CN206559475U - A kind of big target surface industrial camera - Google Patents
A kind of big target surface industrial camera Download PDFInfo
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- CN206559475U CN206559475U CN201720151506.1U CN201720151506U CN206559475U CN 206559475 U CN206559475 U CN 206559475U CN 201720151506 U CN201720151506 U CN 201720151506U CN 206559475 U CN206559475 U CN 206559475U
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- shell
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- industrial camera
- target surface
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Abstract
The utility model discloses a kind of big target surface industrial camera, including shell, also include imaging sensor, image acquisition board, mainboard, power panel and I O board, imaging sensor is fixed on case surface, its pin is worn to enclosure from case surface to be connected with image acquisition board, image acquisition board is connected with mainboard signal, and mainboard is connected with power supply partitioned signal, and power panel is connected with I O board signal；Image acquisition board, mainboard, power panel and I O board are each attached in shell.Imaging sensor is fixed on case surface by the utility model, and heat can be radiated by shell, also solve imaging sensor be generally all mounted in circuit board generation the depth of field it is inconsistent the problem of.
Description
Technical field
The utility model is related to industrial camera technical field, particularly relates to a kind of big target surface industrial camera.
Background technology
In machine vision, industrial camera is a kind of important part.And in industrial camera, imaging sensor is again
It is the thing of the most key core.And the size of the target surface of imaging sensor, often it is directly connected to the quality of imaging.Generally come
Say, the image quality of image is directly proportional to the size of pixel.This also implies that, an equal amount of imaging sensor, if point
Resolution is higher, then Pixel Dimensions are just smaller, and its image quality also will be poorer；If Pixel Dimensions become big, resolution is got over
It is small, high-precision requirement can not be met again.
Therefore a kind of industrial camera of big target surface is needed, while high image quality is ensured, higher point is can guarantee that again
Debate rate；And big target surface imaging sensor has the shortcomings that power consumption golf calorific value is big, if radiating is bad, it can easily produce heat and make an uproar
Sound；Simultaneously as imaging sensor is generally all mounted on circuit board, camera lens is installed on circuit board by lens mount again,
It can so be influenceed due to the precision and SMT precision of circuit board, cause lens plane not exclusively parallel with sensitized lithography, produce the depth of field
Inconsistent the problem of, this point is particularly evident on big target surface imaging sensor.
Utility model content
The utility model proposes a kind of big target surface industrial camera, solve the bad and depth of field that radiates in the prior art and differ
The problem of cause.
What the technical solution of the utility model was realized in：
A kind of big target surface industrial camera, including shell, in addition to imaging sensor, image acquisition board, mainboard, power panel and
I O board, described image sensor is fixed on the case surface, and its pin is worn to enclosure and IMAQ from case surface
Plate is connected, and described image collection plate is connected with the mainboard signal, and the mainboard is connected with the power supply partitioned signal, the electricity
Source plate is connected with the I O board signal；Described image collection plate, mainboard, power panel and I O board are each attached in the shell.
Further, the shell includes bucket and shell back plate in shell foreboard, shell, the shell foreboard and described outer
It is tubular structure that shell back plate, which is sequentially fixed at bucket in the two ends of bucket in the shell, the shell, and described image collection plate is fixed
On the shell foreboard.
Further, described image collection plate includes optics socket, imaging sensor drive circuit and AFE collection electricity
The picture signal collected is converted into data signal by road, described image collection plate, and is exported to mainboard.
Further, the described image sensor back side is provided with heat conductive silica gel, and its pin is connected with the optics socket.
Further, the mainboard is provided with FPGA graphics processing units, DDR memory cell and MCU processing units, described
The view data that mainboard is exported to image acquisition board is acquired；Image is handled by FPGA graphics processing units again, then
Network packet is converted into be sent on power panel.
Further, there are network interface circuit and power circuit on the power panel.
Further, in addition to aluminium cover, be fixed with optical filter and dustproof silica gel in the aluminium cover, the optical filter with it is described
Dustproof silica gel is fitted, and the aluminium cover, optical filter and dustproof silica gel are fixed on the case nose.
Further, the case nose is provided with lens mount.
Further, the shell is provided with aviation head fixture, and the aviation head fixture is provided with aviation head, described
The pin of aviation head is welded with the I O board.
The beneficial effects of the utility model are：Imaging sensor is fixed on the case surface, heat can pass through
Shell radiate, also solve imaging sensor be generally all mounted in circuit board generation the depth of field it is inconsistent the problem of.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the accompanying drawing used required in description of the prior art is briefly described, it should be apparent that, drawings in the following description are only
It is some embodiments of the present utility model, for those of ordinary skill in the art, before creative labor is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of Structure explosion diagram of big target surface industrial camera of the utility model；
Fig. 2 is a kind of structural representation of big target surface industrial camera of the utility model.
