CN206561268U - A kind of compound milling protection device of chipless selective laser fusing - Google Patents
A kind of compound milling protection device of chipless selective laser fusing Download PDFInfo
- Publication number
- CN206561268U CN206561268U CN201621283170.6U CN201621283170U CN206561268U CN 206561268 U CN206561268 U CN 206561268U CN 201621283170 U CN201621283170 U CN 201621283170U CN 206561268 U CN206561268 U CN 206561268U
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- Prior art keywords
- milling
- selective laser
- gas
- chipless
- molded
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The utility model discloses a kind of compound milling protection device of chipless selective laser fusing; it is melted and molded for selective laser among equipment, device is included in the milling attachment that can be processed in the fusion process of selective laser to shaping aspect and the gas-circulating system for removing the chip produced in milling process in time；The gas-circulating system of the milling attachment includes：Admission line, discharge duct, pneumatic filter, air pump, gas-recycling plant, protection gas cylinder, air pressure valve and forming room；The milling attachment is located in forming room, including：Sleeve, milling cutter, air admission hole and steam vent, the utility model is removed chip in milling process by gas-circulating system in time, prevent it from polluting powder bed powder, simultaneously in side surface milling, side powder is removed, disturbance of the side surface powder to milling is prevented, so as to effectively improve quality and performance that selective laser is melted and molded part, the probability for occurring defect inside it is reduced.
Description
Technical field
The utility model is related to the research field of selective laser melt-forming, more particularly to a kind of chipless selective laser fusing
Compound milling protection device.
Background technology
With the development of science and technology, the method for metal parts surface treatment is varied, wherein to metal parts
It is a kind of common metal parts surface treatment mode to carry out Milling Process etc., and its is high in machining efficiency, results in excellent table
Face quality, but more chip in small, broken bits is easily produced, it is widely used in the processing and manufacturing of metal at present.
Selective laser fusing be grow up on the basis of selective laser sintering a kind of be widely used at present it is fast
Fast forming method.Selective laser is melted and molded technology and increasing effect is served in mechanical processing industry, because can
The complicated shape part that traditional diamond-making technique can not be molded is processed, so as to start deeply to apply in manufacture field, is become
Nowadays a part indispensable in machinery manufacturing industry.In the melt-forming system of selective laser, piece surface processing typically exists
Individually carry out and the outermost layer of molding part can only be processed again after part shaping completely.Can not be in forming parts
When be processed, thus easily cracked inside molding part, the defect such as density differs, molded surface is of poor quality.
Therefore need research is a kind of can be in the part forming layer face treatment during the melt-forming part of selective laser
Method, can avoid Milling Processes from easily producing the powder in more fusing shaping powder bed in chip pollution selective laser in small, broken bits
Shortcoming, while can also avoid in the milling process of formation of parts side, the powder of part side surface accumulation is to milling cutter
Disturbance, makes selective laser be melted and molded part quality performance more preferable.
Utility model content
Main purpose of the present utility model is to overcome the shortcoming and deficiency of prior art, and there is provided a kind of chipless selective laser
The compound milling protection device of fusing, can be to the milling attachment of shaping aspect processing and by milling in the fusion process of selective laser
The gas-circulating system that the chip produced in journey is removed in time, the capability and performance that selective laser is melted and molded part is improved with this,
Prevent the chip that milling process is produced from being polluted to the powder in powder bed, influence the stabilization of technique, while during the milling of side surface, by side
The powder on surface can also be removed in time, prevent the powder of side surface accumulation to the disturbing influence of cutter, and attempt to utilize a variety of gold
Belong to the advantage of machine-shaping, various metalworking procedures are optimized into integration, new technological process is opened up.
In order to achieve the above object, the utility model uses following technical scheme：
A kind of compound milling protection device of chipless selective laser fusing of the utility model, is melted and molded for selective laser and sets
Among standby, include the gas-circulating system of milling attachment and milling attachment；The gas-circulating system of the milling attachment includes：Enter
Feed channel, discharge duct, pneumatic filter, air pump, gas-recycling plant, protection gas cylinder, air pressure valve and forming room；It is described
Milling attachment is located in forming room, including：Sleeve, milling cutter, air admission hole and steam vent, the top of the sleeve and milling cutter with
Coupling type clamping is fixed, and the four direction at the top of milling cutter respectively has a coupling type clamping corresponding with sleeve respectively, the air inlet
Hole and steam vent are arranged on sleeve；The entrance of the pneumatic filter connects the blast pipe as derived from milling attachment sleeve
Road, outlet connection air pump；Connect pneumatic filter on the air pump, under connect gas-recycling plant；The gas-recycling plant is integrated
It is melted and molded in selective laser in equipment, gas-recycling plant entrance upper end is air pump, outlet connects protection air circuit pipeline.
