CN206516613U - Encapsulating mould - Google Patents
Encapsulating mould Download PDFInfo
- Publication number
- CN206516613U CN206516613U CN201720175457.5U CN201720175457U CN206516613U CN 206516613 U CN206516613 U CN 206516613U CN 201720175457 U CN201720175457 U CN 201720175457U CN 206516613 U CN206516613 U CN 206516613U
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- pedestal
- encapsulating mould
- injection
- spacing
- movable substrate
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Abstract
The utility model is on encapsulating mould.Pedestal, displaceable member and injection slot are included according to the encapsulating mould of the embodiment of the utility model one.The pedestal includes some positioning holes and reception hole from the downward surface direction extension in its upper surface, it is contained in corresponding reception hole bottom and with one group of adjusting pad of the thickness depending on being needed according to injection, and is arranged at some elastic components that above adjusting pad and top is convexedly stretched in outside the corresponding reception hole.Displaceable member includes the first movable substrate with some groups of spacing holes, and difference group spacing hole has different spacing depth.First movable substrate is configured to need according to the injection and house locating part in respective sets spacing hole so that the locating part is fixed on corresponding positioning hole, so that displaceable member is movably limited in above pedestal.The utility model has reduction production cost, the advantages of improving production efficiency.
Description
Technical field
The utility model is related to the encapsulating mould in technical field of semiconductors, more particularly to half technical field of semiconductors.
Background technology
Injection molding machine is one of instrument indispensable in journey technique after semiconductor packages.During injection, the half of plastic packaging will be treated
Conductors are positioned in the injection slot, corresponding upper die mold is coordinated with the lower mould mould, can then be applied enough stress
Make to treat that the semiconductor package part of plastic packaging is constantly compacted with plastic cement, until reach the balance between stress and elastic component and keep, from
And semiconductor package part plastic packaging thickness and preferable plastic packaging effect needed for obtaining.
However, the injection slot of the existing encapsulating mould for lower mould only has single ID.By injection is applied
Plus stress be fixed, thus the use of the thickness of the semiconductor package part obtained by this encapsulating mould is also single.It is aobvious
So, for different semiconductor package part thickness requirements, new encapsulating mould need to be remake entirely different specification side is provided
Can.This means the limitation in terms of production cost and production efficiency, encapsulating mould also needs further improve to improve
The competitiveness of manufacturer.
Utility model content
One of the purpose of this utility model is to provide a kind of encapsulating mould, and it can meet a variety of semiconductor package parts
Plastic packaging thickness requirements, the different encapsulating moulds brand-new without being replaced by.
According to an embodiment of the present utility model, an encapsulating mould includes pedestal, displaceable member and injection slot.The pedestal bag
Include：Some positioning holes, extend from the upper table of the pedestal towards the lower surface direction of the pedestal；Some reception holes, from the pedestal
Upper table extends towards the lower surface direction of the pedestal；One group of adjusting pad, is contained in corresponding reception hole bottom and with according to injection
Thickness depending on needing；It is corresponding that above some elastic components, the adjusting pad being arranged in corresponding reception hole and top convexedly stretches in this
Reception hole outside；And injection support member, the region convexedly stretched between some reception holes.Displaceable member includes the first removable base
Plate, first movable substrate has some groups of spacing holes that its lower surface is extended to from its upper surface, difference group spacing hole tool
There are different spacing depth.First movable substrate is configured to need according to the injection and limit is housed in respective sets spacing hole
Position part is so that the corresponding positioning hole that the locating part is fixed on the pedestal, so that first movable substrate is movably spacing
Above the pedestal.Injection slot is through the upper surface of the displaceable member to lower surface, and the injection support member convexedly stretches in the injection slot
Bottom that is interior and defining the injection slot.
