CN206759830U - The housing of a kind of electronic equipment - Google Patents

The housing of a kind of electronic equipment Download PDF

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Publication number
CN206759830U
CN206759830U CN201720346952.8U CN201720346952U CN206759830U CN 206759830 U CN206759830 U CN 206759830U CN 201720346952 U CN201720346952 U CN 201720346952U CN 206759830 U CN206759830 U CN 206759830U
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CN
China
Prior art keywords
electronic equipment
substrate
housing
backlight module
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201720346952.8U
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Chinese (zh)
Inventor
许常青
韩婷婷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Refond Optoelectronics Co Ltd
Original Assignee
Shenzhen Refond Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN201720346952.8U priority Critical patent/CN206759830U/en
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Publication of CN206759830U publication Critical patent/CN206759830U/en
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Abstract

The utility model provides the housing of a kind of electronic equipment, it includes backlight module and the frame perpendicular to device screen, backlight module includes substrate and LED chip, turning circuit is set on substrate, LED chip is electrically connected with turning circuit and is encapsulated in by packaging body on substrate, and backlight module is mounted on frame inwall;Compared with prior art, the shell mechanism of the utility model electronic equipment is simple, and backlight module, which is mounted on the frame inwall, can reduce distance needed for mixed light luminous intensity distribution, so as to which that improves electronic equipment screen accounts for screen ratio.

Description

The housing of a kind of electronic equipment
Technical field
It the utility model is related to electronic technology field, more particularly to the housing of a kind of electronic equipment.
Background technology
With the development of smart electronicses product, the screen ratio that accounts for of screen requires more and more higher.In the prior art, electronic equipment makes Be device screen luminous intensity distribution with side-emitting LED lamp group, due to the reason such as LED sizes itself and PCB substrate paster mounting means, it is necessary to Reserve enough distances and carry out mixed light luminous intensity distribution, in order to there are enough spaces to carry out mixed light and luminous intensity distribution, side frame and actual screen cover Need to reserve enough width between plate luminous intensity distribution zone boundary, the area of such device screen panel is generally larger than the effective of reality The area of light-emitting zone so that account for screen than relatively low.
Therefore, it is necessary to be directed to above-mentioned problems of the prior art, there is provided the housing of a kind of electronic equipment, reduce mixed light Distance needed for luminous intensity distribution, so as to which that improves electronic equipment screen accounts for screen ratio.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of electricity for accounting for screen ratio for being advantageous to improve device screen The housing of sub- equipment.
Technical scheme is used by the utility model solves above-mentioned technical problem:
The housing of a kind of electronic equipment, including backlight module and the frame perpendicular to device screen panel are provided, it is described Backlight module includes substrate and LED chip, sets turning circuit on the substrate, the LED chip electrically connects with turning circuit Connect and encapsulated on the substrate by packaging body, the backlight module is mounted on the frame inwall.
As the improvement of above-mentioned technical proposal, packaged type of the LED chip on substrate is upside-down mounting or formal dress.
As the further improvement of above-mentioned technical proposal, the substrate of the backlight module is flexible material so that the back of the body Optical mode group can carry out bending attachment along the frame inwall of the housing.
As the further improvement of above-mentioned technical proposal, the substrate thickness is 0.05~1.5mm.
As the further improvement of above-mentioned technical proposal, the packaged type of the LED chip on the substrate includes spray Apply, dust, any one in dispensing, gluing or mould plastic packaging.
As the further improvement of above-mentioned technical proposal, the height of the packaging body is 0.1~1mm.
As the further improvement of above-mentioned technical proposal, the electronic equipment includes mobile phone, TV, display and flat board electricity Brain.
The beneficial effects of the utility model are:
The shell of the utility model electronic equipment includes backlight module and the frame perpendicular to device screen, the backlight mould Group is mounted on the frame inwall, and it includes substrate and LED chip, sets turning circuit on the substrate, the LED chip with Turning circuit is electrically connected with and encapsulated on the substrate by packaging body, the shell structure letter of the utility model electronic equipment Single, backlight module is mounted on frame inwall, is advantageous to reduce, so as to which that improves device screen accounts for screen ratio.
Brief description of the drawings
, below will be to needed for embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model Accompanying drawing that will be practical briefly describes:
Fig. 1 is the structural representation of housing one embodiment of the utility model electronic equipment;
Fig. 2 is the structural representation of backlight module in embodiment described in housing Fig. 1 of the utility model electronic equipment;
Fig. 3 is the structural representation that LED chip encapsulates in embodiment described in housing Fig. 1 of the utility model electronic equipment.
Embodiment
Design, concrete structure and caused technique effect of the present utility model are carried out below with reference to embodiment and accompanying drawing Clearly and completely describe, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment It is part of the embodiment of the present utility model, rather than whole embodiments, based on embodiment of the present utility model, the skill of this area The other embodiment that art personnel are obtained on the premise of not paying creative work, belong to the model of the utility model protection Enclose.In addition, all connection/annexations being related in patent, not singly refer to component and directly connect, and refer to can be according to specific Performance, by adding or reducing couple auxiliary, to form more excellent draw bail.In the utility model it is involved it is upper, Under, the orientation such as left and right description be only for the mutual alignment relation of each part of the utility model in accompanying drawing. Each technical characteristic in the utility model, can be with combination of interactions on the premise of not conflicting conflict.
Fig. 1 is the structural representation of housing one embodiment of the utility model electronic equipment, with reference to figure 1, the present embodiment In, the housing of a kind of electronic equipment is square structure, and it includes backlight module 30 and the frame 20 perpendicular to device screen panel, Backlight module 30 can be spot light or area source, and backlight module includes substrate 31 and LED chip 32, and LED chip is encapsulated in base On plate 31, in the present embodiment, LED chip uses the packaged type of upside-down mounting, has size small, optics is easier matching, heat radiation energy The advantages of power is high;In other embodiment of the present utility model, LED chip can also use the packaged type of formal dress, backlight mould Group 30 is mounted on the inwall of frame 20, relative to prior art, can reduce the space length needed for LED chip mixed light luminous intensity distribution, So as to reduce the distance on the effective light-emitting zone border of device screen and shell frame, that is, improve and account for screen ratio.
Fig. 2 is the structural representation of backlight module in embodiment described in housing Fig. 1 of the utility model electronic equipment, Fig. 3 It is the structural representation that LED chip encapsulates in embodiment described in housing Fig. 1 of the utility model electronic equipment, with reference to figure 2,3, sheet The packaged type of embodiment LED chip is upside-down mounting, has the advantages of size is small, and optics is easier to match, and heat-sinking capability is high;Backlight Module 30 includes substrate 31 and LED chip 32, sets turning circuit 33 on substrate 31, substrate thickness is 0.05~1.5mm, LED Chip 32 is electrically connected with turning circuit 33, and chip can, eutectic welding be bonded by glue, tin cream with the fixed form of substrate Welding, the present embodiment weld LED chip 32 on the substrate 31 preferably by tin cream, are then encapsulated in institute by packaging body 34 State on substrate, any one of the packaged type including spraying, dusting, in dispensing, gluing or mould plastic packaging, the material of packaging body Can be any organic material and inorganic material, can be with added material in packaging body.After the completion of encapsulation, packaging body can be flat Face, it is shaped face, lens arrangement can also be carried, the height of packaging body is 0.1~1mm after the completion of encapsulation.
The material of the substrate 31 of backlight module 30 can be FPC, epoxy substrate and metal substrate or It any material, can be that multilayer can also be single layer substrate, be provided with turn on circuit 33 on the substrate, in the present embodiment, base The material of plate 31 is preferably flexible material so that backlight module 30 is in flexibility, therefore backlight module 30 can be along casting of electronic device Frame inwall carries out bending attachment, and apparatus casing frame inwall is all covered, and the light that LED chip 32 is sent vertically is injected In device panel so that the distance between the housing border of viewing area border with mounting backlight module greatly reduces, so as to carry Gao Zhanping ratios.
The technical program is applied to the electronic equipments such as mobile phone, TV, display and tablet personal computer.
Preferred embodiment of the present utility model is above are only, but the utility model is not restricted to the embodiment, is familiar with Those skilled in the art can also make a variety of equivalent variations or replacement on the premise of without prejudice to the utility model spirit, this Equivalent deformation or replacement are all contained in the application claim limited range a bit.

Claims (7)

1. the housing of a kind of electronic equipment, it is characterised in that:Frame including backlight module and perpendicular to device screen panel, institute Stating backlight module includes substrate and LED chip, turning circuit is set on the substrate, the LED chip and turning circuit are electrical Connect and encapsulated on the substrate by packaging body, the backlight module is mounted on the frame inwall.
2. the housing of electronic equipment according to claim 1, it is characterised in that:Encapsulation of the LED chip on substrate Mode is upside-down mounting or formal dress.
3. the housing of electronic equipment according to claim 2, it is characterised in that:The substrate of the backlight module is flexible material Material so that the backlight module can carry out bending attachment along the frame inwall of the housing.
4. the housing of electronic equipment according to claim 3, it is characterised in that:The substrate thickness is 0.05~1.5mm.
5. the housing of electronic equipment according to claim 1, it is characterised in that:The LED chip is on the substrate Packaged type includes spraying, dust, dispensing, gluing or mould plastic packaging.
6. the housing of electronic equipment according to claim 5, it is characterised in that:The height of the packaging body be 0.1~ 1mm。
7. the housing of electronic equipment according to claim 1, it is characterised in that:The electronic equipment include mobile phone, TV, Display and tablet personal computer.
CN201720346952.8U 2017-04-01 2017-04-01 The housing of a kind of electronic equipment Active CN206759830U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720346952.8U CN206759830U (en) 2017-04-01 2017-04-01 The housing of a kind of electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720346952.8U CN206759830U (en) 2017-04-01 2017-04-01 The housing of a kind of electronic equipment

Publications (1)

Publication Number Publication Date
CN206759830U true CN206759830U (en) 2017-12-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720346952.8U Active CN206759830U (en) 2017-04-01 2017-04-01 The housing of a kind of electronic equipment

Country Status (1)

Country Link
CN (1) CN206759830U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108831314A (en) * 2018-04-28 2018-11-16 珠海晨新科技有限公司 A kind of LED backlight light-emitting control method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108831314A (en) * 2018-04-28 2018-11-16 珠海晨新科技有限公司 A kind of LED backlight light-emitting control method

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