As preferred technical scheme, the knife rest of the milling cutter connects moving guide rail to realize milling cutter in tri- sides of X, Y, Z
Upward moves freely.
As preferred technical scheme, it is outdoor that the pneumatic filter is located at shaping, and be installed on selective laser and be fused into
In type equipment.
As preferred technical scheme, filter cotton built in the pneumatic filter is filtered out by discharge duct from forming room
The trickle chip produced in derived surface treatment process.
As preferred technical scheme, the air pump is independently installed to be melted and molded outside equipment in selective laser, individually placed,
Vacuumize process is carried out to forming room.
As preferred technical scheme, the gas-recycling plant is driven by motor, suction inlet upper end protection gas again from
Outlet discharge, maintains to protect circulating for gas with this.
As preferred technical scheme, the protection gas cylinder is independently installed to be melted and molded outside equipment in selective laser, individually
Place, protection gas is provided when being melted and molded for forming room selective laser with surface of shaped parts processing, and be gas-circulating system
Protection gas is provided.
As preferred technical scheme, the forming room bottom is moulding cylinder and powder cylinder, and powder cylinder provides selective laser
The raw material metal powder of melt-forming, molding part is located in moulding cylinder；Forming room's top left installs galvanometer to conduct laser
It is processed to surface of shaped parts, powdering brush is installed in forming room, its bottom is flushed with moulding cylinder, powder cylinder surfaces, initially
Position is located between powder cylinder and forming room's side wall, and the metal dust of powder cylinder is swept into shaping by computer control powdering brush movement
Cylinder substrate surface, is molded using laser.
As preferred technical scheme, three pairs of air admission holes, steam vents, the air admission hole, steam vent are provided with the sleeve
The inlet and outlet pipeline of gas circulation loop is connected respectively；Three pairs of inlet and outlet holes are mutually every 120 ° of distributions, and air admission hole is by a circle
Post holes and circular hole connection composition, circular hole bottom is rectangle, circular arc centerline hole with milling cutter center line into 60 ° of angles,
Venthole is conical bore, circular cone centerline hole and milling cutter center line angle at 45 °, and length sleeve is less than the length of milling cutter after clamping
Degree.
The utility model compared with prior art, has the following advantages that and beneficial effect：
1. the innovation in the method for shaping：Conventional selective laser is melted and molded equipment, is merely able to realize the fast of part
Rapid-result type, but can not be processed in forming process to molding part, and after integrating and adding the milling attachment, enrich sharp
Light selective melting is molded, and selective laser is melted and molded process and is more enriched and go deep into.
2. the improvement of pair quantity of sintered parts：Only the part of equipment shaping is melted and molded due to forming process by selective laser
The influence of middle berth rendering, thickness and metal dust purity etc., processes and easily there are some defects, it is difficult to commercial.It will swash
The shaping of light selective melting is integrated with metal surface working process, is shortened selective laser and is melted and molded piece surface processing step
Suddenly, and part is surface-treated during being melted and molded in selective laser, selective laser can be effectively improved molten
Change the quality and performance of molding part, reduce the probability for occurring defect inside it.
3. open up the frontier of selective laser melt-forming：, will by attempting the advantage using various metals machine-shaping
Various metalworking procedures optimize integration, form new manufacturing procedure, and this is that the development that selective laser is melted and molded is opened up
New direction and field.
Brief description of the drawings
Fig. 1 is the gas-circulating system schematic diagram of milling attachment；
Fig. 2 (a) is the left view of milling attachment structure；
Fig. 2 (b) is the front view of milling attachment structure；
Fig. 2 (c) is the top view of milling attachment structure；
Fig. 3 is that milling attachment is melted and molded the machining sketch chart in equipment in selective laser；
Fig. 4 (a) is the 3-D view at the visual angle of milling attachment structure first；
Fig. 4 (b) is the 3-D view at the visual angle of milling attachment structure second.
