CN206686514U - A kind of electronic equipment - Google Patents
A kind of electronic equipment Download PDFInfo
- Publication number
- CN206686514U CN206686514U CN201720478674.1U CN201720478674U CN206686514U CN 206686514 U CN206686514 U CN 206686514U CN 201720478674 U CN201720478674 U CN 201720478674U CN 206686514 U CN206686514 U CN 206686514U
- Authority
- CN
- China
- Prior art keywords
- heat
- face
- semiconductor cooler
- electronic equipment
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
Embodiment of the present utility model discloses a kind of electronic equipment, is related to technical field of electronic equipment, is capable of the temperature of adjustment equipment shell.The electronic equipment, including：Fore shell and rear shell, the fore shell is engaged with rear shell, formed with accommodation space between the fore shell and rear shell, printed circuit board (PCB) is provided with the accommodation space, heater members are provided with the printed circuit board, semiconductor cooler is additionally provided with the accommodation space, the first heat conductor is provided between the first face of the semiconductor cooler and the fore shell, the second heat conductor is provided between the second face of the semiconductor cooler and the rear shell；First heat conductor is in contact with the first face of the semiconductor cooler and the inwall of the fore shell respectively, and second heat conductor is in contact with the second face of the semiconductor cooler and the inwall of the rear shell respectively.The utility model is applied to carry out temperature adjustment to the shell of electronic equipment.
Description
Technical field
Technical field of electronic equipment is the utility model is related to, more particularly to one kind is entered trip temperature using semiconductor cooler and adjusted
The electronic equipment of section.
Background technology
Growing with electronics miniaturization and integration degree, it is reliable that the thermal design of electronic equipment turns into product
Property design in an essential ring.
The basic radiating mode of thermal design includes natural heat dissipation and forces two kinds of forms of radiating, for increasing small-sized
Product, due to the limitation of inner space, it is conventional heat that chip heat is transferred into shell radiating using heat-conducting interface material
Design method.
But for the electronic equipment that some human bodies often contact, it is contemplated that in terms of Consumer's Experience, device housings temperature needs strict
Control is in certain limit of temperature rise, especially for the equipment of metal shell.Therefore, control device skin temperature becomes heat and set
The a great problem of meter.
The content of the invention
In view of this, the utility model embodiment provides a kind of electronic equipment, is capable of the temperature of adjustment equipment shell.
In a first aspect, the utility model embodiment provides a kind of electronic equipment, including：Fore shell and rear shell, the fore shell with
Rear shell is engaged, and formed with accommodation space between the fore shell and rear shell, printed circuit board (PCB) is provided with the accommodation space,
Heater members are provided with the printed circuit board, semiconductor cooler is additionally provided with the accommodation space, are partly led described
The first heat conductor is provided between first face of body refrigerator and the fore shell, in the second face of the semiconductor cooler and institute
State and be provided with the second heat conductor between rear shell；First heat conductor respectively with the first face of the semiconductor cooler and described
The inwall of fore shell is in contact, second heat conductor respectively with the second face of the semiconductor cooler and the inwall of the rear shell
It is in contact.
With reference in a first aspect, in the first embodiment of first aspect, the first face of the semiconductor cooler is
Heat-absorbent surface, the second face of the semiconductor cooler is heat delivery surface.
With reference in a first aspect, in second of embodiment of first aspect, the first face of the semiconductor cooler is
Heat delivery surface, the second face of the semiconductor cooler is heat-absorbent surface.
With reference to the first or second of embodiment of first aspect, first aspect, in the third implementation of first aspect
In mode, first heat conductor is sheet metal component.
With reference to the first or second of embodiment of first aspect, first aspect, in the 4th kind of implementation of first aspect
In mode, second heat conductor is aluminium block or sheet metal component.
With reference to the first or second of embodiment of first aspect, first aspect, in the 5th kind of implementation of first aspect
In mode, the position that the fore shell and rear shell contact with each other is provided with heat-barrier material.
With reference to the 5th kind of embodiment of first aspect, in the 6th kind of embodiment of first aspect, the heat-insulated material
Expect for heat-insulated foam.
It is at least one on the printed circuit board (PCB) with reference in a first aspect, in the 7th kind of embodiment of first aspect
Heat conductive pad is provided between heater members and the rear shell.
The a kind of electronic equipment that the utility model embodiment provides, by being formed between the fore shell of electronic equipment and rear shell
Accommodation space in set semiconductor cooler, between the first face of the semiconductor cooler and the fore shell be provided with first
Heat conductor, the second heat conductor, first heat are provided between the second face of the semiconductor cooler and the rear shell
Conductor is in contact with the first face of the semiconductor cooler and the inwall of the fore shell respectively, second heat conductor respectively with
Second face of the semiconductor cooler and the inwall of the rear shell are in contact, and so, pass through the cause of the semiconductor cooler
Cold or heating can carry out temperature adjustment to the shell such as fore shell often touched of the electronic equipment.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, is not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of embodiment electronic equipment of the present utility model.
Embodiment
The utility model embodiment is described in detail below in conjunction with the accompanying drawings.
