CN206807601U - Compact-sized light-field camera - Google Patents

Compact-sized light-field camera Download PDF

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Publication number
CN206807601U
CN206807601U CN201720615120.1U CN201720615120U CN206807601U CN 206807601 U CN206807601 U CN 206807601U CN 201720615120 U CN201720615120 U CN 201720615120U CN 206807601 U CN206807601 U CN 206807601U
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microlens array
light
lens barrel
field camera
array
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黄杰凡
许星
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Shenzhen Orbbec Co Ltd
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Shenzhen Orbbec Co Ltd
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Abstract

The utility model provides a kind of compact-sized light-field camera, including the base sequentially set;Imaging sensor is arranged on base;Microlens array is arranged at the incident side of imaging sensor, includes multiple lenticule units of array arrangement, multiple photosensitive units on each lenticule unit correspondence image sensor;Main lens is arranged at the incident side of microlens array, for receiving the light of object to be imaged and projecting it onto microlens array;Lens barrel is arranged on base and for fixing main lens and microlens array;Cutoff filter is covered on one side of the microlens array backwards to imaging sensor;Anti-reflection film be covered on microlens array towards or backwards to imaging sensor one side.Cutoff filter and anti-reflection film are bonded with the surface of microlens array respectively, reduce the volume of light-field camera;And it is easy to camera to assemble, improve efficiency of assembling;And the stability of optical element is improved, ensure imaging effect, lift camera quality.

Description

Compact-sized light-field camera
Technical field
The utility model belongs to optical technical field, is to be related to a kind of compact-sized light-field camera more specifically.
Background technology
For light-field camera for traditional camera, can not only obtain the intensity of light can also collect the side of light To, this causes light-field camera to possess more functions, such as first take pictures and focus on afterwards, big depth field imaging, 3D imaging and have an X-rayed into As etc..The use of more extensive structure is the structure based on microlens array (MLA) in light-field camera, i.e., by photosensitive core A MLA array is arranged between piece and imaging len, the pixel that each MLA array elements correspond on multiple sensitive chips, is led to Crossing MLA units can be so that be focused to the target light of any be imaged on the unit at different angles through MLA units originally In corresponding pixel, the later stage is by the processing to these pixels so as to realizing above-mentioned multiple functions.
In the prior art, in order to improve the quality taken pictures, such as remove infrared ray interference, reduce the problems such as " ghost ", Often increase at least one optical element in the camera, increase optical element can undoubtedly bring some problems, such as camera volume Increase, camera internal is complicated to cause inconvenience assembling and fault rate height etc..
Utility model content
The purpose of the utility model embodiment is to provide a kind of compact-sized light-field camera, to solve in the prior art Big, complicated, the not easy to install technical problem of camera volume be present.
To achieve the above object, the technical scheme of the utility model embodiment use is:A kind of compact-sized light is provided Field camera, including sequentially set:
Base;
Imaging sensor, it is arranged on the base, its surface is provided with visible filter;
Microlens array, the incident side of described image sensor is arranged at, includes multiple lenticule units of array arrangement, Each lenticule unit corresponds to multiple photosensitive units in described image sensor;
Main lens, the incident side of the microlens array is arranged at, for receiving the light of object to be imaged and being projected To the microlens array;
Lens barrel, it is arranged on the base and for fixing the main lens and microlens array;
Cutoff filter, it is pasted on one side of the microlens array backwards to described image sensor;
Anti-reflection film, be pasted on the microlens array towards or backwards to described image sensor one side.
Described image sensor and the distance of the microlens array are equal to the focal length of the lenticule unit, described micro- The distance of lens array and the main lens is equal to the focal length of the main lens.
As optimal technical scheme of the present utility model:
The base is semiconductor substrate, and described image sensor is that multiple photosensitive lists are made on the semiconductor substrate The imaging sensor that member is formed.
The cutoff filter and anti-reflection film are plated on the surface of the microlens array.
The one side of the microlens array is plane, and another side is the convex surface of array arrangement, each convex surface with it Part between the plane of face forms a lenticule unit.
The plane is backwards to described image sensor, and the convex surface is towards described image sensor.
The visible filter is Baeyer optical filter.
The microlens array is the microlens array of smalt material.
The lens barrel includes being used for the upper lens barrel for fixing the main lens and the lower mirror for fixing the microlens array Cylinder, the end of the lower lens barrel is fixedly connected with the base.
Dock the end of the upper lens barrel and lower lens barrel;Or the upper lens barrel and the socket of lower lens barrel;Or the upper mirror Cylinder and lower lens barrel are integrally formed.
The light-field camera that the utility model embodiment provides has the advantages that compared with conventional light field camera:Micro- Lens array sets cutoff filter backwards to the one side of imaging sensor, effectively suppresses infrared optical information, in lenticule battle array The one side setting anti-reflection film towards or backwards to imaging sensor is arranged, avoids the past interflection between each surface of optical element from causing " ghost " phenomenon, and reduce the loss of light energy.
Importantly, cutoff filter and anti-reflection film are bonded with the surface of microlens array respectively, it is not required to individually Coated element is set to reduce the volume of optical imaging system, and then reduce the volume of whole light-field camera in light path;And And cutoff filter and anti-reflection film directly are bonded on microlens array surface, triplicity is integral, is easy to camera Assembling, improve efficiency of assembling;Also, three in one structure improves the stability of optical element, prevents cutoff filter There is phenomena such as dystopy, tilt with anti-reflection film, ensure imaging effect, lift camera quality.
Brief description of the drawings
, below will be to embodiment or prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model The required accompanying drawing used is briefly described in description, it should be apparent that, drawings in the following description are only that this practicality is new Some embodiments of type, for those of ordinary skill in the art, without having to pay creative labor, can be with Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation for the light-field camera that the utility model embodiment provides;
Fig. 2 is the structural representation of the microlens array for the light-field camera that the utility model embodiment provides.
Wherein, each reference in figure:
10- bases;20- imaging sensors;30- microlens arrays;40- main lens;50- lens barrels;60- IR cut filters Piece;70- anti-reflection films;301- lenticule units.
Embodiment
In order that the utility model embodiment technical problem to be solved, technical scheme and beneficial effect are more clear bright In vain, below in conjunction with drawings and Examples, the utility model is further elaborated.It is it should be appreciated that described herein Specific embodiment only to explain the utility model, is not used to limit the utility model.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another On one element or it is connected on another element.When an element is known as " being connected to " another element, it can To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ", The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position System, it is for only for ease of description the utility model embodiment and simplifies description, rather than instruction or the device or member that imply meaning Part must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or Implicitly include one or more this feature.In the description of the utility model embodiment, " multiple " are meant that two Or two or more, unless otherwise specifically defined.
Also referring to Fig. 1 and Fig. 2, the compact-sized light-field camera now provided the utility model embodiment is said It is bright.
The compact-sized light-field camera comprises at least base 10, imaging sensor 20, microlens array 30, main lens 40th, lens barrel 50, cutoff filter 60 and anti-reflection film 70;Wherein, main lens 40, microlens array 30, imaging sensor 20 Being set gradually with base 10 along the transmission direction of imaging beam, lens barrel 50 is used to fix main lens 40 and microlens array 30, And one end of lens barrel 50 is fixedly connected with base 10, it is preferable that the axis of lens barrel 50 is perpendicular to the surface of base 10.IR-cut Optical filter 60 is then arranged at microlens array 30 backwards to the surface of imaging sensor 20, i.e., towards main lens 40.Anti-reflection film 70 is then Microlens array 30 is preferably disposed on towards the surface of imaging sensor 20, lenticule battle array is divided into cutoff filter 60 The both side surface of row 30.In another feasible embodiment, anti-reflection film 70 can also be arranged at microlens array 30 backwards The surface of imaging sensor 20, i.e., it is located at the same side of microlens array 30 together with cutoff filter 60.Image sensing Device 20 is used to note down the strength information for reaching light, and surface is clearly imaged provided with visible filter with realizing, image sensing Device 20 includes multiple photosensitive units;Microlens array 30 includes multiple lenticule units 301 of array arrangement, each lenticule list Multiple photosensitive units on first 301 correspondence image sensors 20.In the present embodiment, cutoff filter 60 and anti-reflection film 70 The surface of microlens array 30 is covered on, it is integral with the shape of microlens array 30." pasting " described in the present embodiment is not only Including different optical element attachings is directly formed into another optical element to the surface for together, being additionally included in an optical element, Such as plating, spraying, printing, electro-deposition, chemical deposition, brushing, sputtering sedimentation etc..
The spacing of microlens array 30 and main lens 40 in the utility model embodiment is equal to the focal length of main lens 40, figure As focal length of the spacing of sensor 20 and microlens array 30 equal to lenticule unit 301, to ensure good imaging effect.
The operation principle of above-mentioned light-field camera is:Object space light is injected by main lens 40, is focused on by main lens 40 micro- Lens array 30, after the cutoff filter 60 on the surface of microlens array 30 effectively intercepts infrared light, incide micro- On each lenticule unit 301 of lens array 30, then the side to imaging sensor 20 acted on from the refractive power of lenticule unit 301 To outgoing, and invest on multiple photosensitive units corresponding with lenticule unit 301, and on the surface of microlens array 30 1 Anti-reflection film 70 weakens or eliminated the light reflection between different optical surfaces, adds transmitance.With a lenticule unit 301 The luminous intensity sum that corresponding multiple photosensitive units are collected represents the total light intensity degree that the lenticule unit 301 is sent.Such space In the light that a little sends focused on via main lens 40 on lenticule unit 301 after may proceed to dissipate, it is micro- to eventually arrive at this Corresponding to lens unit 301 on multiple photosensitive units.The directional information of a plurality of light of the point can pass through photosensitive list in space Relative angle between member and lenticule unit 301 calculates, while multiple photosensitive lists corresponding to each lenticule unit 301 The luminous intensity sum that member receives can regard the strength information of the spatial point as.So pass through main lens 40, microlens array 30 The strength information and directional information of target light can be noted down with the cooperating of imaging sensor 20, and then realizes light field phase The corresponding function of machine, such as first take pictures and focus on afterwards.
Above-mentioned imaging sensor can use CCD or cmos image sensor, the visible filter that its surface is set Baeyer optical filter can be used, is used for visual light imaging to ensure that imaging sensor can obtain three kinds of optical signals of red, green, blue.
In the light-field camera that the utility model embodiment provides, cutoff filter 60 and anti-reflection film 70 respectively with it is micro- The surface fitting of lens array 30, is not required to set special coated element, reduces the volume of optical imaging system, and then reduce The volume of whole light-field camera;Also, cutoff filter 60 and anti-reflection film 70 directly are bonded on the surface of microlens array 30, Triplicity is integral, is easy to camera to assemble, improves efficiency of assembling;Also, three in one structure improves optical element Stability, prevent cutoff filter 60 and phenomena such as dystopy, tilt occur in anti-reflection film 70, ensure imaging effect, lifting Camera quality.
Further, in optical transmission process, because cutoff filter 60 is arranged at microlens array 30 backwards The surface of imaging sensor 20, the infrared light in the light that can project main lens 40 are effectively isolated, and prevent infrared light Into microlens array 30, so avoid it is a series of interference imaging factors, for example, when cutoff filter 60 be arranged at it is micro- Lens array 30 towards imaging sensor 20 surface when, infrared light multiple catadioptric in microlens array 30 not only can shadow Cut-off effect is rung, the heating of microlens array 30 can be also caused, influence the stability of the material of microlens array 30, cause Light deformation And some optical performance parameters change, these can all influence imaging effect.
, can be with further, since microlens array 30 is provided with anti-reflection film 70 towards or backwards to the surface of imaging sensor 20 The light reflection between optical element different surfaces is reduced or eliminated, improves the efficiency of light energy utilization, and eliminate as caused by reflection light " ghost Shadow " problem.Cutoff filter 60 and anti-reflection film 70 are preferably divided into microlens array 30 by the utility model embodiment Different surfaces, both ensure imaging effect, the stability being beneficial to again in technique processing and structure.
Further, anti-reflection film 70 can be various material, structure or shape, and thickness and the number of plies also need not be limited strictly, Can be from individual layer to multilayer, every layer of thickness meets to realize the light of respective wavelength anti-reflection effect, every to be used to increase light The optical film of line transmitance can serve as anti-reflection film 70.
In the utility model embodiment, base 10 can electrically connect with imaging sensor 20, for example base 10 is PCB electricity Bottom plate that road plate, Rigid Flex or flexible PCB form with rigid material etc..As a kind of preferable implementation Example, base 10 use semiconductor substrate.Base 10 and imaging sensor 20 can be formed in same processing procedure, semiconductor-based at this The photosensitive unit that multiple array arrangements are directly made on plate forms imaging sensor 20.Specifically, on a wafer with one Fixed spacing makes multiple images sensor 20 simultaneously, has then directly been installed around each imaging sensor 20 in encapsulation micro- The lens barrel 50 of lens array 30 and the grade optical element of main lens 40, cutting can is finally carried out again and directly forms multiple light field phases Machine.This mode can greatly improve manufacture efficiency.
With further reference to Fig. 2, the microlens array 30 in the utility model embodiment is a kind of by high temperature resistant, high printing opacity The array microlens structure that the one side that glass material is process is plane, another side is array convex surface, specific material can be with But it is not limited to use smalt.The plane of the microlens array 30 is towards main lens 40, and convex surface is towards imaging sensor 20, one Convex surface and the part between the plane of its face constitute a lenticule unit 301, it is preferable that infrared section is set in plane Only optical filter 60, anti-reflection film 70 is set on convex surface.
In other embodiments, microlens array 30 can also be processed into above-mentioned shape or other shapes by other materials Shape, such as its two sides is processed as curved surface, i.e. two sides is array convex surface, or one side is that array convex surface another side is array Concave surface etc..Consider the simplification easy to implement and light path of processing technology, the present embodiment is preferably that a facial plane, another side are battle array Arrange the structure on convex surface.
In the utility model embodiment, microlens array 30 and main lens 40 are fixed by lens barrel 50, and the lens barrel 50 can be with It is combining structure or integrative-structure, the lens barrel 50 of combining structure includes being used for the He of upper lens barrel 50 for fixing main lens 40 For fixing the lower lens barrel 50 of microlens array 30, the end of lower lens barrel 50 is fixedly connected with base 10, upper lens barrel 50 and lower mirror The end of cylinder 50 can be docked, i.e., the end of upper lens barrel 50 and lower lens barrel 50 is connected by the mode face such as being bonded or welding.On Lens barrel 50 and lower lens barrel 50 can also be socketed, i.e., upper lens barrel 50 is different with the diameter of lower lens barrel 50, and the end of the two is respectively provided with spiral shell Line structure, the socket of the two screw thread, or the end of the two are provided with the buckle structure to cooperate, the socket of the two buckle etc..And one The lens barrel 50 of body structure, lens barrel 50 and lower lens barrel 50 are integrally formed that the division of the two is only that the master fixed to it is saturating thereon For mirror 40 and microlens array 30, in structure and do not have a detachable property., can be according to the difficulty of assembling in actual assembled Easily selection is using suitable lens barrel structure.
Further, lens barrel 50 is fixedly connected close to one end of base 10 with base 10, specifically, one end of lens barrel 50 with It can be connected with glue, weld or be connected by connector between base 10.For example, several positioning can be set on base 10 Post, positioning hole is correspondingly opened up in the end of lens barrel 50, or positioning hole is opened up on base 10, positioned in the end set of lens barrel 50 Post.
In the present embodiment, main lens 40 is used to receive target light and focal imaging, can be that single lens can also It is the lens group or variable focus lens package that multiple lens are formed.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model Protection domain within.

Claims (10)

1. compact-sized light-field camera, it is characterised in that including what is sequentially set:
Base;
Imaging sensor, it is arranged on the base, its surface is provided with visible filter;
Microlens array, the incident side of described image sensor is arranged at, includes multiple lenticule units of array arrangement, each The lenticule unit corresponds to multiple photosensitive units in described image sensor;
Main lens, the incident side of the microlens array is arranged at, for receiving the light of object to be imaged and projecting it onto institute State microlens array;
Lens barrel, it is arranged on the base and for fixing the main lens and microlens array;
Cutoff filter, it is pasted on one side of the microlens array backwards to described image sensor;
Anti-reflection film, be pasted on the microlens array towards or backwards to described image sensor one side.
2. light-field camera as claimed in claim 1, it is characterised in that described image sensor and the microlens array away from From the focal length equal to the lenticule unit, the distance of the microlens array and the main lens is equal to Jiao of the main lens Away from.
3. light-field camera as claimed in claim 1, it is characterised in that the base is semiconductor substrate, and described image senses Device is makes the imaging sensor that multiple photosensitive units are formed on the semiconductor substrate.
4. light-field camera as claimed in claim 1, it is characterised in that the cutoff filter and anti-reflection film are plated on described The surface of microlens array.
5. light-field camera as claimed in claim 1, it is characterised in that the one side of the microlens array is plane, another side For the convex surface of array arrangement, each convex surface and with part one lenticule unit of composition between the plane of its face.
6. light-field camera as claimed in claim 5, it is characterised in that the plane is described convex backwards to described image sensor Face is towards described image sensor.
7. light-field camera as claimed in claim 1, it is characterised in that the visible filter is Baeyer optical filter.
8. light-field camera as claimed in claim 1, it is characterised in that the microlens array is the lenticule of smalt material Array.
9. the light-field camera as described in claim any one of 1-8, it is characterised in that the lens barrel includes being used to fix the master The upper lens barrel of lens and the lower lens barrel for fixing the microlens array, the end of the lower lens barrel is fixed with the base to be connected Connect.
10. light-field camera as claimed in claim 9, it is characterised in that dock the end of the upper lens barrel and lower lens barrel;Or The upper lens barrel and the socket of lower lens barrel;Or the upper lens barrel and lower lens barrel are integrally formed.
CN201720615120.1U 2017-05-27 2017-05-27 Compact-sized light-field camera Active CN206807601U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107071253A (en) * 2017-05-27 2017-08-18 深圳奥比中光科技有限公司 The light-field camera of compact conformation
WO2019218323A1 (en) * 2018-05-17 2019-11-21 深圳配天智能技术研究院有限公司 Lens array, imaging device, and imaging method
CN112163501A (en) * 2020-09-23 2021-01-01 华天慧创科技(西安)有限公司 Fingerprint identification device and identification method under ultrathin optical screen and electronic equipment thereof
CN113359267A (en) * 2021-04-22 2021-09-07 东南大学 Light field lens and assembling method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107071253A (en) * 2017-05-27 2017-08-18 深圳奥比中光科技有限公司 The light-field camera of compact conformation
WO2019218323A1 (en) * 2018-05-17 2019-11-21 深圳配天智能技术研究院有限公司 Lens array, imaging device, and imaging method
CN112163501A (en) * 2020-09-23 2021-01-01 华天慧创科技(西安)有限公司 Fingerprint identification device and identification method under ultrathin optical screen and electronic equipment thereof
CN113359267A (en) * 2021-04-22 2021-09-07 东南大学 Light field lens and assembling method
CN113359267B (en) * 2021-04-22 2022-07-22 东南大学 Light field lens and assembling method

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