In another embodiment of the present utility model, in each group of spacing hole at least both be located at the first removable base
The opposite side of plate.The encapsulating mould can have three groups of spacing holes and corresponding three groups of positioning holes.The depth of some groups of spacing holes
ID with the injection slot is proportional.This group of adjusting pad can be in a ring.First movable substrate can further include from it
Lower surface extends to some second spacing holes of its upper surface, and some second spacing holes are configured to store some elastic components
In corresponding person top.The pedestal can further include the bottom substrate positioned at bottom and the main substrate positioned at top, the bottom
The bottom surface of substrate defines the lower surface of the pedestal, and the upper surface of the main substrate defines the upper surface of the pedestal, and the support member is protruded out
In the upper surface of the main substrate.The locating part can include and be configured to be contained in the limited bolt set in corresponding spacing hole, and embedding
It is enclosed in limited bolt set and bottom is fixed on the screw in the corresponding positioning hole.The encapsulating mould can further comprise adapting to not
Other groups of adjusting pads of different-thickness are needed and had with injection, and the encapsulating mould is configured to need according to different injections and replaced
This group of adjusting pad.In addition, the thickness of this group of adjusting pad and the other groups of adjusting pads and the ID of the injection slot are proportional.
An embodiment of the present utility model additionally provides the displaceable member of an encapsulating mould, and it includes the first removable base
Plate.First movable substrate has some groups of spacing holes that its lower surface is extended to from its upper surface, difference group spacing hole tool
There are different spacing depth.And first movable substrate is configured to need according to injection and limit is housed in respective sets spacing hole
Position part is so that the locating part is fixed on the pedestal of the encapsulating mould, so that first movable substrate is movably limited in
Above the pedestal.
An embodiment of the present utility model additionally provides the encapsulating mould epoxy seal semiconductor using the utility model embodiment
The method of packaging part, this method includes：It is determined that the injection for the semiconductor package part needs；According to identified injection need
Determine the ID of the injection slot；This group of adjusting pad and the respective sets spacing hole are determined according to identified ID,
This group of adjusting pad has the thickness depending on injection needs, and the respective sets spacing hole has the depth depending on injection needs
Degree；And assemble the encapsulating mould and plastic packaging is carried out to the semiconductor package part using the encapsulating mould.
Encapsulating mould of the present utility model and method can realize the different rule of same encapsulating mould plastic packaging by simply setting
The semiconductor package part of lattice, significantly reduces a whole set of cost for changing encapsulating mould；The time for changing board is also solved simultaneously,
Improve production efficiency.
Brief description of the drawings
It is the side perspective structural representation of the encapsulating mould according to the embodiment of the utility model one shown in Fig. 1
It is the dimensional structure diagram of the pedestal of encapsulating mould according to the embodiment of the utility model one shown in Fig. 2
It is the positive stereochemical structure of the main substrate of the pedestal of encapsulating mould according to the embodiment of the utility model one shown in Fig. 3
Schematic diagram
Fig. 4 is the adjusting pad and the stereochemical structure of elastic component of the pedestal of the encapsulating mould according to the embodiment of the utility model one
Schematic diagram
It is the top plan view structural representation of the encapsulating mould according to the embodiment of the utility model one shown in Fig. 5
It is the first movable substrate of the displaceable member of encapsulating mould according to the embodiment of the utility model one shown in Fig. 6
Look up dimensional structure diagram
Fig. 7 is the diagrammatic cross-section of the encapsulating mould according to the embodiment of the utility model one.
Embodiment
To be better understood from spirit of the present utility model, it is made below in conjunction with part preferred embodiment of the present utility model
Further illustrate.
During semiconductor component packing.During plastic packaging, upper die mold is set to be matched with lower mould mould and apply
Enough stress is pushed, so that the spring contraction on pedestal drives displaceable member to move down.Accordingly, injection slot shoals directly
Bounce to external force and spring and plastic-sealed body reaches balance and kept, to ensure that it is solid that the semiconductor package part obtained has
Combination between housing and housing and inner member is close enough.However, the existing encapsulating mould for lower mould only has list
The ID of one specification, i.e. injection slot is fixed.In this way, in face of needing the semiconductor package part of plastic packaging different-thickness
When, lower mould mould needs to make different exchanges can.The mould of this single specification both improves production cost, also reduces life
Produce efficiency.
And above-mentioned technical problem can then be solved according to the encapsulating mould of the utility model embodiment, it only makees simple setting
The semiconductor package part plastic packaging of multi-thickness requirement can be achieved.
It is the side perspective structural representation of the encapsulating mould 10 according to the embodiment of the utility model one shown in Fig. 1.
As shown in figure 1, according in an embodiment of the present utility model, encapsulating mould 10 is mainly comprising pedestal 20, removable
Moving part 30 and injection slot 40.Displaceable member 30 is movably limited on the pedestal 20；And with the movement of displaceable member 30, note
The depth for moulding groove 40 is also continually changing by ID until ultimate depth is reached, to define be molded semiconductor package part
The thickness of (not shown).
It is the dimensional structure diagram of the pedestal 20 of encapsulating mould 10 according to the embodiment of the utility model one shown in Fig. 2,
Pedestal 20 therein is applicable to encapsulating mould 10 or other embodiments shown in Fig. 1.
Specifically, understanding that the pedestal 20 can further include the bottom substrate 22 positioned at the bottom of the pedestal 20 with reference to Fig. 1,2
And the main substrate 24 positioned at the top of the pedestal 20, the main substrate 24 is positioned at the top of bottom substrate 22.The wherein bottom substrate
22 bottom surface defines the lower surface (not shown) of the pedestal 20, and the upper surface of the main substrate 24 defines the upper surface of the pedestal 20
200.Can other components be further set between bottom substrate 22 and main substrate 24 or other components are not provided with all, according to different realities
Depending on applying example.An injection support member 26 may further be provided in pedestal 20, and it can protrude into injection slot 40 from the top of main substrate 24
Bottom that is interior and defining the injection slot 40.
It is that the front of the main substrate 24 of the pedestal 20 of encapsulating mould 10 according to the embodiment of the utility model one is stood shown in Fig. 3
Body structural representation, and Fig. 4 be then the pedestal 20 of the encapsulating mould 10 according to the embodiment of the utility model one adjusting pad 23 and
The dimensional structure diagram of elastic component 25.Main substrate 24 shown in Fig. 3 and the adjusting pad 23 and elastic component 25 shown in Fig. 4 are except being applicable
In outside the pedestal 20 shown in Fig. 2, it is similarly applied to according to other embodiments of the present utility model.
With reference to Fig. 2,3,4, the pedestal 20 can further comprise some positioning holes 240 and some reception holes 204, from pedestal
20 upper surface 200 extends to the lower surface direction of pedestal 20.Wherein, some reception holes 204 run through the upper surface of main substrate 24
200 to lower surface 242 (referring to Fig. 7) or even section bottom substrate 22, and some positioning holes 240 then extend only to main substrate 24
Interior certain depth.Some reception holes 204 are set around the injection support member 26, i.e., to convexedly stretch in this some for the injection support member 26
Between reception hole 204.Pedestal 20 can also include some groups of adjusting pads 23 and some elastic components 25, and both of which is contained in corresponding receipts
Receive hole 204, and adjusting pad 23 is located at the corresponding bottom of reception hole 204 to support correspondence elastic component 25.Each adjusting pad 23 can be in a ring
Or other shapes of pad, can be the metal material of high rigidity.The adjusting pad 23 of difference group is configured to need difference according to injection
And with different thickness.For example, the thickness and the ID of injection slot 40 of the adjusting pad 23 of different groups are proportional, such as it is molded
The ID needed is deeper, and the thickness of this group of adjusting pad 23 is also thicker.Elastic component 25 can be the spring of high elastic coefficient, respectively
The top 250 of elastic component 25 is convexedly stretched in outside corresponding reception hole 204, and bottom (not shown) can be contained in the annulus of adjusting pad 23
Air switch mouthfuls 230 is to assist elastic component 25 to keep balance.
It is the top plan view structural representation of the encapsulating mould 10 according to the embodiment of the utility model one shown in Fig. 5.Such as Fig. 5
Shown, the displaceable member 30 can further include the first movable substrate 32 and be positioned at the top of the first movable substrate 32
Second displaceable member 34.Other components or only can be further set between the first movable substrate 32 and the second movable substrate 34
First movable substrate 32 is set, depending on not be the same as Example.
It is the first removable base of the displaceable member 30 of encapsulating mould 10 according to the embodiment of the utility model one shown in Fig. 6
Plate 32 looks up dimensional structure diagram.The first movable substrate 32 in embodiment illustrated in fig. 6 is applicable to include Fig. 1 and figure
Encapsulating mould 10 shown in the 5 not displaceable member 30 of be the same as Example inside.
With reference to shown in Fig. 5,6, the first movable substrate 32 has the opening 400 corresponding to injection slot 40.Around the opening
400, from the upper surface 320 of the first movable substrate 32 extend to its lower surface 322 through have some groups of spacing hole 324a,
324b, 324c, difference group spacing hole 324a, 324b, 324c need according to different injections and there is different spacing depth to provide
Displacement space needed for first movable substrate 32.Similar, the depth and note of some groups of spacing holes 324a, 324b, the 324c
The ID for moulding groove 40 is proportional, i.e. the ID of injection slot 40 is deeper, correspondence group spacing hole 324a, 324b, 324c's
Depth is deeper.When it is determined that injection needs, need to select respective thickness one group of adjusting pad 23 and one group of respective depth spacing
Hole.As the skilled personnel can understand, although the present embodiment illustrate only three groups of spacing holes 324a, 324b, 324c, exist
The spacing hole group of other quantity can be designed in other embodiments completely.To obtain preferably limit effect, every group of spacing hole
At least two spacing holes in 324a, 324b, 324c are located at the couple positioned opposite of the opening 400, and such as each group is arranged in every side
Order is opposite or along the spread configuration such as the axis of the opening 400 or diagonal.
During injection, the first movable substrate 32 be configured to according to injection need and respective sets spacing hole 324a, 324b,
Locating part 36 is housed in 324c so that the corresponding positioning hole 240 that the locating part 36 is fixed on the pedestal 20 so that this first
Movable substrate 32 is movably limited in the top of pedestal 20.Locating part 36 can cover 360 comprising a limited bolt and be nested in this
Screw 362 (referring to Fig. 7) in limited bolt set 360, limited bolt set 360 is detachable or is fixed together with the screw 362.
In other embodiments, locating part 36 can use the fixture of other structures, for example, internal thread.When injection demand is determined,
324c in one group of spacing hole with respective depth, such as the present embodiment is selected, then locating part 36 is installed on into the group spacing
In the 324c of hole, other groups of spacing holes 324a, 324b are vacant.The screw 362 of locating part 36 enters pedestal through limited bolt set 360
Corresponding positioning hole 240 on 20 and fasten, so that the first movable substrate 32 is relatively fixed on pedestal 20.
In addition, the first movable substrate 32 can further include extend from its lower surface 322 to its upper surface 320 some
Second spacing hole 326, some second spacing holes 326 are configured to store the top 250 of corresponding person in some elastic components 25,
So as to ensure the balance positioning of elastic component 25.
Fig. 7 is the diagrammatic cross-section of the encapsulating mould 10 according to the embodiment of the utility model one.To highlight the encapsulating mould
Annexation in 10 between critical component, the sectional view has used irregular hatching.
As shown in fig. 7, according in an embodiment of the present utility model, encapsulating mould 10 is mainly comprising pedestal 20, removable
Moving part 30 and injection slot 40, the wherein injection slot 40 have an ID A.
The pedestal 20 can further include positioned at the bottom substrate 22 of the bottom of the pedestal 20 and positioned at the top of pedestal 20
Main substrate 24, and other parts, the injection support member 26 for example protruded out from main substrate 24.Between the different parts of pedestal 20
It can be fixed by the grade various ways of bolt 27.The displaceable member 30 comprising the first movable substrate 32 and be positioned at this first
Second displaceable member 34 of the top of movable substrate 32, it is similar, it can also pass through spiral shell between the different parts of the displaceable member 30
The grade various ways of bolt 27 are fixed.
Some reception holes 204 run through the upper surface 200 of main substrate 24 to lower surface 242 and section bottom substrate 22, and are somebody's turn to do
Some positioning holes 240 then extend only to certain depth in main substrate 24.Adjusting pad 23 and elastic component 25 are contained in corresponding receipts
Receive hole 204, and adjusting pad 23 is located at the corresponding bottom of reception hole 204 to support correspondence elastic component 25.The top 250 of elastic component 25 is certainly
The second spacing hole 326 being positioned on the first movable substrate 32 is protruded out in reception hole 204, it can be ensured that the gentle support of elastic component 25
First movable substrate 32.
The thickness B of adjusting pad 23 and the ID A of injection slot 40 are proportional, when the ID A of injection slot 40 is set
During to deepen, the thickness B of selected adjusting pad 23 is also thickening.Accordingly, the different group limits on the first movable substrate 32
324a, 324b, 324c have different spacing depth in position hole, and the ID A of injection slot 40 is deeper, correspondence group spacing hole
324a, 324b, 324c depth C are deeper.That institute's section view is the spacing hole 324c for being provided with elastic component 36 in Fig. 7.
In the 10 epoxy seal semiconductor packaging part of encapsulating mould using the utility model embodiment, it can first determine to be used to be somebody's turn to do half
The injection of conductor packaging part needs；According to identified injection it needs to be determined that the ID A of the injection slot 40.Further according to really
Fixed ID A determines the one group of adjusting pad 23 and respective sets spacing hole 324a, 324b or 324c to be used, group adjustment
Pad 23 has the thickness B depending on injection needs, and the respective sets spacing hole 324a, 324b or 324c have to be needed according to the injection
Depending on depth C.Determine after used adjusting pad 23 and spacing hole 324a, 324b or 324c, you can with the encapsulating mould
10 and carry out plastic packagings using 10 pairs of semiconductor package parts of the encapsulating mould.During plastic packaging, with the pushing of stress, elasticity
Part 25 is retracted to drive displaceable member 30 to move down, and the depth of corresponding injection slot 40 is gradually become shallower as by ID A；
Simultaneously because displaceable member 30 is moved down, relative position rise of the locating part 36 in the spacing hole 324c, until stress and elasticity
The bounce of part 25 and plastic-sealed body reaches balance and kept.
Technology contents and technical characterstic of the present utility model are had revealed that as above, but those skilled in the art still may be used
A variety of replacements and modification without departing substantially from the utility model spirit can be made based on teaching of the present utility model and announcement.Therefore, originally
The protection domain of utility model should be not limited to the content disclosed in embodiment, and should be replaced including various without departing substantially from of the present utility model
Change and modify, and covered by present patent application claims.
Claims (11)
1. a kind of encapsulating mould, it is characterised in that the encapsulating mould is included：
Pedestal, it is included：
Some positioning holes, extend from the upper table of the pedestal towards the lower surface direction of the pedestal；
Some reception holes, extend from the upper table of the pedestal towards the lower surface direction of the pedestal；
One group of adjusting pad, is configured to be contained in corresponding reception hole bottom and with the thickness depending on needing according to injection；
Some elastic components, the adjusting pad top and top for being configured to be arranged in corresponding reception hole convexedly stretches in the corresponding receipts
Receive outside hole；And
It is molded support member, the region convexedly stretched between some reception holes；
Displaceable member, it is included：
First movable substrate, with some groups of spacing holes that its lower surface is extended to from its upper surface, difference group spacing hole tool
There are different spacing depth；And first movable substrate is configured to according to the injection needs in respective sets spacing hole
Locating part is housed so that the corresponding positioning hole that the locating part is fixed on the pedestal, so that first movable substrate
Movably it is limited in above the pedestal；And
Second movable substrate, is positioned above first movable substrate；
Injection slot, is configured to run through the lower surface of first movable substrate to the upper table of second movable substrate
Face；The injection support member convexedly stretches in the injection slot and defined the bottom of the injection slot.
2. encapsulating mould as claimed in claim 1, it is characterised in that first movable substrate has the correspondence injection
In the opening of groove, each group of spacing hole at least both be located at the opening opposite side, and along the opening diagonal or
Axis direction is arranged.
3. encapsulating mould as claimed in claim 1, it is characterised in that the encapsulating mould has three groups of spacing holes and corresponding
Three groups of positioning holes.
4. encapsulating mould as claimed in claim 1, it is characterised in that the depth of some groups of spacing holes and the injection slot
ID it is proportional.
5. encapsulating mould as claimed in claim 1, it is characterised in that described group of adjusting pad is in a ring.
6. encapsulating mould as claimed in claim 1, it is characterised in that first movable substrate is further included under it
Surface extends to some second spacing holes of its upper surface, if some second spacing holes are configured to store the dry elasticity
The top of corresponding person in part.
7. encapsulating mould as claimed in claim 1, it is characterised in that the pedestal further includes the bottom base positioned at bottom
Plate and the main substrate positioned at top, the bottom surface of the bottom substrate define the lower surface of the pedestal, the upper table of the main substrate
Face defines the upper surface of the pedestal.
8. encapsulating mould as claimed in claim 1, it is characterised in that the locating part includes and is configured to be contained in corresponding
Limited bolt set in spacing hole, and be nested in limited bolt set and bottom is fixed on the screw in the corresponding positioning hole.
9. encapsulating mould as claimed in claim 1, it is characterised in that the encapsulating mould further comprises adapting to different injections
Need and the other groups of adjusting pads with different-thickness, the encapsulating mould is configured to need according to the different injections and replaced
Described group of adjusting pad.
10. encapsulating mould as claimed in claim 9, it is characterised in that the thickness of described group of adjusting pad and the other groups of adjusting pads
Degree and the ID of the injection slot are proportional.
11. encapsulating mould as claimed in claim 1, it is characterised in that first movable substrate has the correspondence injection
In the opening of groove, each group of spacing hole at least both be located at the opening opposite side；And some groups of spacing holes are every
Putting in order for side is opposite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720175457.5U CN206516613U (en) | 2017-02-24 | 2017-02-24 | Encapsulating mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720175457.5U CN206516613U (en) | 2017-02-24 | 2017-02-24 | Encapsulating mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206516613U true CN206516613U (en) | 2017-09-22 |
Family
ID=59868913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720175457.5U Active CN206516613U (en) | 2017-02-24 | 2017-02-24 | Encapsulating mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206516613U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113488397A (en) * | 2021-06-30 | 2021-10-08 | Tcl华星光电技术有限公司 | Glue sealing assembly, glue sealing device and glue sealing method |
-
2017
- 2017-02-24 CN CN201720175457.5U patent/CN206516613U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113488397A (en) * | 2021-06-30 | 2021-10-08 | Tcl华星光电技术有限公司 | Glue sealing assembly, glue sealing device and glue sealing method |
| CN113488397B (en) * | 2021-06-30 | 2023-12-12 | Tcl华星光电技术有限公司 | Sealing assembly, sealing device and sealing method |
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