CN206520281U - A kind of copper-clad plate and printed circuit board - Google Patents
A kind of copper-clad plate and printed circuit board Download PDFInfo
- Publication number
- CN206520281U CN206520281U CN201621309989.5U CN201621309989U CN206520281U CN 206520281 U CN206520281 U CN 206520281U CN 201621309989 U CN201621309989 U CN 201621309989U CN 206520281 U CN206520281 U CN 206520281U
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- Prior art keywords
- copper
- clad plate
- alumina fibre
- fibre paper
- insulating barrier
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Abstract
The utility model discloses a kind of copper-clad plate, including insulating barrier, insulating barrier includes at least one alumina fibre paper or alumina fibre paper prepreg.The utility model copper-clad plate, reinforcing material is used as using alumina fibre paper or alumina fibre paper prepreg, the copper-clad laminate prepared using it is compared with existing CEM 3, thermal conductivity is more excellent, under identical thermal conductivity, heat filling usage amount is reduced, the production technology of sheet material is more excellent, avoid using the higher heat filling of price, cost is relatively low.
Description
Technical field
The utility model belongs to copper-clad plate technical field, and in particular to a kind of copper-clad plate and printed circuit board.
Background technology
With the developing trend multifunction of electronic product, electronic product also constantly develops to compact direction, covers copper
Plate is also faced with high performance low cost and waits more harsh as the base material of basis-printed circuit board (PCB) of electronic product
Demand for development.
Common FR-4, CEM-3 or CEM-1 sheet material is using glass-fiber-fabric, glass fiber paper or wood pulp paper as reinforcing material, and it has
There is excellent mechanical property and insulating properties, but with short and smallization of appliance component, the small high-power inevitable real estate in space
Raw more heat aggregations, cause component electric property to decline or even damage.Due to glass-fiber-fabric, glass fiber paper or wood pulp paper and
Epoxy resin thermal conductivity itself is relatively low, needs to add substantial amounts of heat filling to improve the thermal conductivity of sheet material, but with filler
Addition, thermal conductivity can reach more than 1.6W/mK reluctantly, but with the obvious rising of gelatin viscosity, glue-line mobility
It is deteriorated, the defect of glue layer increases, and causes the combination property of copper-clad laminate drastically to decline.
Utility model content
The purpose of this utility model is to provide a kind of copper-clad plate, solves the problem of existing copper-clad plate thermal conductivity is relatively low.
Another purpose of the present utility model is to provide a kind of printed circuit board.
The utility model is the technical scheme adopted is that a kind of copper-clad plate, including insulating barrier, and insulating barrier includes at least one
Alumina fibre paper or alumina fibre paper prepreg.
The characteristics of the utility model, also resides in,
Alumina fibre paper substance is 50~300g/m2。
The alumina content for the chopped strand that alumina fibre paper is used is 30~95%, 2~18mm of fibre length, diameter
For 5~18 μm, draw ratio≤1500.
The one or both sides of insulating barrier set copper foil layer.
Another technical scheme that the utility model is used is, a kind of printed circuit board, and it includes above-mentioned copper-clad plate.
The beneficial effects of the utility model are that the utility model copper-clad plate is fine using alumina fibre paper or aluminum oxide
Paper prepreg is tieed up as reinforcing material, the copper-clad laminate prepared using it is compared with existing CEM-3, and thermal conductivity is more excellent
It is different, under identical thermal conductivity, heat filling usage amount is reduced, the production technology of sheet material is more excellent, it is to avoid higher using price
Heat filling, cost is relatively low.
Brief description of the drawings
Fig. 1 is the structural representation of the copper-clad plate of the utility model the first embodiment；
Fig. 2 is the structural representation of the copper-clad plate of second of embodiment of the utility model.
In figure, 1. copper foil layers, 2. insulating barriers.
Embodiment
The utility model is described in detail with reference to the accompanying drawings and detailed description.
A kind of copper-clad plate of the utility model, including copper foil layer 1 and insulating barrier 2, as shown in figure 1, copper foil layer 1 is arranged at insulation
The one side of layer 2, as shown in Fig. 2 copper foil layer 1 is arranged at the two sides of insulating barrier 2.
Insulating barrier 2 includes at least one alumina fibre paper or alumina fibre paper prepreg.
It is compared below by two kinds of examples are enumerated with existing copper-clad plate, the characteristics of to illustrate the utility model.
The insulating barrier of scheme one：Glass-fiber-fabric prepreg+alumina fibre paper prepreg+alumina fibre paper+aluminum oxide
Fibrous paper prepreg+glass-fiber-fabric prepreg
The insulating barrier of scheme two：Glass-fiber-fabric prepreg+3* alumina fibre papers prepreg+glass-fiber-fabric prepreg
Insulating barrier in comparative example：Glass-fiber-fabric prepreg+3* glass fiber papers prepreg+glass-fiber-fabric prepreg
Specific performance comparative result is shown in Table 1.
The scheme one and two of table 1 and comparative example copper-clad plate performance comparison result
| Performance | Scheme one | Scheme two | Comparative example |
| Thermal conductivity/W/mk | 2.5 | 3.0 | 1.8 |
| Thermal stress/s | 260 | 280 | 250 |
| Anti-flammability | v-0 | v-0 | v-0 |
| It is secondary apparent | OK | OK | Difference |
| Bonding sheet mobility | It is easy to control | It is easy to control | Hardly gummosis |
As shown in Table 1, when using alumina fibre paper or alumina fibre paper prepreg in the utility model copper-clad plate,
The thermal conductivity of copper-clad plate substantially increases, and thermal stress, the anti-flammability of sheet material do not change substantially, the secondary apparent and bonding of sheet material
Piece mobility can be improved.
The utility model copper-clad plate, the copper-clad plate of the new structure is by alumina fibre paper prepreg and other strengthening materials
Material is combined, and thermal conductivity is more excellent compared with existing CEM-3, under identical thermal conductivity, reduces heat filling usage amount, plate
The production technology of material is more excellent, it is to avoid using the higher heat filling of price, cost is relatively low.
Claims (4)
1. a kind of copper-clad plate, including insulating barrier (2), it is characterised in that the insulating barrier (2) includes at least one alumina fibre
Paper or alumina fibre paper prepreg.
2. copper-clad plate according to claim 1, it is characterised in that the alumina fibre paper substance used in the insulating barrier
For 50~300g/m2。
3. copper-clad plate according to claim 1 or 2, it is characterised in that the one or both sides of the insulating barrier set copper foil
Layer (1).
4. a kind of printed circuit board, it is characterised in that comprising just like the copper-clad plate described in claim any one of 1-3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621309989.5U CN206520281U (en) | 2016-12-01 | 2016-12-01 | A kind of copper-clad plate and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621309989.5U CN206520281U (en) | 2016-12-01 | 2016-12-01 | A kind of copper-clad plate and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206520281U true CN206520281U (en) | 2017-09-26 |
Family
ID=59888381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621309989.5U Active CN206520281U (en) | 2016-12-01 | 2016-12-01 | A kind of copper-clad plate and printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206520281U (en) |
-
2016
- 2016-12-01 CN CN201621309989.5U patent/CN206520281U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |