center is provided with the square hole for placing egative film, institute It is right angle L shaped plate to state fixed pressure plate (8), and fixed pressure plate (8) is bolted on one jiao of compression square hole of bottom plate (7) Interior egative film, two interior right-angle sides of the fixed pressure plate (8) are absolute parallel in corresponding square hole side, the cover plate respectively (9) it is provided with the square plate for being oriented to unfilled corner (12), cover plate (9) is bolted on one jiao of bottom plate (7), and cover plate (9) is with fixing Pressure strip (8) diagonally set and be oriented to unfilled corner (12) apart from fixed pressure plate (8) recently, the block (10) of L-shaped passes through self-adjusting Spring (11), which is movably arranged on, to be oriented in unfilled corner (12), and two outer right-angle sides of block (10) are respectively with being oriented to unfilled corner (12) Edge is bonded, and the top plate (13) is fixed on cover plate (9) and block (10) above, and top plate (13) is provided with not limit stop (10) and self-adjusting spring (11) activity breach.

It is 2. according to claim 1 to position mould, it is characterised in that：The bottom plate (7) is fixedly installed non-porous below Backing board (14).

It is 3. according to claim 1 to position mould, it is characterised in that：The block (10) is the guiding unfilled corner of cover plate (9) (12) cutting material is made.

It is 4. according to claim 1 to position mould, it is characterised in that：The fixed pressure plate (8) is provided with contraposition breach (15)。

It is 5. according to claim 4 to position mould, it is characterised in that：The contraposition breach (15) is semicircle or triangle Shape.

A kind of 6. miniature electronic part of the contraposition Mold Making described in usage right requirement 1, it is characterised in that：Including substrate (1), function line layer (2) and electrode tip (3), the function line layer (2) are mated formation in substrate (1) upper surface, and substrate (1) Clamped and fixed by electrode tip (3) with the both ends of function line layer (2), and function line layer (2) and electrode tip (3) shape Into electrical connection, the lower surface of the function line layer (2) is provided with first thermal insulation layer (4), the upper table of the function line layer (2) Face sets gradually second thermal insulation layer (5) and protective layer (6).

7. miniature electronic part according to claim 6, it is characterised in that：The function line layer (2) is to be covered in base Copper foil on plate (1) etches to be formed.

8. miniature electronic part according to claim 6, it is characterised in that：The middle part of the function line layer (2) is snake Shape circuit.