Drawing reference numeral explanation：1. milling attachment, 2. pneumatic filters, 3. air pumps, 4. gas-recycling plants, 5. protection gas
Bottle, 6. air pressure valves, 7. forming room, 8. admission lines, 9. discharge ducts, 10. sleeves, 11. molding parts, 12. milling cutters, 13. air inlets
Hole, 14. steam vents, 15. galvanometers, 16. powdering brushes, 17. moulding cylinders, 18. powder cylinders.
Embodiment
The utility model is described in further detail with reference to embodiment and accompanying drawing, but implementation of the present utility model
Mode not limited to this.
Embodiment
As shown in figure 1, a kind of compound milling protection device of chipless selective laser fusing of the present embodiment, molten for selective laser
Change among former, include the gas-circulating system of milling attachment and milling attachment；The gas circulation system of the milling attachment
System includes：Admission line 8, discharge duct 9, pneumatic filter 2, air pump 3, gas-recycling plant 4, protection gas cylinder 5, air pressure valve 6,
And forming room 7；The milling attachment 1 is located in forming room, including：Sleeve 10, milling cutter 12, air admission hole 13 and steam vent
14。
As shown in Fig. 2 (a)-Fig. 2 (c), Fig. 4 (a), Fig. 4 (b), the milling attachment 1 is located in forming room, milling attachment
Be made up of milling cutter and sleeve, milling cutter knife rest connect moving guide rail realize milling cutter in X, Y, Z tripartite moving freely upwards, cover
Cylinder at the top of milling cutter with coupling type clamping with being fixed, and the four direction at the top of milling cutter respectively has a coupling type clamping and sleeve respectively
Correspondence, sleeve and milling cutter are detachable to carry out tool changing, the horizontal sectional area of size moulding section in process of milling cutter
Determine.When not carrying out surface of shaped parts processing, milling attachment is located at forming room's powder cylinder side, is designated as initial position；Carry out
During surface of shaped parts processing, milling attachment is moved to above molding part by computer control and molding part is processed；Molding part
After surface treatment terminates, milling attachment returns to initial position.
The pneumatic filter 2 is located at shaping outdoor, is installed on selective laser and is melted and molded in equipment.Entrance is connected by milling
Discharge duct 9 derived from the sleeve 10 of turning device 1, outlet connection air pump 3.Filter cotton built in pneumatic filter, is filtered by blast pipe
The trickle chip that road is produced derived from forming room in surface process.
The air pump 3 is independently installed to be melted and molded outside equipment in selective laser, individually placed.Pneumatic filter 2 is connect thereon,
Under connect gas-recycling plant 4.Air pump major function is that forming room is vacuumized, and the logical protection gas after being is ready.
Because the shaping environment of too high oxygen level is unfavorable for molding high-quality part.
The gas-recycling plant 4 is integrated in selective laser and is melted and molded in equipment, and entrance upper end is air pump 3, and outlet connects
Protect air circuit pipeline.Gas-recycling plant is driven by motor, and protection gas in suction inlet upper end is tieed up again from outlet discharge with this
Circulating for protection gas is held, protection gas is effectively taken away the chip that forming room's inner surface treatment is produced.When gas is followed
When loop device 4 works, air pump 3 does not work.
The protection gas cylinder 5 is independently installed to be melted and molded outside equipment in selective laser, individually placed.Protection gas cylinder be mainly
Protection gas is provided when forming room selective laser is melted and molded and surface of shaped parts is handled, and protection is provided for gas-circulating system
Gas, when air pressure valve 6 shows that gas piping air pressure is not enough, opens protection gas cylinder valve supply in time.
The forming room 7 is the core that selective laser is melted and molded equipment, such as Fig. 3.The forming room bottom is into
Type cylinder 17 and powder cylinder 18, powder cylinder 18 provide the raw material metal powder that selective laser is melted and molded, and molding part is located at shaping
In cylinder 17；Forming room's top left is installed galvanometer 15 and is processed to conduct laser to surface of shaped parts, and powdering brush 16 is installed on
In forming room, its bottom is flushed with moulding cylinder 17, the surface of powder cylinder 18, initial position be located at powder cylinder and forming room's side wall it
Between, computer control powdering brush 16 is moved is swept into moulding cylinder substrate surface by the metal dust of powder cylinder, is carried out into using laser
Type.
The sleeve 10 at the top of milling cutter with coupling type clamping with being fixed, and the four direction at the top of milling cutter respectively has one respectively
Coupling type clamping is corresponding with sleeve, and sleeve is detachable.Three pairs of ports are provided with sleeve, gas circulation loop is connected respectively
Intake and exhaust pipeline.Three pairs of ports are mutually every 120 ° of distributions, and air admission hole is made up of a cylindrical hole and a circular hole connection,
Circular hole bottom is rectangle, is conducive to protecting gas to take away trickle chip during air inlet, rather than under fall on surface of shaped parts so as to shadow
Shaping after sound.Circular arc centerline hole and milling cutter center line are into 60 ° of angles, and venthole is conical bore, circular cone centerline hole with
Milling cutter center line angle at 45 °, length sleeve is less than the length of milling cutter after clamping.
As shown in figure 3, during being melted and molded in actual titanium alloy selective laser, be melted and molded using selective laser and
Milling Process obtains the titanium alloy molding part that performance, quality are more excellent.Selective laser melt-forming is carried out first：Open laser choosing
Area is melted and molded equipment, and appropriate titanium alloy metal dust is added into the powder cylinder 18 of forming room 7, and regulation moulding cylinder 17 is placed
Substrate is regulated, the data of forming part are imported into equipment Computer, laser is opened, treats that all preparations are completed
Afterwards, air pump 3 starts to vacuumize forming room 7, and protection gas cylinder valve opening fills protection gas to forming room after exhausting vacuum, observes
Air pressure valve 6 treats that pipeline air pressure stops supply protection gas after reaching standard, and now gas-recycling plant 4, which is started working, maintains gas
The stabilization of the circulatory system.
Selective laser be melted and molded equipment start working, powdering brush 16 start to the right powdering to the substrate surface of moulding cylinder 17,
Then it is returned to left end initial position and terminates a powdering process；Laser is produced by laser, is conducted through galvanometer 15, is irradiated to powder
Last surface carries out selective laser melt-forming.Every layer of powder thickness is set as 0.04mm, powdering brush 16 per powdering 50 times after suspend
Powdering, i.e. molding part are often molded 2mm, and selective laser is melted and molded pause once.Start the part molded to titanium alloy component
It is surface-treated, forming room 7 fills with protection gas, and gas-circulating system remains normal, and gas-recycling plant 4 is normal
Work.Milling cutter 12 is moved to the molded upper of moulding cylinder and prepared to the molded portion of titanium alloy component under the control of the computer
Divide Surface Machining, length sleeve is less than the length 2mm of milling cutter after clamping, does not influence milling cutter to work, the size of milling cutter is by processed
The surface area of moulding section is determined in journey.
When milling cutter is handled the molded part surface of titanium alloy component, the trickle chip of generation is with protection gas by being connected to
Discharge duct discharge on sleeve steam vent, during by pneumatic filter 2, chip is filtered.Protect gas by rear by gas
EGR sucks and is discharged to gas pipeline, re-enter to forming room, constitutes gas-circulating system.
After milling cutter terminates to the molded part surface processing of titanium alloy component, initial position is returned to, is further continued for being swashed
Light selective melting is molded.Above-mentioned shaping and procedure of processing are circulated until titanium alloy component shaping is finished.
Above-described embodiment is the utility model preferably embodiment, but embodiment of the present utility model is not by above-mentioned
The limitation of embodiment, it is other it is any without departing from Spirit Essence of the present utility model with made under principle change, modify, replace
Generation, combination, simplification, should be equivalent substitute mode, are included within protection domain of the present utility model.
Claims (9)
1. a kind of compound milling protection device of chipless selective laser fusing, is melted and molded among equipment, it is special for selective laser
Levy and be, include the gas-circulating system of milling attachment and milling attachment；The gas-circulating system of the milling attachment includes：Enter
Feed channel (8), discharge duct (9), pneumatic filter (2), air pump (3), gas-recycling plant (4), protection gas cylinder (5), air pressure
Valve (6) and forming room (7)；The milling attachment (1) is located in forming room, including：Sleeve (10), milling cutter (12), air admission hole
(13) and steam vent (14), the sleeve (10) and the top of milling cutter (12) are fixed with coupling type clamping, on milling cutter (12) top
The four direction in portion respectively has a coupling type clamping corresponding with sleeve (10) respectively, the air admission hole (13) and steam vent
(14) it is arranged on sleeve (10)；The entrance connection of the pneumatic filter (2) is arranged by milling attachment (1) sleeve (10) is derived
Feed channel (9), outlet connection air pump (3)；Connect pneumatic filter (2) on the air pump (3), under connect gas-recycling plant (4)；Institute
State gas-recycling plant (4) to be integrated in the melt-forming equipment of selective laser, gas-recycling plant (4) entrance upper end is air pump
(3), outlet connects protection air circuit pipeline.
