CN206706202U - A kind of crystal oscillator probe uses crystal oscillator box - Google Patents
A kind of crystal oscillator probe uses crystal oscillator box Download PDFInfo
- Publication number
- CN206706202U CN206706202U CN201720534550.0U CN201720534550U CN206706202U CN 206706202 U CN206706202 U CN 206706202U CN 201720534550 U CN201720534550 U CN 201720534550U CN 206706202 U CN206706202 U CN 206706202U
- Authority
- CN
- China
- Prior art keywords
- crystal oscillator
- platform
- jaw
- box
- back panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The utility model discloses a kind of crystal oscillator probe crystal oscillator box, mainly by box body (1), and the crystal oscillator platform being arranged in box body (1)；Characterized in that, the crystal oscillator platform is crystal oscillator platform, the crystal oscillator platform includes wafer reception platform (2), and the three-jaw insulating back panel (3) being engaged with wafer reception platform (2).12 chips are provided with crystal oscillator platform of the present utility model, just a variety of different target evaporation capacity can be detected by the chip changed positioned at detection hole, solve the problems, such as that single-wafer box can not accurately be detected to the evaporation capacity of a variety of targets well, so as to effectively reduce the workload of operator, the operating efficiency of crystal oscillator probe is improved well.
Description
Technical field
It the utility model is related to a kind of crystal oscillator probe wafer case, in particular to a kind of crystal oscillator probe crystal oscillator box.
Background technology
Current many R＆D institutions just employ crystal oscillator probe to be controlled to the plated film time of substrate
Target evaporation capacity is detected, operator is by the analyzing and processing for the chip frequency of oscillation for popping one's head in transmitted to crystal oscillator come to plating
The film time is controlled.However, existing crystal oscillator probe uses single-wafer box, the single-wafer box can only be to one kind
Target evaporation capacity is detected, and then needs to change wafer case to ensure the accurate of detection when detecting a variety of target evaporation capacity
Property, this significantly increases the workload of operator, the serious operating efficiency that have impact on crystal oscillator probe.
Utility model content
The purpose of this utility model is that single-wafer box is to a variety of targets used by overcoming existing crystal oscillator probe
Evaporation capacity need to change when being detected wafer case to ensure the accuracy of detection the defects of, there is provided a kind of crystal oscillator probe crystalline substance
Vibration Box.
The purpose of this utility model passes through following technical proposals reality：A kind of crystal oscillator probe uses crystal oscillator box, mainly by box body,
With the crystal oscillator platform composition being arranged in box body；Characterized in that, the crystal oscillator platform includes wafer reception platform, and with wafer reception platform
The three-jaw insulating back panel being connected；Multiple crystal-vibration-chips is provided with the wafer reception platform, is set on the three-jaw insulating back panel
It is equipped with the signal transmission assembly being engaged with crystal-vibration-chip.
The signal transmission assembly includes three calvus for being arranged on three-jaw insulating back panel and being engaged with crystal-vibration-chip, and sets
The three-jaw backboard put on three-jaw insulating back panel and be connected with three calvus.
The detection hole of its bottom is provided through on the box body.
The groove for installing crystal-vibration-chip is provided with the wafer reception platform, and the bottom portion of groove is provided with and detection hole
Corresponding through hole.
The mounting groove corresponding with the groove on wafer reception platform, and the mounting groove are provided with the three-jaw insulating back panel
On be provided through the mounting hole of its bottom.
The three-jaw backboard is then arranged in the mounting hole of three-jaw insulating back panel, and three calvus is arranged on the three-jaw insulation back of the body
In the mounting groove of plate, and three calvus is connected by screw with three-jaw backboard.
Axle sleeve is provided with the wafer reception platform, installing port is provided with the axle sleeve, is also set on the wafer reception platform
It is equipped with multiple screwed holes.