It will be appreciated that described embodiment is only the utility model part of the embodiment, rather than whole implementation
Example.Based on the embodiment in the utility model, those of ordinary skill in the art are obtained under the premise of creative work is not made
The all other embodiment obtained, belong to the scope of the utility model protection.
Embodiment one
Fig. 1 is the structural representation of the utility model embodiment electronic equipment.Referring to Fig. 1, the electronic equipment of the present embodiment
It can include：Fore shell 1 and rear shell 2, the fore shell 1 are engaged with rear shell 2, formed with accommodating between the fore shell 1 and rear shell 2
Space, printed circuit board (PCB) 3 is provided with the accommodation space, heater members 4a, 4b, 4c are provided with the printed circuit board (PCB) 3
And 4d, semiconductor cooler 5 is additionally provided with the accommodation space, the first face of the semiconductor cooler 5 with it is described before
The first heat conductor 6 is provided between shell 1, the second heat is provided between the second face of the semiconductor cooler 5 and the rear shell 2
Conductor 7；First heat conductor 6 connects with the first face of the semiconductor cooler 5 and the inwall of the fore shell 1 respectively
Touch, second heat conductor 7 is in contact with the second face of the semiconductor cooler 5 and the inwall of the rear shell 2 respectively.
The fore shell 1 and rear shell 2 can be metal material or plastic material.
Heater members 4 on the printed circuit board (PCB) 3 include processor chips, such as data processor chips, graphics process
Device chip or network processor chip etc..Before heat caused by the heater members work easily causes the electronic equipment
The heating of shell 1 and rear shell 2.
The semiconductor cooler 5 (Thermo Electric Cooler, abbreviation TEC) is the amber using semi-conducting material
Made of your note effect.So-called Peltier effect, refer to when the galvanic couple that DC current is made up of two kinds of semi-conducting materials, its
One end is absorbed heat, the phenomenon of one end heat release.The N-type of heavy doping and the bismuth telluride of p-type are mainly used as TEC semi-conducting material, telluride
Bismuth element is to generate heat parallel using electrically coupled in series.TEC includes some p-types and N-type to (group), and they are connected in one by electrode
Rise, and be clipped between two ceramic electrodes；When there is electric current to be flowed through from TEC, heat caused by electric current can pass from TEC side
To opposite side, hot face and huyashi-chuuka (cold chinese-style noodles) are produced on TEC, here it is TEC heating and refrigeration principle.
In the present embodiment, by setting semiconductor to cause in the accommodation space that is formed between the fore shell of electronic equipment and rear shell
Cooler, the first heat conductor is provided between the first face of the semiconductor cooler and the fore shell, is caused in the semiconductor
Be provided with the second heat conductor between second face of cooler and the rear shell, first heat conductor respectively with the conductor refrigeration
First face of device and the inwall of the fore shell are in contact, second heat conductor the second face with the semiconductor cooler respectively
And the inwall of the rear shell is in contact, so, the electronics can be set by the refrigeration or heating of the semiconductor cooler
Standby shell carries out temperature adjustment such as the fore shell often touched.
Embodiment two
The structure of the structure of the present embodiment electronic equipment and embodiment one is essentially identical, and difference is, referring to Fig. 1,
In the present embodiment, the first mask body of the semiconductor cooler 5 is heat-absorbent surface, i.e. huyashi-chuuka (cold chinese-style noodles), the of the semiconductor cooler 5
Two mask bodies are heat delivery surface, i.e., hot face, first heat conductor 6 is sheet metal component, and second heat conductor 7 is aluminium block, this
Sample can reduce the temperature of fore shell, by the heat transfer of heat delivery surface to rear shell that is less or not contacted with people, make so as to reach
The effect that fore shell temperature reduces.
When the fore shell 1 is plastics, the area of the sheet metal component can be increased to strengthen the conduction of heat on fore shell 1.When
When the rear shell 2 is plastics, the area of the aluminium block can be increased, by aluminium block reinforcement radiating in order to avoid rear shell overheats.It is optional
Ground, the aluminium block is also alternatively into sheet metal component.
As it was previously stated, the fore shell 1 and rear shell 2 can be metal material or plastic material, when the fore shell 1 and rear shell 2 are equal
For metal material when, to prevent the heat transfer of rear shell 2 from, to fore shell 1, being set at the position that the fore shell 1 and rear shell 2 contact with each other
There is heat-barrier material 8.In the present embodiment, the heat-barrier material 8 is specially heat-insulated foam, and the heat-insulated foam may be provided in the fore shell
1 and rear shell 2 be connected with each other seam crossing.
Heat conductive pad is provided between at least one heater members and the rear shell 2 on the printed circuit board (PCB) 3, in favor of right
The heater members are radiated, and in the present embodiment, heat conductive pad 9b are provided between heater members 4b and the rear shell 2, is being sent out
Heat conductive pad 9d is provided between thermal device 4d and the rear shell 2.
