CN206673981U - A kind of ultrasonic signal excitation, control, reception, conditioning and telecommunication circuit - Google Patents

A kind of ultrasonic signal excitation, control, reception, conditioning and telecommunication circuit Download PDF

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Publication number
CN206673981U
CN206673981U CN201720368560.1U CN201720368560U CN206673981U CN 206673981 U CN206673981 U CN 206673981U CN 201720368560 U CN201720368560 U CN 201720368560U CN 206673981 U CN206673981 U CN 206673981U
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electric capacity
resistance
chip
ground connection
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刘日明
寇治国
方文平
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Hangzhou Jian Wei Electrical Technology Co Ltd
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Hangzhou Jian Wei Electrical Technology Co Ltd
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Abstract

The utility model discloses a kind of excitation of ultrasonic signal, control, reception, conditioning and telecommunication circuit.Including signal transmission circuit, signal conditioning circuit, serial communication circuit and power circuit, signal transmission circuit is used for ultrasonic signal transmitting excitation and excitation control, signal conditioning circuit is used for ultrasound signal receipt and conditioning, serial communication circuit is connected to host computer and communicated respectively between signal transmission circuit and signal conditioning circuit, and power circuit is connected respectively to signal transmission circuit and signal conditioning circuit is powered.High-voltage square-wave ultrasonic excitation signal can be compatible with a variety of ultrasonic transducers caused by the utility model, and with transceiver and transmitting-receiving separation both of which, the system can communicate with host computer and realize the configuration of parameter, the ultrasound echo signal access third party signalling acquisition system that the system receives is used to analyze and handle, and the system run all right, reliability are high and have very high application value.

Description

A kind of ultrasonic signal excitation, control, reception, conditioning and telecommunication circuit
Technical field
A kind of ultrasonic signal circuit is the utility model is related to, encourage, control more particularly, to ultrasonic signal, receiving, Conditioning and telecommunication circuit.
Background technology
Non-destructive testing technology is technology essential in industrial development and effective tool at present, is reflected to a certain extent The level of one National Industrial development, its importance have gained public acceptance.Ultrasonic detection technology as non-destructive testing technology one Part, its application prospect are more and more extensive.Signal source of the ultrasonic wave as non-destructive testing technology, the excitation of ultrasonic wave, controls, connects Receive and the research of the technology such as conditioning and communication seems especially prominent and important.
Utility model content
In order to adapt to the needs of various Ultrasonic NDTs, the utility model proposes a kind of excitation of ultrasonic signal, control System, receive, conditioning and telecommunication circuit, improve ultrasonic exciting and ultrasound echo signal conditioning, realize triggering frequency-adjustable, Triggering mode is adjustable, pulse delay and adjustable pulse width, adjustable gain and ultrasonic probe are adaptive, ultrasonic signal excitation, control System, reception, conditioning and telecommunication circuit can be as independent module applications in ultrasonic examination and ultrasonic wave residual stress measurement.
To realize above-mentioned function, the technical scheme of use is the utility model：
The utility model includes signal transmission circuit, signal conditioning circuit, serial communication circuit and the electricity for power supply Source circuit, signal transmission circuit and signal conditioning circuit are connected through serial communication circuit with host computer, and power circuit connects respectively It is powered to serial communication circuit, signal transmission circuit and signal conditioning circuit；
Described signal transmission circuit is specifically to include signal transmitting main control module, square wave pulse control module, high pressure Pulse excitation module, transmitting impedance matching module and ultrasonic signal emission probe, square wave pulse control module extend including pulse Module and pulse-width controlled module, square wave pulse control module, high-voltage pulse excitation module, transmitting impedance matching module and ultrasound letter Number transmitting probe is sequentially connected；
Described signal conditioning circuit is specifically to include signal condition main control module, pre-amplification and attenuation module, reception Impedance matching module, high-pass filtering control module, program control two level amplification module and ultrasonic signal receiving transducer, pre-amplification and decay Module, receive impedance matching module, high-pass filtering control module, program control two level amplification module and ultrasonic signal receiving transducer successively Connection；
Described serial communication circuit is specifically that the transmitting being connected between signal transmitting main control module and host computer is led to Letter circuit, the conditioning telecommunication circuit being connected between signal condition main control module and host computer.
Described power circuit include+3.3V voltage follower circuits ,+7V voltage follower circuits, -7V voltage follower circuits ,+ 5VIN voltage follower circuits ,+12VIN voltage follower circuits and -12VIN voltage follower circuits；
Described+3.3V voltage follower circuits include：Power management chip U300 SHDN pin are distinguished after being connected with IN pin It is connected with inductance L301 and electric capacity C315 one end, the inductance L301 other end connects+5VIN input voltages and electric capacity C314 respectively, Electric capacity C314 other end ground connection, electric capacity C315 other end ground connection, power management chip U300 GND pin and TAP pin ground connection, The one end of power management chip U300 OUT pin respectively with resistance R306, electric capacity C313 and inductance L300 is connected, resistance R306's The other end is connected with ADJ pin and resistance R307 respectively, and resistance R307 and electric capacity C312 other end ground connection, inductance L300's is another Output 3.3V voltages after end is connected with the electric capacity C313 other ends and electric capacity C300 one end respectively, electric capacity C313 and electric capacity C300's is another One end is grounded；
Described+7V voltage follower circuits include：Power management chip U301 SHDN pin and IN pin connection after with+ 12VIN input voltages are connected with electric capacity C323, inductance L323 other end ground connection, GND pin and TAP pin ground connection, power management core Piece U301 OUT pin are connected with resistance R308, electric capacity C321 and inductance L306 one end respectively, the resistance R308 other end respectively with Power management chip U301 ADJ pin are connected with resistance R309 one end, resistance R309 and electric capacity C321 other ends ground connection, inductance The L306 other end is connected with electric capacity C322, electric capacity C307, electric capacity C305 and inductance L308 one end respectively, electric capacity C322, electric capacity C307 and electric capacity the C305 other end are grounded, and the inductance L308 other end is connected simultaneously with electric capacity C327 and electric capacity C306 one end respectively Output+7V voltages, electric capacity C327 and electric capacity C306 other end ground connection；
Described -7V voltage follower circuits include：Power management chip U302 GND pin ground connection, FB pin are through resistance R312 It is connected with VOUT pin, FB pin are grounded after resistance R311, and REF pin are defeated through resistance R310 ground connection, VIN pin and TAP pin and -12VIN Enter voltage to be connected, TAP foot meridian capacitors C325 ground connection, VOUT pin are grounded through resistance R301 and electric capacity C324, resistance R301 and electric capacity Both ends after both ends after C324 series connection are connected with inductance L307 and electric capacity C326 are in parallel, and electric capacity C326 and electric capacity C308 are in parallel, Draw the one end of port respectively with inductance L309 and electric capacity C309 between inductance L307 and electric capacity C326 to be connected, electric capacity C309 is another End ground connection, the inductance L309 other ends be connecteds with electric capacity C328 and electric capacity C310 one end and export -7V voltages respectively, electric capacity C328 with The electric capacity C310 other ends are grounded；
Described+5VIN voltage follower circuits include：Output+5VIN voltage ends respectively with electric capacity C301, electric capacity C316 and Inductance L302 one end is connected, electric capacity C301 and electric capacity C316 other end ground connection, the inductance L302 other end respectively with electric capacity C302, electric capacity C317 are connected with inductance L303 one end, and the other end ground connection of electric capacity C302 and electric capacity C317 pressures, inductance L303's is another One end is connected with electric capacity C311 one end and outside+5V voltages respectively, electric capacity C311 other end ground connection；
Described+12VIN voltage follower circuits include：Output+12VIN voltage ends respectively with electric capacity C319, electric capacity C304 Be connected with inductance L305 one end, electric capacity C319 and electric capacity C304 other end ground connection, the inductance L305 other end respectively with electric capacity C303, electric capacity C318 are connected with inductance L304 one end, and the other end ground connection of electric capacity C303 and electric capacity C318 pressures, inductance L304's is another One end is connected with electric capacity C320 one end and outside+12V voltages respectively, electric capacity C320 other end ground connection；
Described -12VIN voltage follower circuits include：Output -12VIN voltage ends respectively with electric capacity C322 and inductance L310 One end is connected, electric capacity C322 other end ground connection, the inductance L310 other end respectively with electric capacity C329, electric capacity C330 and inductance L311 one end is connected, electric capacity C329 and electric capacity C330 other end ground connection, the inductance L311 other end respectively with electric capacity C333 mono- End is connected with outside -12V voltages, electric capacity C333 other end ground connection.
Described transmitting telecommunication circuit includes being connected to the communication chip U100 of host computer, communication chip U100 VCC pin It is connected with DI2 pin by electric capacity C181, DI2, ED, ER, GND pin are grounded after being connected, DO1 pin and pin and signal transmitting master control molding Block is connected, and R11 pin are connected with resistance R100 one end, the resistance R100 other end respectively with resistance R101 and resistance R102 one end phase Even, resistance R101 other end ground connection, the resistance R102 other end are connected with pin；
Described conditioning telecommunication circuit includes being connected to the communication chip IC1T of host computer, communication chip IC1T VCC pin It is connected with DI2 pin by electric capacity C1T, DI2, ED, ER, GND pin are grounded after being connected, DO1 pin and pin and signal condition master control molding Block is connected, and R11 pin are connected with resistance R2T one end, and the resistance R2T other end is connected with resistance R3T and resistance R4T one end respectively, Resistance R3T other end ground connection, the resistance R4T other end are connected with pin.
Described signal transmitting main control module includes chip IC 2TA and chip XIT, chip IC 2TA impulse ejection IO Pin is connected with resistance R5T one end, resistance R5T other end output square-wave pulse trigger signal, 3V3IO1 pin, 3V3INT pin and 3V3IO2 pin connect+3.3V voltages, and IO/GCLK1 pin are connected with resistance R8T one end, the resistance R8T other end and chip XIT CLK Pin is connected, and chip XIT EN pin connect+3.3V voltages, and chip XIT GND pin ground connection, chip XIT VCC pin are respectively through electric capacity C4T, C5T, C6T one end are connected with+3.3V voltages, electric capacity C4T, C5T and C6T other end ground connection.
