CN206804814U - A kind of epoxy resin embedding adhesive dielectric properties test sample prepares mould - Google Patents
A kind of epoxy resin embedding adhesive dielectric properties test sample prepares mould Download PDFInfo
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- CN206804814U CN206804814U CN201720697596.4U CN201720697596U CN206804814U CN 206804814 U CN206804814 U CN 206804814U CN 201720697596 U CN201720697596 U CN 201720697596U CN 206804814 U CN206804814 U CN 206804814U
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- mould
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- dielectric properties
- pressing plate
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Abstract
The utility model discloses a kind of epoxy resin embedding adhesive dielectric properties test sample to prepare mould, including with the use of cast piece and pressing plate, the inside of the cast piece offers die cavity and Mo Dao, the die cavity is the circle to be matched with sample, and mould road one end is connected with die cavity, the other end is through the side wall for pouring into a mould piece；The pressing plate is stainless steel platen, and the burnishing surface of corresponding die cavity is provided with its both sides end face, and burnishing surface area is more than chamber area, and the pressing plate corresponds to and opens up the centroclinal angle of oriented die cavity on the position of both sides cast Pian Mo roads port；The cast piece fastens after replacing pressing successively with pressing plate, forms several cast chambers, and the angle of adjacent pressing plates combines to form cast gate.The utility model volume very little, and multi-disc sample can be disposably prepared, specimen surface is bright and clean, bubble-free, quality are high, and sample can be easily separated, and worker's working strength is low.
Description
Technical field
Technical field of mold is the utility model is related to, it particularly relates to which a kind of epoxy resin embedding adhesive dielectric properties are surveyed
Try sample preparation mold.
Background technology
With the development of electronic technology, the integration degree of circuit improves constantly, if heat caused by operation can not
Distribute in time, the stability and service life of electrical equipment can be influenceed, electron pouring sealant can not only radiate well, moreover it is possible to play
Moistureproof, dust-proof and shockproof effect, therefore the application in electronic product is also more and more extensive.Electron pouring sealant is before uncured
Belong to liquid, there is mobility；Waterproof and dampproof, dust-proof insulation, heat conduction, secrecy, anticorrosion, resistance to can be played after being fully cured
Temperature etc. acts on.The species of electron pouring sealant is a lot, mainly include heat conduction casting glue, epoxy resin embedding adhesive, organic silicon potting adhesive,
Polyurethane pouring sealant, LED casting glues etc..Wherein, epoxy resin embedding adhesive is due to viscosity is low, solidfied material hardness is high, surface
The characteristics such as smooth, good luster, good insulating, corrosion-resistant ageing-resistant, cold-resistant thermal shock, it is widely used in electronic transformer, AC electricity
In the encapsulation of appearance, anion generator, Immersible pump in aquarium, ignition coil, electronic module, LED module etc..For epoxy resin encapsulated
For glue, its dielectric properties is its important quality index, determines its insulating properties and safety in utilization, therefore before dispatching from the factory all
Carry out the detection of dielectric properties.Test apperance first is made in epoxy resin embedding adhesive, is then surveyed using Dielectric measuring instrument
Amount.
Current existing sample mould is to dig the stainless steel mould for having size of sample cell body, by epoxy resin electronic pouring sealant
Pour into mould, after cured, beat the mould back side energetically with instruments such as steel hammers, sample is come off.Traditional sample mould examination
It is big that sample prepares mould volume, easily occurs bubble in sample, surface smoothness, poor flatness, also, when sample is taken out
It is extremely difficult, and frequently beat and easily cause die deformation, influence the flatness of sample；In addition, die life is short, work
People's labor intensity is big.
The problem of in correlation technique, effective solution is not yet proposed at present.
Utility model content
The problem of in correlation technique, the utility model proposes a kind of epoxy resin embedding adhesive dielectric properties test sample
Mould is prepared, with the relevant issues for overcoming background technology to be carried.
What the technical solution of the utility model was realized in：
A kind of epoxy resin embedding adhesive dielectric properties test sample prepares mould, including with the use of cast piece and pressure
Plate, the inside of the cast piece offer die cavity and Mo Dao, and the die cavity is the circle to be matched with sample, mould road one end and mould
Chamber is connected, the other end is through the side wall for pouring into a mould piece；The pressing plate is stainless steel platen, and corresponding mould is provided with its both sides end face
The burnishing surface of chamber, and burnishing surface area is more than chamber area, the pressing plate is corresponded on the position of both sides cast Pian Mo roads port
Open up the centroclinal angle of oriented die cavity；The cast piece fastens after replacing pressing successively with pressing plate, forms several cast
Chamber, the angle of adjacent pressing plates combine to form cast gate.
Further improvement of the utility model is：The cast piece is carried out after replacing pressing with pressing plate by several bolts
It is fixed.
Further improvement of the utility model is：The cast piece and pressing plate are square.
Further improvement of the utility model is：The cast piece is that two half are formed by movable buckle clamping.
Further improvement of the utility model is：The angle of inclination of the angle is 10 ° ~ 45 °.
Further improvement of the utility model is：The rising head being connected with die cavity is further opened with the cast piece；Institute
The width for stating rising head is the 1/6 ~ 1/3 of mould road width.
Further improvement of the utility model is：The axis of the rising head is distributed on die cavity axis with the axis in mould road
Both sides.
Further improvement of the utility model is：The rising head is located at the top of die cavity, and mould road is located at the side of rising head.
By adopting the above-described technical solution, the beneficial effects of the utility model are：
The utility model provides a kind of epoxy resin embedding adhesive dielectric properties test sample and prepares mould, volume very little,
And multi-disc sample can be disposably prepared, specimen surface is bright and clean, bubble-free, quality are high, is provided for the accurate detection of dielectric properties
Ensure；This mould can be according to being actually needed carry out assembly and disassembly, and only need can be complete with soft blade for sample after dismounting
Whole separation, without beaing, the finish of specimen surface is ensure that, and reduce the working strength of worker, the mold use life-span
It is significantly increased.
The utility model pressing plate both sides are provided with the burnishing surface of circle, for ensureing the finish of specimen surface and smooth
Degree, and beneficial to the separation of sample.
The cast piece is preferably that two half are formed by movable bayonet clamping, and epoxy resin embedding adhesive pours into mould simultaneously
After solidification, pull two half to separate it to the left and right, realize the separation of cast piece and sample, taking-up greatly reduces
The difficulty of sample, reduces worker labour.
The utility model also further sets rising head on cast piece so that in casting process, gas in die cavity can be with
Discharged along rising head, reduce the appearance of bubble in sample, improve sample mass and finish.
Brief description of the drawings
Fig. 1 is the overall schematic of the utility model embodiment 1；
Fig. 2 is the structural representation of the utility model cast piece；
Fig. 3 is the structural representation of the utility model pressing plate；
Fig. 4 is the schematic cross-sectional view in A-A directions in Fig. 3；
Fig. 5 is the structural representation that piece is poured into a mould in the utility model embodiment 2；
Fig. 6 is the structural representation that piece is poured into a mould in the utility model embodiment 3；
Fig. 7 is the structural representation that piece is poured into a mould in the utility model embodiment 4；
In figure：1st, piece is poured into a mould, 11, die cavity, 12, mould road, 13, bolt, 14, active fastening block, 15, rising head, 16, screw, 2,
Pressing plate, 21, burnishing surface, 22, angle, 3, cast gate.
Embodiment
Describe the utility model in detail below with reference to the accompanying drawings.
