CN206559350U - 4G communication modules - Google Patents

4G communication modules Download PDF

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Publication number
CN206559350U
CN206559350U CN201720114043.1U CN201720114043U CN206559350U CN 206559350 U CN206559350 U CN 206559350U CN 201720114043 U CN201720114043 U CN 201720114043U CN 206559350 U CN206559350 U CN 206559350U
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China
Prior art keywords
pci
interface
mini pci
electrically connected
baseband chip
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CN201720114043.1U
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Chinese (zh)
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任玉东
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Quectel Wireless Solutions Co Ltd
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Quectel Wireless Solutions Co Ltd
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Abstract

The utility model provides a kind of 4G communication modules, including baseband chip, radio-frequency module, mini PCI E interfaces modules and memory;The baseband chip is electrically connected with the radio-frequency module, the mini PCI E interfaces module and the memory respectively;The radio-frequency module is used to receive the first radiofrequency signal for stating baseband chip transmission, and outwards launches first radiofrequency signal;The radio-frequency module is also used and receives the second radiofrequency signal, and second radiofrequency signal is sent to the baseband chip;The mini PCI E interfaces module is used for external mainboard.4G communication modules of the present utility model realize plug and play by mini PCI E interface modules, install and dismantle and be very convenient.And 4G communication modules of the present utility model can the pin of self-defining mini PCI E interface modules, interface function according to demand, it is powerful.

Description

4G communication modules
Technical field
The utility model is related to communication technical field, more particularly to a kind of 4G (forth generation mobile communication technology) communication mould Block.
Background technology
With the development of electronic computer and bus interface technology, increasing intelligent, miniaturization, modular electricity Sub- product is appeared in people's life.Existing 4G communication modules typically use surface mounting technology (SMT), Background Grid array packages (LGA), leadless packages (LCC) etc., although the need for the people met in speed, but function phase is to single, and one Denier module, which goes wrong, to be needed to change or repairs highly inconvenient.
Utility model content
The technical problems to be solved in the utility model be in order to overcome prior art 4G communication modules break down when more Changing or repair highly inconvenient defect, there is provided a kind of 4G communication modules.
The utility model is to solve above-mentioned technical problem by following technical proposals:
A kind of 4G communication modules, its feature is that the 4G communication modules include baseband chip, radio-frequency module, mini A kind of PCI-E (data-interface) interface modules and memory;
The baseband chip is electrically connected with the radio-frequency module, the mini PCI-E interfaces module and the memory respectively Connect;
The radio-frequency module is used to receive the first radiofrequency signal for stating baseband chip transmission, and outwards launches described first and penetrate Frequency signal;The radio-frequency module is also used and receives the second radiofrequency signal, and second radiofrequency signal is sent to the base band core Piece;
The mini PCI-E interfaces module is used for external mainboard.
It is preferred that the mainboard includes mini PCI-E slots;
The mini PCI-E interfaces module includes:PCM (interfaces of transmission digital audio and video signals) interface, the first input are drawn Pin, the first output pin;The PCM data transmission pin of first input pin and the baseband chip is electrically connected, and described the One output pin is electrically connected with the pcm interface;The pcm interface is used to pass with the PCM data of the mini PCI-E slots Defeated pin electrical connection;
And/or, the mini PCI-E interfaces module includes:SIM (subscriber identification card) interface, the second input are drawn Pin, the second output pin;Second input pin is electrically connected with the SIM pins of the baseband chip, and second output is drawn Pin is electrically connected with the SIM interface;The SIM interface is used to electrically connect with the SIM pins of the mini PCI-E slots;
And/or, the mini PCI-E interfaces module includes:USB (USB) interface, the 3rd input pin, 3rd output pin;3rd input pin is electrically connected with the USB pins of the baseband chip, the 3rd output pin with The USB interface electrical connection;The USB interface is used to electrically connect with the USB pins of the mini PCI-E slots;
And/or, the mini PCI-E interfaces module includes:I2C interfaces (twin wire universal serial bus), the 4th input are drawn Pin, the 4th output pin;4th input pin is electrically connected with the I2C data transfer pins of the baseband chip, and described Four output pins are electrically connected with the I2C interfaces;The I2C interfaces are used to pass with the I2C data of the mini PCI-E slots Defeated pin electrical connection;
And/or, the mini PCI-E interfaces module includes:A kind of PCI-E (EBI) interface, the 5th input are drawn Pin, the 5th output pin;5th input pin is electrically connected with the PCI-E data transfer pins of the baseband chip, described 5th output pin is electrically connected with the PCI-E interface;The PCI-E interface is used for the PCI- with the mini PCI-E slots E data transfers pin is electrically connected.
It is preferred that the mini PCI-E interfaces module is electrically connected by PCI-E buses with the baseband chip.
It is preferred that the radio-frequency module includes radio frequency transceiver, power amplifier and duplexer;The radio frequency transceiver point Do not electrically connected with the power amplifier and the duplexer.
It is preferred that the memory is MCP memories.
It is preferred that the 4G communication modules also include power management module, the power management module respectively with the base Microarray strip, the radio-frequency module, the mini PCI-E interfaces module and memory electrical connection.
Positive effect of the present utility model is:4G communication modules of the present utility model pass through mini PCI-E interfaces Module realizes plug and play, installs and dismantles and be very convenient.And 4G communication modules of the present utility model can according to demand voluntarily Pin, the interface function of mini PCI-E interface modules are defined, it is powerful.
Brief description of the drawings
Fig. 1 is the module diagram of the 4G communication modules of the preferred embodiment of the utility model one.
Embodiment
Name preferred embodiment, and become apparent from intactly illustrating the utility model with reference to accompanying drawing.
As shown in figure 1, the 4G communication modules of the present embodiment include baseband chip 1, radio-frequency module 2, mini PCI-E interfaces Module 3, memory 4 and power management module 5.Baseband chip 1 is respectively with radio-frequency module 2, mini PCI-E interfaces module 3 and depositing Reservoir 4 is electrically connected.Power management module 5 respectively with baseband chip 1, radio-frequency module 2, mini PCI-E interfaces module 3 and storage Device 4 is electrically connected, to be powered to baseband chip 1, radio-frequency module 2, mini PCI-E interfaces module 3 and memory 4.mini PCI-E Interface module is used for external mainboard, and mainboard includes mini PCI-E slots, then 4G communication modules are by by mini PCI-E interfaces Module, which is plugged in, to be realized in mini PCI-E slots and is electrically connected with mainboard, to carry out data transmission.
Baseband chip uses the MDM9X40 of Qualcomm, is mainly used in realizing the processing of information and the management of system, including Encoding and decoding to launching or receiving signal, realize the modulation /demodulation of GSM (global system for mobile communications) system and the management of system And control.It is exactly specifically that during transmitting, baseband signal is converted to band signal;During reception, the band signal received It is converted into baseband signal.Meanwhile, be also responsible for address information, text information, pictorial information compiling there is provided including USB, PCM, Basic digital interface, analog interface and the man-machine interfaces such as I2C, SIM, SDIO (secure digital input-output card).
Radio-frequency module is used for the first radiofrequency signal for receiving baseband chip transmission, and outwards launches the first radiofrequency signal;Penetrate Frequency module is also used and receives the second radiofrequency signal, and the second radiofrequency signal is sent to baseband chip.Specifically, radio-frequency module includes Radio frequency transceiver 21, power amplifier 22 and duplexer 23, radio frequency transceiver 21 respectively with power amplifier 22 and duplexer 23 Electrical connection.Radio frequency transceiver is mainly used in realizing the transmitting and reception of radiofrequency signal, and power amplifier is mainly used in amplification transmitting Or the signal received, duplexer main function is will to launch and receive signal to be isolated, it is ensured that receive and transmitting can be simultaneously Normal work.
Mini PCI-E interface modules include:Pcm interface, the first input pin, the first output pin, SIM interface, second Input pin, the second output pin, USB interface, the 3rd input pin, the 3rd output pin, I2C interfaces, the 4th input pin, 4th output pin, PCI-E interface, the 5th input pin and the 5th output pin.The PCM of first input pin and baseband chip Data transfer pin is electrically connected, and the first output pin is electrically connected with pcm interface;Pcm interface is used for and mini PCI-E slots PCM data transmission pin electrical connection;Second input pin is electrically connected with the SIM pins of baseband chip, the second output pin and SIM Interface is electrically connected;SIM interface is used to electrically connect with the SIM pins of mini PCI-E slots;3rd input pin and baseband chip The electrical connection of USB pins, the 3rd output pin electrically connects with USB interface;USB interface is used for the USB with mini PCI-E slots Pin is electrically connected;4th input pin is electrically connected with the I2C data transfer pins of baseband chip, and the 4th output pin connects with I2C Mouth electrical connection;I2C interfaces are used to electrically connect with the I2C data transfer pins of mini PCI-E slots;5th input pin and base The PCI-E data transfers pin electrical connection of microarray strip, the 5th output pin is electrically connected with PCI-E interface;PCI-E interface be used for The PCI-E data transfers pin electrical connection of mini PCI-E slots.
In the present embodiment, mini PCI-E interfaces module is electrically connected by PCI-E buses with baseband chip.PCI-E buses It is attached using serial mode and data exchange, signal interference and the electromagnetic interference between cable can be greatly reduced, effectively Save space.Same system allows multiple mini PCI-E interfaces modules to exist, and each mini PCI-E interfaces module is set up Independent data transmission channel, it is not necessary to whole system bandwidth on demand, so message transmission rate is greatly improved.mini PCI-E interface module is a kind of general-purpose interface based on PCI-E buses, thus with high-performance, scalability strong, high-speed, The features such as high reliability.Mini PCI-E interface module main functions and the mini PCI-E slots on user circuit board (mainboard) Connect there is provided 4G communication modules and the extraneous interface being connected, by pcm interface, SIM interface, USB interface, I2C interfaces and PCI-E interface realizes the data communication between baseband chip and mainboard.Certainly, the 4G communication modules of the present embodiment can be according to demand The pin of self-defining mini PCI-E interface modules, interface function, it is powerful.
Memory in the present embodiment is MCP memories, and it uses a be integrated with 4Gb 8 of Taiwan ESMT companies Nand Flash and 2Gb 32 LPDDR2 memory chip, Nand Flash therein are mainly used in storing matching somebody with somebody for user Confidence ceases, and LPDDR2 is used to store the ephemeral data during user program operation.
Power management module uses the PMD9645 of Qualcomm, and the chip includes input power management, out-put supply pipe Reason, user interface three parts, are mainly used in realizing the management of power supply, and the Power convert of outside input is turned into multichannel has not With the voltage of driving force, it is powered, realizes to baseband chip, radio-frequency module, mini PCI-E interfaces module and memory The management of system power supply, is finally reached the purpose of power saving.
So as to which the 4G communication modules of the present embodiment can pass through mini PCI-E interfaces module and user circuit board (mainboard) Mini PCI-E slots are connected, very easily by the PCI-E interface of baseband chip, USB interface, pcm interface, I2C interfaces, SIM Interface is connected to user circuit board, and the associated peripheral circuits for coordinating user are that can be achieved to dial or receive calls, receive and dispatch short message shifting The transmitting-receiving of dynamic data and mobile communication.Powerful multiple interfaces are present embodiments provided, the demand of different user can be met, Simultaneously because employ mini PCI-E interface modules, thus it is strong etc. excellent with very strong flexibility, plug and play, scalability Point.
Although the foregoing describing embodiment of the present utility model, it will be appreciated by those of skill in the art that This is merely illustrative of, and protection domain of the present utility model is defined by the appended claims.Those skilled in the art On the premise of without departing substantially from principle of the present utility model and essence, various changes or modifications can be made to these embodiments, But these changes and modification each fall within protection domain of the present utility model.

Claims (6)

1. a kind of 4G communication modules, it is characterised in that the 4G communication modules include baseband chip, radio-frequency module, mini PCI- E interface module and memory;
The baseband chip is electrically connected with the radio-frequency module, the mini PCI-E interfaces module and the memory respectively;
The radio-frequency module is used to receive the first radiofrequency signal for stating baseband chip transmission, and outwards launches the first radio frequency letter Number;The radio-frequency module is also used and receives the second radiofrequency signal, and second radiofrequency signal is sent to the baseband chip;
The mini PCI-E interfaces module is used for external mainboard.
2. 4G communication modules as claimed in claim 1, it is characterised in that the mainboard includes mini PCI-E slots;
The mini PCI-E interfaces module includes:Pcm interface, the first input pin, the first output pin;First input Pin is electrically connected with the PCM data transmission pin of the baseband chip, and first output pin is electrically connected with the pcm interface Connect;The pcm interface is used to electrically connect with the PCM data transmission pin of the mini PCI-E slots;
And/or, the mini PCI-E interfaces module includes:SIM interface, the second input pin, the second output pin;Described Two input pins are electrically connected with the SIM pins of the baseband chip, and second output pin is electrically connected with the SIM interface; The SIM interface is used to electrically connect with the SIM pins of the mini PCI-E slots;
And/or, the mini PCI-E interfaces module includes:USB interface, the 3rd input pin, the 3rd output pin;Described Three input pins are electrically connected with the USB pins of the baseband chip, and the 3rd output pin is electrically connected with the USB interface; The USB interface is used to electrically connect with the USB pins of the mini PCI-E slots;
And/or, the mini PCI-E interfaces module includes:I2C interfaces, the 4th input pin, the 4th output pin;Described Four input pins are electrically connected with the I2C data transfer pins of the baseband chip, the 4th output pin and the I2C interfaces Electrical connection;The I2C interfaces are used to electrically connect with the I2C data transfer pins of the mini PCI-E slots;
And/or, the mini PCI-E interfaces module includes:PCI-E interface, the 5th input pin, the 5th output pin;It is described 5th input pin is electrically connected with the PCI-E data transfer pins of the baseband chip, the 5th output pin with it is described PCI-E interface is electrically connected;The PCI-E interface is used to be electrically connected with the PCI-E data transfer pins of the mini PCI-E slots Connect.
3. 4G communication modules as claimed in claim 1, it is characterised in that the mini PCI-E interfaces module passes through PCI-E Bus is electrically connected with the baseband chip.
4. 4G communication modules as claimed in claim 1, it is characterised in that the radio-frequency module includes radio frequency transceiver, power Amplifier and duplexer;The radio frequency transceiver is electrically connected with the power amplifier and the duplexer respectively.
5. 4G communication modules as claimed in claim 1, it is characterised in that the memory is MCP memories.
6. 4G communication modules as claimed in claim 1, it is characterised in that the 4G communication modules also include power management mould Block, the power management module respectively with the baseband chip, the radio-frequency module, the mini PCI-E interfaces module and institute State memory electrical connection.
CN201720114043.1U 2017-02-03 2017-02-03 4G communication modules Active CN206559350U (en)

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Application Number Priority Date Filing Date Title
CN201720114043.1U CN206559350U (en) 2017-02-03 2017-02-03 4G communication modules

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Application Number Priority Date Filing Date Title
CN201720114043.1U CN206559350U (en) 2017-02-03 2017-02-03 4G communication modules

Publications (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109862322A (en) * 2019-02-19 2019-06-07 深圳市研诺达科技有限公司 A kind of audio-visual acquisition equipment of 4G based on the transmission of UVC data

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109862322A (en) * 2019-02-19 2019-06-07 深圳市研诺达科技有限公司 A kind of audio-visual acquisition equipment of 4G based on the transmission of UVC data
CN109862322B (en) * 2019-02-19 2020-12-08 深圳市研诺达科技有限公司 4G audio-visual collection equipment based on UVC data transmission

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