Described square wave pulse control module includes pulse delay chip IC 4T, pulse width control chip IC 5T, chip IC6T and reverse booster IC7T：Chip IC 4T TRIG pin connect square-wave pulse trigger signal, chip IC 4T RES and GND pin Ground connection, chip IC 4T P0~P11 pin are connected with signal transmitting main control module, chip IC 4T AE and VDD pin and+5V voltages It is connected, VDD pin are connected with electric capacity C39T and electric capacity C41T one end, electric capacity C39T and electric capacity C41T other end ground connection, chip IC4T OUTB pin are connected with chip IC 5T TRIG pin；
Chip IC 5T RES and GND pin ground connection, chip IC 5T P0~P11 pin are connected with signal transmitting main control module, AE and VDD pin are connected with+5V voltages, and chip IC 5T VDD pin are connected with electric capacity C42T and electric capacity C44T one end, electric capacity C42T and Electric capacity C44T other end ground connection, chip IC 5T OUT pin are connected with chip IC 6T 4 pin and 5 pin；
Chip IC 6T 14 pin connect+5V voltages and electric capacity C38T one end, electric capacity C38T other end ground connection, chip respectively IC6T 6 pin are connected with resistance R30T one end, and the resistance R30T other end is connected with reverse booster IC7T 1 pin, reversely rise Depressor IC7T 5 pin are connected with electric capacity C47T one end, electric capacity the C47T other end and the fixing ends of adjustable resistance R32T mono- and resistance R33T one end is connected, and adjustable resistance R32T sliding end is connected with resistance R31T one end, another fixing ends of adjustable resistance R32T and The resistance R33T other ends are connected with resistance R34 T one end together, resistance R31T other ends output square-wave pulse signal, resistance R34 T Other end ground connection, reverse booster IC7T 6 pin respectively with electric capacity C81T, C82T, C83T, C45T, C46T and inductance L16T One end is connected, electric capacity C81T, C82T, C83T, C45T and C46T other end ground connection, inductance L16T another termination+12V electricity Pressure.
Described high-voltage pulse excitation module includes power supply chip POEWR1T and switch K2T：Square-wave pulse signal (input Signal) base stage respectively with triode V10T and triode V18T is connected, triode V18T emitter stage respectively with inductance L11T, Electric capacity C88T, electric capacity C89T connect with electric capacity C90T one end, inductance L11T another termination -12V voltages, electric capacity C88T, C89T Be grounded with the C90T other end, triode V18T colelctor electrode respectively with resistance R54T one end and triode V10T emitter stage phase Even, grid of the resistance R54T other ends respectively with resistance R58T one end and metal-oxide-semiconductor V14T is connected, R58T other end ground connection, MOS Pipe V14T source electrode is connected with resistance R62T one end, resistance R62T other end ground connection, metal-oxide-semiconductor V14T drain electrode and electric capacity C118T with C119T one end is connected, and electric capacity C118T and the C119T other end are connected with resistance R90T and diode V22T one end, Resistance R90T and diode the V22T other end are grounded, and metal-oxide-semiconductor V14T's drains as output signal and with diode V9T just Pole is connected with metal-oxide-semiconductor V7T source electrode, and diode V9T negative pole is connected with triode V8T emitter stage, triode V8T base stage The grid with resistance R6T, resistance R52T, electric capacity C59T~C63T, resistance R51T one end and metal-oxide-semiconductor is connected respectively, triode V8T colelctor electrode and resistance R6T, R52T, electric capacity C59T~C63T other end ground connection, resistance the R51T other end and resistance R44T one end is connected, and the resistance R44T other end is connected with resistance R41T one end, the resistance R41T other end respectively with electric capacity C33T, C49T, C48T, C52T, C51T one end are connected with voltage-stabiliser tube V2T negative pole, power supply chip POEWR1T 3 pin；
The other end of power supply chip POEWR1T 4 pin respectively with electric capacity C33T, C49T, C48T, C52T and C51T is connected, Chip POEWR1T 1 pin is connected by electric capacity C18T with 2 pin, and POEWR1T 2 pin connect+24V voltages, voltage-stabiliser tube V2T positive pole The drain electrode with resistance R42T, R43T, R44T one end and metal-oxide-semiconductor V7T is connected respectively, resistance R39T, R42T, R43T and R44T's The other end is connected with electric capacity C55T one end, the electric capacity C55T other end and voltage-stabiliser tube V5T positive pole, resistance R38T and resistance R40T One end be connected, the negative pole with diode V6T, resistance R48T, electric capacity C64T's voltage-stabiliser tube V5T negative pole and C58T are connected respectively, Diode V6T positive pole is connected with electric capacity C64T and the C58T other end, the resistance R48T other end respectively with inductance L17T, electricity Hold C126T, C127T with C128T one end to be connected, electric capacity C126T, C127T and C128T other end ground connection, inductance L17T's is another One termination+12V voltages, resistance R38T and resistance R40T another terminating resistor R46T one end and voltage-stabiliser tube V3T negative pole, resistance R46T other end ground connection, voltage-stabiliser tube V3T positive pole meet diode V1T negative pole, diode V4T positive pole and resistance R47T mono- End, resistance R47T other end ground connection, diode V1T positive pole and diode V4T negative pole connect switch K2T 1 pin and make height Driving pulse output is pressed, 3 pin for switching K2T connect+12V voltages, and 5 pin for switching K2T connect metal-oxide-semiconductor Q2T drain electrode, switch the 7 of K2T Pin connecting terminal X9, metal-oxide-semiconductor Q2T grid are launched main control module with signal by resistance R50T and are connected, after Q2T source ground It is connected by electric capacity C57T with its own grid.
Described transmitting impedance matching module includes metal-oxide-semiconductor Q3T~Q6T and switch K3T~K6T：
Metal-oxide-semiconductor Q3T grid is launched main control module with signal by resistance R71T and is connected, and metal-oxide-semiconductor Q3T source electrode passes through Electric capacity C70T is connected with its own grid, and metal-oxide-semiconductor Q3T drain electrode is connected with switching K3T 5 pin, and 3 pin for switching K3T meet+12V Voltage；
1 pin for switching K3T is connected with switching K4T 1 pin, and metal-oxide-semiconductor Q4T grid is led by resistance R72T and signal transmitting Control module is connected, and metal-oxide-semiconductor Q4T source electrode is connected by electric capacity C71T with its own grid, metal-oxide-semiconductor Q4T drain electrode and switch K4T 5 pin are connected；
Switch K4T 3 pin connect+12V voltages, and 7 pin for switching K4T are connected with switching K5T 1 pin, metal-oxide-semiconductor Q5T grid Launch main control module with signal by resistance R73T to be connected, metal-oxide-semiconductor Q5T source electrode passes through electric capacity C72T and its own grid phase Even, metal-oxide-semiconductor Q5T drain electrode is connected with switching K5T 5 pin；
Switch K5T 3 pin connect+12V voltages, and 7 pin for switching K5T are connected with switching K6T 7 pin, metal-oxide-semiconductor Q6T grid Launch main control module with signal by resistance R74T to be connected, metal-oxide-semiconductor Q6T source electrode passes through electric capacity C73T and its own grid phase Even, metal-oxide-semiconductor Q6T drain electrode with switch K6T 5 pin be connected, 3 pin for switching K6T connect+12V voltages, switch K6T 1 pin output and The high-voltage pulse pumping signal of ultrasonic wave transmitting probe impedance matching.
Described signal condition main control module includes chip U101 and chip Y100, chip U101 IO/GCLK0 pin with Resistance R108 one end is connected, and the resistance R108 other end is connected with chip Y100 CLK pin, and chip Y100 EN pin meet+3.3V Voltage, chip Y100 GND pin ground connection, chip Y100 VCC pin one end with electric capacity C136, C137, C138 and+3.3V respectively Voltage is connected, electric capacity C136, C137 and C138 other end ground connection；
Described reception impedance matching module includes metal-oxide-semiconductor Q707, Q700~Q702 and switch K707, K700~K702： Metal-oxide-semiconductor Q707 grid is connected by resistance R707 with signal condition main control module, and metal-oxide-semiconductor Q707 source electrode passes through electric capacity C707 is connected with its own grid, and metal-oxide-semiconductor Q707 drain electrode is connected with switching K707 5 pin, and 3 pin for switching K707 connect+12V electricity Pressure, 1 pin for switching K707 are connected with ultrasonic wave reception signal end, switch signal after K707 7 pin output impedances matching, metal-oxide-semiconductor Q700 grid is connected by resistance R700 with signal condition main control module, metal-oxide-semiconductor Q700 source electrode by electric capacity C700 with Its own grid is connected, and metal-oxide-semiconductor Q700 drain electrode is connected with switching K700 5 pin, and 3 pin for switching K700 connect+12V voltages, open Signal after pass K700 7 output impedances matching, 1 pin for switching K700 are connected with switching K701 1 pin, metal-oxide-semiconductor Q701 grid It is connected by resistance R701 with signal condition main control module, metal-oxide-semiconductor Q701 source electrode passes through electric capacity C701 and its own grid It is connected, metal-oxide-semiconductor Q701 drain electrode is connected with K701 5 pin, and 3 pin for switching K701 connect+12V voltages, switch K701 7 pin with opening 7 pin for closing K702 are connected, and metal-oxide-semiconductor Q702 grid is launched main control module with signal by resistance R702 and is connected, metal-oxide-semiconductor Q702 Source electrode be connected by electric capacity C702 with its own grid, metal-oxide-semiconductor Q702 drain electrode with switch K702 5 pin be connected, switch K702 3 pin connect+12V voltages, switch K702 1 pin output be connected with 15 Ohmic resistances after be grounded.