Embodiment three
The structure of the structure of the present embodiment electronic equipment and embodiment two is essentially identical, and difference is, referring to Fig. 1,
In the present embodiment, the first mask body of the semiconductor cooler 5 is heat delivery surface, i.e., hot face, the of the semiconductor cooler 5
Two faces are heat-absorbent surface, i.e. huyashi-chuuka (cold chinese-style noodles).
In the present embodiment, the connection circuit of the semiconductor cooler 5 is provided with both positive and negative polarity switching switch and (not shown in figure
Go out), the both positive and negative polarity of the semiconductor cooler 5 can be switched over by the switching switch.When electronic equipment is in low temperature
During environment, both positive and negative polarity switching can be carried out to the semiconductor cooler, by sheet metal component by the first of the semiconductor cooler 5
Heat transfer caused by face heats to fore shell 1 to fore shell 1, the temperature of fore shell 1 is risen to the Contact Temperature of human comfort.
In the various embodiments described above, the electronic equipment can exist in a variety of forms, include but is not limited to：
(1) mobile communication equipment：The characteristics of this kind equipment is that possess mobile communication function, and to provide speech, data
Communicate as main target.This Terminal Type includes：Smart mobile phone (such as iPhone), multimedia handset, feature mobile phone, and it is low
Hold mobile phone etc..
(2) super mobile personal computer equipment：This kind equipment belongs to the category of personal computer, there is calculating and processing work(
Can, typically also possess mobile Internet access characteristic.This Terminal Type includes：PDA, MID and UMPC equipment etc., such as iPad.
(3) portable entertainment device：This kind equipment can show and play content of multimedia.The kind equipment includes：Audio,
Video player (such as iPod), handheld device, e-book, and intelligent toy and portable car-mounted navigation equipment.
(4) server：The equipment for providing the service of calculating, the composition of server are total including processor, hard disk, internal memory, system
Line etc., server is similar with general computer architecture, but due to needing to provide highly reliable service, therefore in processing energy
Power, stability, reliability, security, scalability, manageability etc. require higher.
(5) other electronic equipments with data interaction function.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply and deposited between these entities or operation
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Nonexcludability includes, so that process, method, article or equipment including a series of elements not only will including those
Element, but also the other element including being not expressly set out, or it is this process, method, article or equipment also to include
Intrinsic key element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that
Other identical element also be present in process, method, article or equipment including the key element.
Each embodiment in this specification is described by the way of related, identical similar portion between each embodiment
Divide mutually referring to what each embodiment stressed is the difference with other embodiment.
It is described above, only specific embodiment of the present utility model, but the scope of protection of the utility model is not limited to
In this, any one skilled in the art is in the technical scope that the utility model discloses, the change that can readily occur in
Change or replace, should all cover within the scope of protection of the utility model.Therefore, the scope of protection of the utility model should be with right
It is required that protection domain be defined.
Claims (8)
1. a kind of electronic equipment, it is characterised in that including：Fore shell and rear shell, the fore shell are engaged with rear shell, in the fore shell
Formed with accommodation space between rear shell, printed circuit board (PCB) is provided with the accommodation space, is set on the printed circuit board
There are heater members, it is characterised in that semiconductor cooler is additionally provided with the accommodation space, in the semiconductor cooler
The first heat conductor is provided between first face and the fore shell, between the second face of the semiconductor cooler and the rear shell
Provided with the second heat conductor；
First heat conductor is in contact with the first face of the semiconductor cooler and the inwall of the fore shell respectively, and described
Two heat conductors are in contact with the second face of the semiconductor cooler and the inwall of the rear shell respectively.
2. electronic equipment according to claim 1, it is characterised in that the first face of the semiconductor cooler is heat absorption
Face, the second face of the semiconductor cooler is heat delivery surface.
3. electronic equipment according to claim 1, it is characterised in that the first face of the semiconductor cooler is heat release
Face, the second face of the semiconductor cooler is heat-absorbent surface.
4. according to the electronic equipment described in any one of claims 1 to 3, it is characterised in that first heat conductor is metal plate
Part.
5. according to the electronic equipment described in any one of claims 1 to 3, it is characterised in that second heat conductor is aluminium block
Or sheet metal component.
6. according to the electronic equipment described in any one of claims 1 to 3, it is characterised in that the fore shell and rear shell contact with each other
Position be provided with heat-barrier material.
7. electronic equipment according to claim 6, it is characterised in that the heat-barrier material is heat-insulated foam.
8. according to the electronic equipment described in any one of claims 1 to 3, it is characterised in that on the printed circuit board (PCB) at least
Heat conductive pad is provided between one heater members and the rear shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720478674.1U CN206686514U (en) | 2017-05-03 | 2017-05-03 | A kind of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720478674.1U CN206686514U (en) | 2017-05-03 | 2017-05-03 | A kind of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206686514U true CN206686514U (en) | 2017-11-28 |
Family
ID=60406995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720478674.1U Expired - Fee Related CN206686514U (en) | 2017-05-03 | 2017-05-03 | A kind of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206686514U (en) |
-
2017
- 2017-05-03 CN CN201720478674.1U patent/CN206686514U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171128 Termination date: 20210503 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |