CN206559240U - New H bridge inverters - Google Patents

Abstract

The utility model belongs to inverter technology field, the new H bridge inverters proposed, including casing, constant pressure capacitance group and inverter bridge group are provided with casing, constant pressure capacitance group is connected by the bus-bar being arranged on casing with inverter bridge group, inverter bridge group is connected with MOSfet driving plates, and MOSfet driving plates are arranged in casing；Inverter bridge group includes the four metal-oxide-semiconductor groups connect in H bridgings, and four metal-oxide-semiconductor group inputs are connected by pole plate with constant pressure capacitance group respectively, and output end is in parallel by exchanging output board, and pole plate is arranged in casing with output board is exchanged；Metal-oxide-semiconductor group is set on a heat sink, and radiator is arranged in casing by installation side plate；Radiator is two and is water-cooling plate, and its top and bottom is respectively arranged with a metal-oxide-semiconductor group, is internally provided with water channel.The utility model is skillfully constructed, and solves and installs substantial amounts of Absorption Capacitance additional between prior art bridge arm, causing the cost of inverter increases, complicated, safeguards the technical problem of the drawbacks such as inconvenience.

Description

New H bridge inverters

Technical field

The utility model belongs to inverter technology field, is related to a kind of new H bridge inverters.

Background technology

Series resonant circuit is voltage source inverter, and small perceptual state is presented in resonant tank, and inverter bridge is driven to voltage side Ripple switches, and power supply needs constant pressure source to provide electric energy, therefore power supply needs to add constant pressure electric capacity to ensure before inverter after rectification The stabilization of supply voltage.In general split or integral type high-frequency electrical gas holder, a block space can be specially stayed to fill constant pressure capacitor Group, capacitor bank is connected in inverter bridge input again by flexible cord, and electrically connection is loose for such a structure, between electric capacity and inverter Line or length are short, cause manufacturer's standard disunity, in addition more seriously between line lead-in inductance in high frequency high current Induced electromotive force can be produced under switching, the due to voltage spikes that electromotive force is produced is added to inverter input terminal, inverter is caused harm. To prevent the harm inverter bridge of due to voltage spikes from can install substantial amounts of Absorption Capacitance additional between bridge arm.So the cost of inverter can be caused Increase, it is complicated, safeguard the drawbacks such as inconvenience.

Utility model content

The utility model proposes a kind of new H bridge inverters, the cost increase of inverter in the prior art, structure are solved Complexity, safeguards the technical problem of the drawbacks such as inconvenience.

What the technical solution of the utility model was realized in：

Constant pressure capacitance group and inverter bridge group are provided with new H bridge inverters, including casing, the casing,

The constant pressure capacitance group is connected by bus-bar with the inverter bridge group,

The bus-bar is arranged on the casing by electric capacity supporting plate,

The inverter bridge group is connected with MOSfet driving plates, and the MOSfet driving plates are arranged in the casing.

As further technical scheme, the inverter bridge group includes the four metal-oxide-semiconductor groups connect in H bridgings,

Four metal-oxide-semiconductor group inputs are connected by pole plate with constant pressure capacitance group respectively, and output end is exported by exchanging Plate is in parallel, and the pole plate is arranged in the casing with output board is exchanged.

As further technical scheme, the metal-oxide-semiconductor group is set on a heat sink, and the radiator passes through installation side plate It is arranged in the casing.

As further technical scheme, the radiator is two and is water-cooling plate, and its top and bottom is The metal-oxide-semiconductor group is provided with, water channel is internally provided with,

The exchange output board is two, is arranged between two radiators, is respectively used to connection two described scattered The metal-oxide-semiconductor group that the metal-oxide-semiconductor group set at the top of hot device and bottom are set,

The pole plate is two, is arranged on the opposite side of the radiator, the top plate of the pole plate is with being arranged on described dissipate Metal-oxide-semiconductor group connection at the top of hot device, bottom plate is connected with being arranged on the metal-oxide-semiconductor group of the radiator bottom.

As further technical scheme, the water channel is two, and described water channel one end is connected by successive watercourse, another End is connected by water nozzle with supply channel or discharge pipe line.

As further technical scheme, there is space between the bottom plate of the constant pressure capacitance group and the casing.