Described pre-amplification and attenuation module include chip U402~U404：Signal (input signal) is connected to after impedance matching Resistance R423, R409 and R417 one end, connecting resistance R402 and voltage-stabiliser tube U405 after the resistance R423 other ends are connected with resistance R424 3 pin, connecting resistance R407 and voltage-stabiliser tube U406 3 pin, resistance R417 are another after the resistance R409 other ends are connected with resistance R410 Connecting resistance R415 and voltage-stabiliser tube U407 3 pin, voltage-stabiliser tube U405 3 pin pass through resistance R403 and core after end is connected with resistance R418 Piece U402+IN pin are connected, and voltage-stabiliser tube U406 3 pin are connected with chip U403-IN pin, voltage-stabiliser tube U407 3 pin and chip U404-IN pin are connected；
Parallel resistance R401 and electric capacity C400 between chip U402 FB pin and-IN pin, chip U402-IN pin pass through respectively It is grounded after resistance R400 and electric capacity C401, chip U402-5V pin are grounded after electric capacity C422 and C404 respectively, chip U402's GND pin are grounded, and chip U402+5V pin are grounded after electric capacity C421 and C402 respectively, and chip U402 VOUT pin pass through resistance R404 is connected with relay K400 10 pin, the chip U402 CC pin series capacitance again after resistance R405 and electric capacity C403 respectively It is grounded after C405, relay K400 1,4,6 and 9 pin ground connection, relay K400 2 pin and diode D400 1 pin and metal-oxide-semiconductor Q400 drain electrode is connected, and diode D400 3 pin are connected with relay K400 3 pin, metal-oxide-semiconductor Q400 source ground, metal-oxide-semiconductor Q400 grid is connected with resistance R406 and electric capacity C406, and the resistance R406 other end is connected with signal condition main control module, Electric capacity C406 other end ground connection, relay K400 5 pin output amplification or deamplification；
Chip U403 FB pin are connected after resistance R408 and electric capacity C407 with-IN pin respectively, chip U403+IN pin point It is not grounded after electric capacity C424, C410 and resistance R412, chip U403 GND pin ground connection, chip U403+5V pin are respectively through electricity It is grounded after holding C423 and C408, chip U403 VOUT pin are connected by resistance R411 with relay K401 10 pin, chip U403 CC pin are grounded after series capacitance C411 again after resistance R413 and electric capacity C409 respectively, and 1,4,6 and the 9 of relay K401 Pin is grounded, and relay K401 2 pin are connected with the drain electrode of diode D401 1 pin and metal-oxide-semiconductor Q401, diode D401 3 pin Be connected with relay K401 3 pin, metal-oxide-semiconductor Q401 source ground, metal-oxide-semiconductor Q401 grid respectively with resistance R414 and electric capacity C412 one end is connected, and the resistance R414 other end is connected with signal condition main control module, electric capacity C412 other end ground connection, after Electrical equipment K401 5 pin output amplification or deamplification；
Chip U404 FB pin are connected after resistance R416 and electric capacity C413 with-IN pin respectively, chip U404+IN pin point It is not grounded after electric capacity C416, C426 and resistance R420, chip U404 GND pin ground connection, chip U404+5V pin are respectively through electricity It is grounded after holding C425 and C414, chip U404 VOUT pin are connected by resistance R419 with relay K402 10 pin, chip U404 CC pin are grounded after series capacitance C417 again after resistance R421 and electric capacity C415 respectively, and 1,4,6 and the 9 of relay K402 Pin is grounded, and relay K402 2 pin are connected with the drain electrode of diode D402 1 pin and metal-oxide-semiconductor Q402, diode D402 3 pin Be connected with relay K402 3 pin, metal-oxide-semiconductor Q402 source ground, metal-oxide-semiconductor Q402 grid respectively with resistance R422 and electric capacity C418 one end is connected, and the resistance R422 other end is connected with signal condition main control module, electric capacity C418 other end ground connection, after Electrical equipment K402 5 pin output amplification or deamplification.
Described high-pass filtering control module includes relay K600~relay K602,
The output signal difference contact relay K600 of the pre-amplification and attenuation module 10 pin and electric capacity C601, C602, C604 and C605 one end, electric capacity C601 and C602 another relay termination K601 10 pin, electric capacity C604's and C605 Another relay termination K602 10 pin；
Relay K600 1,4,6 and 9 pin ground connection, relay K600 2 pin connect diode D600 1 pin and MOS respectively Pipe Q600 drain electrode, diode D600 3 pin contact relay K600 3 pin, metal-oxide-semiconductor Q600 source ground, metal-oxide-semiconductor Q600's Grid is connected with electric capacity C600 and resistance R600 one end, electric capacity C600 other end ground connection, resistance the R600 other end and signal Conditioning main control module is connected；Relay K601 1,4,6 and 9 pin ground connection, relay K601 2 pin meet diode D601 respectively 1 pin and metal-oxide-semiconductor Q601 drain electrode, diode D601 3 pin connect K601 3 pin, metal-oxide-semiconductor Q601 source ground, metal-oxide-semiconductor Q601 grid is connected with electric capacity C603 and resistance R601 one end, electric capacity C603 other end ground connection, the resistance R601 other end It is connected with signal condition main control module；Relay K602 1,4,6 and 9 pin ground connection, relay K602 2 pin connect two poles respectively The drain electrode of pipe D602 1 pin and metal-oxide-semiconductor Q602, diode D602 3 pin connect K602 3 pin, metal-oxide-semiconductor Q602 source ground, Metal-oxide-semiconductor Q602 grid is connected with electric capacity C606 and resistance R602 one end, and electric capacity C606 other end ground connection, resistance R602's is another One end is connected with signal condition main control module；
Relay K600, relay K601 and relay K602 5 pin are grounded through resistance R606, and are used as high-pass filtering control The output end of molding block is output in differential converter, and the single-ended signal after high-pass filtering is converted into two-way through differential converter Differential signal.
Described program control second amplifying circuit includes chip U210, chip U211 and chip U208：Controlled by high-pass filtering The negative differential signal Sig_Isolated_B- that module sends over passes through 3 pin phases after resistance R210 with clamp diode U214 Even, clamp diode U214 3 pin are connected with chip U210 16 pin, the positive differential sended over by high-pass filtering control module Signal Sig_Isolated_B+ after resistance R211 with clamp diode U214 1 pin and 2 pin by being connected, clamp diode U214 1 pin is connected with chip U210 1 pin；
Chip U210 2,8,10,15 and 17 pin ground connection, chip U210 3 pin and 4 pin are grounded by electric capacity C216, chip U210 6 pin are grounded by electric capacity C220, and chip U210 7 pin are grounded by electric capacity C218, chip U210 8 pin series resistances It is connected after R204 and electric capacity C251 with clamp diode U215 1 and 2 pin, chip U210 9 pin pass through resistance R200 and electric capacity Be connected after C248 with clamp diode U215 3 pin, chip U210 11 pin are grounded by electric capacity C204, chip U210 12, 13 and 14 pin are connected with signal condition main control module；
Clamp diode U215 3 pin are connected with electric capacity C211 one end and chip U211 16 pin, and electric capacity C211's is another End is connected with the 1 of clamp diode U215 and chip U211 1 pin, chip U211 2,8,10,15 and 17 pin ground connection, chip U211 3 pin and 4 pin are grounded by electric capacity C217, and chip U211 6 pin are grounded by electric capacity C221, and chip U211 7 pin lead to Electric capacity C219 ground connection is crossed, chip U211 8 pin are connected by electric capacity C250 with chip U208 6 pin, and chip U211 9 pin pass through Electric capacity C249 is connected with chip U208 3 pin, and chip U211 11 pin are grounded by electric capacity C205, chip U211 12,13 and 14 pin are connected with signal condition main control module；
It is grounded after chip U208 1 and 2 pin shunt capacitance C206, C207 and C208, chip U208 3 pin and resistance R202 It is connected with electric capacity C212 one end, the resistance R202 other end is grounded, the electric capacity C212 other end and U208 6 pin and resistance R203 One end is connected, and resistance R203 other end ground connection, chip U208 9 pin are connected with signal condition main control module, chip U208 10 pin ground connection, 11, the 12 of chip U208 connected with 13 pin after be grounded respectively after electric capacity C213, C214 and C215, chip U208 15 pin are connected with resistance R201 one end, and the resistance R201 other end is connected with electric capacity C209, C260 and C210 one end, electricity Hold C209 and C260 other end ground connection, the electric capacity C210 other end exports the signal after two level programming amplifying.
The beneficial effects of the utility model are
The utility model realizes ultrasonic signal excitation, control, the circuit design for receiving, nursing one's health and communicating, especially Excitation, the design of high-voltage pulse electronic circuit of ultrasonic signal, meet the transmitting of ultrasonic signal and substantially for reception Ask, can be as the ultrasonic signal driving source of Ultrasonic Nondestructive field independence.The system run all right, reliability is high, has Higher application value.
The utility model combines the delay and pulse-width controlled, signal amplification, the filtering of high-frequency signal and logical of square-wave signal The technologies such as letter, improve signal to noise ratio, gain-adjusted scope and the pulse-triggered frequency of ultrasonic wave transmission signal and reception signal, tool There are stronger technological innovation and advance, laid a good foundation for the following high performance ultrasonic non destructive detection equipment of exploitation.
Brief description of the drawings
Fig. 1 is the system architecture diagram of the utility model embodiment.
Fig. 4 is the signal emission module master controller of the utility model embodiment.
Fig. 2 is the Circuit management module of the utility model embodiment.
Fig. 3 is the serial communication circuit of the utility model embodiment.
Fig. 5 is the square wave pulse control module of the utility model embodiment.
Fig. 6 is the high-voltage pulse excitation control module of the utility model embodiment.
Fig. 7 is the transmitting impedance matching module of the utility model embodiment.
Fig. 8 is the Signal-regulated kinase master controller of the utility model embodiment.
Fig. 9 is the reception impedance matching module of the utility model embodiment.
Figure 10 is the pre-amplification and attenuation module of the utility model embodiment.
Figure 11 is the high-pass filtering control module of the utility model embodiment.
Figure 12 is the program control second amplifying circuit of the utility model embodiment.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment is described in further detail to the utility model.
As shown in figure 1, Tthe utility model system includes signal transmission circuit, signal conditioning circuit and serial communication circuit, Signal transmission circuit be used for ultrasonic signal transmitting excitation and excitation control, signal conditioning circuit be used for ultrasound signal receipt and Conditioning, serial communication circuit are connected to host computer respectively between signal transmission circuit and signal conditioning circuit.
Signal transmission circuit is specifically to include signal transmitting main control module, square wave pulse control module, high-tension pulse impulse Encourage module, transmitting impedance matching module and ultrasonic signal emission probe, square wave pulse control module include pulse extension of module and Pulse-width controlled module, square wave pulse control module, high-voltage pulse excitation module, transmitting impedance matching module and ultrasonic signal emission Probe is sequentially connected.
Signal conditioning circuit is specifically to include signal condition main control module, pre-amplification and attenuation module, receive impedance With module, high-pass filtering control module, program control two level amplification module and ultrasonic signal receiving transducer, pre-amplification and attenuation module, Impedance matching module, high-pass filtering control module, program control two level amplification module and ultrasonic signal receiving transducer is received to be sequentially connected.
Serial communication circuit is specifically to include launching telecommunication circuit and nurse one's health telecommunication circuit.
Tthe utility model system is also devised with being used to launch main control module, square wave pulse control module, high pressure for signal Pulse excitation module, impedance matching module, signal condition main control module, reception impedance matching module, pre-amplification and decay mode The power supply electricity of the above-mentioned modules power supply such as block, high-pass filtering control module, program control two level amplification module and serial communication circuit Road.
As shown in figure 3, power circuit includes+3.3V voltage follower circuits ,+7V voltage follower circuits, -7V voltage outputs electricity Road ,+5VIN voltage follower circuits ,+12VIN voltage follower circuits and -12VIN voltage follower circuits.
