CN206622277U - One kind plus adhesive dispenser - Google Patents
One kind plus adhesive dispenser Download PDFInfo
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- CN206622277U CN206622277U CN201720156295.0U CN201720156295U CN206622277U CN 206622277 U CN206622277 U CN 206622277U CN 201720156295 U CN201720156295 U CN 201720156295U CN 206622277 U CN206622277 U CN 206622277U
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- crystal
- die bond
- bonding adhesive
- glue
- disk cover
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Abstract
The utility model discloses one kind plus adhesive dispenser, including die bond lacquer disk(-sc), crystal-bonding adhesive disk cover, crystal-bonding adhesive disc spins drive division, plastic squeeze portion.Crystal-bonding adhesive disk cover is in the form of slot, and crystal-bonding adhesive disk cover is covered on die bond lacquer disk(-sc).Jiao Dao is provided with above die bond lacquer disk(-sc).The bottom surface of crystal-bonding adhesive disk cover is provided with glue feeding channel.Bottom in the groove of crystal-bonding adhesive disk cover is provided with several glue baffle plates.Glue baffle plate is located in glue road.There is interval between the bottom of glue baffle plate and Jiao Dao bottom surface.The die bond material of plastic squeeze portion extrusion is entered in glue road from glue feeding channel.Crystal-bonding adhesive disc spins drive division drives crystal-bonding adhesive disc spins；Glue baffle plate keeps the thickness of die bond material；The die bond material for keeping thickness through glue baffle plate is sent out from a gum outlet.Adhesive dispenser should be added to be stamped crystal-bonding adhesive disk cover on die bond lacquer disk(-sc), and the impurity completely cut off in air, reduce the contact surface of die bond material and air, effectively extend the online usage time of die bond material.
Description
Technical field
It the utility model is related to die bond equipment technical field, more particularly to a kind of plus adhesive dispenser.
Background technology
During the semiconductor integrated circuit packages such as IC package, LED encapsulation, chip, which is fixed, using die bond equipment is
A very important step process.Die bond technique is to load die bond bonding or welding material in the dress adhesive dispenser of bonder, profit
Chip and support are sticked together with the caking property of die bond material.
Die bond lacquer disk(-sc) it is exposed, rotate and can all reduce the usage time of die bond material, over time with the increase of rotating speed, Gu
Brilliant material viscosity rises, and causes the abnormal generation of more/few glue, wire drawing, bonding force not enough easily occur during dispensing, influences to seal
Effect is filled, the design of die bond lacquer disk(-sc) directly affects the product reliability and efficiency and cost of die bond process.
Die bond material is added in die bond lacquer disk(-sc), at present using artificial addition manner, frequent operation plus glue weight accuracy
It is uncontrollable, cause person works' amount big, waste die bond material, be unfavorable for environmental protection and reduce production cost.
Utility model content
In view of the shortcomings of the prior art, the utility model proposes one kind plus adhesive dispenser, (1) should add adhesive dispenser in crystal-bonding adhesive
Crystal-bonding adhesive disk cover is stamped on disk, the impurity completely cut off in air, the contact surface of die bond material and air is reduced, solves die bond lacquer disk(-sc)
The problem of interior online usage time of die bond material is short.(2) adhesive dispenser should be added to control consolidating in packing element using motor driving glue-extruding rod
Brilliant material flows out from nozzle, solves the problems, such as manually to add glue frequent operation plus glue weight accuracy uncontrollable.
To achieve these goals, technical solutions of the utility model are as follows：
One kind plus adhesive dispenser, including die bond lacquer disk(-sc), crystal-bonding adhesive disk cover, crystal-bonding adhesive disc spins drive division, plastic squeeze portion.Crystal-bonding adhesive
Disk cover is in the form of slot, and crystal-bonding adhesive disk cover is covered on die bond lacquer disk(-sc).Several are provided with above die bond lacquer disk(-sc) to be used to load die bond material
Jiao Dao.The bottom surface of crystal-bonding adhesive disk cover is provided with glue feeding channel.Bottom in the groove of crystal-bonding adhesive disk cover is kept off provided with several glue
Plate.Glue baffle plate is located in glue road.There is interval between the bottom of glue baffle plate and Jiao Dao bottom surface.The die bond material of plastic squeeze portion extrusion
Material is entered in glue road from glue feeding channel.Crystal-bonding adhesive disc spins drive division drives crystal-bonding adhesive disc spins；Glue baffle plate keeps die bond
The thickness of material；The die bond material for keeping thickness through glue baffle plate is sent out from a gum outlet.
Further, in addition to crystal-bonding adhesive disk cover height regulating rod.Crystal-bonding adhesive disk cover height regulating rod is used to adjust die bond
The distance between lacquer disk(-sc) lid and die bond lacquer disk(-sc).
Further, in addition to mounting seat.Mounting seat is connected by crystal-bonding adhesive disk cover height regulating rod with crystal-bonding adhesive disk cover
Connect.Plastic squeeze portion is arranged in mounting seat.Crystal-bonding adhesive disk cover is located at the lower section of mounting seat.
Further, die bond lacquer disk(-sc) is in the form of annular discs；Crystal-bonding adhesive disk cover is in circular groove shape.
Further, crystal-bonding adhesive disc spins drive division includes crystal-bonding adhesive table motor.The rotating shaft of crystal-bonding adhesive table motor is positioned at solid
On the axis of brilliant lacquer disk(-sc).The rotating shaft of crystal-bonding adhesive table motor is connected with the center of circle of die bond lacquer disk(-sc).
Further, the locating slot being used for for the positioning of crystal-bonding adhesive table motor is provided with above die bond lacquer disk(-sc)；Locating slot is located at
In Jiao Dao inner ring.The bolt hole for being used for connecting crystal-bonding adhesive table motor is provided with the center of locating slot.
Further, Jiao Dao is in annular shape centered on the axle center of die bond lacquer disk(-sc).Glue baffle plate is provided with along Jiao Dao trends,
Jiao Dao is divided into Nei Jiao Dao Hewaijiao roads by glue baffle plate.Bottom in the groove of crystal-bonding adhesive disk cover is provided with several interior scrapers, scraped outside
Knife.Interior scraper is used in the die bond material Chan Daowaijiao roads in Nei Jiao roads.Outer scraper is used for the die bond material in Wai Jiao roads
In Chan Daoneijiao roads.
Further, Nei Jiao roads, the bottom surface in Wai Jiao roads are high, middle low in both sides respectively.
Further, plastic squeeze portion includes packing element, glue-extruding rod, plastic squeeze motor, packing element neck.Packing element neck is arranged on plastic squeeze horse
The bottom reached；Plastic squeeze motor, packing element neck are respectively fitted on glue-extruding rod；Plastic squeeze motor can drive glue-extruding rod to move up and down.Glue
Cylinder is perpendicular to the bottom surface of crystal-bonding adhesive disk cover；The lower end of glue-extruding rod is located in packing element；The upper end of packing element is arranged on by packing element neck
The bottom of plastic squeeze motor；The lower end of packing element is provided with a nozzle, and nozzle is connected with glue feeding channel.
Further, plastic squeeze portion also includes motor cabling channel.Motor cabling channel is located at the side of plastic squeeze motor.
The beneficial effects of the utility model：
(1) adhesive dispenser should be added to be stamped crystal-bonding adhesive disk cover on die bond lacquer disk(-sc), and the impurity completely cut off in air, reduced die bond material
With the contact surface of air, the online usage time of die bond material is effectively extended.
(2) adhesive dispenser should be added to control the die bond material in packing element to be flowed out from nozzle, without people using motor driving glue-extruding rod
Work is operated, and die bond material is added automatically according to manufacturing informatization system and device parameter, and precision is controllable, is saved artificial.