The center hole corresponding with the screwed hole on wafer reception platform, the three-jaw backboard are provided with the three-jaw backboard
Then by being bolted to what screwed hole matched on wafer reception platform.
Alignment pin is provided with the outside of the axle sleeve, the card being engaged with alignment pin is provided with the three-jaw insulating back panel
Groove.
The utility model has advantages below and beneficial effect compared with prior art：
(1) multiple chips are provided with wafer reception platform of the present utility model, the chip of detection hole is located at by changing just
A variety of different target evaporation capacity can be detected, solving single-wafer box well can not be to the evaporation of a variety of targets
The problem of amount is accurately detected, so as to effectively reduce the workload of operator, crystal oscillator probe is improved well
Operating efficiency.
(2) three calvus set in the utility model can closely contact with crystal-vibration-chip, effectively raise crystal oscillator frequency
The stability of transmission.
(3) it is of the present utility model that there is the advantage such as low with production cost simple in construction, reasonable in design.
Brief description of the drawings
Fig. 1 is overall schematic of the present utility model.
Fig. 2 is top view of the present utility model.
Fig. 3 is the structural representation of crystal oscillator platform of the present utility model.
Fig. 4 is overall profile of the present utility model.
Fig. 5 is the structural representation of wafer reception platform of the present utility model.
Fig. 6 is the structural representation of three-jaw insulating back panel of the present utility model.
Fig. 7 is the utility model crystal oscillator platform explosive view.
In above-mentioned accompanying drawing, component names are as follows corresponding to reference：
1-box body, 2-wafer reception platform, 3-three-jaw insulating back panel, 4-crystal-vibration-chip, 5-three calvus, 6-three-jaw back of the body
Plate, 7-axle sleeve, 8-alignment pin, 9-detection hole, 10-groove, 11-through hole, 12-mounting groove, 13-screw, 14-installation
Hole, 15-screwed hole, 16-bolt, 17-neck, 18-installing port.
Embodiment
The utility model is described in further detail with reference to embodiment, but embodiment of the present utility model is simultaneously
Not limited to this.
Embodiment
As shown in figs. 1 to 6, the utility model discloses a kind of crystal oscillator probe crystal oscillator box, mainly by box body 1 and crystal oscillator platform
Composition.Wherein, crystal oscillator platform is as shown in figure 3, it includes wafer reception platform 2 and three-jaw insulating back panel 3.Wherein, as shown in Fig. 4,6,
Crystal-vibration-chip 4 is provided with the wafer reception platform 2, axle sleeve 7, alignment pin 8 is provided with axle sleeve 7.The three-jaw insulating back panel 3
For the signal transmission assembly of upper setting as shown in Fig. 4,6, it includes three calvus 5 and three-jaw backboard 6.
During implementation, the box body 1 is used as main carrier of the present utility model, and the box body 1 is used to carry crystal oscillator platform, the box body 1
It is upper be provided with for target atomic group or ion by and through the bottom of box body 1 detection hole 9, the box in specific use
Body 1 is threadedly attached on crystal oscillator probe.
The wafer reception platform 2 as illustrated in figures 3-6, preferentially 12 crystal-vibration-chips 4 is provided with the wafer reception platform 2, in order to
Make the crystal oscillator frequency of the crystal-vibration-chip 4 more stable, crystal-vibration-chip 4 of the present utility model preferentially employs the plating Jin Jing with high conductance
Shake piece, and the crystal-vibration-chip 4 is then used for detection to target evaporation capacity, i.e., the monitoring to the coating film thickness of substrate, the utility model lead to
Frequency of oscillation of the crystal-vibration-chip 4 after target molecule is adsorbed is crossed to be monitored to the coating film thickness of substrate.Meanwhile this practicality is new
The groove 10 for being used for installing crystal-vibration-chip 4 is provided with wafer reception platform 2, the groove 10 is provided with corresponding with detection hole 9 and passed through
The through hole 11 of the bottom of groove 10 is worn, the setting quantity of groove 10 is identical with the quantity of crystal-vibration-chip 4.When specifically used, wafer reception
Axle sleeve 7 is provided with platform 2, installing port 18 is provided with axle sleeve 7, the installing port 18 is used to install set by external motor rotating shaft
Trundle.Multiple screwed holes 15 are additionally provided with the wafer reception platform 2, are connected to by axle sleeve 7 in external motor, the axle sleeve 7
On be additionally provided with alignment pin 8, and after wafer reception platform 2 is connected with the rotating shaft of external motor and is fixed by fixing screws
Formed with certain gap between the inside bottom of box body 1, to ensure that crystal oscillator platform can be turned under the drive of external motor
It is dynamic.
Meanwhile it is provided with as shown in Fig. 4,6, on the three-jaw insulating back panel 3 relative with the groove 10 on wafer reception platform 2
Answer and quantity identical mounting groove 12, the mounting groove 12 are provided through the mounting hole 14 of its bottom, three-jaw insulating back panel 3 is still
It is provided with the center hole corresponding with the screwed hole of wafer reception platform 2 15.Three-jaw insulating back panel of the present utility model preferentially uses
Resistant to elevated temperatures ceramics are used as insulating back panel, also can be used as three-jaw insulation using different insulating materials according to being actually needed
Backboard 3.When in use, the three-jaw insulating back panel 3 is then the bolt 16 to be matched by the screwed hole 15 with wafer reception platform 2
It is connected and fixed on wafer reception platform 2.The signal transmission assembly on three-jaw insulating back panel 3 is arranged on as shown in Fig. 4,6, it is wrapped
Three calvus 5 for being arranged on that it is engaged with crystal-vibration-chip 4 in the mounting groove 12 of three-jaw insulating back panel 3 are included, and are arranged on three-jaw insulation
The quantity of the three-jaw backboard 6 being connected in the mounting hole 14 of backboard 3 and with three calvus 5, three set calvus 5 and three-jaw backboard 6
It is identical with the quantity of crystal-vibration-chip 4, be provided with the connecting pole with silk hole on the three-jaw backboard 6, three calvus 5 then by with connecting pole
The screw 13 that silk hole matches is connected on three-jaw backboard 6.Three calvus 5 has good elasticity, i.e. three calvus 5 can be with crystalline substance
The piece 4 that shakes closely contacts, and enables three calvus 5 to carry out the crystal oscillator frequency of crystal-vibration-chip 4 to be accurately transferred to three-jaw backboard 6.Described three
The neck 17 being engaged with alignment pin 8 is additionally provided with pawl insulating back panel 3.
In use, the neck 17 of three-jaw insulating back panel 3 is engaged with the alignment pin 8 of wafer reception platform 2, three calvus 5 can be made
Accurately aligned with crystal-vibration-chip 4, the neck and wafer reception platform 2 for making three-jaw insulating back panel 3 are more convenient when mounted.It is described
Box body 1 on be also provided with the detection hole 9 used corresponding with any one through hole of the upper groove of wafer reception platform 2, during detection
The original or ion of target are then adsorbed onto on detection crystal-vibration-chip 4 by the detection hole 9, and testing staff passes through the vibration to crystal-vibration-chip 4
Frequency just can obtain the thickness of substrate coating after being analyzed and processed, so as to be controlled to the time of substrate coating.
During the utility model carrying out practically, after staff can input the digit of corresponding crystal-vibration-chip 4 by console, control
Platform processed then can output current then wafer reception platform 2 can be driven to rotate to external motor, external motor, make the crystal oscillator of selected positioning number
Piece 4 is located at the detection hole 9 of box body 1, to complete the detection to target evaporation capacity.After the target of evaporation has been changed, work people
Member only need to input the new digit of crystal-vibration-chip 4 by console, and wafer reception platform 2 then can be under the drive of external motor by selected position
Several crystal-vibration-chips 4 are transformed at the detection hole 9 of box body 1, and without changing wafer case, just new target evaporation capacity can be carried out
Accurately detection.Popped one's head in so as to which the utility model solves the existing crystal oscillator using one chip crystal oscillator box well to a variety of targets
When the evaporation capacity of material is detected, the problem of need to changing wafer case, this is greatly reduced the workload of operator, effectively carries
The high operating efficiency of crystal oscillator probe.
As described above, the utility model can be realized well.
Claims (9)
1. a kind of crystal oscillator probe uses crystal oscillator box, mainly by box body (1), and the crystal oscillator platform composition being arranged in box body (1)；Its feature
It is, the crystal oscillator platform includes wafer reception platform (2), and the three-jaw insulating back panel (3) being connected with wafer reception platform (2)；Institute
State and multiple crystal-vibration-chip (4) is provided with wafer reception platform (2), be provided with the three-jaw insulating back panel (3) and crystal-vibration-chip (4)
The signal transmission assembly being engaged.
2. a kind of crystal oscillator probe according to claim 1 uses crystal oscillator box, it is characterised in that：The signal transmission assembly includes
Three calvus (5) for being arranged on three-jaw insulating back panel (3) and being engaged with crystal-vibration-chip (4), and it is arranged on three-jaw insulating back panel (3)
Three-jaw backboard (6) that is upper and being connected with three calvus (5).
3. a kind of crystal oscillator probe according to claim 2 uses crystal oscillator box, it is characterised in that：It is provided with the box body (1)
Detection hole (9) through its bottom.
4. a kind of crystal oscillator probe according to claim 3 uses crystal oscillator box, it is characterised in that：On the wafer reception platform (2)
The groove (10) for installing crystal-vibration-chip (4) is provided with, and groove (10) bottom is provided with corresponding with detection hole (9) lead to
Hole (11).
5. a kind of crystal oscillator probe according to claim 4 uses crystal oscillator box, it is characterised in that：The three-jaw insulating back panel (3)
On be provided with the mounting groove (12) corresponding with the groove (10) on wafer reception platform (2), and be provided through on the mounting groove
The mounting hole (14) of its bottom.
6. a kind of crystal oscillator probe according to claim 5 uses crystal oscillator box, it is characterised in that：The three-jaw backboard (6) then sets
Put in the mounting hole (14) of three-jaw insulating back panel (3), three calvus (5) is arranged on the mounting groove of three-jaw insulating back panel (3)
(12) in, and three calvus (5) is connected by screw (13) with three-jaw backboard (6).
A kind of 7. crystal oscillator probe crystal oscillator box according to any one of claim 1~6, it is characterised in that：The chip is held
Connect and axle sleeve (7) is provided with platform (2), installing port (18) is provided with the axle sleeve (7), is also set up on the wafer reception platform (2)
There are multiple screwed holes (15).
8. a kind of crystal oscillator probe according to claim 7 uses crystal oscillator box, it is characterised in that：Set on the three-jaw backboard (6)
Be equipped with the center hole corresponding with the screwed hole (15) on wafer reception platform (2), the three-jaw backboard (6) then by with screwed hole
(15) bolt (16) to match is connected on wafer reception platform (2).
9. a kind of crystal oscillator probe according to claim 8 uses crystal oscillator box, it is characterised in that：Set on the outside of the axle sleeve (7)
There is alignment pin (8), the neck (17) being engaged with alignment pin (8) is provided with the three-jaw insulating back panel (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720534550.0U CN206706202U (en) | 2017-05-15 | 2017-05-15 | A kind of crystal oscillator probe uses crystal oscillator box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720534550.0U CN206706202U (en) | 2017-05-15 | 2017-05-15 | A kind of crystal oscillator probe uses crystal oscillator box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206706202U true CN206706202U (en) | 2017-12-05 |
Family
ID=60463213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720534550.0U Expired - Fee Related CN206706202U (en) | 2017-05-15 | 2017-05-15 | A kind of crystal oscillator probe uses crystal oscillator box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206706202U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106967958A (en) * | 2017-05-15 | 2017-07-21 | 成都西沃克真空科技有限公司 | A kind of crystal oscillator probe uses crystal oscillator box |
| CN108823545A (en) * | 2018-09-07 | 2018-11-16 | 京东方科技集团股份有限公司 | Crystal oscillator sonde configuration and evaporation coating device |
| CN113106410A (en) * | 2021-03-05 | 2021-07-13 | 深圳市福浪电子有限公司 | Automatic switching device for crystal oscillation plate in furnace for film coating machine |
-
2017
- 2017-05-15 CN CN201720534550.0U patent/CN206706202U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106967958A (en) * | 2017-05-15 | 2017-07-21 | 成都西沃克真空科技有限公司 | A kind of crystal oscillator probe uses crystal oscillator box |
| CN108823545A (en) * | 2018-09-07 | 2018-11-16 | 京东方科技集团股份有限公司 | Crystal oscillator sonde configuration and evaporation coating device |
| US10988840B2 (en) | 2018-09-07 | 2021-04-27 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Crystal oscillation probe structure and evaporation device |
| CN113106410A (en) * | 2021-03-05 | 2021-07-13 | 深圳市福浪电子有限公司 | Automatic switching device for crystal oscillation plate in furnace for film coating machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206706202U (en) | A kind of crystal oscillator probe uses crystal oscillator box | |
| CN107064255B (en) | A kind of combination electrode formula pH sensor and preparation method thereof based on CMOS technology | |
| CN106967958A (en) | A kind of crystal oscillator probe uses crystal oscillator box | |
| CN104535824B (en) | Testing system and method for critical current density of high temperature superconductor film material | |
| WO2017193415A1 (en) | Method for preparing graphene modified composite planar ph sensor | |
| CN105954333A (en) | Gold nanobelt three-electrode sensor used for monitoring heavy metal and preparation method thereof | |
| CN104062322A (en) | Humidity sensor and preparation method thereof | |
| JPH07169803A (en) | Wafer prober | |
| CN206772938U (en) | A kind of crystal oscillator probe for being used to detect evaporator evaporation amount | |
| CN205981818U (en) | A MALDI target plate that is used for sample to fix in detection of chip carrier normal position | |
| CN207881944U (en) | Moving-coil detects bearing | |
| CN106896144A (en) | Optical addressing potential sensing assembly | |
| CN106645329B (en) | A kind of double-deck film modified pH of GO-Nafion, water content compound sensor and preparation method thereof | |
| CN114308739A (en) | Rotary material taking structure of full-automatic wafer sorting machine | |
| JPS58220438A (en) | Measuring placing stand for semiconductor wafer | |
| CN108918353A (en) | A kind of method of particle matter qualitative detection in atmospheric environment | |
| CN209167186U (en) | Contact resistance test machine | |
| CN103389296A (en) | Quick preparation method of SERS (surface-enhanced Raman scattering) active substrate with three-dimensional nano porous structure | |
| CN109142185B (en) | Water vapor transmittance testing system and method | |
| CN206480606U (en) | Wafer mounting apparatus and wafer sort fixture | |
| CN207623454U (en) | Hi-pot test machine and high-voltage testing system | |
| CN206919799U (en) | A kind of tool for being used to detect crystal oscillator chip coating clamp | |
| CN218524632U (en) | Chip with adjustable target spot aperture for metabolism detection of time-of-flight mass spectrometry | |
| CN110205600A (en) | A kind of high temperature resistant dual purpose crystalline substance control instrument | |
| CN104569109B (en) | A kind of chip structure and its integrated encapsulation method towards ISFET sensors |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171205 Termination date: 20200515 |