CN206522945U - A kind of miniature dehydrating unit in cabinet - Google Patents
A kind of miniature dehydrating unit in cabinet Download PDFInfo
- Publication number
- CN206522945U CN206522945U CN201720144866.9U CN201720144866U CN206522945U CN 206522945 U CN206522945 U CN 206522945U CN 201720144866 U CN201720144866 U CN 201720144866U CN 206522945 U CN206522945 U CN 206522945U
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- China
- Prior art keywords
- chilling plate
- fin
- semiconductor chilling
- sheet metal
- dehydrating unit
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Abstract
The utility model discloses a kind of miniature dehydrating unit in cabinet, including heat abstractor, semiconductor chilling plate, condensate film and radiator fan, the hot face of the semiconductor chilling plate is provided with heat abstractor, the heat abstractor includes fin, metal tube and sheet metal, metal tube is provided with the fin, sheet metal is provided with the metal tube, the back side of the sheet metal is provided with radiator fan, the fin is connected with semiconductor chilling plate, and the huyashi-chuuka (cold chinese-style noodles) of the semiconductor cooling piece is provided with condensate film.A kind of dehydrating unit in cabinet of the present utility model, can efficiently dehumidify, semiconductor chilling plate can effectively radiate.
Description
Technical field
The utility model is related to dehumidifying technology field, more particularly to a kind of miniature dehydrating unit in cabinet.
Background technology
Radiating mode for the semiconductor cooling fin of dehumidifying is to use common aluminium heat sink, and it passes through fixed branch
Together with frame, screw are carried on the back with cooling fin, then by the outside air draft of fan, fin is cooled, so as to be radiated.For
Defrost mode on the condensate film of semiconductor cooling fin is, using conventional fan alignment condensate film blowing, to lift the temperature of condensate film
Degree, to reach defrosting function.Because the hot face back of the body of semiconductor cooling fin has aluminium heat sink and fan, huyashi-chuuka (cold chinese-style noodles) is carried on the back again condensate film,
Condensate film front is provided with fan again, and air flow is not smooth, and the air for not having substantial amounts of low temperature during radiating is supplemented, and is entered during defrosting
The air gone out is mutually collided, and allows defrosting function to have a greatly reduced quality.Direct result is exactly that the hot face of semiconductor cooling fin can not quickly dissipate
Heat, huyashi-chuuka (cold chinese-style noodles) just can not cool quickly, directly result in effect on moisture extraction bad；Secondly it is exactly, when environment temperature is quickly less than -5 DEG C, to remove
White function does not serve too big at all.
Utility model content
For the dehydrating unit effect on moisture extraction in above-mentioned existing cabinet it is bad the problem of, skill to be solved in the utility model
Art problem is to provide a kind of miniature dehydrating unit in cabinet.
In order to solve the above technical problems, the technical solution of the utility model is：A kind of miniature dehumidifying dress in cabinet
Put, including heat abstractor, semiconductor chilling plate, condensate film and radiator fan, the hot face of the semiconductor chilling plate is provided with scattered
Thermal, the heat abstractor includes being provided with metal tube, the gold on fin, metal tube and sheet metal, the fin
Sheet metal is provided with category pipe, the back side of the sheet metal is provided with radiator fan, and the fin connects with semiconductor chilling plate
Connect, the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate is provided with condensate film.
The preferred scheme of such scheme is：The fin is copper sheet, and the metal tube is copper pipe, and the sheet metal is aluminium
Matrix, copper material has good thermal diffusivity, and the heat in the hot face of semiconductor chilling plate can be transmitted into aluminium profiles piece well
On.
The preferred scheme of such scheme is：Thermal paste, fin are provided between the fin and semiconductor chilling plate
Pass through thermal paste and the hot face good contact of semiconductor chilling plate.
The preferred scheme of such scheme is：The front end of the sheet metal is provided with ventilating opening, by fan from outside to inside
Direct-ventilation heat dissipating, so that the heat in the hot face of semiconductor chilling plate be scattered away, can be reduced quickly by the disperses heat on sheet metal
Its temperature, and then coldface temperature is reduced, efficiently dehumidified by condensate film.
Beneficial effect：Using above-mentioned technical proposal, a kind of miniature dehydrating unit in cabinet of the present utility model, copper
Piece loads onto condensate film, passes through copper by thermal paste and the hot face good contact of semiconductor chilling plate, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate
The heat in the hot face of semiconductor chilling plate, can be transmitted on aluminium profiles piece by the excellent radiating effect of material well.In aluminium profiles piece
The back side is provided with radiator fan, is dried outside in towards aluminium profiles piece, while open a ventilating opening before aluminium profiles piece, allows fan
Wind lead directly to., can be quickly by the disperses heat on aluminium profiles piece, so as to will partly lead by the direct-ventilation heat dissipating of fan from outside to inside
The heat in the hot face of body cooling piece is scattered away, and reduces its temperature, and then reduces coldface temperature, is efficiently dehumidified by condensate film.This
A kind of dehydrating unit in cabinet of utility model, can efficiently dehumidify, semiconductor chilling plate can effectively radiate.
Brief description of the drawings
Fig. 1 is a kind of structural representation of miniature dehydrating unit in cabinet of the utility model；
Fig. 2 is the structural representation of heat abstractor in the utility model.
In figure：1- metal tubes, 2- sheet metals, 3- fin, 4- semiconductor chilling plates, 5- condensate films, 6- fans.
Embodiment
Embodiment of the present utility model is described further below in conjunction with the accompanying drawings.Herein it should be noted that
Explanation for these embodiments is used to help understand the utility model, but does not constitute to restriction of the present utility model.This
Outside, as long as technical characteristic involved in each embodiment of the utility model disclosed below does not constitute conflict each other
It can just be mutually combined.
As shown in figure 1, a kind of miniature dehydrating unit in cabinet of the present embodiment, including heat abstractor, semiconductor
Cooling piece 4, condensate film 5 and radiator fan 6, the hot face of semiconductor chilling plate 4 are provided with heat abstractor, and the heat abstractor includes
It is provided with fin 3, metal tube 1 and sheet metal 2, fin 3 on metal tube 1, metal tube 1 and is provided with sheet metal 2, sheet metal
2 back side is provided with radiator fan 6, and fin 3 is connected with semiconductor chilling plate 4, and the huyashi-chuuka (cold chinese-style noodles) of semiconductor cooling piece 4 is provided with condensation
Piece 5.
Wherein, fin 3 is copper sheet, and metal tube 1 is copper pipe, and sheet metal 2 is aluminium profiles piece, and copper material has good dissipate
It is hot, the heat in the hot face of semiconductor chilling plate can be well transmitted on aluminium profiles piece.
Wherein, thermal paste is provided between fin 3 and semiconductor chilling plate 4, fin passes through thermal paste and semiconductor
The hot face good contact of cooling piece.
Wherein, the front end of sheet metal 2 is provided with ventilating opening, can be quickly by the direct-ventilation heat dissipating of fan from outside to inside
By the disperses heat on aluminium profiles piece, so that the heat in the hot face of semiconductor chilling plate be scattered away, its temperature is reduced, and then reduce huyashi-chuuka (cold chinese-style noodles)
Temperature, is efficiently dehumidified by condensate film.
In summary, a kind of miniature dehydrating unit in cabinet provided by the utility model, copper sheet passes through radiating
The hot face good contact of glue and semiconductor chilling plate, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate loads onto condensate film, passes through the good of copper material
The heat in the hot face of semiconductor chilling plate, can be transmitted on aluminium profiles piece by good thermal diffusivity well.It is provided with the aluminium profiles piece back side
Radiator fan, dries outside in towards aluminium profiles piece, while opening a ventilating opening before aluminium profiles piece, allows the wind of fan to lead directly to.
, can be quickly by the disperses heat on aluminium profiles piece, so that by semiconductor chilling plate by the direct-ventilation heat dissipating of fan from outside to inside
The heat in hot face is scattered away, and reduces its temperature, and then reduces coldface temperature, is efficiently dehumidified by condensate film.The utility model
A kind of dehydrating unit in cabinet, can efficiently dehumidify, semiconductor chilling plate can effectively radiate.
Embodiment of the present utility model is explained in detail above in association with accompanying drawing, but the utility model is not limited to be retouched
The embodiment stated.For a person skilled in the art, it is right in the case where not departing from the utility model principle and spirit
These embodiments carry out a variety of change, modification, replacement and modification, still fall within protection domain of the present utility model.
Claims (4)
1. a kind of miniature dehydrating unit in cabinet, including heat abstractor, semiconductor chilling plate, condensate film and radiation air
Fan, it is characterised in that：The hot face of the semiconductor chilling plate is provided with heat abstractor, and the heat abstractor includes fin, gold
It is provided with category pipe and sheet metal, the fin on metal tube, the metal tube and is provided with sheet metal, the back of the body of the sheet metal
Face is provided with radiator fan, and the fin is connected with semiconductor chilling plate, and the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate is provided with cold
Solidifying piece.
2. a kind of miniature dehydrating unit in cabinet according to claim 1, it is characterised in that:The fin is
Copper sheet, the metal tube is copper pipe, and the sheet metal is aluminium profiles piece.
3. a kind of miniature dehydrating unit in cabinet according to claim 1, it is characterised in that:The fin with
Thermal paste is provided between sheet metal.
4. a kind of miniature dehydrating unit in cabinet according to claim 1, it is characterised in that:The sheet metal
Front end is provided with ventilating opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720144866.9U CN206522945U (en) | 2017-02-17 | 2017-02-17 | A kind of miniature dehydrating unit in cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720144866.9U CN206522945U (en) | 2017-02-17 | 2017-02-17 | A kind of miniature dehydrating unit in cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206522945U true CN206522945U (en) | 2017-09-26 |
Family
ID=59891523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720144866.9U Active CN206522945U (en) | 2017-02-17 | 2017-02-17 | A kind of miniature dehydrating unit in cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206522945U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109030143A (en) * | 2018-07-16 | 2018-12-18 | 安徽建筑大学 | Preposed preprocessing device of gas analysis system |
| WO2022206568A1 (en) * | 2021-03-30 | 2022-10-06 | 华为技术有限公司 | Thermoelectric refrigeration module, heat dissipation component, chip packaging structure, and electronic device |
-
2017
- 2017-02-17 CN CN201720144866.9U patent/CN206522945U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109030143A (en) * | 2018-07-16 | 2018-12-18 | 安徽建筑大学 | Preposed preprocessing device of gas analysis system |
| WO2022206568A1 (en) * | 2021-03-30 | 2022-10-06 | 华为技术有限公司 | Thermoelectric refrigeration module, heat dissipation component, chip packaging structure, and electronic device |
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