As shown in figure 3 ,+3.3V voltage follower circuits include：After power management chip U300 SHDN pin connect with IN pin One end with inductance L301 and electric capacity C315 is connected respectively, and the inductance L301 other end connects+5VIN input voltages and electric capacity respectively C314, electric capacity C314 other end ground connection, electric capacity C315 other end ground connection, power management chip U300 GND pin and TAP pin Ground connection, the one end of power management chip U300 OUT pin respectively with resistance R306, electric capacity C313 and inductance L300 are connected, resistance The R306 other end is connected with ADJ pin and resistance R307 respectively, resistance R307 and electric capacity C312 other end ground connection, inductance L300 The other end be connected respectively with the electric capacity C313 other ends and electric capacity C300 one end after export 3.3V voltages, electric capacity C313 and electric capacity C300 other end ground connection.
As shown in figure 3 ,+7V voltage follower circuits include：Power management chip U301 SHDN pin and IN pin connection after with+ 12VIN input voltages are connected with electric capacity C323, inductance L323 other end ground connection, GND pin and TAP pin ground connection, power management core Piece U301 OUT pin are connected with resistance R308, electric capacity C321 and inductance L306 one end respectively, the resistance R308 other end respectively with Power management chip U301 ADJ pin are connected with resistance R309 one end, resistance R309 and electric capacity C321 other ends ground connection, inductance The L306 other end is connected with electric capacity C322, electric capacity C307, electric capacity C305 and inductance L308 one end respectively, electric capacity C322, electric capacity C307 and electric capacity the C305 other end are grounded, and the inductance L308 other end is connected simultaneously with electric capacity C327 and electric capacity C306 one end respectively Output+7V voltages, electric capacity C327 and electric capacity C306 other end ground connection.
As shown in figure 3, -7V voltage follower circuits include：Power management chip U302 GND pin ground connection, FB pin are through resistance R312 is connected with VOUT pin, and FB pin are grounded after resistance R311, and REF pin are grounded through resistance R310, VIN pin and TAP pin with- 12VIN input voltages are connected, and TAP foot meridian capacitors C325 ground connection, VOUT pin are grounded through resistance R301 and electric capacity C324, resistance R301 Both ends after both ends after being connected with electric capacity C324 are connected with inductance L307 and electric capacity C326 are in parallel, electric capacity C326 and electric capacity C308 Parallel connection, the one end of port respectively with inductance L309 and electric capacity C309 is drawn between inductance L307 and electric capacity C326 and is connected, electric capacity The C309 other ends are grounded, and the inductance L309 other ends are connected with electric capacity C328 and electric capacity C310 one end and export -7V voltages respectively, electricity Hold C328 and electric capacity C310 other ends ground connection.
As shown in figure 3 ,+5VIN voltage follower circuits include：Output+5VIN voltage ends respectively with electric capacity C301, electric capacity C316 is connected with inductance L302 one end, electric capacity C301 and electric capacity C316 other end ground connection, the inductance L302 other end respectively with Electric capacity C302, electric capacity C317 are connected with inductance L303 one end, the other end ground connection of electric capacity C302 and electric capacity C317 pressures, inductance L303 The other end be connected respectively with electric capacity C311 one end and outside+5V voltages, electric capacity C311 other end ground connection.
As shown in figure 3 ,+12VIN voltage follower circuits include：Output+12VIN voltage ends respectively with electric capacity C319, electric capacity C304 is connected with inductance L305 one end, electric capacity C319 and electric capacity C304 other end ground connection, the inductance L305 other end respectively with Electric capacity C303, electric capacity C318 are connected with inductance L304 one end, the other end ground connection of electric capacity C303 and electric capacity C318 pressures, inductance L304 The other end be connected respectively with electric capacity C320 one end and outside+12V voltages, electric capacity C320 other end ground connection.
As shown in figure 3, -12VIN voltage follower circuits include：Output -12VIN voltage ends respectively with electric capacity C322 and inductance L310 one end is connected, electric capacity C322 other end ground connection, the inductance L310 other end respectively with electric capacity C329, electric capacity C330 and electricity Sense L311 one end is connected, electric capacity C329 and electric capacity C330 other end ground connection, the inductance L311 other end respectively with electric capacity C333 One end is connected with outside -12V voltages, electric capacity C333 other end ground connection.
As shown in figure 4, transmitting telecommunication circuit includes being connected to the communication chip U100 of host computer, communication chip U100's VCC pin are connected with DI2 pin by electric capacity C181, and DI2, ED, ER, GND pin are grounded after being connected, and DO1 pin and pin are led with signal transmitting Control module is connected, and R11 pin are connected with resistance R100 one end, the resistance R100 other end respectively with resistance R101 and resistance R102 One end is connected, and resistance R101 other end ground connection, the resistance R102 other end is connected with pin.
As shown in figure 4, conditioning telecommunication circuit includes being connected to the communication chip IC1T of host computer, communication chip IC1T's VCC pin are connected with DI2 pin by electric capacity C1T, and DI2, ED, ER, GND pin are grounded after being connected, DO1 pin and pin and signal condition master control Molding block is connected, and R11 pin are connected with resistance R2T one end, the resistance R2T other end respectively with resistance R3T and resistance R4T one end phase Even, resistance R3T other end ground connection, the resistance R4T other end are connected with pin.
As shown in Fig. 2 signal transmitting main control module includes chip IC 2TA and chip XIT, chip IC 2TA pulse hair Penetrate IO pin with resistance R5T one end to be connected, resistance R5T other end output square-wave pulse trigger signal, 3V3IO1 pin, 3V3INT pin + 3.3V voltages are connect with 3V3IO2 pin, IO/GCLK1 pin are connected with resistance R8T one end, and the resistance R8T other end is with chip XIT's CLK pin are connected, and chip XIT EN pin connect+3.3V voltages, and chip XIT GND pin ground connection, chip XIT VCC pin are respectively through electricity Hold C4T, C5T, C6T one end with+3.3V voltages to be connected, electric capacity C4T, C5T and C6T other end ground connection.
As shown in figure 5, square wave pulse control module include pulse delay chip IC 4T, pulse width control chip IC 5T, Chip IC 6T and reverse booster IC7T.
Chip IC 4T TRIG pin meet square-wave pulse trigger signal, chip IC 4T RES and GND pin ground connection, chip IC 4T P0~P11 pin and signal transmitting main control module be connected, chip IC 4T AE and VDD pin are connected with+5V voltages, VDD pin and Electric capacity C39T is connected with electric capacity C41T one end, electric capacity C39T and electric capacity C41T other end ground connection, chip IC 4T OUTB pin with Chip IC 5T TRIG pin are connected.
Chip IC 5T RES and GND pin ground connection, chip IC 5T P0~P11 pin are connected with signal transmitting main control module, AE and VDD pin are connected with+5V voltages, and chip IC 5T VDD pin are connected with electric capacity C42T and electric capacity C44T one end, electric capacity C42T and Electric capacity C44T other end ground connection, chip IC 5T OUT pin are connected with chip IC 6T 4 pin and 5 pin.
Chip IC 6T 14 pin connect+5V voltages and electric capacity C38T one end, electric capacity C38T other end ground connection, chip respectively IC6T 6 pin are connected with resistance R30T one end, and the resistance R30T other end is connected with reverse booster IC7T 1 pin, reversely rise Depressor IC7T 5 pin are connected with electric capacity C47T one end, electric capacity the C47T other end and the fixing ends of adjustable resistance R32T mono- and resistance R33T one end is connected, and adjustable resistance R32T sliding end is connected with resistance R31T one end, another fixing ends of adjustable resistance R32T and The resistance R33T other ends are connected with resistance R34 T one end together, resistance R31T other ends output square-wave pulse signal, resistance R34 T Other end ground connection, reverse booster IC7T 6 pin respectively with electric capacity C81T, C82T, C83T, C45T, C46T and inductance L16T One end is connected, electric capacity C81T, C82T, C83T, C45T and C46T other end ground connection, inductance L16T another termination+12V electricity Pressure.
This circuit module IC5T and IC6T can realize driving pulse delay and excitation pulse to be accurate to nanosecond adjustable, Driving pulse delay is adjustable to make multichannel ultrasonic system synchronization very accurate, and adjustable pulse width can be matched more accurately not Same probe, flexibility are very high.
As shown in fig. 6, high-voltage pulse excitation module includes power supply chip POEWR1T and switch K2T.
Base stage of the square-wave pulse signal (input signal) respectively with triode V10T and triode V18T is connected, triode V18T emitter stage is connected with inductance L11T, electric capacity C88T, electric capacity C89T and electric capacity C90T one end respectively, and inductance L11T's is another Termination -12V voltages, electric capacity C88T, C89T and C90T other end ground connection, triode V18T colelctor electrode respectively with resistance R54T One end is connected with triode V10T emitter stage, the resistance R54T other ends respectively with resistance R58T one end and metal-oxide-semiconductor V14T grid Extremely it is connected, R58T other end ground connection, metal-oxide-semiconductor V14T source electrode is connected with resistance R62T one end, resistance R62T another termination Ground, metal-oxide-semiconductor V14T drain electrode are connected with electric capacity C118T and C119T one end, electric capacity C118T and the C119T other end and resistance R90T is connected with diode V22T one end, resistance R90T and diode V22T other end ground connection, metal-oxide-semiconductor V14T drain electrode conduct Output signal is simultaneously connected with the source electrode of diode V9T positive pole and metal-oxide-semiconductor V7T, and diode V9T negative pole is with triode V8T's Emitter stage is connected, triode V8T base stage respectively with resistance R6T, resistance R52T, electric capacity C59T~C63T, resistance R51T one End is connected with the grid of metal-oxide-semiconductor, triode V8T colelctor electrode and resistance R6T, R52T, the electric capacity C59T~C63T other end Ground connection, the resistance R51T other end are connected with resistance R44T one end, and the resistance R44T other end is connected with resistance R41T one end, electricity Hinder R41T the other end respectively with electric capacity C33T, C49T, C48T, C52T, C51T one end and voltage-stabiliser tube V2T negative pole, power supply Chip POEWR1T 3 pin are connected.
The other end of power supply chip POEWR1T 4 pin respectively with electric capacity C33T, C49T, C48T, C52T and C51T is connected, Chip POEWR1T 1 pin is connected by electric capacity C18T with 2 pin, and POEWR1T 2 pin connect+24V voltages, voltage-stabiliser tube V2T positive pole The drain electrode with resistance R42T, R43T, R44T one end and metal-oxide-semiconductor V7T is connected respectively, resistance R39T, R42T, R43T and R44T's The other end is connected with electric capacity C55T one end, the electric capacity C55T other end and voltage-stabiliser tube V5T positive pole, resistance R38T and resistance R40T One end be connected, the negative pole with diode V6T, resistance R48T, electric capacity C64T's voltage-stabiliser tube V5T negative pole and C58T are connected respectively, Diode V6T positive pole is connected with electric capacity C64T and the C58T other end, the resistance R48T other end respectively with inductance L17T, electricity Hold C126T, C127T with C128T one end to be connected, electric capacity C126T, C127T and C128T other end ground connection, inductance L17T's is another One termination+12V voltages, resistance R38T and resistance R40T another terminating resistor R46T one end and voltage-stabiliser tube V3T negative pole, resistance R46T other end ground connection, voltage-stabiliser tube V3T positive pole meet diode V1T negative pole, diode V4T positive pole and resistance R47T mono- End, resistance R47T other end ground connection, diode V1T positive pole and diode V4T negative pole connect switch K2T 1 pin and make height Driving pulse output is pressed, 3 pin for switching K2T connect+12V voltages, and 5 pin for switching K2T connect metal-oxide-semiconductor Q2T drain electrode, switch the 7 of K2T Pin connecting terminal X9, metal-oxide-semiconductor Q2T grid are launched main control module with signal by resistance R50T and are connected, after Q2T source ground It is connected by electric capacity C57T with its own grid.
This circuit can trigger output pulse width accurately adjustable high-voltage square wave signal, and this circuit is imitated using 4 ultrahigh speed fields Should pipe coordinate and realize that the trailing edge of pulse is very fast, it is while also very high by electric current, realize the balanced Matching of speed and electric current, More preferable incentive probe sends ultrasonic wave.
As shown in fig. 7, transmitting impedance matching module includes metal-oxide-semiconductor Q3T~Q6T and switch K3T~K6T.Metal-oxide-semiconductor Q3T's Grid is launched main control module with signal by resistance R71T and is connected, and metal-oxide-semiconductor Q3T source electrode passes through electric capacity C70T and its own grid Extremely it is connected, metal-oxide-semiconductor Q3T drain electrode is connected with switching K3T 5 pin, and 3 pin for switching K3T connect+12V voltages；Switch K3T 1 pin with Switch K4T 1 pin is connected, and metal-oxide-semiconductor Q4T grid is launched main control module with signal by resistance R72T and is connected, metal-oxide-semiconductor Q4T Source electrode be connected by electric capacity C71T with its own grid, metal-oxide-semiconductor Q4T drain electrode with switch K4T 5 pin be connected；Switch K4T's 3 pin connect+12V voltages, and 7 pin for switching K4T are connected with switching K5T 1 pin, and metal-oxide-semiconductor Q5T grid passes through resistance R73T and signal Transmitting main control module is connected, and metal-oxide-semiconductor Q5T source electrode is connected by electric capacity C72T with its own grid, metal-oxide-semiconductor Q5T drain electrode It is connected with 5 pin for switching K5T；Switch K5T 3 pin connect+12V voltages, and 7 pin for switching K5T are connected with switching K6T 7 pin, MOS Pipe Q6T grid is launched main control module by resistance R74T and signal and is connected, metal-oxide-semiconductor Q6T source electrode by electric capacity C73T with Its own grid is connected, and metal-oxide-semiconductor Q6T drain electrode is connected with switching K6T 5 pin, and 3 pin for switching K6T connect+12V voltages, switch The high-voltage pulse pumping signal of the K6T output of 1 pin and ultrasonic wave transmitting probe impedance matching.
The utility model is designed in conjunction by launching switch Q3T~Q6T and switch K3T~K6T in impedance matching module Work realize impedance matching value continuously adjustabe, from 15 ohm to 500 ohm continuously adjustabe, ensure that optimal of signal Match somebody with somebody, reduce signal noise, improve signal ratio.
As shown in figure 8, signal condition main control module includes chip U101 and chip Y100, chip U101 IO/GCLK0 Pin is connected with resistance R108 one end, and the resistance R108 other end is connected with chip Y100 CLK pin, and chip Y100 EN pin connect+ 3.3V voltages, chip Y100 GND pin ground connection, chip Y100 VCC pin respectively with electric capacity C136, C137, C138 one end and+ 3.3V voltages are connected, electric capacity C136, C137 and C138 other end ground connection.
As shown in figure 9, receive impedance matching module include metal-oxide-semiconductor Q707, Q700~Q702 and switch K707, K700~ K702：Metal-oxide-semiconductor Q707 grid is connected by resistance R707 with signal condition main control module, and metal-oxide-semiconductor Q707 source electrode passes through Electric capacity C707 is connected with its own grid, and metal-oxide-semiconductor Q707 drain electrode is connected with switch K707 5 pin, and 3 pin for switching K707 connect+ 12V voltages, 1 pin for switching K707 are connected with ultrasonic wave reception signal end, switch signal after K707 7 pin output impedances matching, Metal-oxide-semiconductor Q700 grid is connected by resistance R700 with signal condition main control module, and metal-oxide-semiconductor Q700 source electrode passes through electric capacity C700 is connected with its own grid, and metal-oxide-semiconductor Q700 drain electrode is connected with switching K700 5 pin, and 3 pin for switching K700 connect+12V electricity Pressure, signal after K700 7 output impedances matching is switched, 1 pin for switching K700 is connected with switching K701 1 pin, metal-oxide-semiconductor Q701's Grid is connected by resistance R701 with signal condition main control module, and metal-oxide-semiconductor Q701 source electrode passes through electric capacity C701 and its own Grid is connected, and metal-oxide-semiconductor Q701 drain electrode is connected with K701 5 pin, and 3 pin for switching K701 connect+12V voltages, switch K701 7 pin It is connected with 7 pin for switching K702, metal-oxide-semiconductor Q702 grid is launched main control module with signal by resistance R702 and is connected, metal-oxide-semiconductor Q702 source electrode is connected by electric capacity C702 with its own grid, and metal-oxide-semiconductor Q702 drain electrode is connected with switching K702 5 pin, opens Close K702 3 pin connect+12V voltages, switch K702 1 pin output be connected with 15 Ohmic resistances after be grounded.
As shown in Figure 10, pre-amplification and attenuation module include chip U402~U404.Signal (input letter after impedance matching Number) resistance R423, R409 and R417 one end is connected to, connecting resistance R402 and voltage stabilizing after the resistance R423 other ends are connected with resistance R424 Pipe U405 3 pin, connecting resistance R407 and voltage-stabiliser tube U406 3 pin, resistance after the resistance R409 other ends are connected with resistance R410 Connecting resistance R415 and voltage-stabiliser tube U407 3 pin after the R417 other ends are connected with resistance R418, voltage-stabiliser tube U405 3 pin pass through resistance R403 is connected with chip U402+IN pin, and voltage-stabiliser tube U406 3 pin are connected with chip U403-IN pin, and the 3 of voltage-stabiliser tube U407 Pin is connected with chip U404-IN pin.
Parallel resistance R401 and electric capacity C400 between chip U402 FB pin and-IN pin, chip U402-IN pin pass through respectively It is grounded after resistance R400 and electric capacity C401, chip U402-5V pin are grounded after electric capacity C422 and C404 respectively, chip U402's GND pin are grounded, and chip U402+5V pin are grounded after electric capacity C421 and C402 respectively, and chip U402 VOUT pin pass through resistance R404 is connected with relay K400 10 pin, the chip U402 CC pin series capacitance again after resistance R405 and electric capacity C403 respectively It is grounded after C405, relay K400 1,4,6 and 9 pin ground connection, relay K400 2 pin and diode D400 1 pin and metal-oxide-semiconductor Q400 drain electrode is connected, and diode D400 3 pin are connected with relay K400 3 pin, metal-oxide-semiconductor Q400 source ground, metal-oxide-semiconductor Q400 grid is connected with resistance R406 and electric capacity C406, and the resistance R406 other end is connected with signal condition main control module, Electric capacity C406 other end ground connection, relay K400 5 pin output amplification or deamplification；
Chip U403 FB pin are connected after resistance R408 and electric capacity C407 with-IN pin respectively, chip U403+IN pin point It is not grounded after electric capacity C424, C410 and resistance R412, chip U403 GND pin ground connection, chip U403+5V pin are respectively through electricity It is grounded after holding C423 and C408, chip U403 VOUT pin are connected by resistance R411 with relay K401 10 pin, chip U403 CC pin are grounded after series capacitance C411 again after resistance R413 and electric capacity C409 respectively, and 1,4,6 and the 9 of relay K401 Pin is grounded, and relay K401 2 pin are connected with the drain electrode of diode D401 1 pin and metal-oxide-semiconductor Q401, diode D401 3 pin Be connected with relay K401 3 pin, metal-oxide-semiconductor Q401 source ground, metal-oxide-semiconductor Q401 grid respectively with resistance R414 and electric capacity C412 one end is connected, and the resistance R414 other end is connected with signal condition main control module, electric capacity C412 other end ground connection, after Electrical equipment K401 5 pin output amplification or deamplification；
Chip U404 FB pin are connected after resistance R416 and electric capacity C413 with-IN pin respectively, chip U404+IN pin point It is not grounded after electric capacity C416, C426 and resistance R420, chip U404 GND pin ground connection, chip U404+5V pin are respectively through electricity It is grounded after holding C425 and C414, chip U404 VOUT pin are connected by resistance R419 with relay K402 10 pin, chip U404 CC pin are grounded after series capacitance C417 again after resistance R421 and electric capacity C415 respectively, and 1,4,6 and the 9 of relay K402 Pin is grounded, and relay K402 2 pin are connected with the drain electrode of diode D402 1 pin and metal-oxide-semiconductor Q402, diode D402 3 pin Be connected with relay K402 3 pin, metal-oxide-semiconductor Q402 source ground, metal-oxide-semiconductor Q402 grid respectively with resistance R422 and electric capacity C418 one end is connected, and the resistance R422 other end is connected with signal condition main control module, electric capacity C418 other end ground connection, after Electrical equipment K402 5 pin output amplification or deamplification.
The utility model is by using three big device chips of prevention, three big device chips of prevention in pre-amplification and attenuation module Amplify different multiples respectively, system is possessed HDR measurement capability, can be to ultrasonic beginning ripple using droop amplifier Also starting point can be accurately measured, high-gain amplifier has higher sensitivity to small ultrasonic signal.
As shown in figure 11, high-pass filtering control module is specifically：The output signal of pre-amplification and attenuation module is succeeded respectively Electrical equipment K600 10 pin and electric capacity C601, C602, C604 and C605 one end, electric capacity C601 and C602 another relay termination K601 10 pin, electric capacity C604 and C605 another relay termination K602 10 pin；Relay K600 1,4,6 and 9 pin connect Ground, relay K600 2 pin connect the drain electrode of diode D600 1 pin and metal-oxide-semiconductor Q600 respectively, and diode D600 3 pin are succeeded Electrical equipment K600 3 pin, metal-oxide-semiconductor Q600 source ground, metal-oxide-semiconductor Q600 grid and electric capacity C600 and resistance R600 one end phase Even, electric capacity C600 other end ground connection, the resistance R600 other end are connected with signal condition main control module.
Relay K601 1,4,6 and 9 pin ground connection, relay K601 2 pin connect diode D601 1 pin and MOS respectively Pipe Q601 drain electrode, diode D601 3 pin connect K601 3 pin, metal-oxide-semiconductor Q601 source ground, metal-oxide-semiconductor Q601 grid with Electric capacity C603 is connected with resistance R601 one end, electric capacity C603 other end ground connection, resistance the R601 other end and signal condition master Control module is connected.
Relay K602 1,4,6 and 9 pin ground connection, relay K602 2 pin connect diode D602 1 pin and MOS respectively Pipe Q602 drain electrode, diode D602 3 pin connect K602 3 pin, metal-oxide-semiconductor Q602 source ground, metal-oxide-semiconductor Q602 grid with Electric capacity C606 is connected with resistance R602 one end, electric capacity C606 other end ground connection, resistance the R602 other end and signal condition master Control module is connected.
Relay K600, relay K601 and relay K602 5 pin are grounded through resistance R606, and are used as high-pass filtering control The output end of molding block is output in differential converter, and the single-ended signal after high-pass filtering is converted into two-way through differential converter Differential signal.
As shown in figure 12, program control second amplifying circuit includes chip U210, chip U211 and chip U208.By high-pass filtering The negative differential signal Sig_Isolated_B- that control module sends over by after resistance R210 with clamp diode U214 3 Pin is connected, and clamp diode U214 3 pin are connected with chip U210 16 pin, are sended over just by high-pass filtering control module Differential signal Sig_Isolated_B+ after resistance R211 with clamp diode U214 1 pin and 2 pin by being connected, the pole of clamper two Pipe U214 1 pin is connected with chip U210 1 pin.
Chip U210 2,8,10,15 and 17 pin ground connection, chip U210 3 pin and 4 pin are grounded by electric capacity C216, chip U210 6 pin are grounded by electric capacity C220, and chip U210 7 pin are grounded by electric capacity C218, chip U210 8 pin series resistances It is connected after R204 and electric capacity C251 with clamp diode U215 1 and 2 pin, chip U210 9 pin pass through resistance R200 and electric capacity Be connected after C248 with clamp diode U215 3 pin, chip U210 11 pin are grounded by electric capacity C204, chip U210 12, 13 and 14 pin are connected with signal condition main control module.
Clamp diode U215 3 pin are connected with electric capacity C211 one end and chip U211 16 pin, and electric capacity C211's is another End is connected with the 1 of clamp diode U215 and chip U211 1 pin, chip U211 2,8,10,15 and 17 pin ground connection, chip U211 3 pin and 4 pin are grounded by electric capacity C217, and chip U211 6 pin are grounded by electric capacity C221, and chip U211 7 pin lead to Electric capacity C219 ground connection is crossed, chip U211 8 pin are connected by electric capacity C250 with chip U208 6 pin, and chip U211 9 pin pass through Electric capacity C249 is connected with chip U208 3 pin, and chip U211 11 pin are grounded by electric capacity C205, chip U211 12,13 and 14 pin are connected with signal condition main control module.
It is grounded after chip U208 1 and 2 pin shunt capacitance C206, C207 and C208, chip U208 3 pin and resistance R202 It is connected with electric capacity C212 one end, the resistance R202 other end is grounded, the electric capacity C212 other end and U208 6 pin and resistance R203 One end is connected, and resistance R203 other end ground connection, chip U208 9 pin are connected with signal condition main control module, chip U208 10 pin ground connection, 11, the 12 of chip U208 connected with 13 pin after be grounded respectively after electric capacity C213, C214 and C215, chip U208 15 pin are connected with resistance R201 one end, and the resistance R201 other end is connected with electric capacity C209, C260 and C210 one end, electricity Hold C209 and C260 other end ground connection, the electric capacity C210 other end exports the signal after two level programming amplifying.
This circuit module is combined the amplification realized and different gains are carried out to signal by chip U210, U211 and U208, The ability for making system possess the controllable amplification of time section, the high section of clawback use low gain, reduce blind area, the low area of echo Section uses plus and blowup, increases defect detection rate.
Above-mentioned embodiment is used for illustrating the utility model, rather than the utility model is limited, Spirit of the present utility model and any modifications and changes in scope of the claims, made to the utility model, all fall Enter the scope of protection of the utility model.

Claims (10)

1. a kind of ultrasonic signal excitation, control, reception, conditioning and telecommunication circuit, it is characterised in that：
Including signal transmission circuit, signal conditioning circuit, serial communication circuit and power circuit for power supply, signal transmitting Circuit and signal conditioning circuit are connected through serial communication circuit with host computer, power circuit be connected respectively to serial communication circuit, Signal transmission circuit and signal conditioning circuit are powered；
Described signal transmission circuit is specifically to include signal transmitting main control module, square wave pulse control module, high-voltage pulse Module, transmitting impedance matching module and ultrasonic signal emission probe, square wave pulse control module is encouraged to include pulse extension of module With pulse-width controlled module, square wave pulse control module, high-voltage pulse excitation module, transmitting impedance matching module and ultrasonic signal hair Probe is penetrated to be sequentially connected；
Described signal conditioning circuit is specifically to include signal condition main control module, pre-amplification and attenuation module, receive impedance Matching module, high-pass filtering control module, program control two level amplification module and ultrasonic signal receiving transducer, pre-amplification and decay mode Block, reception impedance matching module, high-pass filtering control module, program control two level amplification module and ultrasonic signal receiving transducer connect successively Connect；
Described serial communication circuit is specifically the transmitting communication electricity being connected between signal transmitting main control module and host computer Road, the conditioning telecommunication circuit being connected between signal condition main control module and host computer.
2. a kind of ultrasonic signal excitation according to claim 1, control, reception, conditioning and telecommunication circuit, its feature exist In：Described power circuit includes+3.3V voltage follower circuits ,+7V voltage follower circuits, -7V voltage follower circuits ,+5VIN Voltage follower circuit ,+12VIN voltage follower circuits and -12VIN voltage follower circuits；
Described+3.3V voltage follower circuits include：Power management chip U300 SHDN pin and IN pin connection after respectively with electricity Sense L301 is connected with electric capacity C315 one end, and the inductance L301 other end connects+5VIN input voltages and electric capacity C314, electric capacity respectively C314 other end ground connection, electric capacity C315 other end ground connection, power management chip U300 GND pin and TAP pin ground connection, power supply The one end of managing chip U300 OUT pin respectively with resistance R306, electric capacity C313 and inductance L300 is connected, and resistance R306's is another End is connected with ADJ pin and resistance R307 respectively, resistance R307 and electric capacity C312 other end ground connection, the inductance L300 other end point The other end of 3.3V voltages, electric capacity C313 and electric capacity C300 is exported after not being connected with the electric capacity C313 other ends and electric capacity C300 one end Ground connection；
Described+7V voltage follower circuits include：It is defeated with+12VIN after power management chip U301 SHDN pin and IN pin connection Enter voltage with electric capacity C323 to be connected, inductance L323 other end ground connection, GND pin and TAP pin ground connection, power management chip U301's OUT pin are connected with resistance R308, electric capacity C321 and inductance L306 one end respectively, the resistance R308 other end respectively with power management Chip U301 ADJ pin are connected with resistance R309 one end, and resistance R309 and electric capacity C321 other ends ground connection, inductance L306's is another One end is connected with electric capacity C322, electric capacity C307, electric capacity C305 and inductance L308 one end respectively, electric capacity C322, electric capacity C307 and electricity Hold C305 other end ground connection, the inductance L308 other end is connected with electric capacity C327 and electric capacity C306 one end and exports+7V respectively Voltage, electric capacity C327 and electric capacity C306 other end ground connection；
Described -7V voltage follower circuits include：Power management chip U302 GND pin ground connection, FB pin through resistance R312 with VOUT pin are connected, and FB pin are grounded after resistance R311, and REF pin are grounded through resistance R310, and VIN pin and TAP pin input with -12VIN Voltage is connected, and TAP foot meridian capacitors C325 ground connection, VOUT pin are grounded through resistance R301 and electric capacity C324, resistance R301 and electric capacity Both ends after both ends after C324 series connection are connected with inductance L307 and electric capacity C326 are in parallel, and electric capacity C326 and electric capacity C308 are in parallel, Draw the one end of port respectively with inductance L309 and electric capacity C309 between inductance L307 and electric capacity C326 to be connected, electric capacity C309 is another End ground connection, the inductance L309 other ends be connecteds with electric capacity C328 and electric capacity C310 one end and export -7V voltages respectively, electric capacity C328 with The electric capacity C310 other ends are grounded；
Described+5VIN voltage follower circuits include：Output+5VIN voltage ends respectively with electric capacity C301, electric capacity C316 and inductance L302 one end is connected, electric capacity C301 and electric capacity C316 other end ground connection, the inductance L302 other end respectively with electric capacity C302, electricity Hold C317 with inductance L303 one end to be connected, the other end ground connection of electric capacity C302 and electric capacity C317 pressures, the inductance L303 other end point It is not connected with electric capacity C311 one end and outside+5V voltages, electric capacity C311 other end ground connection；
Described+12VIN voltage follower circuits include：Output+12VIN voltage ends respectively with electric capacity C319, electric capacity C304 and electricity Sense L305 one end is connected, electric capacity C319 and electric capacity C304 other end ground connection, the inductance L305 other end respectively with electric capacity C303, Electric capacity C318 is connected with inductance L304 one end, the other end ground connection of electric capacity C303 and electric capacity C318 pressures, the inductance L304 other end It is connected respectively with electric capacity C320 one end and outside+12V voltages, electric capacity C320 other end ground connection；
Described -12VIN voltage follower circuits include：Output -12VIN voltage ends respectively with electric capacity C322 and inductance L310 one end Be connected, electric capacity C322 other end ground connection, the inductance L310 other end respectively with electric capacity C329, electric capacity C330 and inductance L311 mono- End is connected, electric capacity C329 and electric capacity C330 other end ground connection, and the inductance L311 other end is respectively with electric capacity C333 one end and outside Portion's -12V voltages are connected, electric capacity C333 other end ground connection.
3. a kind of ultrasonic signal excitation according to claim 1, control, reception, conditioning and telecommunication circuit, its feature exist In：Described transmitting telecommunication circuit includes communication chip U100, and communication chip U100 VCC pin and DI2 pin pass through electric capacity C181 It is connected, DI2, ED, ER, GND pin are grounded after being connected, and DO1 pin and pin are connected with signal transmitting main control module, R11 pin and resistance R100 one end is connected, and the resistance R100 other end is connected with resistance R101 and resistance R102 one end respectively, and resistance R101's is another End ground connection, the resistance R102 other end are connected with pin；
Described conditioning telecommunication circuit includes communication chip IC1T, and communication chip IC1T VCC pin and DI2 pin pass through electric capacity C1T It is connected, DI2, ED, ER, GND pin are grounded after being connected, and DO1 pin and pin are connected with signal condition main control module, R11 pin and resistance R2T one end is connected, and the resistance R2T other end is connected with resistance R3T and resistance R4T one end respectively, resistance R3T another termination Ground, the resistance R4T other end are connected with pin.
4. a kind of ultrasonic signal excitation according to claim 1, control, reception, conditioning and telecommunication circuit, its feature exist In：Described signal transmitting main control module includes chip IC 2TA and chip XIT, chip IC 2TA impulse ejection IO pin and electricity Resistance R5T one end is connected, resistance R5T other end output square-wave pulse trigger signal, 3V3IO1 pin, 3V3INT pin and 3V3IO2 pin + 3.3V voltages are connect, IO/GCLK1 pin are connected with resistance R8T one end, and the resistance R8T other end is connected with chip XIT CLK pin, Chip XIT EN pin connect+3.3V voltages, chip XIT GND pin ground connection, chip XIT VCC pin respectively through electric capacity C4T, C5T, C6T one end is connected with+3.3V voltages, electric capacity C4T, C5T and C6T other end ground connection；
Described square wave pulse control module includes pulse delay chip IC 4T, pulse width control chip IC 5T, chip IC 6T With reverse booster IC7T：Chip IC 4T TRIG pin connect square-wave pulse trigger signal, and chip IC 4T RES and GND pin are grounded, Chip IC 4T P0~P11 pin are connected with signal transmitting main control module, and chip IC 4T AE and VDD pin are connected with+5V voltages, VDD pin are connected with electric capacity C39T and electric capacity C41T one end, electric capacity C39T and electric capacity C41T other end ground connection, chip IC 4T's OUTB pin are connected with chip IC 5T TRIG pin；Chip IC 5T RES and GND pin ground connection, chip IC 5T P0~P11 pin and letter Number transmitting main control module is connected, AE and VDD pin are connected with+5V voltages, chip IC 5T VDD pin and electric capacity C42T and electric capacity C44T one end is connected, electric capacity C42T and electric capacity C44T other end ground connection, chip IC 5T OUT pin and chip IC 6T 4 pin and 5 Pin is connected；Chip IC 6T 14 pin connect+5V voltages and electric capacity C38T one end, electric capacity C38T other end ground connection, chip respectively IC6T 6 pin are connected with resistance R30T one end, and the resistance R30T other end is connected with reverse booster IC7T 1 pin, reversely rise Depressor IC7T 5 pin are connected with electric capacity C47T one end, electric capacity the C47T other end and the fixing ends of adjustable resistance R32T mono- and resistance R33T one end is connected, and adjustable resistance R32T sliding end is connected with resistance R31T one end, another fixing ends of adjustable resistance R32T and The resistance R33T other ends are connected with resistance R34 T one end together, resistance R31T other ends output square-wave pulse signal, resistance R34 T Other end ground connection, reverse booster IC7T 6 pin respectively with electric capacity C81T, C82T, C83T, C45T, C46T and inductance L16T One end is connected, electric capacity C81T, C82T, C83T, C45T and C46T other end ground connection, inductance L16T another termination+12V electricity Pressure.
5. a kind of ultrasonic signal excitation according to claim 1, control, reception, conditioning and telecommunication circuit, its feature exist In：Described high-voltage pulse excitation module includes power supply chip POEWR1T and switch K2T：
Base stage of the square-wave pulse signal respectively with triode V10T and triode V18T is connected, triode V18T emitter stage difference It is connected with inductance L11T, electric capacity C88T, electric capacity C89T and electric capacity C90T one end, inductance L11T another termination -12V voltages, electricity Hold C88T, C89T and C90T other end ground connection, triode V18T colelctor electrode respectively with resistance R54T one end and triode V10T emitter stage is connected, and grid of the resistance R54T other ends respectively with resistance R58T one end and metal-oxide-semiconductor V14T is connected, R58T's The other end is grounded, and metal-oxide-semiconductor V14T source electrode is connected with resistance R62T one end, resistance R62T other end ground connection, metal-oxide-semiconductor V14T's Drain electrode is connected with electric capacity C118T and C119T one end, electric capacity C118T and the C119T other end and resistance R90T and diode V22T One end is connected, resistance R90T and diode V22T other end ground connection, metal-oxide-semiconductor V14T drain electrode as output signal and with two poles Pipe V9T positive pole is connected with metal-oxide-semiconductor V7T source electrode, and diode V9T negative pole is connected with triode V8T emitter stage, triode The V8T base stage grid phase with resistance R6T, resistance R52T, electric capacity C59T~C63T, resistance R51T one end and metal-oxide-semiconductor respectively Even, triode V8T colelctor electrode and resistance R6T, R52T, electric capacity C59T~C63T other end ground connection, resistance R51T's is another One end is connected with resistance R44T one end, and the resistance R44T other end is connected with resistance R41T one end, the resistance R41T other end point Not with electric capacity C33T, C49T, C48T, C52T, C51T one end and voltage-stabiliser tube V2T negative pole, power supply chip POEWR1T 3 pin It is connected；
The other end of power supply chip POEWR1T 4 pin respectively with electric capacity C33T, C49T, C48T, C52T and C51T is connected, chip POEWR1T 1 pin is connected by electric capacity C18T with 2 pin, and POEWR1T 2 pin connect+24V voltages, voltage-stabiliser tube V2T positive pole difference Drain electrode with resistance R42T, R43T, R44T one end and metal-oxide-semiconductor V7T is connected, and resistance R39T, R42T, R43T and R44T's is another End is connected with electric capacity C55T one end, the electric capacity C55T other end and the one of voltage-stabiliser tube V5T positive pole, resistance R38T and resistance R40T End is connected, and the negative pole with diode V6T, resistance R48T, electric capacity C64T's voltage-stabiliser tube V5T negative pole and C58T are connected respectively, two poles Pipe V6T positive pole is connected with electric capacity C64T and the C58T other end, the resistance R48T other end respectively with inductance L17T, electric capacity C126T, C127T are connected with C128T one end, and electric capacity C126T, C127T and C128T other end ground connection, inductance L17T's is another Termination+12V voltages, resistance R38T and resistance R40T another terminating resistor R46T one end and voltage-stabiliser tube V3T negative pole, resistance R46T other end ground connection, voltage-stabiliser tube V3T positive pole meet diode V1T negative pole, diode V4T positive pole and resistance R47T mono- End, resistance R47T other end ground connection, diode V1T positive pole and diode V4T negative pole connect switch K2T 1 pin and make height Driving pulse output is pressed, 3 pin for switching K2T connect+12V voltages, and 5 pin for switching K2T connect metal-oxide-semiconductor Q2T drain electrode, switch the 7 of K2T Pin connecting terminal X9, metal-oxide-semiconductor Q2T grid are launched main control module with signal by resistance R50T and are connected, after Q2T source ground It is connected by electric capacity C57T with its own grid.
6. a kind of ultrasonic signal excitation according to claim 1, control, reception, conditioning and telecommunication circuit, its feature exist In：Described transmitting impedance matching module includes metal-oxide-semiconductor Q3T~Q6T and switch K3T~K6T：Metal-oxide-semiconductor Q3T grid passes through electricity Resistance R71T is connected with signal transmitting main control module, and metal-oxide-semiconductor Q3T source electrode is connected by electric capacity C70T with its own grid, MOS Pipe Q3T drain electrode is connected with switching K3T 5 pin, and 3 pin for switching K3T connect+12V voltages；
1 pin for switching K3T is connected with switching K4T 1 pin, and metal-oxide-semiconductor Q4T grid launches main control by resistance R72T and signal Module is connected, and metal-oxide-semiconductor Q4T source electrode is connected by electric capacity C71T with its own grid, and metal-oxide-semiconductor Q4T drain electrode is with switch K4T's 5 pin are connected；
Switch K4T 3 pin connect+12V voltages, and 7 pin for switching K4T are connected with switching K5T 1 pin, and metal-oxide-semiconductor Q5T grid passes through Resistance R73T is connected with signal transmitting main control module, and metal-oxide-semiconductor Q5T source electrode is connected by electric capacity C72T with its own grid, Metal-oxide-semiconductor Q5T drain electrode is connected with switching K5T 5 pin；
Switch K5T 3 pin connect+12V voltages, and 7 pin for switching K5T are connected with switching K6T 7 pin, and metal-oxide-semiconductor Q6T grid passes through Resistance R74T is connected with signal transmitting main control module, and metal-oxide-semiconductor Q6T source electrode is connected by electric capacity C73T with its own grid, Metal-oxide-semiconductor Q6T drain electrode is connected with switching K6T 5 pin, and 3 pin for switching K6T connect+12V voltages, switchs K6T 1 pin output and surpasses The high-voltage pulse pumping signal of acoustic emission probe impedance matching.
7. a kind of ultrasonic signal excitation according to claim 1, control, reception, conditioning and telecommunication circuit, its feature exist In：Described signal condition main control module includes chip U101 and chip Y100, chip U101 IO/GCLK0 pin and resistance R108 one end is connected, and the resistance R108 other end is connected with chip Y100 CLK pin, and chip Y100 EN pin connect+3.3V voltages, Chip Y100 GND pin ground connection, chip Y100 VCC pin one end with electric capacity C136, C137, C138 and+3.3V voltages respectively It is connected, electric capacity C136, C137 and C138 other end ground connection；
Described reception impedance matching module includes metal-oxide-semiconductor Q707, Q700~Q702 and switch K707, K700~K702：Metal-oxide-semiconductor Q707 grid is connected by resistance R707 with signal condition main control module, metal-oxide-semiconductor Q707 source electrode by electric capacity C707 with Its own grid is connected, and metal-oxide-semiconductor Q707 drain electrode is connected with switching K707 5 pin, and 3 pin for switching K707 connect+12V voltages, open 1 pin for closing K707 is connected with ultrasonic wave reception signal end, switchs signal after K707 7 pin output impedances matching, metal-oxide-semiconductor Q700's Grid is connected by resistance R700 with signal condition main control module, and metal-oxide-semiconductor Q700 source electrode passes through electric capacity C700 and its own Grid is connected, and metal-oxide-semiconductor Q700 drain electrode is connected with switching K700 5 pin, and 3 pin for switching K700 connect+12V voltages, switch K700 The matching of 7 output impedances after signal, 1 pin for switching K700 1 pin with switch K701 is connected, and metal-oxide-semiconductor Q701 grid passes through electricity Resistance R701 is connected with signal condition main control module, and metal-oxide-semiconductor Q701 source electrode is connected by electric capacity C701 with its own grid, Metal-oxide-semiconductor Q701 drain electrode is connected with K701 5 pin, and 3 pin for switching K701 connect+12V voltages, switchs K701 7 pin and switch K702 7 pin are connected, and metal-oxide-semiconductor Q702 grid is launched main control module with signal by resistance R702 and is connected, metal-oxide-semiconductor Q702's Source electrode is connected by electric capacity C702 with its own grid, and metal-oxide-semiconductor Q702 drain electrode is connected with switching K702 5 pin, switchs K702 3 pin connect+12V voltages, switch K702 1 pin output be connected with 15 Ohmic resistances after be grounded.
8. a kind of ultrasonic signal excitation according to claim 1, control, reception, conditioning and telecommunication circuit, its feature exist In：Described pre-amplification and attenuation module include chip U402~U404：
Signal is connected to resistance R423, R409 and R417 one end after impedance matching, after the resistance R423 other ends are connected with resistance R424 Connecting resistance R402 and voltage-stabiliser tube U405 3 pin, connecting resistance R407 and voltage-stabiliser tube after the resistance R409 other ends are connected with resistance R410 U406 3 pin, connecting resistance R415 and voltage-stabiliser tube U407 3 pin, voltage-stabiliser tube after the resistance R417 other ends are connected with resistance R418 U405 3 pin are connected by resistance R403 with chip U402+IN pin, voltage-stabiliser tube U406 3 pin and chip U403-IN pin phases Even, voltage-stabiliser tube U407 3 pin are connected with chip U404-IN pin；
Parallel resistance R401 and electric capacity C400 between chip U402 FB pin and-IN pin, chip U402-IN pin are respectively through resistance It is grounded after R400 and electric capacity C401, chip U402-5V pin are grounded after electric capacity C422 and C404 respectively, chip U402 GND Pin is grounded, and chip U402+5V pin are grounded after electric capacity C421 and C402 respectively, and chip U402 VOUT pin pass through resistance R404 It is connected with relay K400 10 pin, the chip U402 CC pin series capacitance C405 again after resistance R405 and electric capacity C403 respectively After be grounded, relay K400 1,4,6 and 9 pin ground connection, relay K400 2 pin and diode D400 1 pin and metal-oxide-semiconductor Q400 Drain electrode be connected, diode D400 3 pin are connected with relay K400 3 pin, metal-oxide-semiconductor Q400 source ground, metal-oxide-semiconductor Q400 Grid be connected with resistance R406 and electric capacity C406, the resistance R406 other end is connected with signal condition main control module, electric capacity C406 other end ground connection, relay K400 5 pin output amplification or deamplification；
Chip U403 FB pin are connected after resistance R408 and electric capacity C407 with-IN pin respectively, and chip U403+IN pin pass through respectively It is grounded after electric capacity C424, C410 and resistance R412, chip U403 GND pin ground connection, chip U403+5V pin are respectively through electric capacity It is grounded after C423 and C408, chip U403 VOUT pin are connected by resistance R411 with relay K401 10 pin, chip U403 CC pin be grounded again after series capacitance C411 after resistance R413 and electric capacity C409 respectively, relay K401 1,4,6 and 9 pin connect Ground, relay K401 2 pin are connected with the drain electrode of diode D401 1 pin and metal-oxide-semiconductor Q401, diode D401 3 pin with after Electrical equipment K401 3 pin are connected, metal-oxide-semiconductor Q401 source ground, metal-oxide-semiconductor Q401 grid respectively with resistance R414 and electric capacity C412 One end is connected, and the resistance R414 other end is connected with signal condition main control module, electric capacity C412 other end ground connection, relay K401 5 pin output amplification or deamplification；
Chip U404 FB pin are connected after resistance R416 and electric capacity C413 with-IN pin respectively, and chip U404+IN pin pass through respectively It is grounded after electric capacity C416, C426 and resistance R420, chip U404 GND pin ground connection, chip U404+5V pin are respectively through electric capacity It is grounded after C425 and C414, chip U404 VOUT pin are connected by resistance R419 with relay K402 10 pin, chip U404 CC pin be grounded again after series capacitance C417 after resistance R421 and electric capacity C415 respectively, relay K402 1,4,6 and 9 pin connect Ground, relay K402 2 pin are connected with the drain electrode of diode D402 1 pin and metal-oxide-semiconductor Q402, diode D402 3 pin with after Electrical equipment K402 3 pin are connected, metal-oxide-semiconductor Q402 source ground, metal-oxide-semiconductor Q402 grid respectively with resistance R422 and electric capacity C418 One end is connected, and the resistance R422 other end is connected with signal condition main control module, electric capacity C418 other end ground connection, relay K402 5 pin output amplification or deamplification.
9. a kind of ultrasonic signal excitation according to claim 1, control, reception, conditioning and telecommunication circuit, its feature exist In：Described high-pass filtering control module includes relay K600~relay K602,
The output signal difference contact relay K600 of the pre-amplification and attenuation module 10 pin and electric capacity C601, C602, C604 and C605 one end, electric capacity C601 and C602 another relay termination K601 10 pin, electric capacity C604's and C605 is another Relay termination K602 10 pin；
Relay K600 1,4,6 and 9 pin ground connection, relay K600 2 pin connect diode D600 1 pin and metal-oxide-semiconductor respectively Q600 drain electrode, diode D600 3 pin contact relay K600 3 pin, metal-oxide-semiconductor Q600 source ground, metal-oxide-semiconductor Q600 grid Pole is connected with electric capacity C600 and resistance R600 one end, and electric capacity C600 other end ground connection, resistance the R600 other end and signal are adjusted Reason main control module is connected；Relay K601 1,4,6 and 9 pin ground connection, relay K601 2 pin connect diode D601's respectively The drain electrode of 1 pin and metal-oxide-semiconductor Q601, diode D601 3 pin meet K601 3 pin, metal-oxide-semiconductor Q601 source ground, metal-oxide-semiconductor Q601 Grid be connected with electric capacity C603 and resistance R601 one end, electric capacity C603 other end ground connection, resistance the R601 other end and letter Number conditioning main control module be connected；Relay K602 1,4,6 and 9 pin ground connection, relay K602 2 pin connect diode respectively The drain electrode of D602 1 pin and metal-oxide-semiconductor Q602, diode D602 3 pin meet K602 3 pin, metal-oxide-semiconductor Q602 source ground, MOS Pipe Q602 grid is connected with electric capacity C606 and resistance R602 one end, and electric capacity C606 other end ground connection, resistance R602's is another End is connected with signal condition main control module；
Relay K600, relay K601 and relay K602 5 pin are grounded through resistance R606, and as high-pass filtering control mould The output end of block is output in differential converter, and the single-ended signal after high-pass filtering is converted into positive and negative difference through differential converter Signal.
10. a kind of ultrasonic signal excitation, control, reception, conditioning and telecommunication circuit according to claim 1, its feature It is：Described program control second amplifying circuit includes chip U210, chip U211 and chip U208：Negative differential signal Sig_ Isolated_B- is connected by 3 pin after resistance R210 with clamp diode U214, clamp diode U214 3 pin and chip U210 16 pin are connected, principal-employment sub-signal Sig_Isolated_B+ by after resistance R211 with clamp diode U214 1 pin and 2 pin are connected, and clamp diode U214 1 pin is connected with chip U210 1 pin；
Chip U210 2,8,10,15 and 17 pin ground connection, chip U210 3 pin and 4 pin are grounded by electric capacity C216, chip U210 6 pin be grounded by electric capacity C220, chip U210 7 pin are grounded by electric capacity C218, chip U210 8 pin series resistance R204 It is connected with 1 and 2 pin after electric capacity C251 with clamp diode U215, chip U210 9 pin pass through resistance R200 and electric capacity C248 It is connected afterwards with clamp diode U215 3 pin, chip U210 11 pin are grounded by electric capacity C204, chip U210 12,13 and 14 pin are connected with signal condition main control module；
Clamp diode U215 3 pin are connected with electric capacity C211 one end and chip U211 16 pin, the electric capacity C211 other end with The 1 of clamp diode U215 is connected with chip U211 1 pin, chip U211 2,8,10,15 and 17 pin ground connection, chip U211's 3 pin and 4 pin are grounded by electric capacity C217, and chip U211 6 pin are grounded by electric capacity C221, and chip U211 7 pin pass through electric capacity C219 is grounded, and chip U211 8 pin are connected by electric capacity C250 with chip U208 6 pin, and chip U211 9 pin pass through electric capacity C249 is connected with chip U208 3 pin, and chip U211 11 pin are grounded by electric capacity C205, chip U211 12,13 and 14 pin It is connected with signal condition main control module；
It is grounded after chip U208 1 and 2 pin shunt capacitance C206, C207 and C208, chip U208 3 pin and resistance R202 and electricity Hold C212 one end to be connected, resistance R202 other end ground connection, the electric capacity C212 other end and U208 6 pin and resistance R203 one end It is connected, resistance R203 other end ground connection, chip U208 9 pin are connected with signal condition main control module, and the 10 of chip U208 Pin be grounded, 11, the 12 of chip U208 connected with 13 pin after be grounded respectively after electric capacity C213, C214 and C215, chip U208's 15 pin are connected with resistance R201 one end, and the resistance R201 other end is connected with electric capacity C209, C260 and C210 one end, electric capacity C209 It is grounded with the C260 other end, the signal after electric capacity C210 other end output two level programming amplifying.
CN201720368560.1U 2017-04-10 2017-04-10 A kind of ultrasonic signal excitation, control, reception, conditioning and telecommunication circuit Active CN206673981U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109044790A (en) * 2018-07-27 2018-12-21 温州市人民医院 A kind of portable supersonic strikes back machine
CN109672477A (en) * 2019-01-29 2019-04-23 天津师范大学 A kind of acoustic array power supply and order downlink multiplex system and its control method based on pulse density modulated

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109044790A (en) * 2018-07-27 2018-12-21 温州市人民医院 A kind of portable supersonic strikes back machine
CN109044790B (en) * 2018-07-27 2020-09-25 温州市人民医院 Portable ultrasonic back knocking machine
CN109672477A (en) * 2019-01-29 2019-04-23 天津师范大学 A kind of acoustic array power supply and order downlink multiplex system and its control method based on pulse density modulated
CN109672477B (en) * 2019-01-29 2023-08-29 四川天源宏创科技有限公司 Acoustic array power supply and command downlink multiplexing system based on pulse density modulation and control method thereof

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