2. fusing compound milling protection device in chipless selective laser according to claim 1, it is characterised in that the milling cutter
(12) knife rest connects moving guide rail to realize milling cutter moving freely on tri- directions of X, Y, Z.
3. fusing compound milling protection device in chipless selective laser according to claim 1, it is characterised in that the gas
Filter (2) is located at forming room (7) outside, and is installed in the melt-forming equipment of selective laser.
4. the compound milling protection device of chipless selective laser fusing according to claim 1 or 3, it is characterised in that described
Filter cotton built in pneumatic filter (2), is produced in filtering out the surface treatment process as derived from discharge duct (9) from forming room (7)
Raw trickle chip.
5. fusing compound milling protection device in chipless selective laser according to claim 1, it is characterised in that the air pump
(3) it is independently installed to be melted and molded in selective laser outside equipment, it is individually placed, vacuumize process is carried out to forming room (7).
6. fusing compound milling protection device in chipless selective laser according to claim 1, it is characterised in that the gas
EGR (4) is driven by motor, and protection gas in suction inlet upper end maintains to protect the recycle stream of gas again from outlet discharge with this
It is dynamic.
7. fusing compound milling protection device in chipless selective laser according to claim 1, it is characterised in that the protection
Gas cylinder (5) is independently installed to be melted and molded outside equipment in selective laser, individually placed, be forming room selective laser be melted and molded and into
Protection gas is provided during airfoil surface processing, and protection gas is provided for gas-circulating system.
8. fusing compound milling protection device in chipless selective laser according to claim 1, it is characterised in that the shaping
Room bottom is moulding cylinder (17) and powder cylinder (18), and powder cylinder (18) provides the raw material metal powder that selective laser is melted and molded
End, molding part is located in moulding cylinder (17)；Forming room's top left is installed galvanometer (15) and entered to conduct laser to surface of shaped parts
Row processing, powdering brush (16) is installed in forming room, and its bottom is flushed with moulding cylinder (17), powder cylinder (18) surface, initial bit
Setting between powder cylinder and forming room's side wall, the metal dust of powder cylinder is swept into by computer control powdering brush (16) movement
Type cylinder substrate surface, is molded using laser.
9. fusing compound milling protection device in chipless selective laser according to claim 1, it is characterised in that the sleeve
(10) three pairs of air admission holes (13), steam vent (14) are provided with, the air admission hole (13), steam vent (14) connect gas circulation respectively
The inlet and outlet pipeline in loop；Three pairs of inlet and outlet holes are mutually every 120 ° of distributions, and air admission hole (13) is by a cylindrical hole and a circle
Arc hole connection composition, circular hole bottom is rectangle, and circular arc centerline hole is with milling cutter center line into 60 ° of angles, and venthole (14) is
Conical bore, circular cone centerline hole and milling cutter center line angle at 45 °, length sleeve are less than the length of milling cutter after clamping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621283170.6U CN206561268U (en) | 2016-11-28 | 2016-11-28 | A kind of compound milling protection device of chipless selective laser fusing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621283170.6U CN206561268U (en) | 2016-11-28 | 2016-11-28 | A kind of compound milling protection device of chipless selective laser fusing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206561268U true CN206561268U (en) | 2017-10-17 |
Family
ID=60029096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621283170.6U Withdrawn - After Issue CN206561268U (en) | 2016-11-28 | 2016-11-28 | A kind of compound milling protection device of chipless selective laser fusing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206561268U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106425501A (en) * | 2016-11-28 | 2017-02-22 | 华南理工大学 | Chipless composite milling protective device and control method for selective laser melting |
-
2016
- 2016-11-28 CN CN201621283170.6U patent/CN206561268U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106425501A (en) * | 2016-11-28 | 2017-02-22 | 华南理工大学 | Chipless composite milling protective device and control method for selective laser melting |
| CN106425501B (en) * | 2016-11-28 | 2018-07-20 | 华南理工大学 | A kind of chipless selective laser melt compound milling protective device and control method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20171017 Effective date of abandoning: 20180720 |
|
| AV01 | Patent right actively abandoned |