Embodiment 1
A kind of epoxy resin embedding adhesive dielectric properties test sample prepares mould, as shown in figure 1, including with the use of pour
Piece 1 and pressing plate 2 are noted, the cast piece 1 fastens after replacing pressing successively with pressing plate 2, forms several cast chambers.The cast piece
1 offers the screw of same apertures with the preferably square of pressing plate 2, its surrounding, and four bolts sequentially pass through cast piece 1 and pressure
Fastening is realized after plate 2.
As shown in figure 1, the inside of the cast piece 1 offers die cavity 11 and Mo Dao 12, the die cavity 11 is and sample phase
Identical circle, the side wall of die cavity 11 is shiny surface；Described one end of mould road 12 is connected with die cavity 11, the other end is through cast piece 1
Side wall, mould road 12 can uniformly flow into die cavity positioned at the middle part of cast piece 1, epoxy resin embedding adhesive when flowing into, gas in die cavity
Body uniformly rises, outer row, reduces the generation of bubble.
As shown in Figure 2 and Figure 3, the pressing plate 2 is stainless steel platen, and the throwing of corresponding die cavity is provided with its both sides end face
Smooth surface 21, and the area of burnishing surface 21 is more than the area of die cavity 11, to ensure the finish of the specimen surface after solidifying.The pressing plate 2
The centroclinal angle 22 of oriented die cavity 11, the angle 22 are opened up on the position of the corresponding port of 1 mould road of both sides cast piece 12
Angle of inclination be 10 ° ~ 45 °, preferably 15 ° ~ 30 °.After cast piece 1 combines with pressing plate 2, the angle 22 of adjacent two block pressur plate 2
Combination forms cast gate 3, and cast gate 3 is connected with mould road 12, is easy to the inflow of epoxy resin embedding adhesive.
Embodiment 2
The present embodiment and the structure of embodiment 1 are substantially similar, and its difference is：It is further opened with being used to arrange on the cast piece 1
The rising head 15 of gas.
As shown in figure 5, the inside of the cast piece 1 offers die cavity 11, mould road 12 and rising head 15, the mould road 12 and emit
Mouth 15 is connected with die cavity 11, and the axis of rising head 15 is arranged on the both sides of the axis of die cavity 11 with the axisymmetrical in mould road 12.
With pouring into for epoxy resin embedding adhesive, gas is discharged through rising head；Rising head is symmetrical arranged with mould road, reduces exhaust dead angle.
The width of the rising head 15 is 1/6 ~ 1/3, preferably the 1/5 ~ 1/4 of the width of mould road 12.
Embodiment 3
The present embodiment and the structure of embodiment 1 are substantially similar, and its difference is：It is further opened with being used to arrange on the cast piece 1
The rising head 15 of gas.
As shown in fig. 6, the inside of the cast piece 1 offers die cavity 11, mould road 12 and rising head 15, the mould road 12 and emit
Mouth 15 is connected with die cavity 11.The rising head 15 is located at the top of die cavity 11, realizes the abundant discharge of gas, and mould road 12 is located at
The side of rising head 15.
The width of the rising head 15 is 1/6 ~ 1/3, preferably the 1/5 ~ 1/4 of the width of mould road 12.
Embodiment 4
The present embodiment and the structure of embodiment 1 are substantially similar, and its difference is：The cast piece 1 is that two half pass through work
The dynamic clamping of buckle 14 forms.
As shown in fig. 7, the cast piece 1 is made up of two half, connected between two half by movable buckle 14
Connect, movable buckle is positioned at cast piece 1 bottom.By pulling two half to both sides, cast piece 1 can be made to separate, examination is reduced
Sample takes out difficulty.
The course of work of the present utility model is：
The quantitative requirement prepared according to sample, cast piece is combined with pressing plate, tightened using bolt.Mould will be prepared
Place in the horizontal plane, make cast gate direction upward；Epoxy resin embedding adhesive is poured into cast gate, gently vibration discharge bubble, so
Solidification is stood afterwards, unclamps bolt, successively separation cast piece and pressing plate, and sample is separated with pressing plate using soft paper blade, taken out
Sample, it can be tested after carrying out shaping to sample.
Preferred embodiment of the present utility model is the foregoing is only, it is all in this practicality not to limit the utility model
Within new spirit and principle, any modification, equivalent substitution and improvements made etc., guarantor of the present utility model should be included in
Within the scope of shield.
Claims (9)
1. a kind of epoxy resin embedding adhesive dielectric properties test sample prepares mould, it is characterised in that：Including with the use of pour
Note piece（1）And pressing plate（2）, the cast piece（1）Inside offer die cavity（11）With mould road（12）, the die cavity（11）For with
The circle that sample matches, mould road（12）One end and die cavity（11）It is connected, the other end runs through cast piece（1）Top sidewall；Institute
State pressing plate（2）For stainless steel platen, the burnishing surface of corresponding die cavity is provided with its both sides end face（21）, and burnishing surface（21）Face
Product is more than die cavity（11）Area, the pressing plate（2）Corresponding both sides cast piece（1）Mould road（12）Opened up on the position of port oriented
Die cavity（11）Centroclinal angle（22）；The cast piece（1）With pressing plate（2）Successively alternately press after fasten, formed it is some
Individual cast chamber, adjacent pressing plates（2）Angle（22）Combination forms cast gate（3）.
2. a kind of epoxy resin embedding adhesive dielectric properties test sample according to claim 1 prepares mould, its feature exists
In：The cast piece（1）With pressing plate（2）Pass through several bolts after alternately pressing（13）It is fixed.
3. a kind of epoxy resin embedding adhesive dielectric properties test sample according to claim 1 prepares mould, its feature exists
In：The cast piece（1）With pressing plate（2）It is square.
4. a kind of epoxy resin embedding adhesive dielectric properties test sample according to claim 1 prepares mould, its feature exists
In：The cast piece（1）Pass through movable buckle for two half（14）Clamping forms.
5. a kind of epoxy resin embedding adhesive dielectric properties test sample according to claim 1 prepares mould, its feature exists
In：The angle（22）Angle of inclination be 10 ° ~ 45 °.
6. a kind of epoxy resin embedding adhesive dielectric properties test sample according to claim 1 prepares mould, its feature exists
In：The cast piece（1）On be further opened with and die cavity（11）The rising head being connected（15）.
7. a kind of epoxy resin embedding adhesive dielectric properties test sample according to claim 6 prepares mould, its feature exists
In：The rising head（15）Width be mould road（12）The 1/6 ~ 1/3 of width.
8. a kind of epoxy resin embedding adhesive dielectric properties test sample according to claim 7 prepares mould, its feature exists
In：The rising head（15）Axis and mould road（12）Axis be distributed on die cavity（11）The both sides of axis.
9. a kind of epoxy resin embedding adhesive dielectric properties test sample according to claim 7 prepares mould, its feature exists
In：The rising head（15）Positioned at die cavity（11）Top, mould road（12）Positioned at rising head（15）Side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720697596.4U CN206804814U (en) | 2017-06-15 | 2017-06-15 | A kind of epoxy resin embedding adhesive dielectric properties test sample prepares mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720697596.4U CN206804814U (en) | 2017-06-15 | 2017-06-15 | A kind of epoxy resin embedding adhesive dielectric properties test sample prepares mould |
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| CN206804814U true CN206804814U (en) | 2017-12-26 |
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| CN201720697596.4U Active CN206804814U (en) | 2017-06-15 | 2017-06-15 | A kind of epoxy resin embedding adhesive dielectric properties test sample prepares mould |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109774035A (en) * | 2018-12-10 | 2019-05-21 | 河南平高通用电气有限公司 | Sample block casting mold |
-
2017
- 2017-06-15 CN CN201720697596.4U patent/CN206804814U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109774035A (en) * | 2018-12-10 | 2019-05-21 | 河南平高通用电气有限公司 | Sample block casting mold |
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