In figure, 1- lens mounts；2- aluminium covers；3- optical filters；4- dustproof silica gels；5- imaging sensors；6- shell foreboards；7- schemes
As collection plate；8- mainboards；9- thermally conductive sheets；10- power panels；11- network interfaces；12-IO plates；Bucket in 13- shells；14- aviation heads
Fixture；15- aviation heads；16- shell back plates.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
As depicted in figs. 1 and 2, the utility model proposes a kind of big target surface industrial camera, including shell, in addition to image
Sensor 5, image acquisition board 7, mainboard 8, power panel 10 and I O board 12, imaging sensor 5 are fixed on case surface, its pin from
Case surface is worn to enclosure and is connected with image acquisition board, and image acquisition board 7 is connected with the signal of mainboard 8, mainboard 8 and power panel
10 signals are connected, and power panel 10 is connected with the signal of I O board 12；Image acquisition board 7, mainboard 8, power panel 10 and I O board 12 are fixed
In shell.
Imaging sensor 5 is fixed on case surface by the utility model, and heat can be radiated by shell, also solve figure
As sensor 5 be generally all mounted in circuit board generation the depth of field it is inconsistent the problem of.
Shell includes bucket 13 and shell back plate 16 in shell foreboard 6, shell, and shell foreboard 6 and shell back plate 16 are solid successively
It is tubular structure to be scheduled on bucket 13 in the two ends of bucket 13 in shell, shell, and image acquisition board 7 is fixed on shell foreboard 6.
Image acquisition board 7 is fixed on shell foreboard 6 by stud, and image acquisition board 7 is connected with the signal of mainboard 8, mainboard 8
It is connected with the signal of power panel 10, power panel 10 is connected with the signal of I O board 12.Image acquisition board 7 is connected with mainboard 8 by connector for substrate
Connect, mainboard 8 is connected with power panel 10 by connector for substrate, power panel 10 is connected with I O board 12 by arranging faller gill mother.
Image acquisition board 7 is fixed on shell foreboard 6 by 4 copper posts, and mainboard 8 is fixed to image acquisition board 7 by 4 copper posts
On, power panel 10 is fixed on mainboard 8 by 4 copper posts, and four fixed screws of the I O board 12 in shell back plate 16 are locked at electricity
In four copper posts on source plate 10.
Image acquisition board 7 includes optics socket, the drive circuit of imaging sensor 5 and AFE Acquisition Circuits, IMAQ
The picture signal collected is converted into data signal by plate 7, and is exported to mainboard 8.
The back side of imaging sensor 5 is provided with heat conductive silica gel, and its pin is connected with optics socket.
Mainboard 8 is provided with FPGA graphics processing units, DDR memory cell and MCU processing units, and mainboard 8 is to IMAQ
The view data that plate 7 is exported is acquired；Image is handled by FPGA graphics processing units again, reconvert is into network data
Bag is sent on power panel 10.
There are the circuit of network interface 11 and power circuit on power panel 10, power circuit is that mainboard 8 and each module provide electricity
Source, the also chip of network interface 11, and RJ45 network interfaces 11, the transmission for data.
A L-type thermally conductive sheet 9 is provided between mainboard 8 and network board, the material of thermally conductive sheet 9 is copper, and the one end of thermally conductive sheet 9 applies thermal conductive silicon
Fat is fitted with mainboard 8, and the other end is brought into close contact through power panel 10 and I O board 12 with shell.Meanwhile, the side of thermally conductive sheet 9 with it is outer
Bucket 13 is brought into close contact in shell, mainboard 8FPGA heat is directly delivered to by thermally conductive sheet 9 on shell, is accelerated radiating.
There is aluminium cover 2 top of imaging sensor 5, and aluminium cover 2 is covered on imaging sensor 5, and before 4 screw lockings to shell
On plate 6, optical filter 3 and dustproof silica gel 4 are fixed with aluminium cover 2, optical filter 3 is fitted with dustproof silica gel 4, aluminium cover 2, the and of optical filter 3
Dustproof silica gel 4 is fixed on case nose.
Case nose is provided with lens mount 1.Lens mount 1 is installed on shell foreboard 6, and the camera lens mouthful of lens mount 1 is straight for M58
Footpath, can connect M58 mouthfuls of camera lens, and F mouth mirror heads can also be connect by adaptor.
Shell is provided with aviation head fixture 14, and aviation head fixture 14 is provided with aviation head 15, the pin of aviation head 15
Welded with I O board 12, aviation head fixture 14 passes through two screw lockings with back plate.
Imaging sensor 5 is installed to aluminium shell surface by the utility model, makes the back side of imaging sensor 5 and shell abundant
Contact, makes the heat of imaging sensor 5 all reach on shell, can be kept away while imaging sensor 5 is installed on shell
Exempt from by the introduced error of pcb board and SMT, it is ensured that absolute parallel of lens plane and the sensitized lithography of imaging sensor 5.
Imaging sensor 5 is arranged on housing main body surface, and the electrical pin of imaging sensor 5 is reserved from case surface
Insert, be connected with Internal PCB in gap.
The one aluminium cover 2 in the top of imaging sensor 5, the surrounding of aluminium cover 2 has four screw holes, for being locked to housing main body
On, optical filter 3 can be installed on the aluminium cover 2 and dustproof silica gel 4 is padded, can be dust-proof, also image can be compressed by the pad of dustproof silica gel 4
Sensor 5, makes its firm.
The interface of aviation head 15 of camera, has an aviation head fixture 14, first fixes aviation head 15 installed in aviation head
On part 14, then the electrical pin of aviation head 15 is welded on PCB, after shell back plate 16 is installed, then passes through screw locking
Aviation head fixture 14, makes it be fixed on shell.So aviation head 15 can be freely separating with shell, facilitate aviation head 15 and electricity
The maintenance and replacing of road plate.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
Within the spirit and principle of utility model, any modification, equivalent substitution and improvements made etc. should be included in the utility model
Protection domain within.
Claims (9)
1. a kind of big target surface industrial camera, including shell, it is characterised in that：Also include imaging sensor, image acquisition board, master
Plate, power panel and I O board, described image sensor are fixed on the case surface, and its pin is worn to described from the case surface
Enclosure is connected with described image collection plate, and described image collection plate is connected with the mainboard signal, the mainboard with it is described
Power supply partitioned signal is connected, and the power panel is connected with the I O board signal；Described image collection plate, mainboard, power panel and I O board
It is each attached in the shell.
2. a kind of big target surface industrial camera according to claim 1, it is characterised in that：The shell include shell foreboard,
Bucket and shell back plate in shell, the shell foreboard and the shell back plate are sequentially fixed at the two ends of bucket in the shell, institute
It is tubular structure to state bucket in shell, and described image collection plate is fixed on the shell foreboard.
3. a kind of big target surface industrial camera according to claim 1 or 2, it is characterised in that：Described image collection plate includes
Optics socket, imaging sensor drive circuit and AFE Acquisition Circuits, described image collection plate is by the picture signal collected
Data signal is converted into, and is exported to mainboard.
4. a kind of big target surface industrial camera according to claim 3, it is characterised in that：The described image sensor back side is provided with
Heat conductive silica gel, its pin is connected with the optics socket.
5. a kind of big target surface industrial camera according to claim 1, it is characterised in that：The mainboard is provided with FPGA images
Processing unit, DDR memory cell and MCU processing units, the view data that the mainboard is exported to image acquisition board are acquired；
Image is handled by FPGA graphics processing units again, reconvert is sent on power panel into network packet.
6. a kind of big target surface industrial camera according to claim 1, it is characterised in that：There is network interface on the power panel
Circuit and power circuit.
7. a kind of big target surface industrial camera according to claim 1, it is characterised in that：Also include in aluminium cover, the aluminium cover
Optical filter and dustproof silica gel are fixed with, the optical filter is fitted with the dustproof silica gel, the aluminium cover, optical filter and dustproof silica gel
It is fixed on the case nose.
8. a kind of big target surface industrial camera according to claim 1 or 7, it is characterised in that：The case nose is provided with mirror
Headstock.
9. a kind of big target surface industrial camera according to claim 1, it is characterised in that：The shell is solid provided with aviation head
Determine part, the aviation head fixture is provided with aviation head, and the pin of the aviation head is welded with the I O board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720151506.1U CN206559475U (en) | 2017-02-20 | 2017-02-20 | A kind of big target surface industrial camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720151506.1U CN206559475U (en) | 2017-02-20 | 2017-02-20 | A kind of big target surface industrial camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206559475U true CN206559475U (en) | 2017-10-13 |
Family
ID=60010466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720151506.1U Active CN206559475U (en) | 2017-02-20 | 2017-02-20 | A kind of big target surface industrial camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206559475U (en) |
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2017
- 2017-02-20 CN CN201720151506.1U patent/CN206559475U/en active Active
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