CN206595230U - Semiconductor lead carriage presses detent mechanism - Google Patents
Semiconductor lead carriage presses detent mechanism Download PDFInfo
- Publication number
- CN206595230U CN206595230U CN201720377246.XU CN201720377246U CN206595230U CN 206595230 U CN206595230 U CN 206595230U CN 201720377246 U CN201720377246 U CN 201720377246U CN 206595230 U CN206595230 U CN 206595230U
- Authority
- CN
- China
- Prior art keywords
- semiconductor lead
- lead carriage
- detent mechanism
- actuator
- pressing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Detent mechanism is pressed the utility model discloses a kind of semiconductor lead carriage, including：Pedestal, actuator, bearing part and pressing plate；Wherein, actuator with relative to the angle of basement tilt one on the pedestal；The bearing part is carried and positioning semiconductor lead frame on the pedestal with providing；The pressing plate is moved back and forth located at the actuator by actuator driving, and then is compressed by the part that is carried on to the semiconductor lead carriage on bearing part of working end of pressing plate to carry out precise positioning.In semiconductor lead carriage pressing detent mechanism of the present utility model, the recess for the partial circumferential that can expose semiconductor lead carriage is provided with the working end of pressing plate, CCD can be facilitated to recognize the marks such as sequence number or bar code on semiconductor lead carriage periphery, and conveniently carry out the operation such as laser marking on semiconductor lead carriage periphery, and the back fire Substances Pollution that the periphery of other capped semiconductor lead carriages is produced when then can prevent from being marked by laser.
Description
Technical field
The utility model is related to a kind of mechanism that precise positioning is carried out to frivolous workpiece, especially for semiconductor lead
Frame carries out the mechanism of precisely pressing positioning, in favor of the progress of the processing procedures such as subsequent images inspection, laser marking.
Background technology
Semiconductor lead carriage system is filled with the medium as chip and printed circuit board circuitry connection for semiconductor package, also known as
For Wire lead for integrated circuit；In making, generally with chemical etching or mechanical stamping mode, on copper alloy or iron-nickel alloy sheet
By integrated circuit foot stool shape imprinting moulding above integrated circuit.
Due to progressing greatly for semiconductor technology so that the integrated circuit of manufacture is increasingly miniaturized, semiconductor lead carriage is also therewith
More shape is frivolous.Semiconductor lead carriage after manufacture is in strip and quite frivolous before not cutting, therefore is carrying out visual examination
Or marking needs elder generation to carry out precise positioning in board equipment before processing procedures such as (Marking)；Its positioning method generally with Z axis to (hang down
Nogata to) or X axis (horizontal direction) detent mechanism to lead frame carry out clip.
However, Z axis to detent mechanism moved due to needing in semiconductor lead carriage upper vertical with to semiconductor lead
Frame carry out clip or release clip, therefore Z axis to detent mechanism can occupy the installing space of other assemblies；For example influence partly leading
Body lead frame upper set sets the accommodation space of CCD images verifying attachment or laser marking press equipment.
Although the detent mechanism of X axis does not interfere with the space above semiconductor lead carriage, if but semiconductor lead carriage
When not by precise positioning, then the problems such as causing semiconductor lead carriage warpage when being positioned mechanism clip from X axis, influence
The yield of lead frame product.
Utility model content
In order to solve the above technical problems, the utility model purpose is to provide a kind of semiconductor lead carriage pressing localization machine
Structure, except can precise positioning and ensure semiconductor lead carriage can entirely be fixed in pressing detent mechanism in addition to, more can effectively save
Save using space, production yield improved, so as to overcome the deficiencies in the prior art.
To reach above-mentioned purpose, the technical solution of the utility model is as follows：
Detent mechanism is pressed the utility model discloses a kind of semiconductor lead carriage, including：
One pedestal；
One actuator, to be located at relative to the angle of basement tilt one on the pedestal；
One bearing part, on the pedestal, the bearing part is available for carrying and positions semiconductor lead frame；
One pressing plate, is moved back and forth located at the actuator by actuator driving, and one end of the pressing plate is work
End, the working end is used to compress the part that the semiconductor lead carriage is carried on the bearing part.
It is preferred that, the working end of the pressing plate has a underlying horizontal plane, and the horizontal plane is used for described half
Conductor frame is compressed.
It is preferred that, the working end of the pressing plate is provided with an at least recess, and the recess is to expose the semiconductor lead to the open air
The partial circumferential of frame, makes a check device to recognize the mark being located on semiconductor lead carriage by the recess, or make one to add
Frock is put to be processed by the recess to the semiconductor lead carriage.
It is preferred that, a fixed seat is fixedly provided with the bearing part, the fixed seat is provided with least one toward upper process
Protruded stigma, the protruded stigma is used for through the hole on the semiconductor lead carriage to be determined the semiconductor lead carriage
Position.
It is preferred that, the moving direction of the length direction system of the pressing plate parallel to the actuator.
It is preferred that, the range of tilt angles of the actuator is 15 °~45 °.
It is preferred that, the pedestal is provided with an oblique fixed part, and the actuator is fixed on the oblique fixed part.
It is preferred that, the range of tilt angles of the oblique fixed part is 15 °~45 °.
Further, the actuator is cylinder.
Compared with prior art, advantage of the present utility model at least that：
1) the utility model can compress semiconductor lead carriage by brief mechanism the working end that is positioned at pressing plate
Between horizontal plane and bearing part.
2) semiconductor lead carriage pressing detent mechanism of the present utility model is set with inclined configuration so that semiconductor lead carriage
Top there is sufficient space group to set the equipment such as the image inspection devices such as CCD or laser marking press equipment.
3) in semiconductor lead carriage pressing detent mechanism of the present utility model, half can be exposed by being provided with the working end of pressing plate
The recess of the partial circumferential of conductor frame, can facilitate CCD to recognize the marks such as sequence number or bar code on semiconductor lead carriage periphery
Note, and the conveniently operation such as progress laser marking on semiconductor lead carriage periphery, and other capped semiconductor lead carriages
The back fire Substances Pollution that produces when then can prevent from being marked by laser of periphery.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
The required accompanying drawing used is briefly described in description or in the prior art.
The three-dimensional signal of the integrated model form for the semiconductor lead carriage pressing detent mechanism that Fig. 1 provides for the utility model
Figure；
The pressing plate for the semiconductor lead carriage pressing detent mechanism that Fig. 2 provides for the utility model is not yet to semiconductor lead carriage
The view compressed；
The pressing plate for the semiconductor lead carriage pressing detent mechanism that Fig. 3 provides for the utility model is compressed to semiconductor lead carriage
View；
The recess of the pressing plate for the semiconductor lead carriage pressing detent mechanism that Fig. 4 provides for the utility model can expose semiconductor to the open air
The schematic top plan view of the structural relation of lead frame periphery.
Description of reference numerals：1- pedestals, the oblique fixed parts of 11-, 2- actuators, 3- pressing plates, 31- horizontal planes, 32- recesses,
4- bearing parts, 5- fixed seats, 51- protruded stigmas, 6- semiconductor lead carriages.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe.
As Figure 1-4, the semiconductor lead carriage pressing detent mechanism that the utility model is provided, at least includes：One base
1, one actuator 2 of seat, a pressing plate 3 and a bearing part 4.Wherein, pedestal 1 be board skeleton a part, to support it is foregoing it
Actuator 2, pressing plate 3, bearing part 4 and other elements；Two groups of bearing parts 4 are then set on pedestal 1, and two bearing part 4 is with mutual
Parallel and symmetrical state is arranged on pedestal 1, is made that semiconductor lead carriage 6 can be placed between two bearing parts 4 and is held along two
The length direction of holder 4 is conveyed.Preferably, the utility model can further be fixedly disposed a fixed seat in bearing part 4
5, then set in fixed seat 5 at least one toward upper process protruded stigma 51, the periphery of semiconductor lead carriage 6 then sets a plurality of correspondence institutes
The hole 61 of protruded stigma 51 such as state, be to make described to wait protruded stigma 51 to wear when semiconductor lead carriage 6 is placed on bearing part 4 thereby
The hole 61 crossed on corresponding semiconductor lead carriage 6 is so that semiconductor lead carriage 6 to be positioned.
One actuator 2 is then set on the pedestal 1 of the side of a bearing part 4 wherein, and actuator 2 is with relative to pedestal 1
With tilting an angle A on pedestal 1；Preferably, to set one oblique with tilting an angle A relative to pedestal 1 on pedestal 1
Fixed part 11, then actuator 2 is formed heeling condition on oblique fixed part 11 actuator 2；Preferably, the inclination
The scope of angle A is 15 °~45 °；The actuator 2 preferably uses cylinder.
Pressing plate 3 is the plate body with a length, the pressing plate 3 be located at actuator 2 and can driven member 2 drive reciprocal shifting
It is dynamic；For example, it is the moving direction for making the length direction of pressing plate 3 parallel to actuator 2 that pressing plate 3, which is located at after actuator 2,.Pressing plate 3
One end of length direction is working end, and the working end has a underlying horizontal plane 31, and the horizontal plane 31 is used for pair
The part of semiconductor lead carriage 6 being carried on bearing part 4 carries out compressing positioning.In addition, the working end of pressing plate 3 is provided with least one
The recess 32 of through hole up and down, when the horizontal plane 31 of pressing plate 3 is pressed on semiconductor lead carriage 6, the recess 32 is to expose
Reveal the ad-hoc location of the periphery upper surface of semiconductor lead carriage 6, an image inspection device is set by the recess 32 identification
The mark of the ad-hoc location on semiconductor lead carriage 6, or a processing unit (plant) is led by the recess 32 to semiconductor
The upper surface of coil holder 6 is processed.Wherein, the image inspection device can be the device such as CCD or equipment；The processing
Device may, for example, be laser marking press equipment；The mark may, for example, be sequence number or bar code etc..
Further illustrate that of the present utility model to make flowing mode as follows：
The semiconductor lead carriage 6 that periphery is previously provided with plural number hole 61 arranged in a straight line is placed between two bearing parts 4
Fixed seat 5 on, and protruded stigma 51 in fixed seat 5 is made the Primary Location of semiconductor lead carriage 6 through corresponding hole 6；
Then by inductor (not shown) in sense semiconductor lead carriage 6 be placed positioning it is proper after coordinate it is default calculate
Machine program starts the start of actuator 2, is moved during 2 start of actuator with dynamic pressure plate 3 toward the direction of semiconductor lead carriage 6, until pressure
The horizontal plane 31 of the working end of plate 3 entirely presses on the upper surface of the periphery of semiconductor lead carriage 6 to enter semiconductor lead carriage 6
Row precise positioning.Coordinate again shown in Fig. 4, now, sequence number and bar code on semiconductor lead carriage 6 etc. is marked in advance
Be able to it is exposed by corresponding recess 32, so that the CCD located at the top of semiconductor lead carriage 6 carries out image check identification.
Or, in another program such as laser marking press equipment can be entered by the recess 32 to the surface of semiconductor lead carriage 6
Row is laser carved.
Semiconductor lead carriage of the present utility model is pressed on detent mechanism, applicable all kinds of encapsulation boards, can be closely
Compress semiconductor lead carriage and the installing space of other assemblies (such as CCD or laser marking press equipment) will not be occupied, and half can be solved
The problems such as conductor frame warpage, positioning accurate accuracy is improved, with sharp semiconductor packages successive process.Also, of the present utility model half
Conductor frame presses pressing of the detent mechanism to semiconductor lead carriage and acted only once, and it is all profit to be effectively improved known mechanism
With it is in rotary moving cooperation specific direction rectilinear movement, or first move horizontally vertically move again can just complete pressing and it is excessively numerous
Multiple shortcoming.
Semiconductor lead carriage pressing detent mechanism of the present utility model is simple, can be compressed directly semiconductor lead carriage
It is positioned between the horizontal plane of the working end of pressing plate and bearing part.Furthermore, the pressure set by the utility model with inclined configuration
Close detent mechanism so that there is sufficient space group to set the inspection equipment such as CCD or laser marking press equipment for the top of semiconductor lead carriage
Or process equipment.Also, being provided with the recessed of the peripheral part ad-hoc location that can expose semiconductor lead carriage using the working end of pressing plate
Portion, except facilitating CCD to recognize the marks such as sequence number or bar code on semiconductor lead carriage periphery, and conveniently in semiconductor lead
Carried out on frame periphery outside the operation such as laser marking, it is other be not exposed to recess and the periphery of capped semiconductor lead carriage then
The back fire Substances Pollution produced when can prevent from being marked by laser.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or new using this practicality
Type.A variety of modifications to these embodiments will be apparent for those skilled in the art, determine herein
The General Principle of justice can in other embodiments be realized in the case where not departing from spirit or scope of the present utility model.Cause
This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The most wide scope consistent with features of novelty.
Claims (9)
1. a kind of semiconductor lead carriage presses detent mechanism, its spy is, including：
One pedestal；
One actuator, to be located at relative to the angle of basement tilt one on the pedestal；
One bearing part, on the pedestal, the bearing part is available for carrying and positions semiconductor lead frame；
One pressing plate, is moved back and forth on the actuator and by actuator driving, and one end of the pressing plate is working end,
The working end is used to compress the part that the semiconductor lead carriage is carried on the bearing part.
2. semiconductor lead carriage according to claim 1 presses detent mechanism, it is characterised in that the working end of the pressing plate
With a underlying horizontal plane, the horizontal plane is used to compress the semiconductor lead carriage.
3. semiconductor lead carriage according to claim 2 presses detent mechanism, it is characterised in that the working end of the pressing plate
Provided with an at least recess, partial circumferential of the recess to expose the semiconductor lead carriage to the open air makes a check device to pass through
The recess identification is located at the mark on semiconductor lead carriage, or a processing unit (plant) is led by the recess to the semiconductor
Coil holder is processed.
4. semiconductor lead carriage according to claim 3 presses detent mechanism, it is characterised in that fixed on the bearing part
Ground be provided with a fixed seat, the fixed seat provided with least one toward upper process protruded stigma, the protruded stigma be used for through located at described
Hole on semiconductor lead carriage to the semiconductor lead carriage to position.
5. semiconductor lead carriage according to claim 4 presses detent mechanism, it is characterised in that the length side of the pressing plate
To being moving direction parallel to the actuator.
6. semiconductor lead carriage according to claim 5 presses detent mechanism, it is characterised in that the inclination of the actuator
Angular range is 15 °~45 °.
7. semiconductor lead carriage according to claim 5 presses detent mechanism, it is characterised in that the pedestal is provided with one
Oblique fixed part, the actuator is fixed on the oblique fixed part.
8. semiconductor lead carriage according to claim 7 presses detent mechanism, it is characterised in that the oblique fixed part
Range of tilt angles is 15 °~45 °.
9. the semiconductor lead carriage pressing detent mechanism according to claim 6 or 8, it is characterised in that the actuator is
Cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720377246.XU CN206595230U (en) | 2017-04-12 | 2017-04-12 | Semiconductor lead carriage presses detent mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720377246.XU CN206595230U (en) | 2017-04-12 | 2017-04-12 | Semiconductor lead carriage presses detent mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206595230U true CN206595230U (en) | 2017-10-27 |
Family
ID=60121222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720377246.XU Active CN206595230U (en) | 2017-04-12 | 2017-04-12 | Semiconductor lead carriage presses detent mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206595230U (en) |
-
2017
- 2017-04-12 CN CN201720377246.XU patent/CN206595230U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104709711A (en) | Auto-feeder of integrated matching electrical testing machine equipment | |
| CN108538961B (en) | Method for positioning and marking crystalline silicon-based solar cell wafer | |
| CN206595230U (en) | Semiconductor lead carriage presses detent mechanism | |
| CN204549425U (en) | The self-propelled material transporter of integrated coupling electric logging device equipment | |
| CN106124082A (en) | Automotive temp sensor assembling wire body | |
| JP3091424B2 (en) | Perforator | |
| CN206020246U (en) | One kind is rushed sample bending and flattens all-in-one | |
| CN104640370A (en) | Method of reading barcodes of multi-layer circuit board | |
| CN212620636U (en) | Bearing frame detects equipment of carving seal | |
| CN209911419U (en) | Carrier test tool | |
| CN209945203U (en) | Height difference checking fixture for bent flexible printed circuit board | |
| CN107436405A (en) | Electric checking method and electric checkup apparatus | |
| CN208350849U (en) | A kind of ICT automatic aligning test fixture | |
| CN207563545U (en) | A kind of processing mold of seat side plate | |
| CN217775938U (en) | A tool for debugging radium-shine printing position | |
| CN209747509U (en) | Semiconductor package with marking alignment structure | |
| CN206411421U (en) | The high accuracy positioning and detection means of a kind of exposure machine | |
| CN210247202U (en) | Jig for printing patch backflow | |
| CN207578007U (en) | A kind of manipulator, two rewinding on-line Application equipment | |
| CN215448388U (en) | Point taking jig for steel ball impact | |
| CN208496078U (en) | Mobile phone shell coding device | |
| CN212020535U (en) | Heat exchanger head location frock | |
| CN209792884U (en) | Gantry type PCB laser marking device | |
| CN209015188U (en) | A kind of two dimensional code tooling | |
| CN205414129U (en) | Terminal punching die |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |