CN206538372U - The viscous diaphragm of the quick solution of one kind heating - Google Patents
The viscous diaphragm of the quick solution of one kind heating Download PDFInfo
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- CN206538372U CN206538372U CN201720177781.0U CN201720177781U CN206538372U CN 206538372 U CN206538372 U CN 206538372U CN 201720177781 U CN201720177781 U CN 201720177781U CN 206538372 U CN206538372 U CN 206538372U
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- layer
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- heat conduction
- heating
- adhesive
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Abstract
The utility model is related to a kind of viscous diaphragm of the quick solution of heating; the thermal contraction film layer including heat shrink, heating release sticky heat conduction pyrolysis adhesive-layer, release layer successively; the heat conduction pyrolysis adhesive-layer is coated with to be formed on the release layer, and the heat conduction pyrolysis adhesive-layer is fitted with the thermal contraction film layer.The viscous diaphragm of the quick solution of the utility model one kind heating; by building new heat conduction pyrolysis adhesive-layer; the innovation in adhesive-layer in terms of addition heat filling is pyrolyzed in heat conduction; because heat shrink films heat shrink is rolled and the conduction of heat filling accelerated heat; realize the quick and complete solution of heating viscous; the efficiency of processing procedure is substantially increased in actual applications, while some can also not applied in heatproof component processing well in electronic product.
Description
Technical field
The utility model is related to a kind of viscous diaphragm of solution, more particularly to a kind of viscous diaphragm of the quick solution of heating.
Background technology
With the development of science and technology, electronic product plays more and more important role, various electronics productions in people live
Product need to carry out CNC processing to parts such as metal edge frame therein, glass.Need to use diaphragm in process to electronics production
Product part is fixed and protective effect.The viscous diaphragm of pyrolysis is good due to initial viscosity, and electronic product components can be played well
Fixation and protective effect, and realize easily to peel off by mode of heating after machining and do not stay cull, in electronic product components
With more and more extensive in processing.But diaphragm is glued in current pyrolysis, needed after electronic product components are machined by
One hot environment, and need the long period to realize that solution is viscous completely, diaphragm could be realized easily to peel off and removed, this mistake
Journey have impact on processing procedure efficiency and to some not the part of heatproof be not suitable for using.So diaphragm is glued in the pyrolysis of routine on the market
Certain limitation is have received in use.
Utility model content
The utility model solve technical problem be:A kind of viscous diaphragm of the quick solution of heating is built, prior art solution is overcome
Viscous diaphragm solution glues slow-footed technical problem.
The technical solution of the utility model is:A kind of viscous diaphragm of the quick solution of heating is built, successively including heat shrink
Thermal contraction film layer, heating release heat conduction pyrolysis adhesive-layer, the release layer of viscosity, and the heat conduction pyrolysis adhesive-layer is coated with to be formed in institute
State on release layer, the heat conduction pyrolysis adhesive-layer is fitted with the thermal contraction film layer.
Further technical scheme of the present utility model is:The thermal contraction thicknesses of layers scope is 25 microns to 50 microns.
Further technical scheme of the present utility model is:The heat conduction pyrolysis adhesive-layer thickness range is 20 microns micro- to 40
Rice.
Further technical scheme of the present utility model is:The release layer thickness range is 10 microns to 20 microns.
It is of the present utility model to have the technical effect that:A kind of viscous diaphragm of the quick solution of heating is built, successively including heat shrink
Thermal contraction film layer, heating release heat conduction pyrolysis adhesive-layer, the release layer of viscosity, and the heat conduction pyrolysis adhesive-layer is coated with to be formed in institute
State on release layer, the heat conduction pyrolysis adhesive-layer is fitted with the thermal contraction film layer.The quick solution of the utility model one kind heating is viscous
Diaphragm, by building new heat conduction pyrolysis adhesive-layer, the wound in adhesive-layer in terms of addition heat filling is pyrolyzed in heat conduction
Newly, rolled and conducted with heat filling accelerated heat due to heat shrink films heat shrink, realized the quick and complete solution of heating and glue, in reality
The efficiency of processing procedure is substantially increased in the application of border, while some can not also be obtained well in heatproof component processing in electronic product
Using.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
With reference to specific embodiment, technical solutions of the utility model are further illustrated.
As shown in figure 1, embodiment of the present utility model is:A kind of viscous diaphragm of the quick solution of heating is built, successively
Thermal contraction film layer 1 including heat shrink, heating release heat conduction pyrolysis adhesive-layer 2, the release layer 3 of viscosity, the heat conduction pyrolysis
The coating of adhesive-layer 2 is formed on the release layer 3, and the heat conduction pyrolysis adhesive-layer 2 is fitted with the thermal contraction film layer 1.
As shown in figure 1, specific implementation process of the present utility model is:The use of thermal contraction film layer 1 polyester thermal contraction film,
Any one in polyethylene heat-shrinkage film, polyvinyl chloride heat shrinkable film, polystyrene heat shrink films.The heat shrink films thickness
It is 25 microns to 50 microns to spend scope.The viscous adhesive layer 2 of heat conduction pyrolysis includes solvent-borne type pyrolysis viscose glue and sticks agent, curing agent, hair
Particle, heat filling are steeped, expanded particle, 80-150 DEG C of blowing temperature are then added wherein, heat filling is aluminum oxide, oxidation
Any of magnesium, zinc oxide, aluminium nitride, boron nitride, carborundum, graphite, dry by coater oven and are made.The foaming grain
The mass ratio of son addition is 3%-20%, and the mass ratio of heat filling addition is 0.5%-5%, and sticky 10 grams of scope is extremely
2000 grams/25mm.The heat conduction pyrolysis adhesive-layer thickness range is 20 microns to 40 microns.
The thickness of release layer 3 is 0.01-0.2mm, including release liners and mould release membrance, 1 gram to 100 grams of off-type force scope/
25mm.The release layer thickness range is 10 microns to 20 microns.
To realize a kind of production for heating the viscous diaphragm of quick solution, its production process is as follows:
Embodiment:
The first step, chooses the suitable polyester thermal contraction film of thickness;
Second step, expanded particle is added by being pyrolyzed in solvent-borne type during viscose glue sticks agent, curing agent, the UV solution viscose glues of composition,
80 DEG C -100 DEG C of the expanded particle blowing temperature added, addition mass ratio is 10%, and heat filling is added in adhesive,
Added heat filling is aluminium nitride, and addition mass ratio is 3%, and is added after appropriate solvent dilution, is scraped with nick, comma
A kind of coating method is coated on the layer upper surface for the mould release membrance that thickness is 0.05mm in knife, slit, is made after oven drying
The viscous adhesive layer of heat conduction pyrolysis of 0.03mm thickness, 0.04mm gauge polyester heat shrink films of fitting.Quickly solution is viscous for obtained heating
Diaphragm may be implemented in 85 DEG C of hot water and is pyrolyzed completely in 5s, is kept completely separate with affixed object, realize the viscous target of quick solution.
It is of the present utility model to have the technical effect that:A kind of viscous diaphragm of the quick solution of heating is built, successively including heat shrink
Thermal contraction film layer 1, heating release heat conduction pyrolysis adhesive-layer 2, the release layer 3 of viscosity, and the heat conduction pyrolysis coating of adhesive-layer 2 is formed
On the release layer 3, the heat conduction pyrolysis adhesive-layer 2 is fitted with the thermal contraction film layer 1.The utility model one kind heating is fast
The viscous diaphragm of speed solution, by building new heat conduction pyrolysis adhesive-layer, heat filling side is added in heat conduction pyrolysis adhesive-layer
The innovation in face, is rolled due to heat shrink films heat shrink and is conducted with heat filling accelerated heat, realizes the quick and complete solution of heating
It is viscous, the efficiency of processing procedure is substantially increased in actual applications, while some can not also be obtained in heatproof component processing in electronic product
To good application.
Above content is to combine specific preferred embodiment further detailed description of the utility model, it is impossible to
Assert that specific implementation of the present utility model is confined to these explanations.For the ordinary skill of the utility model art
For personnel, without departing from the concept of the premise utility, some simple deduction or replace can also be made, should all be regarded
To belong to protection domain of the present utility model.
Claims (4)
1. the viscous diaphragm of the quick solution of one kind heating, it is characterised in that the thermal contraction film layer including heat shrink, heating are released successively
Heat conduction pyrolysis adhesive-layer, the release layer of viscosity, the heat conduction pyrolysis adhesive-layer are coated with to be formed on the release layer, the heat conduction
Pyrolysis adhesive-layer is fitted with the thermal contraction film layer.
2. heat the viscous diaphragm of quick solution according to claim 1, it is characterised in that the thermal contraction thicknesses of layers scope is
25 microns to 50 microns.
3. the viscous diaphragm of quick solution is heated according to claim 1, it is characterised in that the heat conduction is pyrolyzed adhesive-layer thickness model
Enclose for 20 microns to 40 microns.
4. the viscous diaphragm of quick solution is heated according to claim 1, it is characterised in that the release layer thickness range is 10 micro-
Rice is to 20 microns.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201720177781.0U CN206538372U (en) | 2017-02-24 | 2017-02-24 | The viscous diaphragm of the quick solution of one kind heating |
Applications Claiming Priority (1)
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CN201720177781.0U CN206538372U (en) | 2017-02-24 | 2017-02-24 | The viscous diaphragm of the quick solution of one kind heating |
Publications (1)
Publication Number | Publication Date |
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CN206538372U true CN206538372U (en) | 2017-10-03 |
Family
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CN201720177781.0U Active CN206538372U (en) | 2017-02-24 | 2017-02-24 | The viscous diaphragm of the quick solution of one kind heating |
Country Status (1)
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CN (1) | CN206538372U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109449080A (en) * | 2018-11-12 | 2019-03-08 | 京东方科技集团股份有限公司 | The minimizing technology of glue film and preparation method thereof, display device and glue film |
CN115322697A (en) * | 2022-08-31 | 2022-11-11 | 苏州赛伍应用技术股份有限公司 | Low-temperature foaming type thermal viscosity-reducing adhesive tape and preparation method and application thereof |
-
2017
- 2017-02-24 CN CN201720177781.0U patent/CN206538372U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109449080A (en) * | 2018-11-12 | 2019-03-08 | 京东方科技集团股份有限公司 | The minimizing technology of glue film and preparation method thereof, display device and glue film |
US11655399B2 (en) | 2018-11-12 | 2023-05-23 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Adhesive film, preparation method thereof, display device and method for removing adhesive film |
CN115322697A (en) * | 2022-08-31 | 2022-11-11 | 苏州赛伍应用技术股份有限公司 | Low-temperature foaming type thermal viscosity-reducing adhesive tape and preparation method and application thereof |
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Legal Events
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 518000 building B3, Hengkeng Industrial Park, guantian community, Beihuan Road, Shiyan street, Bao'an District, Shenzhen City, Guangdong Province Code: t7-0202-b00210, 1st, 2nd and 3rd floors Patentee after: SHENZHEN YIDAXING TECHNOLOGY Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Shiyan Town, loop AFP Science Park building B3 Patentee before: SHENZHEN YIDAXING INDUSTRIAL MATERIAL Co.,Ltd. |
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CP03 | Change of name, title or address |