(3) crystal-bonding adhesive disk cover height regulating rod can adjust the height of crystal-bonding adhesive disk cover, preferably control the die bond in glue road
The thickness of material, technology stability is improved, save die bond material.
(4) Jiao Dao bottom surface is high, middle low in both sides respectively, can reduce the die bond material of bottom, and thickness more preferably controls,
Make technique relatively reliable.
(5) it is dynamic that shovel is carried out to the die bond material on Shuan Jiao roads using inside and outside scraper, avoids die bond precipitation of material to glue road bottom
Portion, cause to waste；And die bond material is easily mixed, die bond material can be saved, extends the usage time of die bond material.
Brief description of the drawings
Fig. 1 is dimensional structure diagram of the present utility model.
Fig. 2 is the dimensional structure diagram of die bond lacquer disk(-sc) 1 in Fig. 1.
Fig. 3 is the dimensional structure diagram of crystal-bonding adhesive disk cover 2 in Fig. 1.
Fig. 4 is the bottom plan structural representation of crystal-bonding adhesive disk cover 2 in Fig. 1.
Fig. 5 is the dimensional structure diagram in plastic squeeze portion 5 in Fig. 1.
Wherein, Fig. 1 to Fig. 5 reference is：Die bond lacquer disk(-sc) 1, crystal-bonding adhesive disk cover 2, crystal-bonding adhesive disk cover height regulating rod
3rd, crystal-bonding adhesive disc spins drive division 4, plastic squeeze portion 5, mounting seat 6；Glue road 11, locating slot 12, bolt hole 13, glue baffle plate 111；Enter
Glue passage 21, glue baffle plate 22, gum outlet 23, rotating shaft through hole 24, interior scraper 25, outer scraper 26；Packing element 51, glue-extruding rod 52, squeeze
Glue motor 53, plastic squeeze motor support column 54, packing element neck 55, motor cabling channel 56.
Embodiment
With reference to the accompanying drawings and examples, the utility model is expanded on further.
As shown in figure 1, a kind of plus adhesive dispenser, for adding glue for die bond equipment, including die bond lacquer disk(-sc) 1, crystal-bonding adhesive disk cover 2,
Crystal-bonding adhesive disk cover height regulating rod 3, crystal-bonding adhesive disc spins drive division 4, plastic squeeze portion 5, mounting seat 6.
One end of mounting seat 6 connects with die bond equipment, and mounting seat 6 is used to adhesive dispenser will be added to be arranged on die bond equipment.Peace
Dress seat 6 is connected by crystal-bonding adhesive disk cover height regulating rod 3 with crystal-bonding adhesive disk cover 2.Plastic squeeze portion 5 is arranged in mounting seat 6.Die bond
Lacquer disk(-sc) rotary driving part 4 is used to drive die bond lacquer disk(-sc) 1 to rotate.Crystal-bonding adhesive disk cover 2 is located at the lower section of mounting seat 6.Crystal-bonding adhesive disk cover 2
It is in the form of slot, it is adapted with die bond lacquer disk(-sc) 1.Crystal-bonding adhesive disk cover 2 is covered on die bond lacquer disk(-sc) 1.Several are provided with above die bond lacquer disk(-sc) 1
For loading the glue road 11 of die bond material.Shown in Figure 2, the bottom surface of crystal-bonding adhesive disk cover 2 is provided with glue feeding channel 21.Referring to figure
Shown in 4, the bottom in the groove of crystal-bonding adhesive disk cover 2 is provided with several glue baffle plates 22.The top of crystal-bonding adhesive disk cover 2 is provided with a plastic emitting
Mouth 23.Gum outlet 23 communicates with glue road 11.Glue baffle plate 22 is used for the thickness for the die bond material for controlling gum outlet 23 to export.Glue
Baffle plate 22 is located in glue road 11.There is interval between the bottom of glue baffle plate 22 and the bottom surface in glue road 11 so that die bond material flows through.
Plastic squeeze portion 5 is connected with glue feeding channel 21.After die bond material extrusion in plastic squeeze portion 5, entered by glue feeding channel 21
Enter in the glue road 11 of die bond lacquer disk(-sc) 1.Crystal-bonding adhesive disc spins drive division 4 drives die bond lacquer disk(-sc) 1 to rotate.Die bond lacquer disk(-sc) 1 can rotate forward,
Invert or move reciprocatingly.Die bond material rotates with die bond lacquer disk(-sc) 1.Crystal-bonding adhesive disk cover 2 does not rotate with die bond lacquer disk(-sc) 1.Glue
The die bond material that water baffle plate 22 will be above the bottom of glue baffle plate 22 blocks so that flows through the thickness of the die bond material of glue baffle plate 22
Degree meets requirement.Flow through glue baffle plate 22 die bond material go at gum outlet 23 after, sent out from gum outlet 23.Die bond is set
It is standby to take glue at gum outlet 23, for chip and support to be sticked together.
Crystal-bonding adhesive disk cover 2 can completely cut off the impurity in air, reduce the contact surface of die bond material and air, effectively extend solid
The brilliant online usage time of material.Crystal-bonding adhesive disk cover height regulating rod 3 can adjust the height of crystal-bonding adhesive disk cover 2, preferably control glue
The thickness of die bond material in road 11, technology stability is improved, save die bond material.
It is preferred that die bond lacquer disk(-sc) 1 is in the form of annular discs；Crystal-bonding adhesive disk cover 2 is in circular groove shape.
Crystal-bonding adhesive disc spins drive division 4 is arranged on the top of mounting seat 6.Crystal-bonding adhesive disc spins drive division 4 includes crystal-bonding adhesive
Table motor.The rotating shaft of crystal-bonding adhesive table motor is located on the axis of die bond lacquer disk(-sc) 1.It is provided with the center of the bottom surface of crystal-bonding adhesive disk cover 2
Rotating shaft through hole 24.The rotating shaft of crystal-bonding adhesive table motor is connected through rotating shaft through hole 24 with the center of circle of die bond lacquer disk(-sc) 1.
As shown in Fig. 2 the dimensional structure diagram for die bond lacquer disk(-sc) 1.Glue road 11 is in centered on the axle center of die bond lacquer disk(-sc) 1
It is circular.Circular locating slot 12 is provided with above die bond lacquer disk(-sc) 1, for being positioned for crystal-bonding adhesive table motor.Locating slot 12 is located at
In the inner ring in glue road 11.The height of locating slot 12 is higher than the upper top surface of die bond lacquer disk(-sc) 1.It is provided with the center of locating slot 12 and is used to connect
Connect the bolt hole 13 of crystal-bonding adhesive table motor.
Glue baffle plate 111 is provided with along the trend of glue road 11, and glue baffle plate 111 is by the Fen Weineijiao Dao Hewaijiao roads of glue road 11.
It is preferred that the bottom surface in Nei Jiao roads, Wai Jiao roads is high, middle low in both sides respectively.Specifically, Nei Jiao roads, the cross section in Wai Jiao roads are
" V " font or " U " font, so that die bond material flows to lowest part naturally；In such manner, it is possible to the die bond material of bottom is reduced, it is thick
The more preferable control of degree, makes technique relatively reliable.
As shown in figure 4, the bottom plan structural representation for crystal-bonding adhesive disk cover 2.Bottom in the groove of crystal-bonding adhesive disk cover 2 is set
There are several interior scraper 25, outer scrapers 26.Interior scraper 25 is used in the die bond material Chan Daowaijiao roads in Nei Jiao roads.Outer scraper
26 are used in the die bond material Chan Daoneijiao roads in Wai Jiao roads.So, die bond precipitation of material will not be caused to the bottom of glue road 11,
Cause to waste；And die bond material is easily mixed, die bond material can be saved, extends the usage time of die bond material.
In order to reduce difficulty of processing and combine actual use, glue road 11, interior scraper 25, outer scraper 26 quantity can be by reality
Border increase in demand or reduction.
With reference to Fig. 1, and it is shown in Figure 5, and plastic squeeze portion 5 includes packing element 51, glue-extruding rod 52, plastic squeeze motor 53, plastic squeeze motor
Support column 54, packing element neck 55, motor cabling channel 56.
Plastic squeeze motor support column 54 is vertically mounted in mounting seat 6.Plastic squeeze motor 53 is arranged on plastic squeeze motor support column 54
On.Packing element neck 55 is arranged on the bottom of plastic squeeze motor 53.Plastic squeeze motor 53, packing element neck 55 are respectively fitted on glue-extruding rod 52.
Plastic squeeze motor 53 can drive glue-extruding rod 52 to move up and down.
Packing element 51 is perpendicular to the bottom surface of crystal-bonding adhesive disk cover 2.The lower end of glue-extruding rod 52 is located in packing element 51.The upper end of packing element 51
The bottom of plastic squeeze motor 53 is arranged on by packing element neck 55.The lower end of packing element 51 is provided with a nozzle, nozzle and glue feeding channel 21
It is connected.Motor cabling channel 56 is located at the side of plastic squeeze motor 53.
Packing element 51 is built with die bond material.Plastic squeeze motor 53 receives control signal, control glue-extruding rod 52 on packing element 51 is interior,
Lower movement.When glue-extruding rod 52 moves downward, the die bond material extruded in packing element 51 flows out from nozzle, is entered by glue feeding channel 21
In glue road 11.Plastic squeeze portion 5 adds die bond material without manual operation, automatically according to manufacturing informatization system and device parameter,
Precision is controllable, saves artificial.
Above-described is only preferred embodiment of the present utility model, and the utility model is not limited to above example.Can
With understand, those skilled in the art directly export or associate on the premise of basic conception of the present utility model is not departed from its
It is improved and change is considered as being included within the scope of protection of the utility model.
Claims (10)
1. one kind plus adhesive dispenser, it is characterised in that：
Including die bond lacquer disk(-sc) (1), crystal-bonding adhesive disk cover (2), crystal-bonding adhesive disc spins drive division (4), plastic squeeze portion (5)；
Crystal-bonding adhesive disk cover (2) is in the form of slot, and crystal-bonding adhesive disk cover (2) is covered on die bond lacquer disk(-sc) (1)；
Several Jiao Dao (11) for being used to load die bond material are provided with above die bond lacquer disk(-sc) (1)；
The bottom surface of crystal-bonding adhesive disk cover (2) is provided with glue feeding channel (21)；
Bottom in the groove of crystal-bonding adhesive disk cover (2) is provided with several glue baffle plates (22)；Glue baffle plate (22) is located at Jiao Dao (11)
It is interior；There is interval between the bottom of glue baffle plate (22) and Jiao Dao (11) bottom surface；
The die bond material of plastic squeeze portion (5) extrusion is entered in Jiao Dao (11) from glue feeding channel (21)；
Crystal-bonding adhesive disc spins drive division (4) driving die bond lacquer disk(-sc) (1) rotation；Glue baffle plate (22) keeps the thickness of die bond material；
The die bond material for keeping thickness through glue baffle plate (22) is sent out from a gum outlet (23).
2. according to claim 1 plus adhesive dispenser, it is characterised in that：
Also include crystal-bonding adhesive disk cover height regulating rod (3)；
The crystal-bonding adhesive disk cover height regulating rod (3) is used to adjust the distance between crystal-bonding adhesive disk cover (2) and die bond lacquer disk(-sc) (1).
3. according to claim 2 plus adhesive dispenser, it is characterised in that：
Also include mounting seat (6)；
Mounting seat (6) is connected by crystal-bonding adhesive disk cover height regulating rod (3) with crystal-bonding adhesive disk cover (2)；
Plastic squeeze portion (5) is arranged in mounting seat (6)；
Crystal-bonding adhesive disk cover (2) is located at the lower section of mounting seat (6).
4. according to claim 1 plus adhesive dispenser, it is characterised in that：
Die bond lacquer disk(-sc) (1) is in the form of annular discs；Crystal-bonding adhesive disk cover (2) is in circular groove shape.
5. according to claim 4 plus adhesive dispenser, it is characterised in that：
Crystal-bonding adhesive disc spins drive division (4) includes crystal-bonding adhesive table motor；
The rotating shaft of the crystal-bonding adhesive table motor is located on the axis of die bond lacquer disk(-sc) (1)；
The rotating shaft of the crystal-bonding adhesive table motor is connected with the center of circle of die bond lacquer disk(-sc) (1).
6. according to claim 5 plus adhesive dispenser, it is characterised in that：
The locating slot (12) being used for for crystal-bonding adhesive table motor positioning is provided with above die bond lacquer disk(-sc) (1)；Locating slot (12) position
In the inner ring of Jiao Dao (11)；
The bolt hole (13) for being used for connecting crystal-bonding adhesive table motor is provided with the center of locating slot (12).
7. according to claim 4 plus adhesive dispenser, it is characterised in that：
Jiao Dao (11) is centered on the axle center of die bond lacquer disk(-sc) (1) in annular shape；
Glue baffle plate (111) is provided with along Jiao Dao (11) trends, Jiao Dao (11) is divided into Nei Jiao roads and outer glue by glue baffle plate (111)
Road；
Bottom in the groove of crystal-bonding adhesive disk cover (2) is provided with several interior scraper (25), outer scrapers (26)；
Interior scraper (25) is used in the die bond material shovel in the Nei Jiao roads to the Wai Jiao roads；
Outer scraper (26) is used in the die bond material shovel in the Wai Jiao roads to the Nei Jiao roads.
8. according to claim 7 plus adhesive dispenser, it is characterised in that：
The Nei Jiao roads, the bottom surface in Wai Jiao roads are high, middle low in both sides respectively.
9. according to claim 1 plus adhesive dispenser, it is characterised in that：
Plastic squeeze portion (5) includes packing element (51), glue-extruding rod (52), plastic squeeze motor (53), packing element neck (55)；
Packing element neck (55) is arranged on the bottom of plastic squeeze motor (53)；Plastic squeeze motor (53), packing element neck (55) are respectively fitted over crowded
On glue bar (52)；Plastic squeeze motor (53) can drive glue-extruding rod (52) to move up and down；
Packing element (51) is perpendicular to the bottom surface of crystal-bonding adhesive disk cover (2)；The lower end of glue-extruding rod (52) is located in packing element (51)；Packing element (51)
Upper end by packing element neck (55) be arranged on plastic squeeze motor (53) bottom；The lower end of packing element (51) is provided with a nozzle, nozzle
It is connected with glue feeding channel (21).
10. according to claim 1 plus adhesive dispenser, it is characterised in that：
Plastic squeeze portion (5) also includes motor cabling channel (56)；
Motor cabling channel (56) is located at the side of plastic squeeze motor (53).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720156295.0U CN206622277U (en) | 2017-02-21 | 2017-02-21 | One kind plus adhesive dispenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720156295.0U CN206622277U (en) | 2017-02-21 | 2017-02-21 | One kind plus adhesive dispenser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206622277U true CN206622277U (en) | 2017-11-10 |
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ID=60211256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720156295.0U Active CN206622277U (en) | 2017-02-21 | 2017-02-21 | One kind plus adhesive dispenser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206622277U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110560337A (en) * | 2019-09-20 | 2019-12-13 | 山西高科华兴电子科技有限公司 | Device and method for prolonging service life of bonding adhesive workshop of microelectronic packaging chip |
-
2017
- 2017-02-21 CN CN201720156295.0U patent/CN206622277U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110560337A (en) * | 2019-09-20 | 2019-12-13 | 山西高科华兴电子科技有限公司 | Device and method for prolonging service life of bonding adhesive workshop of microelectronic packaging chip |
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