CN206517665U - A kind of stable PCB of performance - Google Patents
A kind of stable PCB of performance Download PDFInfo
- Publication number
- CN206517665U CN206517665U CN201720086261.9U CN201720086261U CN206517665U CN 206517665 U CN206517665 U CN 206517665U CN 201720086261 U CN201720086261 U CN 201720086261U CN 206517665 U CN206517665 U CN 206517665U
- Authority
- CN
- China
- Prior art keywords
- hot zone
- straight length
- pcb
- bend loss
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses the PCB that a kind of performance is stable, including PCB substrate and the heat conducting pipe being arranged in PCB substrate, the PCB substrate includes hot zone and non-hot zone；The heat conducting pipe includes being arranged on the bend loss of hot zone and is arranged on non-hot zone and the straight length connected with bend loss, the straight length includes the first straight length and the second straight length connected with the first straight length, and the distance between first straight length and bend loss junction and non-hot zone are more than the distance between the first straight length and the second straight length junction and non-hot zone；Heat transferring medium is provided with the heat conducting pipe, cooling-down effect can be effectively improved using the structure, the performance of pcb board is improved.
Description
Technical field
The utility model is related to PCB field, and in particular to a kind of stable PCB of performance.
Background technology
With developing rapidly for microelectric technique, chip dominant frequency is constantly enhanced, and function increasingly strengthens, and power consumption gradually increases
Greatly, cause the temperature overheating of pcb board, influence the safety in utilization and service life of PCB, or even be easily caused PCB electricity
The failure of road plate.In order to improve the radiating efficiency of PCB, stability, the disclosure of Application No. 201620809357.9 are improved
A kind of PCB structure, it sets closed heat conducting pipe in PCB substrate, and set heat transferring medium in heat conducting pipe, leads to
The transmission of temperature is realized in the flowing for crossing heat-conducting medium, so as to realize cooling.But, its cooling-down effect is not good.
Utility model content
In order to solve the above-mentioned technical problem the utility model provides a kind of performance stable PCB.
The utility model is achieved through the following technical solutions：
A kind of stable PCB of performance, including PCB substrate and the heat conducting pipe being arranged in PCB substrate,
The PCB substrate includes hot zone and non-hot zone；
The heat conducting pipe include be arranged on hot zone bend loss and be arranged on non-hot zone and connected with bend loss it is straight
Pipeline section, the straight length includes the first straight length and the second straight length for connect with the first straight length, first straight length and
The distance between bend loss junction and non-hot zone be more than the first straight length and the second straight length junction and non-hot zone it
Between distance；
Heat transferring medium is provided with the heat conducting pipe.
In practice, inventor is had found, heat conducting pipe is provided with even in non-hot zone, but liquid flow in heat conducting pipe
Dynamic property is poor, and the temperature of non-hot zone is significantly lower than the temperature of hot zone, causes cooling-down effect unobvious.Therefore inventor is existing
Improved in pcb board structure, i.e., each section of the height to heat conducting pipe is adjusted, to strengthen the mobility of heat transferring medium, from
And improve cooling-down effect.It can be seen from physical principle, from the bottom of water to water heating can improve firing rate, its be finally because
The good fluidity of water.It is normal in use, the one side with hot zone and non-hot zone upward, the heat transferring medium in bend loss is heated
Temperature rises.The distance between first straight length and bend loss junction and non-hot zone are more than the first straight length and the second straight tube
The distance between section junction and non-hot zone, the first straight length made and the junction of the second straight length junction constitute heat conduction
The high point of pipe, bend pipe area constitutes the rising that can be hoisted automatically after the coolant-temperature gage rising in the low spot of heat conducting pipe, bend pipe, constitutes water
Flow up and down, because the mobility of water strengthens, its water absorbs temperature to be increased within a certain period of time, improves cooling-down effect.Existing skill
In art, the heat conducting pipe of non-hot zone also uses bend pipe structure, and its bending place further hinders the flowing of heat transferring medium, that is, entered
One step hinders cooling-down effect.The present invention is further on this basis to be improved, and the heat conducting pipe under non-hot zone is set to
Straight tube structure, it is to avoid impacted to water mobility, further improves cooling-down effect, improves the performance of pcb board..
Preferably, in order to strengthen uptake and absorptivity to hot zone heat, the bend loss is into " S " type.
Preferably, the mobility in order to further improve heat transferring medium, the bend loss center section and hot zone
The distance between be less than the distance between two ends and hot zone.
The utility model compared with prior art, has the following advantages and advantages：
1st, the utility model makes the junction of the first straight length and the second straight length junction constitute the high point of heat conducting pipe, curved
Area under control constitutes the rising that can be hoisted automatically after the coolant-temperature gage rising in the low spot of heat conducting pipe, bend pipe, constitutes the flowing up and down of water, carries
The mobility of high heat conduction liquid in pipe, so as to improve cooling-down effect, improves the performance of pcb board.
2nd, the heat conducting pipe under the non-hot zone of heat conducting pipe of the present utility model is set to straight tube structure, it is to avoid to water mobility
Impact, further improve cooling-down effect, improve the performance of pcb board.
Brief description of the drawings
Accompanying drawing described herein is used for providing further understanding the utility model embodiment, constitutes the one of the application
Part, does not constitute the restriction to the utility model embodiment.In the accompanying drawings：
Fig. 1 is the utility model structural representation.
Mark and corresponding parts title in accompanying drawing：
1st, PCB substrate, 2, bend loss, 3, straight length.
Embodiment
For the purpose of this utility model, technical scheme and advantage is more clearly understood, with reference to embodiment and accompanying drawing,
The utility model is described in further detail, and exemplary embodiment of the present utility model and its explanation are only used for explaining this
Utility model, is not intended as limiting of the present utility model.
Embodiment 1
A kind of stable PCB of performance as shown in Figure 1, including PCB substrate 1 and it is arranged on leading in PCB substrate
Heat pipe,
The PCB substrate includes hot zone and non-hot zone；
The heat conducting pipe include be arranged on hot zone bend loss 2 and be arranged on non-hot zone and connected with bend loss it is straight
Pipeline section 3, the straight length includes the first straight length and the second straight length for connect with the first straight length, first straight length and
The distance between bend loss junction and non-hot zone be more than the first straight length and the second straight length junction and non-hot zone it
Between distance；
Heat transferring medium is provided with the heat conducting pipe.
Embodiment 2
The present embodiment is improved on the basis of above-described embodiment, i.e., described bend loss is into " S " type.
The distance between the bend loss center section and hot zone are less than the distance between two ends and hot zone.
Heat transferring medium is preferably water.
As far as possible, the distance between the first straight length and bend loss junction and non-hot zone ratio the first straight length and second
Straight length junction and the big 1mm in the distance between non-hot zone.
Above-described embodiment, is entered to the purpose of this utility model, technical scheme and beneficial effect
One step is described in detail, be should be understood that and be the foregoing is only embodiment of the present utility model, is not used to limit
Fixed protection domain of the present utility model, all any modifications within spirit of the present utility model and principle, made, is equally replaced
Change, improve, should be included within protection domain of the present utility model.
Claims (3)
1. a kind of stable PCB of performance, including PCB substrate and the heat conducting pipe being arranged in PCB substrate, its feature exist
In：
The PCB substrate includes hot zone and non-hot zone；
The heat conducting pipe includes being arranged on the bend loss of hot zone and is arranged on non-hot zone and the straight length connected with bend loss,
The straight length includes the first straight length and the second straight length connected with the first straight length, first straight length and bend loss
The distance between junction and non-hot zone be more than between the first straight length and the second straight length junction and non-hot zone away from
From；
Heat transferring medium is provided with the heat conducting pipe.
2. a kind of stable PCB of performance according to claim 1, it is characterised in that the bend loss is into " S "
Type.
3. a kind of stable PCB of performance according to claim 1, it is characterised in that the bend loss pars intermedia
Point it is less than the distance between two ends and hot zone with the distance between hot zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720086261.9U CN206517665U (en) | 2017-01-23 | 2017-01-23 | A kind of stable PCB of performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720086261.9U CN206517665U (en) | 2017-01-23 | 2017-01-23 | A kind of stable PCB of performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206517665U true CN206517665U (en) | 2017-09-22 |
Family
ID=59866807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720086261.9U Expired - Fee Related CN206517665U (en) | 2017-01-23 | 2017-01-23 | A kind of stable PCB of performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206517665U (en) |
-
2017
- 2017-01-23 CN CN201720086261.9U patent/CN206517665U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170922 Termination date: 20210123 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |