CN206620295U - MEMS sonic transducers - Google Patents
MEMS sonic transducers Download PDFInfo
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- CN206620295U CN206620295U CN201720227788.9U CN201720227788U CN206620295U CN 206620295 U CN206620295 U CN 206620295U CN 201720227788 U CN201720227788 U CN 201720227788U CN 206620295 U CN206620295 U CN 206620295U
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- vibrating diaphragm
- movable comb
- fixed broach
- comb
- diaphragm component
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- 230000005236 sound signal Effects 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 52
- 239000000463 material Substances 0.000 claims description 23
- 238000006073 displacement reaction Methods 0.000 claims description 19
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 11
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 7
- 229920005591 polysilicon Polymers 0.000 claims description 7
- 239000012528 membrane Substances 0.000 claims description 5
- 229920002521 macromolecule Polymers 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 1
- 230000010355 oscillation Effects 0.000 claims 1
- 239000000178 monomer Substances 0.000 abstract description 3
- 230000004888 barrier function Effects 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 210000001520 comb Anatomy 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 229910001338 liquidmetal Inorganic materials 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000002210 silicon-based material Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
- 230000026683 transduction Effects 0.000 description 1
- 238000010361 transduction Methods 0.000 description 1
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Abstract
The utility model discloses a kind of MEMS sonic transducers, constituted by first movable comb and the first fixed broach, and in two groups of comb structures being made up of the second movable comb and the second fixed broach, the movable comb that the movable comb of one of which comb structure is higher than in fixed broach, another group of comb structure is less than fixed broach；MEMS sonic transducers of the present utility model, vibrating diaphragm component can export the audio signal of high frequency in itself, comb structure can as transducer low frequency configuration, and the driving interface of the two can be planned independently, and be integrated in a monomer can be while export low-and high-frequency signal, so as to provide accurate sound signal.In addition, sonic transducer of the present utility model, vibrating diaphragm component can also form microphone structure so as to which the amendment for sound source provides the noise signal parameter in the external world, improve the anti-noise ability of sonic transducer while audio signal output sound is received.
Description
Technical field
The utility model is related to field of sound transducers, more precisely, is related to a kind of sonic transducer with comb structure,
Such as MEMS sound-producing devices or its integrated with MEMS microphone.
Background technology
Loudspeaker is to be both provided with loudspeaker in important electroacoustic transduction part, most of consumer electronics product or raise one's voice
Device module.With the gradually development of the consumer electronics products such as mobile phone, tablet personal computer, people propose more to the performance of loudspeaker
High requirement.
With developing rapidly for portable product, the demand of Microspeaker is already the emphasis of next micro electronmechanical product,
But the displacement space of MEMS component is often dependant on the thickness of sacrifice layer, this is the maximum limitation of Microspeaker, articulation ability also because
This is limited.
In addition portable product is in addition to assembly volume will reduce, and the requirement for sound quality is growing day by day, using number
The size requirements of MEMS component are already run counter in sound signal design of the mode of group to meet low-and high-frequency.
Utility model content
A purpose of the present utility model is to provide a kind of new solution of MEMS sonic transducers.
According to first aspect of the present utility model there is provided a kind of MEMS sonic transducers, including substrate and vibrating diaphragm component,
The vibrating diaphragm component is linked together by spring beam with substrate；Wherein, set respectively in the relative both sides of the vibrating diaphragm component
There is at least one set of first movable comb, it is movable to be respectively arranged with least one set second in the other relative both sides of the vibrating diaphragm component
Broach；It is provided with the first fixed broach for being combined together with the first movable comb on the substrate, and for
The second fixed broach that two movable combs are combined together；
Wherein, constituted by first movable comb and the first fixed broach, and by the second movable comb and second
In two groups of comb structures that fixed broach is constituted, the movable comb of one of which comb structure is higher than fixed broach, another group of comb
Movable comb in toothing is less than fixed broach；
The vibrating diaphragm component is configured to supply the vibrational state of sonic transducer；
Two groups of comb structures are configured as：It is respectively that vibrating diaphragm component is overall at two under respective electrostatic force
Displacement in opposite direction provides driving force.
Alternatively, first movable comb is higher than the first fixed broach, and second movable comb is fixed less than second
Broach.
Alternatively, first movable comb is less than the first fixed broach, and second movable comb is fixed higher than second
Broach.
Alternatively, the vibrating diaphragm component is integrally rectangular, and first movable comb is arranged on vibrating diaphragm component one pair of which
On relative side wall, second movable comb is arranged on the relative side wall of vibrating diaphragm component another pair.
Alternatively, the spring beam is provided with four, four angles of the vibrating diaphragm component connected respectively.
Alternatively, the vibrating diaphragm component is integrally rounded, and first movable comb, the second movable comb are evenly distributed on
On the circumferencial direction of vibrating diaphragm component.
Alternatively, the substrate is provided with cavity volume, and the vibrating diaphragm component is arranged in the cavity volume of substrate, and described first fixes
Broach, the second fixed broach are arranged on the inwall of substrate cavity volume.
Alternatively, the material selection liquid metal film or macromolecule membrane of the spring beam.
Alternatively, the vibrating diaphragm component includes the framework positioned at outside, and the vibrating diaphragm in framework.
Alternatively, the framework and spring beam are integral, using identical material.
Alternatively, the vibrating diaphragm is the sounding vibrating diaphragm of sound-producing device, and the vibrating diaphragm selects piezoceramic material.
Alternatively, the vibrating diaphragm is the sounding vibrating diaphragm of sound-producing device, in addition to for coordinating with vibrating diaphragm so that the vibrating diaphragm
The auxiliary section of vibration.
Alternatively, the vibrating diaphragm is the sounding vibrating diaphragm of exports audio signal；Also include being used to constitute flat board with the vibrating diaphragm
The back pole plate of capacitance structure；The vibrating diaphragm constitutes the microphone that surrounding noise signals are characterized for inputting with back pole plate.
Alternatively, first movable comb, the second movable comb, the first fixed broach, the second fixed broach are using single
Crystal silicon or polysilicon.
According to another aspect of the present utility model, a kind of method for manufacturing above-mentioned MEMS sonic transducers is additionally provided, including
Following steps：
A) substrate is provided, different height is etched over the substrate and in first groove, the second groove of pectinate texture；
B) conductive layer is deposited on substrate, the conductive layer is filled in first groove, in second groove；
C) conductive layer is etched, the first movable comb, the second movable comb are formed in the first groove, second groove
Tooth, the first fixed broach, the second fixed broach；
D) framework and spring beam to form vibrating diaphragm component are deposited and etched in the upper surface of substrate；
E) deposition forms vibrating diaphragm on framework；
F) etched substrate, vibrating diaphragm, framework, the first movable comb, the second movable comb, the first fixed broach, second are consolidated
Determine broach, spring beam to discharge.
MEMS sonic transducers of the present utility model, vibrating diaphragm component can export the audio signal of high frequency, comb structure in itself
Can as transducer low frequency configuration, and the driving interface of the two can plan independently, and be integrated in can be in a monomer simultaneously
Low-and high-frequency signal is exported, so as to provide accurate sound signal.In addition, sonic transducer of the present utility model, vibrating diaphragm component is connecing
While exported sound by audio signal, microphone structure can also be formed so as to which the amendment for sound source provides the noise in the external world
Signal parameter, improves the anti-noise ability of sonic transducer.
Inventor of the present utility model has found that in the prior art, the amplitude of microphone device is limited；In addition, portable production
Product are in addition to assembly volume will reduce, and the requirement for sound quality is growing day by day, and low-and high-frequency is met by the way of array
Sound signal design already run counter to the size requirements of MEMS component.Therefore, the utility model to be realized technical assignment or
Person's technical problem to be solved be it is that those skilled in the art never expect or it is not expected that, therefore the utility model is
A kind of new technical scheme.
It is of the present utility model other by referring to the drawings to the detailed description of exemplary embodiment of the present utility model
Feature and its advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing for being combined in the description and constituting a part for specification shows embodiment of the present utility model, and
And be used to explain principle of the present utility model together with its explanation.
Fig. 1 is the top view of the utility model sonic transducer.
Fig. 2 is along the first movable comb, the profile in the first fixed broach direction in Fig. 1.
Fig. 3 is along the second movable comb, the profile in the second fixed broach direction in Fig. 1.
Fig. 4 is the first movable comb, the comparison diagram of the second movable comb position profile in Fig. 1.
Fig. 5 to Figure 10 is the manufacturing process flow diagram of the utility model sonic transducer.
Embodiment
Various exemplary embodiments of the present utility model are described in detail now with reference to accompanying drawing.It should be noted that：Unless another
Illustrate outside, the part and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is not limited
Make scope of the present utility model.
The description only actually at least one exemplary embodiment is illustrative below, never as to this practicality
New and its application or any limitation used.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as a part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
There is provided a kind of MEMS sonic transducers, the transducing in order to solve problems of the prior art for the utility model
Device can be manufactured using MEMS technology, and can increase substantially the performance of sonic transducer, and substantially reduce sonic transducer
Volume.
With reference to Fig. 1, MEMS sonic transducers of the present utility model, Microspeaker, including substrate 1 and vibrating diaphragm component, bullet
Property beam 4, the vibrating diaphragm component is linked together by spring beam 4 and substrate 1 so that the vibrating diaphragm component can be suspended at substrate
On 1.
In one specific embodiment of the utility model, the vibrating diaphragm component can be arranged on the end face of substrate 1；
In the utility model another specific embodiment, cavity volume is provided with the substrate 1, the vibrating diaphragm component is located at lining
In the cavity volume at bottom 1, spring beam 4 extends on the in-plane of vibrating diaphragm component, and one end is connected on the inwall of the cavity volume of substrate 1, separately
One end is connected to the side wall of vibrating diaphragm component.The quantity of spring beam 4 can be provided with multiple, be uniformly arranged on the circumference of vibrating diaphragm component
On direction, so as to provide stable resilient support for vibrating diaphragm component., can be in bullet in order to improve the elastic effect of spring beam 4
Structure around folding is set on property beam 4, and such as broached-tooth design, this belongs to the common knowledge of those skilled in the art, herein no longer
Illustrate.
For example when vibrating diaphragm component of the present utility model is rectangular configuration, the spring beam 4 can be provided with four, and this four
Individual spring beam 4 is connected to four angles of vibrating diaphragm component；When vibrating diaphragm component selects circular configuration, multiple spring beams 4 are uniform
On the circumferencial direction for being distributed in vibrating diaphragm component.
Vibrating diaphragm component of the present utility model is configured to supply the vibrational state of sonic transducer, that is to say, that the vibrating diaphragm
Component can receive the electric signal for being loaded with audio, pass through the vibration realizing sonic transducer of vibrating diaphragm component, the sounding of Microspeaker.
Vibrating diaphragm component of the present utility model is sounding vibrating diaphragm, and it can select piezoceramic material so that this sonic transducer
It may be constructed piezoelectric actuated sound-producing device.
Certainly, for a person skilled in the art, vibrating diaphragm component of the present utility model can also be other known
Sound-producing device, for example parallel plate type electrostatically actuated, voice coil loudspeaker voice coil actuating sound-producing device.For example, sonic transducer of the present utility model,
It can include being used to coordinate with vibrating diaphragm component so that the auxiliary section of vibrating diaphragm component vibration, the auxiliary section can be voice coil loudspeaker voice coil knot
Structure, the vibration sounding of vibrating diaphragm component is realized by the driving of voice coil loudspeaker voice coil.The auxiliary section can also be magnet, hot-wire coil mode
Electromagnetic structure etc., by the cooperation between magnet and hot-wire coil, realizes the vibration sounding of vibrating diaphragm component；The drive of this several vibrating diaphragm
Dynamic structure and its operation principle belong to the common knowledge of those skilled in the art, therefore, are no longer repeated herein.
Referring to figs. 1 to Fig. 4, vibrating diaphragm component of the present utility model can include outside framework 3, and in framework 3
Vibrating diaphragm 2.The framework 3 can select metal material or other materials well-known to those skilled in the art, and it is mainly
Vibrating diaphragm 2 provides support.The framework 3 for example can be rectangular frame, and the vibrating diaphragm 2 is connected to framework 3 by the position at its edge
On, the vibration section of the central region of vibrating diaphragm 2 is suspended at the hollow position of framework 3 so that the vibration of the vibrating diaphragm 2 will not be by framework
3 influence.
Above-mentioned spring beam 4 is attached to the marginal position of framework 3, it is achieved thereby that the elasticity of vibrating diaphragm component and substrate 1 connects
Connect.The utility model one preferred embodiment in, the spring beam 4 can use identical material with framework 3, and be
One, it can be obtained in MEMS technology by depositing, etching same sedimentary.
Sonic transducer of the present utility model, in addition to the comb structure being arranged between vibrating diaphragm component and substrate 1 so that
Whole vibrating diaphragm component can be driven to occur the displacement on vibrating diaphragm component planes direction in the presence of electrostatic force.
Specifically, at least one set of first movable comb 5 is respectively arranged with the relative both sides of the vibrating diaphragm component, with reference to figure
1, first movable comb 5 can use polysilicon or single crystal silicon material, and it may be provided on the framework 3 of vibrating diaphragm component,
And the first movable comb 5 is arranged on the relative both sides of vibrating diaphragm component.The position of the first movable comb 5 of correspondence on the substrate 1
Install and be equipped with the first fixed broach 6, first fixed broach 6 can use with the identical material of the first movable comb 5, it can set
Put on the inwall of the cavity volume of substrate 1, and intersect with the first movable comb 5 on vibrating diaphragm component and be combined together, form broach knot
Structure, is designated as the first comb structure.
At least one set of second movable comb 7 is respectively arranged with the relative both sides of the vibrating diaphragm component, it is described with reference to Fig. 1
Second movable comb 7 can use polysilicon or single crystal silicon material, and it may be provided on the framework 3 of vibrating diaphragm component, and the
Two movable combs 7 are arranged on the relative both sides of vibrating diaphragm component.The position of the second movable comb 7 of correspondence is set on the substrate 1
Have the second fixed broach 8, second fixed broach 8 can use with the identical material of the second movable comb 7, it may be provided at lining
On the inwall of the cavity volume of bottom 1, and intersect with the second movable comb 7 on vibrating diaphragm component and be combined together, form comb structure, be designated as
Second comb structure.
Wherein, in the first comb structure being made up of the fixed broach 6 of the first movable comb 5 and first, and by
In the second comb structure that two movable combs 7 and the second fixed broach 8 are constituted, the movable comb of one of which comb structure is higher than
Movable comb in fixed broach, another group of comb structure is less than fixed broach.Such as described first movable comb 5 is higher than first
Fixed broach 6, second movable comb 7 is less than the second fixed broach 8.It is of course also possible to be that first movable comb 5 is low
In the first fixed broach 6, second movable comb 7 is higher than the second fixed broach 8.So that two groups of comb structures can by with
It is set to：It is respectively that the overall displacement in two opposite directions of vibrating diaphragm component provides driving force under respective electrostatic force.
The first fixed broach 6 is now less than with the first movable comb 5, the second movable comb 7 is higher than the second fixed broach 8
Example, is described in detail to sonic transducer of the present utility model.
Fig. 2 is two group of first movable comb 5, profile in the direction of the first fixed broach 6, the first fixed broach 6 along along Fig. 1
On the inwall for being connected to the cavity volume of substrate 1, when substrate 1 uses monocrystalline silicon, the first fixed broach 6 uses monocrystalline silicon or polysilicon material
During material, in order to ensure the insulation between the fixed broach 6 of substrate 1 and first, set between the fixed broach 6 of substrate 1 and first
Insulating barrier 10 is equipped with, the insulating barrier 10 can use silica material known in MEMS technology etc., and the insulating barrier 10
It can be used as follow-up etching stopping layer, this belongs to the common knowledge of those skilled in the art, herein no longer specifically
It is bright.
First movable comb 5 is connected on the framework 3 of vibrating diaphragm component, the fixed broach 6 of the first movable comb 5 and first
Intersection is combined together, and the two partly overlaps together, with reference to the overlapping region 50 shown in Fig. 2.Described first movable comb
The lower end of tooth 5 is less than the lower end of first fixed broach 6, and the upper end of first movable comb 5 is fixed less than described first
The upper end of broach 6 so that together with the first movable comb 5 is not completely overlapped with the first fixed broach 6.
This is allowed for when to voltage difference is formed between the first movable comb 5, the first fixed broach 6, for example can to first
Dynamic broach 5 is passed through 0V direct current, when being passed through 5V direct current to the first fixed broach 6, in the presence of electrostatic force, can make the
Relative to the first fixed broach 6 upward displacement occurs for one movable comb 5.Movably combed by the first of vibrating diaphragm component opposite sides
Tooth 5, so as to drive whole vibrating diaphragm component to be subjected to displacement upwards, until the orthographic projection of the first movable comb 5, the first fixed broach 6
Overlap, the displacement is designated as S1.Displacement S1 maximum depend on the first movable comb 5 and the first fixed broach 6 it
Between difference in height.
Fig. 3 is two group of second movable comb 7, profile in the direction of the second fixed broach 8, the second fixed broach 8 along along Fig. 1
On the inwall for being connected to the cavity volume of substrate 1, when substrate 1 uses monocrystalline silicon, the second fixed broach 8 uses monocrystalline silicon or polysilicon material
During material, in order to ensure the insulation between the fixed broach 8 of substrate 1 and second, set between the fixed broach 8 of substrate 1 and second
Insulating barrier 10 is equipped with, the insulating barrier 10 can use silica material known in MEMS technology etc., and the insulating barrier 10
It can be used as etching stopping layer, this belongs to the common knowledge of those skilled in the art, no longer illustrates herein.
Second movable comb 7 is connected on the framework 3 of vibrating diaphragm component, the fixed broach 8 of the second movable comb 7 and second
Intersection is combined together, and the two partly overlaps together, with reference to the overlapping region 70 shown in Fig. 3.Described second movable comb
The lower end of tooth 7 is higher than the lower end of second fixed broach 8, and the upper end of second movable comb 7 is fixed higher than described second
The upper end of broach 8 so that together with the second movable comb 7 is not completely overlapped with the second fixed broach 8.
This is allowed for when to voltage difference is formed between the second movable comb 7, the second fixed broach 8, for example can to second
Dynamic broach 7 is passed through 0V direct current, when being passed through 5V direct current to the second fixed broach 8, in the presence of electrostatic force, can make the
Relative to the second fixed broach 8 downward displacement occurs for two movable combs 7.Movably combed by the second of vibrating diaphragm component opposite sides
Tooth 7, so as to drive whole vibrating diaphragm component to be subjected to displacement downwards, until the orthographic projection of the second movable comb 7, the second fixed broach 8
Overlap, the displacement is designated as S2.Displacement S2 maximum depend on the second movable comb 7 and the second fixed broach 8 it
Between difference in height.
The profile along the second movable comb, the second fixed broach part is illustrated that on the left of Fig. 4, right side is illustrated that
Along the first movable comb, the profile of the first fixed broach part.Vibrating diaphragm component of the present utility model the first movable comb 5,
Upward displacement S1 can occur under the driving of first fixed broach 6, in the driving of the second movable comb 7, the second fixed broach 8
Downward displacement S2 can occur down, this two groups of comb structures pass through respective control, it is possible to achieve vibrating diaphragm component integrally occurs
Total amount is S1+S2 displacement.This is under conditions of sonic transducer is size-constrained, and the displacement for substantially increasing vibrating diaphragm component is interval,
It is greatly improved voice effect of the vibrating diaphragm component in low frequency；And vibrating diaphragm component can export the audio signal of high frequency in itself, the two
Driving interface can independently plan that and be integrated in a monomer can be accurate so as to provide while export low-and high-frequency signal
Sound signal.
Preferably, when the vibrating diaphragm component is integrally rectangular, first movable comb 5 is arranged on vibrating diaphragm component wherein
On a pair of relative side walls, second movable comb 7 is arranged on the relative side wall of vibrating diaphragm component wherein another pair.When described
When vibrating diaphragm component is integrally rounded, first movable comb 5, the second movable comb 7 are evenly distributed on the circumference of vibrating diaphragm component
On direction.So as to the independent control by the first movable comb 5, the second movable comb 7 realize vibrating diaphragm component upwards or
Downward easy motion.
Preferably, because vibrating diaphragm component can occur always under the first movable comb 5, the control of the second movable comb 7
The displacement interval for S1+S2 is measured, therefore, the material of the utility model spring beam 4 is preferred to use liquid metal film or high score
Sub- film, it is interval so as to meet the larger displacement of vibrating diaphragm component.
Sonic transducer of the present utility model can be used as loudspeaker, that is to say, that vibrating diaphragm component is in itself and broach knot
High frequency of the structure respectively as loudspeaker, low frequency configuration.In the utility model another specific embodiment, the utility model
Sonic transducer be also used as noise reduction sound-producing device and use.
Specifically, the vibrating diaphragm component is still as receiving audio signal and export the sounding vibrating diaphragm of sound, itself and broach
Respective outer side edges together, realize the sounding of loudspeaker.Sonic transducer of the present utility model, in addition to for the structure of vibrating diaphragm 2
Into the back pole plate of capacity plate antenna structure (view is not provided)；The vibrating diaphragm 2 is constituted for characterizing ambient noise letter with back pole plate
Number microphone structure.The microphone structure of vibrating diaphragm 2 and this plate condenser type of back pole plate belongs to the public affairs of those skilled in the art
Know general knowledge.Microphone structure and loadspeaker structure independent control, that is to say, that vibrating diaphragm component can export sound simultaneously, also may be used
To receive and feed back the noise signal in the external world, the basis of amendment is provided so as to the audio signals for sound source, sound is realized
The anti-noise feature of transducer.
The utility model additionally provides a kind of manufacture method of MEMS sonic transducers, and it comprises the following steps：
A) substrate 1 is provided, different height is etched on the substrate 1 and in the first groove 1a of pectinate texture, second
Groove 1b, with reference to Fig. 5；
Substrate 1 of the present utility model can select single crystal silicon material, and deep ion etching machine bench can be used, carves on substrate 1
Lose first groove 1a, the second groove 1b of different height difference；For the ease of operating, the depth of all first groove 1a on substrate
Degree can be with identical, and all second groove 1b depth can be with identical；
B) conductive layer 14 is deposited on substrate 1, the conductive layer 14 is filled in first groove 1a, second groove 1b, join
Examine Fig. 6；
Conductive layer 14 of the present utility model can use monocrystalline silicon or polysilicon, and the conductive layer 14 is filled in different height
In the first groove 1a and second groove 1b of degree；Herein it should be noted that because substrate 1 employs single crystal silicon material, being
Ensureing insulation, (Fig. 5 is to scheming, it is necessary to first produce a layer insulating on substrate 1 and in first groove 1a, second groove 1b
10 is not shown), the insulating barrier can use silica material, and this not only realizes the insulation between substrate 1 and conductive layer 14, should
Insulating barrier is also used as follow-up etching stopping layer；
C) conductive layer 14 is etched, the first movable comb 5, the are formed in the first groove 1a, second groove 1b
Two movable combs 7, the first fixed broach 6, the second fixed broach 8, with reference to Fig. 7；
, therefore, can be right because second groove 1b depth is more than first groove 1a depth in the structure shown in Fig. 7
Conductive layer in second groove 1b is performed etching, so as to form the broach with height fall；Herein it should be noted that needing
Formed positioned at the first movable comb 5 of opposite sides and the first fixed broach 6, Yi Jiwei coordinated with the first movable comb 5
In the second movable comb 7 of opposite sides and the second fixed broach 8 coordinated with the second movable comb 7；And make first movable
Broach 5, the first fixed broach 6, the second movable comb 7, the second fixed broach 8 meet the fit structure of foregoing description；
D) framework 3 and spring beam to form vibrating diaphragm component are deposited and etched in the upper surface of substrate 1, with reference to Fig. 8；
Framework 3 and spring beam of the present utility model are preferred to use identical material, for example can on substrate depositing liquid
Metal, so that above-mentioned framework 3 is formed, and the spring beam being connected between framework 3 and substrate 1；Herein it should be noted that
, it is necessary to set mask on substrate 1 when depositing liquid metal, so as to prevent liquid metals from depositing to unwanted area
Domain；
E) deposition forms vibrating diaphragm 2 on the frame 3, with reference to Fig. 9；
The material of vibrating diaphragm 2 of the present utility model can select PZT piezoceramic materials, and the region that need not be deposited is set and covered
Membrane structure, so that vibrating diaphragm 2 is only deposited on framework 3；
F) etched substrate 1, by vibrating diaphragm 2, framework 3, the first movable comb 5, the second movable comb 7, the first fixed broach 6,
Second fixed broach 8, spring beam are discharged, with reference to Figure 10.
Deep ion etching machine can be used, vibrating diaphragm 2, framework 3, the first movable comb 5, the second movable comb 7, first is removed
Fixed broach 6, the second fixed broach 8, the monocrystalline substrate material below spring beam, so that said structure be discharged.
This should be noted that due in above-mentioned steps be provided with insulating barrier, the stop-layer that the insulating barrier can be etched as deep ion,
So as to prevent that when deep ion etches silicon substrate, each functional structure layer of sonic transducer being etched away；Subsequently need to use
For example hydrogen fluoride removes insulating barrier, and this belongs to the common knowledge of those skilled in the art, no longer illustrates herein.
Although some specific embodiments of the present utility model are described in detail by example, this area
It is to be understood by the skilled artisans that example above is merely to illustrate, rather than in order to limit scope of the present utility model.This
Field it is to be understood by the skilled artisans that can be in the case where not departing from scope and spirit of the present utility model, to above example
Modify.Scope of the present utility model is defined by the following claims.
Claims (14)
1. a kind of MEMS sonic transducers, it is characterised in that：Including substrate (1) and vibrating diaphragm component, the vibrating diaphragm component passes through bullet
Property beam (4) links together with substrate (1)；Wherein, at least one set of the is respectively arranged with the relative both sides of the vibrating diaphragm component
One movable comb (5), at least one set of second movable comb (7) is respectively arranged with the other relative both sides of the vibrating diaphragm component；
The first fixed broach (6) for being combined together with the first movable comb (5) is provided with the substrate (1), and is used for
The second fixed broach (8) being combined together with the second movable comb (7)；
Wherein, constituted by first movable comb (5) and the first fixed broach (6), and by the second movable comb (7) with
In two groups of comb structures that second fixed broach (8) is constituted, the movable comb of one of which comb structure is higher than fixed broach, separately
Movable comb in one group of comb structure is less than fixed broach；
The vibrating diaphragm component is configured to supply the vibrational state of sonic transducer；
Two groups of comb structures are configured as：It is respectively that vibrating diaphragm component is overall opposite at two under respective electrostatic force
Displacement on direction provides driving force.
2. MEMS sonic transducers according to claim 1, it is characterised in that：First movable comb (5) is higher than first
Fixed broach (6), second movable comb (7) is less than the second fixed broach (8).
3. MEMS sonic transducers according to claim 1, it is characterised in that：First movable comb (5) is less than first
Fixed broach (6), second movable comb (7) is higher than the second fixed broach (8).
4. MEMS sonic transducers according to claim 1, it is characterised in that：The vibrating diaphragm component is integrally rectangular, described
First movable comb (5) is arranged on the relative side wall of vibrating diaphragm component one pair of which, and second movable comb (7), which is arranged on, to be shaken
On the relative side wall of membrane module another pair.
5. MEMS sonic transducers according to claim 4, it is characterised in that：The spring beam (4) is provided with four, respectively
Four angles of the vibrating diaphragm component of connection.
6. MEMS sonic transducers according to claim 1, it is characterised in that：The vibrating diaphragm component is integrally rounded, described
First movable comb (5), the second movable comb (7) are evenly distributed on the circumferencial direction of vibrating diaphragm component.
7. MEMS sonic transducers according to claim 1, it is characterised in that：The substrate (1) is provided with cavity volume, described to shake
Membrane module is arranged in the cavity volume of substrate (1), and first fixed broach (6), the second fixed broach (8) are arranged on substrate (1)
On the inwall of cavity volume.
8. MEMS sonic transducers according to claim 1, it is characterised in that：The material selection liquid of the spring beam (4)
Metallic film or macromolecule membrane.
9. MEMS sonic transducers according to claim 1, it is characterised in that：The vibrating diaphragm component includes the frame positioned at outside
Frame (3), and the vibrating diaphragm (2) in framework (3).
10. MEMS sonic transducers according to claim 9, it is characterised in that：The framework (3) and spring beam (4) are one
Body, using identical material.
11. MEMS sonic transducers according to claim 9, it is characterised in that：The vibrating diaphragm (2) is the sounding of sound-producing device
Vibrating diaphragm, the vibrating diaphragm (2) selects piezoceramic material.
12. MEMS sonic transducers according to claim 9, it is characterised in that：The vibrating diaphragm (2) is the sounding of sound-producing device
Vibrating diaphragm, in addition to for coordinating with vibrating diaphragm (2) so that the auxiliary section of the diaphragm oscillations.
13. MEMS sonic transducers according to claim 9, it is characterised in that：The vibrating diaphragm (2) is exports audio signal
Sounding vibrating diaphragm；Also include the back pole plate for being used to constitute capacity plate antenna structure with the vibrating diaphragm (2)；The vibrating diaphragm (2) and back pole plate
Constitute the microphone that surrounding noise signals are characterized for inputting.
14. MEMS sonic transducers according to claim 1, it is characterised in that：First movable comb (5), second can
Dynamic broach (7), the first fixed broach (6), the second fixed broach (8) use monocrystalline silicon or polysilicon.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106911990A (en) * | 2017-03-09 | 2017-06-30 | 歌尔股份有限公司 | MEMS sonic transducers and its manufacture method |
| CN110392331A (en) * | 2018-04-20 | 2019-10-29 | 意法半导体股份有限公司 | Piezo-electric acoustical MEMS transducer and its manufacturing method |
-
2017
- 2017-03-09 CN CN201720227788.9U patent/CN206620295U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106911990A (en) * | 2017-03-09 | 2017-06-30 | 歌尔股份有限公司 | MEMS sonic transducers and its manufacture method |
| CN110392331A (en) * | 2018-04-20 | 2019-10-29 | 意法半导体股份有限公司 | Piezo-electric acoustical MEMS transducer and its manufacturing method |
| US11051113B2 (en) | 2018-04-20 | 2021-06-29 | Stmicroelectronics S.R.L. | Piezoelectric acoustic MEMS transducer and fabrication method thereof |
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Effective date of registration: 20191115 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co., Ltd Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Gore Co., Ltd. |
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