CN206686185U - Multiple IIC communication equipments hot plug devices - Google Patents

Multiple IIC communication equipments hot plug devices Download PDF

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Publication number
CN206686185U
CN206686185U CN201720416795.3U CN201720416795U CN206686185U CN 206686185 U CN206686185 U CN 206686185U CN 201720416795 U CN201720416795 U CN 201720416795U CN 206686185 U CN206686185 U CN 206686185U
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China
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iic
hot plug
communication equipments
plug devices
microcontroller
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CN201720416795.3U
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Chinese (zh)
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高学严
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Jiangsu Allray Inc
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Jiangsu Allray Inc
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Abstract

The utility model discloses a kind of multiple IIC communication equipments hot plug devices, including microcontroller, PC, power module and test board, described microcontroller is connected with PC and power module respectively, described test board is connected between microcontroller and PC by iic bus respectively, described test board at least two, SFP modules insertion port is provided with each described test board, one group of analog switch is sealed in the iic bus of each SFP modules insertion port position.By the above-mentioned means, multiple IIC communication equipments hot plug devices of the present utility model, in whole test process, SFP packing forms optical modules IIC hot plug is realized, will not cause system iic bus failure, stability is strong, the system reboot dynamic time can be saved, improves operating efficiency.

Description

Multiple IIC communication equipments hot plug devices
Technical field
The utility model belongs to the technical field of communication, and in particular to a kind of multiple IIC communication equipments hot plug devices.
Background technology
At present in the sensitivity of automatic testing light module, transmitting luminous power, high alarm and low alarm parameter field, testing Station is all a test parameter performance, not read through model internal data, and the module having before causing on station is burnt by internal data The module of record mistake, loss or leakage burning is taken as certified products to be put in storage, and ultimately results in client returns and does over again.And SFP packing forms Optical module be the module for being required to hot plug, former hot plug SFP encapsulation optical module is the power supply and difference for only connecting module Divided data signal wire, SFP encapsulation optical module IIC communication bus be to be not connected on the iic bus of system, and now in order to Can read module internal data, it is necessary to iic bus also will can be thermally connected on iic bus, for system host read light Inside modules data judge whether correctly.Because the iic bus of SFP encapsulation optical modules can be by the letter of original bus in hot plug Number deformation is drawn, bus timing is become chaotic, cause often have the connection of iic bus data outage, communication connection unsuccessfully occurs, and needs Relevant device is restarted into reset, influences the stability and operating efficiency of system.
Utility model content
The utility model waits mainly solving the technical problems that a kind of multiple IIC communication equipments hot plug devices of offer Analog switch is connected again after iic bus voltage stabilization, it is possible to achieve the iic bus of the optical module of SFP packing forms, which is connected to, is Unite on iic bus, in whole test process, realize SFP packing forms optical modules IIC hot plug, system IIC will not be caused Bus failure, stability is strong, can save the system reboot dynamic time, improve operating efficiency.
In order to solve the above technical problems, the technical scheme that the utility model uses is:A kind of multiple IIC are provided to lead to Believe equipment hot swap device, including microcontroller, PC, power module and test board, described microcontroller difference It is connected with PC and power module, described test board is connected between microcontroller and PC by iic bus respectively, Described test board at least two, SFP modules insertion port is each provided with described test board, in each SFP moulds One group of analog switch is sealed in the iic bus of block insertion port position.
In one preferred embodiment of the utility model, described microcontroller is that control chip selects peripheral hardware band IIC to lead to The chip of letter, serial communication and ADC samplings.
In one preferred embodiment of the utility model, described PC turns IIC ports and miniature control by serial ports Device is connected.
In one preferred embodiment of the utility model, described PC is common computer.
In one preferred embodiment of the utility model, the beginning state of described test board is electriferous state.
In one preferred embodiment of the utility model, the insertion of described SFP modules is plugged with SFP packing forms on port Optical module.
In one preferred embodiment of the utility model, pull-up resistor is also respectively provided with described iic bus, is passed through The level of iic bus is pulled upward to supply voltage by pull-up resistor behind optical module insertion SFP module insertions port in the short time, then Connect analog switch.
In one preferred embodiment of the utility model, described analog switch is controlled by the controlling switch of microcontroller Action.
The beneficial effects of the utility model are:Multiple IIC communication equipments hot plug devices of the present utility model, wait IIC Analog switch is connected again after bus voltage is stable, it is possible to achieve the iic bus of the optical module of SFP packing forms is connected to system On iic bus, in whole test process, SFP packing forms optical modules IIC hot plug is realized, system IIC will not be caused total Line failure, stability is strong, can save the system reboot dynamic time, improve operating efficiency.
Brief description of the drawings
, below will be to needed for embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model The accompanying drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some realities of the present utility model Example is applied, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to these accompanying drawings Other accompanying drawings are obtained, wherein:
Fig. 1 is the structured flowchart of a preferred embodiment of the multiple IIC communication equipments hot plug devices of the utility model.
Embodiment
The technical scheme in the embodiment of the utility model will be clearly and completely described below, it is clear that described Embodiment is only part of the embodiment of the present utility model, rather than whole embodiments.Based on the implementation in the utility model Example, all other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, is belonged to The scope of the utility model protection.
As shown in figure 1, the utility model embodiment includes:
A kind of multiple IIC communication equipments hot plug devices, including microcontroller, PC, power module and test board, Described microcontroller is connected with PC and power module respectively, and described test board is connected to by iic bus respectively Between microcontroller and PC, described test board at least two, each SFP modules are provided with described test board Port is inserted, one group of analog switch is sealed in the iic bus of each SFP modules insertion port position.
In above-mentioned, described microcontroller is that control chip selects peripheral hardware with IIC communications, serial communication and ADC samplings Chip.Wherein, described PC turns IIC ports by serial ports and is connected with microcontroller;Described PC is common Computer.
Further, the beginning state of described test board is electriferous state.Wherein, described SFP modules insertion port On be plugged with the optical modules of SFP packing forms.
Further, pull-up resistor is also respectively provided with described iic bus, is inserted by pull-up resistor in optical module The level of iic bus is pulled upward to supply voltage in the short time after entering SFP modules insertion port, then connects analog switch, is waited Analog switch is connected again after iic bus voltage stabilization, it is possible to achieve the iic bus of the optical module of SFP packing forms, which is connected to, is Unite on iic bus.
The application seals in 1 group of simulation in the iic bus of the port position of each SFP modules insertion in existing equipment and opened Close, this analog switch by microcontroller controlling switch control action, use by the operating current of microcontroller detection module simultaneously Insertion with judging optical module.The beginning state of test board is "on" position, and analog switch is off-state.Now insert SFP The optical module of packing forms, microcontroller can detect the operating current of module, and mould is waited until after determining module is inserted Analog switch is closed again after block internal work is stable, closure analog switch indicator lamp is bright.So connection iic bus will not be to former total Line impacts, and influences the normal operating conditions of former bus.Then the startup test process button on PC interfaces is clicked on, works as PC After judging the whole test process of optical module, test result is included on PC interface, finish test procedure.Work as operator After member extracts the optical module of SFP packing forms, microcontroller is pulled out by the operating current judge module of detection module, this When disconnect analog switch, wait the insertion of next module to test.
Control the principle realized:The optical module of SFP packing forms is first inserted, due to the optical module of each SFP packing forms Iic bus on have pull-up resistor, so the level of iic bus can be pulled upward into electricity in very short time after module insertion Source voltage, simulation is now connected again and opens and system iic bus will not be impacted, can be smoothly by the optical mode of SFP packing forms The iic bus of block is connected on system iic bus.
By the insertion of the optical module of SFP packing forms, analog switch is connected again after waiting iic bus voltage stabilization, can To realize that the iic bus of the optical module of SFP packing forms is connected on system iic bus.Be not in because SFP encapsulates optical mode The signal of original bus can be drawn deformation by the iic bus of block in hot plug, bus timing is become chaotic, caused often to have Iic bus data outage connects, and communicates to connect unsuccessfully generation, it is necessary to which relevant device is restarted into reset, influences the stability of system. The system reboot dynamic time can be saved, improves operating efficiency.
In the present embodiment, the concrete model that uses for:
1st, microcontroller selection C8051F336, peripheral hardware band IIC communication functions, band multi-channel A/D C functions, is not limited to this type Number microcontroller;
2nd, analog switch selects MAX4706, the switch of not limited to this model;
4th, the optical module of the unlimited insertion SFP packing forms of test board.
In summary, multiple IIC communication equipments hot plug devices of the present utility model, after waiting iic bus voltage stabilization Analog switch is connected again, it is possible to achieve the iic bus of the optical module of SFP packing forms is connected on system iic bus, whole In test process, SFP packing forms optical modules IIC hot plug to be realized, system iic bus failure will not be caused, stability is strong, The system reboot dynamic time can be saved, improves operating efficiency.
Embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, it is every The equivalent structure or equivalent flow conversion made using the utility model description, or directly or indirectly it is used in other phases The technical field of pass, similarly it is included in scope of patent protection of the present utility model.

Claims (8)

  1. A kind of 1. multiple IIC communication equipments hot plug devices, it is characterised in that including microcontroller, PC, power module with And test board, described microcontroller are connected with PC and power module respectively, described test board is total by IIC respectively Line is connected between microcontroller and PC, described test board at least two, is respectively provided with each described test board There are SFP modules to insert port, one group of analog switch is sealed in the iic bus of each SFP modules insertion port position.
  2. 2. multiple IIC communication equipments hot plug devices according to claim 1, it is characterised in that described miniature control Device is that control chip selects chip of the peripheral hardware with IIC communications, serial communication and ADC samplings.
  3. 3. multiple IIC communication equipments hot plug devices according to claim 2, it is characterised in that described PC passes through Serial ports turns IIC ports and is connected with microcontroller.
  4. 4. multiple IIC communication equipments hot plug devices according to claim 1, it is characterised in that described PC is general Logical computer.
  5. 5. multiple IIC communication equipments hot plug devices according to claim 1, it is characterised in that described test board Beginning state is electriferous state.
  6. 6. multiple IIC communication equipments hot plug devices according to claim 1, it is characterised in that described SFP modules are inserted The optical module of SFP packing forms is plugged with inbound port.
  7. 7. multiple IIC communication equipments hot plug devices according to claim 6, it is characterised in that on described iic bus Be also respectively provided with pull-up resistor, by pull-up resistor optical module insert SFP modules insert behind port it is in the short time that IIC is total The level of line is pulled upward to supply voltage, then connects analog switch.
  8. 8. multiple IIC communication equipments hot plug devices according to claim 1, it is characterised in that described analog switch By the controlling switch control action of microcontroller.
CN201720416795.3U 2017-04-20 2017-04-20 Multiple IIC communication equipments hot plug devices Active CN206686185U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720416795.3U CN206686185U (en) 2017-04-20 2017-04-20 Multiple IIC communication equipments hot plug devices

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Application Number Priority Date Filing Date Title
CN201720416795.3U CN206686185U (en) 2017-04-20 2017-04-20 Multiple IIC communication equipments hot plug devices

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CN206686185U true CN206686185U (en) 2017-11-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106936496A (en) * 2017-04-20 2017-07-07 江苏奥雷光电有限公司 Multiple IIC communication equipments hot plug devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106936496A (en) * 2017-04-20 2017-07-07 江苏奥雷光电有限公司 Multiple IIC communication equipments hot plug devices

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