As further technical scheme, the casing includes main box and is symmetricly set on the side of the main box both sides Casing,

The main box and the side box body are separated by side plate,

The constant pressure capacitance group and the inverter bridge group are arranged in the main box, and the MOSfet driving plates are set In the side box body.

As further technical scheme, two side box bodies are connected by connecting plate,

The support plate for extending the casing is provided with the top and bottom of the side plate.

As further technical scheme, the casing is metal cabinet, and is additionally provided with digital electricity thereon Flow table, handle and blow vent.

As further technical scheme, heavily loaded plug is provided with the casing, the heavily loaded plug includes heavy duty and inserted Seat and the plug being arranged on the heavily loaded socket, the heavily loaded socket are arranged on the casing.

The utility model use principle and have the beneficial effect that：

1st, the utility model by integrated design by constant pressure capacitor design in inversion box, be connected to by bus-bar inverse Become device (inverter bridge group) input, be allowed to lead-in inductance minimum, effectively reduce the lower induced electromotive force of high frequency high current switching Occurrence probability, and then avoid the due to voltage spikes that is produced by electromotive force and export to the normal damage of inverter so that when using without Substantial amounts of Absorption Capacitance need to be installed additional, the headspace of periphery is eliminated, power unit module structure dismounts easy maintenance, together When cause compact equipment, Electro Magnetic Compatibility is good, small volume, according to power need can easily add power cell, outside The features such as contour road is simple, can be applied on series resonance High Frequency Solid State induction heating power, realizes the unification of manufacturer's standard Change, and excessive electric capacity need not be added, reduce manufacturing cost.

Wherein, casing is made of metal, can shield interference of the external magnetic field to internal wiring, while in also shielding Interference of the portion magnetic field to periphery circuit.

Two metal-oxide-semiconductor groups share a radiator, pole plate and exchange output board, are ensuring each equal thermal diffusivity of metal-oxide-semiconductor group Well, while connection is stable, the terseness and compactedness of equipment overall structure are further ensure that, science is set, closed Reason.

Bus-bar is arranged on casing by electric capacity supporting plate so that there is certain space between bus-bar and casing, The heat produced when being easy to constant pressure capacitance group to work is discharged in time, it is ensured that the stability and Optimality of its working condition.

2nd, the metal-oxide-semiconductor of the utility model inverter is installed in parallel on a heat sink, point 4 bridge arm layouts, wherein radiator It is arranged on by installation side plate in casing, it is ensured that there is certain space between the shell of radiator and casing, it is ensured that thereon The thermal diffusivity of metal-oxide-semiconductor group is good, while being easy to operating personnel to install metal-oxide-semiconductor, increase in the different zones of radiator as needed Convenience and flexibility that equipment is installed.

Meanwhile, the utility model realizes the cooling of inverter bridge group by cooled plate, realizes the fast cooling of inverter bridge group, And different zones lowering temperature uniform, it is ensured that the stability during equipment use.

3rd, the driving plate of the utility model inverter point both sides symmetric configuration is placed in two in the both sides of H bridge arms by side plate In side metal cell (side box body), effectively increase the antijamming capability of equipment, it is ensured that the stability of equipment working state and Accuracy.

Two side box bodies are connected by connecting plate, are effectively increased the integrally-built stability of casing, are effectively reduced and set The probability deformed in standby use or transportation, is set scientific and reasonable.

4th, heavily loaded plug is provided with the utility model casing, the setting of heavily loaded plug causes device interior cable and outside Cable can be attached by the heavily loaded socket and plug of interconnection, and this setting effectively increases cable inside and outside equipment and connected Regularity, it is to avoid the cable that Internal cable and External cable are directly connected to cause be connected in a jumble, the drawbacks of safety coefficient is poor, So that device structure is compacter, clean and tidy, security is more preferably.

Brief description of the drawings

The utility model is described in further detail with reference to the accompanying drawings and detailed description.

Fig. 1 is the utility model structural representation；

Fig. 2 is the structural representation of exchange output board in the utility model；

Fig. 3 is the structural representation of water channel in the utility model；

In figure：1- casings, 11- main boxes, 12- side box bodies, 13- side plates, 14- support plates, 2- constant pressure capacitance groups, 3- inverter bridges Group, 31-MOS pipe groups, 311- the first metal-oxide-semiconductor groups, 312- the second metal-oxide-semiconductor groups, the metal-oxide-semiconductor groups of 313- the 3rd, the metal-oxide-semiconductors of 314- the 4th Group, 32- radiators, the radiators of 321- first, the radiators of 322- second, 33- exchange output boards, the exchange output boards of 331- first, 332- second exchanges output board, 34- pole plates, the pole plates of 341- first, the pole plates of 342- second, 35- installation side plates, 36- connectors, 4- Bus-bar, 5- water channels, 6- successive watercourses, 7- water nozzles, 8- connecting plates, 9- heavy duty plugs, 91- heavy duty sockets, 92- plugs, 10- numbers Word current table, 15- handles, 16- blow vents, 17- electric capacity supporting plates, 18-MOSfet driving plates.

Embodiment

Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belongs to the scope of the utility model protection.

As shown in Figures 1 to 3, the utility model proposes new H bridge inverters, including casing 1 sets persevering in casing 1 Voltage capacitance group 2 and inverter bridge group 3,

Constant pressure capacitance group 2 is connected by the bus-bar 4 being arranged on casing 1 with inverter bridge group 3,

Inverter bridge group 3 is connected with MOSfet driving plates 18, and MOSfet driving plates 18 are arranged in casing 1.

The utility model by integrated design by constant pressure capacitor design in inversion box, inversion is connected to by bus-bar Device (inverter bridge group 3) input, is allowed to lead-in inductance minimum, effectively reduces the hair of the lower induced electromotive force of high frequency high current switching Raw probability, and then the due to voltage spikes output produced by electromotive force is avoided to the normal damage of inverter so that need not when using Install substantial amounts of Absorption Capacitance additional, eliminate the headspace of periphery, power unit module structure dismounts easy maintenance, simultaneously So that compact equipment, Electro Magnetic Compatibility is good, small volume needs easily add power cell, periphery according to power The features such as circuit is simple, can be applied on series resonance High Frequency Solid State induction heating power, realize the unitized of manufacturer's standard, And excessive electric capacity need not be added, reduce manufacturing cost.

Further, inverter bridge group 3 includes the four metal-oxide-semiconductor groups 31 connect in H bridgings,

Four inputs of metal-oxide-semiconductor group 31 are connected by pole plate 34 with constant pressure capacitance group 2 respectively, and output end is exported by exchanging Plate 33 is in parallel, and pole plate 34 is arranged in casing 1 with output board 33 is exchanged.

Further, metal-oxide-semiconductor group 31 is arranged on radiator 32, and radiator 32 is arranged in casing 1 by installation side plate 35.

The metal-oxide-semiconductor of inverter is installed in parallel on radiator 32, point 4 bridge arm layouts, and wherein radiator 32 is by installing Side plate 35 is arranged in casing 1, it is ensured that there is certain space between the shell of radiator 32 and casing 1, it is ensured that MOS thereon The thermal diffusivity of pipe group 31 is good, while being easy to operating personnel to install metal-oxide-semiconductor, increase in the different zones of radiator 32 as needed Convenience and flexibility that equipment is installed.

Further, radiator 32 is two and is water-cooling plate, and its top and bottom is provided with metal-oxide-semiconductor group 31, Water channel 5 is internally provided with,

It is two to exchange output board 33, is arranged between two radiators 32, is respectively used to two radiators 32 of connection and pushes up The metal-oxide-semiconductor group 31 that the metal-oxide-semiconductor group 31 and bottom that portion is set are set,

Pole plate 34 is two, is arranged on the opposite side of radiator 32, the top plate of pole plate 34 is with being arranged on the top of radiator 32 Metal-oxide-semiconductor group 31 connect, bottom plate is connected with being arranged on the metal-oxide-semiconductor group 31 of the bottom of radiator 32.

Four metal-oxide-semiconductor groups 31 in the utility model inverter bridge group 3 are designated as the first metal-oxide-semiconductor group 311, the second metal-oxide-semiconductor respectively Group the 312, the 3rd metal-oxide-semiconductor group 313 and the 4th metal-oxide-semiconductor group 314, radiator 32 is two and is designated as the first radiator 321 and the respectively Second radiator 322, exchange output board 33 is designated as the first exchange output board 331 for two and exchanges output board 332, pole with second respectively Plate 34 is two and is designated as the first pole plate 341 and the second pole plate 342 respectively.Wherein, the first metal-oxide-semiconductor group 311 and the second metal-oxide-semiconductor group 312 are located at the top and bottom of the first radiator 321 respectively, and are connected respectively with the top plate and bottom plate of the first pole plate 341；3rd The metal-oxide-semiconductor group 314 of metal-oxide-semiconductor group 313 and the 4th respectively be located at the second radiator 322 top and bottom, and respectively with the second pole plate 342 top plate and bottom plate connection；First exchange output board 331 is connected with the first metal-oxide-semiconductor group 311, the 3rd metal-oxide-semiconductor group 313, and second Exchange output board 332 is connected with the second metal-oxide-semiconductor group 312, the 4th metal-oxide-semiconductor group 314.

This setting causes two metal-oxide-semiconductor groups 31 to share a radiator 32, pole plate 34 and exchange output board 33, is ensuring While each metal-oxide-semiconductor 31 equal thermal diffusivities of group are good, connection is stable, the terseness of equipment overall structure further ensure that And compactedness, set science, rationally.

Further, metal-oxide-semiconductor group 31 is connected by connector 36 with exchange output board 33 and pole plate 34,

Water channel 5 is two, and the one end of water channel 5 is connected by successive watercourse 6, and the other end passes through water nozzle 7 and supply channel or row Water lines are connected.

In use, cooling water enters the water channel 5 being attached thereto by water nozzle 7 in supply channel, then sequentially pass through the water channel 5th, successive watercourse 6, another water channel 5 and discharge pipe line outflow.Cooling water is during water channel 5 flows by the heat band in cooled plate Walk, and then realize the temperature adjustment of metal-oxide-semiconductor group thereon, it is remained under rational operating temperature, it is ensured that its work shape State is good.Meanwhile, this setting causes inverter bridge group 3 to cool quickly, and different zones lowering temperature uniform, it is ensured that equipment was used Stability in journey.

Further, there is space between the bottom plate of constant pressure capacitance group 2 and casing 1.

There is certain space between constant pressure capacitance group 2 and casing 1, when being easy to the constant pressure capacitance group to work the heat that produces and When discharge, it is ensured that the stability and Optimality of its working condition.

Further, casing 1 includes main box 11 and is symmetricly set on the side box body 12 of the both sides of main box 11,

Main box 11 and side box body 12 are separated by side plate 13,

Constant pressure capacitance group 2 and inverter bridge group 3 are arranged in main box 11, and MOSfet driving plates 18 are arranged on side box body 12 It is interior.

The driving plate of inverter point both sides symmetric configuration is placed in both sides metal cell in the both sides of H bridge arms by side plate 13 In (side box body 12), the antijamming capability of equipment is effectively increased, it is ensured that the stability and accuracy of equipment working state.

Further, two side box bodies 12 are connected by connecting plate 8,

The top and bottom of side plate 13 are provided with the support plate 14 for extending casing 1.

The setting of connecting plate 8 effectively increases the integrally-built stability of casing 1, effectively reduces equipment and uses or transport During the probability that deforms, set scientific and reasonable.Here connecting plate 8 can use aluminium, it is ensured that its relatively low quality, preferably Mechanical and physical performance and longer service life.

The setting of support plate 14 serves the effect of cushion block so that after equipment is placed on desktop or ground, can be propped, more It is convenient for the user to operate, meet its use requirement.

Further, casing 1 is metal cabinet, and is additionally provided with digital electronic ammeter 10, handle 15 thereon and leads to Gas port 16.

Casing 1 is made of metal, interference of the external magnetic field to internal wiring can be shielded, while can also shield inner magnet Interference of the field to periphery circuit.

User's facilities for observation working condition at any time is easy in the setting of digital electronic ammeter 10, meets its use requirement, setting section Learn, rationally,

The setting of handle 15 is easy to user to carry and mobile,

The setting of blow vent 16 effectively ensure that the thermal diffusivity of equipment is good, further ensure different electrically members in equipment Stable working state, the safety of part.

Further, heavily loaded plug 9 is provided with casing 1, heavily loaded plug 9 includes heavily loaded socket 91 and is arranged on heavily loaded socket Plug 92 on 91, heavily loaded socket 91 is arranged on casing 1.

The setting of heavily loaded plug 9 cause device interior cable and External cable can by the heavily loaded socket 91 of interconnection and Plug 92 is attached, this setting effectively increases the regularity that cable inside and outside equipment is connected, it is to avoid Internal cable with it is outer The cable that portion's cable is directly connected to cause connects the drawbacks of mixed and disorderly, safety coefficient is poor so that device structure is compacter, clean and tidy, Security is more preferably.

Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model Within the spirit and principle of utility model, any modification, equivalent substitution and improvements made etc. should be included in the utility model Protection domain within.

Claims (10)

1. new H bridge inverters, it is characterised in that including casing (1), be provided with the casing (1) constant pressure capacitance group (2) and Inverter bridge group (3),

The constant pressure capacitance group (2) is connected by bus-bar (4) with the inverter bridge group (3),

The bus-bar (4) is arranged on the casing (1) by electric capacity supporting plate (17),

The inverter bridge group (3) is connected with MOSfet driving plates (18), and the MOSfet driving plates (18) are arranged on the casing (1) in.

2. new H bridge inverters according to claim 1, it is characterised in that the inverter bridge group (3) includes being in H bridgings The four metal-oxide-semiconductor groups (31) connect,

Four metal-oxide-semiconductor group (31) inputs are connected by pole plate (34) with constant pressure capacitance group (2) respectively, and output end is by handing over Flow output board (33) in parallel, the pole plate (34) is arranged in the casing (1) with output board (33) is exchanged.

3. new H bridge inverters according to claim 2, it is characterised in that the metal-oxide-semiconductor group (31) is arranged on radiator (32) on, the radiator (32) is arranged in the casing (1) by installation side plate (35).

4. new H bridge inverters according to claim 3, it is characterised in that the radiator (32) is two and is Water-cooling plate, its top and bottom are provided with the metal-oxide-semiconductor group (31), are internally provided with water channel (5),

The exchange output board (33) is two, is arranged between two radiators (32), is respectively used to connect two institutes The metal-oxide-semiconductor group (31) that the metal-oxide-semiconductor group (31) set at the top of radiator (32) and bottom are set is stated,

The pole plate (34) is two, is arranged on the opposite side of the radiator (32), the top plate of the pole plate (34) and setting The metal-oxide-semiconductor group (31) connection at the top of the radiator (32), bottom plate and the institute for being arranged on the radiator (32) bottom State metal-oxide-semiconductor group (31) connection.

5. new H bridge inverters according to claim 4, it is characterised in that the water channel (5) is two, the water channel (5) one end is connected by successive watercourse (6), and the other end is connected by water nozzle (7) with supply channel or discharge pipe line.

6. new H bridge inverters according to claim 1, it is characterised in that the constant pressure capacitance group (2) and the casing (1) there is space between bottom plate.

7. new H bridge inverters according to claim 1, it is characterised in that the casing (1) include main box (11) and The side box body (12) of the main box (11) both sides is symmetricly set on,

The main box (11) and the side box body (12) are separated by side plate (13),

The constant pressure capacitance group (2) and the inverter bridge group (3) are arranged in the main box (11), the MOSfet drivings Plate (18) is arranged in the side box body (12).

8. new H bridge inverters according to claim 7, it is characterised in that two side box bodies (12) pass through connection Plate (8) is connected,

The support plate (14) for extending the casing (1) is provided with the top and bottom of the side plate (13).

9. new H bridge inverters according to claim 1, it is characterised in that the casing (1) is metal cabinet, and its On be additionally provided with digital electronic ammeter (10), handle (15) and blow vent (16).

10. the new H bridge inverters according to any one of claim 1~9, it is characterised in that set on the casing (1) There is heavily loaded plug (9), the heavily loaded plug (9) includes heavily loaded socket (91) and the plug being arranged on the heavily loaded socket (91) (92), the heavily loaded socket (91) is arranged on the casing (1).