CN113488397B

CN113488397B - Sealing assembly, sealing device and sealing method

Info

Publication number: CN113488397B
Application number: CN202110736304.4A
Authority: CN
Inventors: 向昌明
Original assignee: TCL Huaxing Photoelectric Technology Co Ltd
Current assignee: TCL Huaxing Photoelectric Technology Co Ltd
Priority date: 2021-06-30
Filing date: 2021-06-30
Publication date: 2023-12-12
Anticipated expiration: 2041-06-30
Also published as: CN113488397A

Abstract

The application discloses a sealing assembly, a sealing device and a sealing method. The sealing assembly comprises a carrier plate, a limiting piece, a sealing mould and a cover plate. The limiting piece is located on one side of the carrier plate. The limiting piece comprises a first opening for accommodating the to-be-sealed glue piece. The sealing mold is positioned at one side of the limiting piece away from the carrier plate. The sealing mold comprises a second opening for containing the sealing glue and a glue overflow hole. The second opening is arranged opposite to the first opening. The glue overflow hole is arranged adjacent to the second opening. The apron is located the one side that seals the gluey mould and keep away from the locating part. The cover plate is arranged opposite to the carrier plate. The sealing glue component provided by the application can prevent the sealing glue from overflowing the sealing glue component in the pressing process.

Description

Sealing assembly, sealing device and sealing method

Technical Field

The application relates to the technical field of packaging, in particular to a glue sealing assembly, a glue sealing device and a glue sealing method.

Background

Before leaving the factory, some industrial products need to be packaged, so that the purposes of isolating water and oxygen and prolonging the service life of the industrial products are achieved. The encapsulation process is one of the common packaging methods. The encapsulation process generally places the corresponding industrial product and the encapsulation adhesive in the encapsulation assembly, and encapsulates the industrial product by pressing the encapsulation assembly. At present, in the process of pressing the packaging assembly, packaging glue easily overflows the packaging assembly, so that the packaging effect of industrial products is poor.

Disclosure of Invention

The application aims to provide a sealing assembly, a sealing device and a sealing method, which are used for solving the problem that sealing glue is easy to overflow the sealing assembly in the prior art.

The embodiment of the application provides a sealing assembly, which comprises:

a carrier plate;

the limiting piece is positioned on one side of the carrier plate and comprises a first opening for accommodating a piece to be sealed;

the sealing die is positioned on one side, far away from the carrier plate, of the limiting piece and comprises a second opening for containing sealing glue and a glue overflow hole, the second opening is opposite to the first opening, and the glue overflow hole is adjacent to the second opening;

and the cover plate is positioned at one side of the sealing mold, which is far away from the limiting piece, and the cover plate is arranged opposite to the carrier plate.

In some embodiments, the sealing mold comprises a plurality of glue overflow holes, and the glue overflow holes are arranged along the edge of the second opening.

In some embodiments, the plurality of glue overflow holes are uniformly distributed along the circumferential direction of the second opening.

In some embodiments, the sealing assembly further comprises a protective film, wherein the protective film is positioned between the to-be-sealed piece and the sealing die, and the protective film covers the non-sealing area of the to-be-sealed piece.

In some embodiments, the glue overflow hole is located at one side of the non-glue sealing area of the glue sealing member.

In some embodiments, a gap is provided between the encapsulation glue and an inner wall of the second opening.

In some embodiments, the molding assembly further comprises a release film located between the molding die and the cover plate, the release film covering the second opening and the flash hole.

In some embodiments, the sealing assembly further comprises a connecting piece, and the carrier plate, the limiting piece, the sealing mold and the cover plate are detachably connected through the connecting piece.

The embodiment of the application also provides a sealing device, which comprises the sealing assembly, and the sealing device further comprises:

the vacuum chamber comprises a bottom plate and side walls, wherein the side walls form a containing cavity around the edge of the bottom plate, and the sealing assembly is positioned in the containing cavity;

a sealing plate, an edge of which is in contact with the sidewall;

and the pressing assembly is connected with one side of the sealing plate, and the sealing assembly is positioned between the bottom plate and the pressing assembly.

In some embodiments, the sealing device further comprises a seal, one end of the seal is in contact with one end of the side wall away from the bottom plate, and the other end of the seal is in contact with a side of the sealing plate adjacent to the sealing assembly.

The embodiment of the application also provides a sealing method, which adopts the sealing assembly to seal the glue, and comprises the following steps:

attaching a protective film to the non-sealing area of the to-be-sealed glue piece;

packaging the to-be-sealed glue piece by using the glue sealing assembly;

removing the protective film;

and curing the to-be-sealed glue piece.

The application provides a sealing assembly. The sealing assembly comprises a carrier plate, a limiting piece, a sealing mould and a cover plate. The limiting piece is located on one side of the carrier plate. The limiting piece comprises a first opening for accommodating the to-be-sealed glue piece. The sealing mold is positioned at one side of the limiting piece away from the carrier plate. The sealing mold comprises a second opening for containing the sealing glue and a glue overflow hole. The second opening is arranged opposite to the first opening. The glue overflow hole is arranged adjacent to the second opening. The apron is located the one side that seals the gluey mould and keep away from the locating part. The cover plate is arranged opposite to the carrier plate. According to the application, the glue overflow hole is arranged in the glue sealing mould, so that a containing space is provided for redundant packaging glue. In the process of pressing the packaging adhesive and the to-be-sealed adhesive piece, the redundant packaging adhesive can flow into the adhesive overflow hole from the second opening, so that the problem that the packaging effect of the to-be-sealed adhesive piece is affected due to the fact that the redundant packaging adhesive directly overflows from the second opening to the sealing adhesive component is avoided. Therefore, the sealing component provided by the application can improve the packaging effect of the to-be-sealed piece.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments of the present application will be briefly described below, it being obvious that the drawings in the following description are only some examples and implementations of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a package assembly according to the present application.

Fig. 2 is a schematic structural view of a limiting member provided by the application.

Fig. 3 is a schematic view of a first structure of the molding die provided by the application.

Fig. 4 is a schematic view of a second structure of the molding die provided by the application.

Fig. 5 is a schematic view of a third structure of the molding die provided by the application.

Fig. 6 is a schematic diagram of a first structure of the sealing device provided by the application.

Fig. 7 is a working flow chart of the sealing device provided by the application.

Fig. 8 is a schematic diagram of a second structure of the sealing device provided by the application.

Fig. 9 is a flow chart of the encapsulation method provided by the application.

Fig. 10 is a schematic structural diagram of a part to be sealed in steps B10 to B30 of the sealing method according to the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.

It should be noted that the ordinal numbers of the first and second and the like mentioned in the present application do not represent any order, number or importance, but are used for distinguishing different parts. The terms of directions such as up, down, left and right are only referred to in the attached drawings. The terms of positional relationship such as "one side" and "another side" are used herein to distinguish between the different parts. Therefore, the use of numerical, directional and positional relationship terms is intended to illustrate and understand the present application, and is not intended to limit the present application. In the application, unless explicitly stated and defined otherwise, a first feature on one side, [ up ] or [ down ] of a second feature may include the first and second features being either directly or through another feature in contact therewith, not directly. Like numbers refer to like elements throughout the specification. Because the dimensions and thicknesses of the various components illustrated in the figures are presented for ease of illustration, the present disclosure is not necessarily limited to the illustrated dimensions and thicknesses of the various components.

The application provides a sealing assembly. As shown in fig. 1, the molding compound assembly 100 includes a carrier 101, a limiting member 102, a molding compound die 103, a cover plate 104, a protective film 105, a release film 106, and a connecting member 107.

The carrier 101 is used for carrying the to-be-sealed glue piece 20. The to-be-sealed glue piece 20 is located at one side of the carrier 101, and the to-be-sealed glue piece 20 is in direct contact with the carrier 101.

The limiting member 102 is located at one side of the carrier 101. Specifically, the limiting member 102 is located at a side of the carrier 101 bearing the to-be-sealed glue member 20. The stopper 102 is in contact with the carrier 101. The stopper 102 includes a first opening 1021. The to-be-sealed member 20 is located in the first opening 1021. The shape of the first opening 1021 is matched with the shape of the to-be-sealed glue piece 20, and the edge of the to-be-sealed glue piece 20 is contacted with the inner wall of the first opening 1021. As shown in fig. 2, when the cross-section of the member to be sealed 20 is rectangular in shape, the first opening 1021 is rectangular in shape. The cross-sectional area of the member to be sealed 20 is equal to the area of the first opening 1021. The above arrangement is beneficial to placing the member to be sealed 20 in the first opening 1021 and enabling the edge of the member to be sealed 20 to contact the inner wall of the first opening 1021. The edge of the limiting member 102 corresponds to the edge of the carrier plate 101. Since the relative positions of the limiting member 102 and the carrier 101 are unchanged, when the to-be-sealed glue member 20 is located in the first opening 1021 of the limiting member 102, the limiting member 102 can limit the position of the to-be-sealed glue member 20 on the carrier 101, so as to avoid influencing the packaging effect of the package member 20 due to the change of the relative positions of the to-be-sealed glue member 20 and the carrier 101.

It is understood that a certain gap may exist between the to-be-sealed member 20 and the inner wall of the first opening 1021. When the molding compound 30 needs to be heated to a predetermined value to be pressed, the to-be-molded member 20 is easily expanded by heating. A certain gap exists between the to-be-sealed glue piece 20 and the inner wall of the first opening 1021 to provide a certain deformation space for the to-be-sealed glue piece 20, so that the to-be-sealed glue piece 20 and the limiting piece 102 can be prevented from being excessively attached to cause damage to the to-be-sealed glue piece 20.

It is understood that the shape of the first opening 1021 may be regular polygon, circular, oval or other irregular shape. The shape of the first opening 1021 is adapted to the shape of the to-be-sealed member 20, and the shape of the first opening 1021 is not limited in the present application.

As shown in fig. 1, the protective film 105 is located on a side of the to-be-sealed glue piece 20 away from the carrier plate 101. The protective film 105 is located between the member to be sealed 20 and the sealing die 103. The protective film 105 covers the non-sealing area 20b of the member to be sealed 20. Specifically, the protective film 105 has an adhesive property on a side close to the member to be sealed 20. The protective film 105 is adhered to the non-sealing region 20b of the member 20 to be sealed and the edge of the stopper 102 near the first opening 1021.

It is understood that the protective film 105 may be bonded only to the non-sealing region 20b of the member 20 to be sealed.

According to the application, the protective film 105 is arranged in the packaging assembly, and the protective film 105 covers the non-sealing area of the to-be-sealed glue piece 20, so that the contact between the to-be-sealed glue piece 20 and the non-sealing area of the to-be-sealed glue piece 20 and the packaging glue 30 in the pressing process can be avoided, and the performance of the to-be-sealed glue piece 20 product is ensured.

It is understood that the to-be-encapsulated component 20 provided by the present application includes an encapsulated region 20a and a non-encapsulated region 20b. The sealing area 20a is an area where the member to be sealed 20 is attached to the sealing compound 30. The non-sealing region 20b refers to a region of the member to be sealed 20 other than the sealing region 20a. In the present application, the non-sealing region 20b is located at the edge of the sealing region 20a. The non-sealing area 20b of the member to be sealed 20 may be located at other positions of the sealing area 20a. The non-sealing area 20b of the to-be-sealed member 20 may not be provided, i.e. the surface of the to-be-sealed member 20 needs to be sealed. The present application is not particularly limited to the member to be sealed 20.

In the present application, the to-be-encapsulated member 20 may be a substrate provided with a light emitting diode chip. The substrate includes a light emitting region and a non-light emitting region. A light emitting diode chip is arranged in the light emitting area. The portion of the substrate other than the light-emitting region is a non-light-emitting region. The non-light-emitting area is used for setting wires so as to control the lighting of the light-emitting diode chip. The light emitting region may be disposed at a central region of the substrate. The non-light emitting region is disposed around the light emitting region. In the existing display panel using the light emitting diode chip as the light source. After the light emitting diode chip is connected with the substrate, the light emitting diode chip needs to be sealed, so that water and oxygen are prevented from entering the light emitting diode chip. In the present application, a thermocompression bonding adhesive is used as the encapsulation adhesive 30. And pressing the substrate provided with the light-emitting diode chip through the hot-pressing glue, so that the glue sealing of the light-emitting diode chip is realized. Therefore, in the present application, the light emitting region of the substrate is the sealing region 20a. The non-light emitting region of the substrate is a non-encapsulant region 20b. When the sealing process is performed, the hot-pressing glue seals the light-emitting diode chip located in the sealing area 20a, so that water and oxygen are prevented from entering the light-emitting diode chip.

The sealing mold 103 is located at one side of the limiting piece 102 away from the carrier 101. The molding die 103 includes a second opening 1031 and a flash 1032. The second opening 1031 is disposed opposite to the first opening 1021. The molding compound 30 is disposed in the second opening 1031. The second openings 1031 define the glue locations of the glue 30. As shown in fig. 1, when the member to be sealed 20 includes a sealing region 20a and a non-sealing region 20b, the second opening 1031 is located above the sealing region 20a of the member to be sealed 20. Since the to-be-sealed member 20 is located in the first opening 1021, the sealing compound 30 is located in the second opening 1031, and the second opening 1031 is opposite to the first opening 1021, so as to define a position where the sealing compound 30 is adhered to the to-be-sealed member 20. As shown in fig. 1, the width of the second opening 1031 is smaller than the width of the first opening 1021. The width of the second opening 1031 is smaller than that of the first opening 1021, so that the packaging adhesive 30 is only attached to one side of the to-be-sealed adhesive piece 20, and the performance of the to-be-sealed adhesive piece 20 is prevented from being influenced by excessive sealing of the packaging adhesive 30.

It is understood that in the present embodiment, the width of the second opening 1031 may be equal to the width of the first opening 1021. The width of the second opening 1031 is equal to the width of the first opening 1021, so that the performance of the to-be-sealed member 20 can be prevented from being affected by the excessive sealing of the sealing compound 30. The width of the second opening 1031 and the width of the first opening 1021 are not particularly limited in the present application.

The shape of the second opening 1031 is adapted to the shape of the sealing area 20a of the member to be sealed 20. Specifically, when the molding region 20a is rectangular in shape, the second opening 1031 is rectangular in shape. And the edge of the second opening 1031 corresponds to the edge of the sealing region 20a.

A gap is provided between the encapsulation compound 30 and the inner wall of the second opening 1031. When the molding compound 30 needs to be heated to a preset value to be pressed, the molding compound 30 is easily expanded by heating. A certain gap exists between the packaging adhesive 30 and the inner wall of the second opening 1031 to provide a certain deformation space for the packaging adhesive 30, so that the pressure of the packaging adhesive 30 can be released when the packaging adhesive 30 is pressed, and damage to the to-be-sealed adhesive piece 20 caused by overlarge pressure of the packaging adhesive 30 in the pressing process is avoided. Meanwhile, a certain gap is formed between the encapsulation compound 30 and the inner wall of the second opening 1031, so that the encapsulation effect of the to-be-encapsulated piece 20 can be further prevented from being affected due to the overflow of the encapsulation compound 30 from the encapsulation compound assembly 100.

The gap between the encapsulation compound 30 and the inner wall of the second opening 1031 needs to be set within a proper range. Specifically, the width p1 of the gap between the encapsulation compound 30 and the inner wall of the second opening 1031 is between 2 mm and 3 mm. Specifically, the width p1 of the gap between the encapsulation compound 30 and the inner wall of the second opening 1031 may be 2 mm, 2.5 mm, or 3 mm. When the width p1 of the gap is smaller than 2 mm, the second opening 1031 cannot provide enough deformation space for the molding compound 30, and damage to the molding compound 20 caused by excessive pressure of the molding compound 30 cannot be effectively avoided. When the width p1 of the gap is greater than 3 mm, the second opening 1031 cannot effectively define the sealing position of the sealing compound 30. When the lamination is performed, the movement and deformation of the encapsulation compound 30 cannot be limited in an effective range, so that the encapsulation compound 30 deviates from a preset encapsulation position, and the encapsulation effect of the to-be-encapsulated compound 20 is affected. Therefore, the width p1 of the gap between the encapsulation compound 30 and the inner wall of the second opening 1031 is between 2 mm and 3 mm, so as to avoid the damage to the to-be-encapsulated component 20 caused by the excessive pressure of the encapsulation compound 30 and ensure the encapsulation compound 30 to encapsulate at the preset encapsulation position.

It is understood that the shape of the second opening 1031 may be regular polygon, circle, ellipse, or other irregular shape. The shape of the second opening 1031 is adapted to the edge of the sealing area 20a of the sealing compound 30. The shape of the second opening 1031 is not limited in the present application.

As shown in fig. 1 and 3, the glue overflow hole 1032 is provided adjacent to the second opening 1031. Specifically, the glue overflow hole 1032 is disposed opposite to the non-sealing area 20b of the to-be-sealed glue member 20. The flash 1032 is located on one side of the non-sealing area 20b of the member 20 to be sealed. The front projection of the glue overflow hole 1032 on the carrier plate 101 overlaps the front projection of the non-glue sealing area 20b of the piece to be sealed 20 on the carrier plate 101.

When the molding die 103 includes a plurality of flash holes 1032, the flash holes 1032 are uniformly distributed along the circumferential direction of the second opening 1031. The uniform distribution of the flash holes 1032 along the circumferential direction of the second opening 1031 means that the plurality of flash holes 1032 are uniformly distributed along the edge area where the second opening 1031 is closed. Specifically, as shown in fig. 3, the molding die 103 includes four flash holes 1032. The second opening 1031 is rectangular in shape. Four glue overflow holes 1032 are uniformly distributed on four sides of the second opening 1031. That is, the glue overflow holes 1032 are provided at adjacent positions on each side of the second opening 1031. The shortest distance between the flash 1032 and the edge of the second opening 1031 is equal. The width of each glue overflow hole 1032 is equal to the side length of the second opening 1031. According to the application, the glue overflow holes 1032 are uniformly distributed along the circumferential direction of the second opening 1031, so that a containing space can be reserved for the redundant glue overflow holes 1032 at a plurality of positions of the edge where the second opening 1031 is closed, and the packaging glue 30 is prevented from directly overflowing from the second opening 1031 to the glue sealing assembly 100.

It is understood that the shape of the second opening 1031 may be regular polygon, circle, ellipse, or other irregular shape. The shape of the glue overflow hole 1032 in fig. 3 is exemplified by a regular polygon, but is not a limitation of the present application.

It is understood that, in the embodiment of the present application, when the molding die 103 includes one flash 1032, the flash 1032 may be disposed only at one side of the second opening 1031.

As shown in fig. 4, in the embodiment of the present application, when the molding die 103 includes a plurality of flash holes 1032, the plurality of flash holes 1032 may be disposed around the edge of the second opening 1031, and the plurality of flash holes 1032 extend from the edge of the second opening 1031 to the edge of the molding die 103. In the present application, a plurality of glue overflow holes 1032 are provided to extend from the edge of the second opening 1031 to the edge of the glue sealing mold 103, so that the accommodating space of the excess glue overflow holes 1032 can be further increased. When the volume of the excess molding compound 30 exceeds the accommodating space of the flash hole 1032 near the second opening 1031, the excess molding compound 30 can further flow into the flash hole 1032 far from the edge of the second opening 1031, so as to further avoid the molding compound 30 from overflowing the packaging component and ensure the packaging effect of the to-be-packaged compound 20.

As shown in fig. 5, in an embodiment of the present application, the molding die 103 may include only one flash 1032. The glue overflow hole 1032 has an annular structure. The flash hole 1032 is disposed around the edge of the second opening 1031. The glue overflow holes 1032 are arranged around the edge of the second opening 1031, so that a containing space can be reserved for the excessive glue overflow holes 1032 on the edge of the second opening 1031, and the package glue 30 is further prevented from directly overflowing from the second opening 1031 to the glue sealing assembly 100.

It is understood that in an embodiment of the present application, the molding die 103 may include a plurality of annular flash holes 1032 as shown in fig. 5. A plurality of annular flash holes 1032 are concentrically disposed around the edge of the second opening 1031.

As shown in fig. 1, the thickness of the encapsulation compound 30 is greater than the thickness of the encapsulation compound mold 103. Specifically, the difference p2 between the thickness of the molding compound 30 and the thickness of the molding compound mold 103 is between 1 mm and 2 mm. The difference p2 between the thickness of the molding compound 30 and the thickness of the molding compound mold 103 may be 1 mm, 1.5 mm, or 2 mm. In the process of pressing the encapsulation compound 30 and the to-be-encapsulated compound 20, the difference p2 between the thickness of the encapsulation compound 30 and the thickness of the encapsulation compound mold 103 is smaller than 1 mm, which results in that the encapsulation compound 30 cannot effectively encapsulate the to-be-encapsulated compound 20, and thus the encapsulation effect of the to-be-encapsulated compound 20 is poor. The difference p2 between the thickness of the encapsulation compound 30 and the thickness of the encapsulation compound mold 103 is greater than 2 mm, so that a large amount of redundant encapsulation compound 30 is generated in the process of laminating the encapsulation compound 30 and the to-be-encapsulated compound 20, the redundant encapsulation compound 30 cannot be contained in the glue overflow holes 1032, and the redundant encapsulation compound 30 is easy to overflow the encapsulation component, thereby affecting the encapsulation effect of the to-be-encapsulated compound 20. Therefore, the difference p2 between the thickness of the molding compound 30 and the thickness of the molding die 103 is set between 1 mm and 2 mm, so as to ensure the molding effect of the molding compound 20.

The release film 106 is located on the side of the sealing mold 103 away from the part 20 to be sealed. The release film 106 is located between the encapsulation compound 30 and the cover plate 104. The release film 106 covers the second opening 1031 and the glue overflow hole 1032.

The release film 106 is a film having a different surface energy. The release film 106 is not tacky, or is slightly tacky, after contact with a particular material under limited conditions. The release film 106 exhibits an extremely light and stable release force to the encapsulation compound 30. In the present application, the adhesion force between the release film 106 and the encapsulation compound 30 is smaller than that between the cover plate 104 and the encapsulation compound 30. After the lamination of the encapsulation compound 30 and the to-be-encapsulated compound 20 is completed, the release film 106 can be directly peeled off from the surface of the encapsulation compound 30 in the encapsulation compound area 20a and the surface of the encapsulation compound 30 in the glue overflow hole 1032, and the release film 106 is not easy to remain on the surface of the encapsulation compound 30.

According to the application, the release film 106 is arranged between the packaging adhesive 30 and the cover plate 104, so that the packaging adhesive 30 can be prevented from being directly adhered to the cover plate 104, and the separation of the cover plate 104 and the packaging adhesive 30 is facilitated.

The cover plate 104 is located on a side of the release film 106 remote from the encapsulant 30. The cover plate 104 is disposed opposite to the carrier plate 101. One end of the cover plate 104 is aligned with one end of the carrier plate 101. The orthographic projection of the encapsulation compound 30 on the carrier 101 is located within the range of the orthographic projection of the cover plate 104 on the carrier 101. The encapsulation compound 30 and the to-be-encapsulated compound 20 are stacked between the cover plate 104 and the carrier plate 101. When the pressing is performed, the distance between the cover plate 104 and the carrier plate 101 is shortened. The cover plate 104 applies pressure to one side of the encapsulation compound 30. The encapsulation compound 30 deforms, thereby achieving encapsulation of the part 20 to be encapsulated.

The connecting piece 107 is located at the edges of the carrier 101, the limiting piece 102, the sealing mold 103, the release film 106 and the cover plate 104. The connecting piece 107 is connected with the carrier plate 101, the limiting piece 102, the sealing die 103, the release film 106 and the cover plate 104. Specifically, as shown in fig. 1, the connection member 107 may be a screw. Screw holes are formed in the edges of the carrier plate 101, the limiting piece 102, the sealing die 103, the release film 106 and the cover plate 104. The threaded holes of the carrier plate 101 are in one-to-one correspondence with the threaded holes of the limiting piece 102, the threaded holes of the sealing die 103 and the threaded holes of the cover plate 104. The screw realizes the detachable connection of the carrier plate 101 and the limiting piece 102, the sealing die 103, the release film 106 and the cover plate 104 through the threaded holes.

It will be appreciated that in embodiments of the present application, the connection member 107 may also be a clamping member (not shown). The clamping piece clamps the carrier plate 101, the limiting piece 102, the sealing die 103, the release film 106 and the cover plate 104 which are arranged in a laminated mode, so that detachable connection of the carrier plate 101, the limiting piece 102, the sealing die 103, the release film 106 and the cover plate 104 is achieved. The connection member 107 is not particularly limited in the present application.

According to the application, the connecting piece 107 is arranged in the sealing glue assembly 100, so that the carrier plate 101, the limiting piece 102, the sealing glue die 103, the release film 106 and the cover plate 104 are detachably connected, and the sealing glue 30 is beneficial to placing the sealing glue 20 and the sealing glue 30 in the sealing glue assembly 100, so that the sealing glue of the sealing glue 30 to the sealing glue 20 is realized.

The glue sealing assembly provided by the application is provided with the glue overflow hole in the glue sealing mould, and the glue overflow hole is arranged adjacent to the second opening for containing the packaging glue. When the to-be-sealed glue piece is pressed with the packaging glue, the glue overflow hole provides an accommodating space for the redundant packaging glue, so that the influence on the glue sealing effect of the to-be-sealed glue piece caused by the fact that the redundant packaging glue directly overflows from the second opening to the glue sealing assembly 100 can be avoided. The packaging component provided by the application can improve the sealing effect of the to-be-sealed glue piece. Meanwhile, the glue overflow hole is arranged opposite to the non-sealing area of the to-be-sealed glue piece, so that the excessive packaging glue can be prevented from flowing to the non-sealing area of the to-be-sealed glue piece, and the normal use of the related functions of the to-be-sealed glue piece is ensured.

The application also provides a sealing device 10. Referring to fig. 1 and fig. 6, fig. 6 is a schematic structural diagram of a first embodiment of an adhesive sealing apparatus according to the present application.

As shown in fig. 6, the sealing device 10 includes the sealing assembly 100, the vacuum chamber 200, the sealing plate 300, and the pressing assembly 400 as described above.

The vacuum chamber 200 includes a bottom plate 201 and a sidewall 202. The side wall 202 is disposed around the edge of the bottom plate 201 to form the receiving chamber 200a. The receiving chamber 200a is used for receiving the molding compound assembly 100. Specifically, the molding compound assembly 100 is located on a side of the base 201 where the sidewall 202 is located. The vacuum chamber 200 forms a closed space with the sealing plate 300. The sidewall 202 of the vacuum chamber 200 is provided with an air-extracting hole 203. One end of the suction hole 203 is connected to the accommodating chamber 200a, and the other end of the suction hole 203 is connected to a vacuum pump (not shown). The vacuum chamber 200 may pump air of the accommodating chamber 200a by a vacuum pump to make the vacuum degree of the accommodating chamber 200a reach a preset vacuum degree.

The edge of the sealing plate 300 contacts the inner side of the sidewall 202. The sealing plate 300 forms a closed space with the vacuum chamber 200. The molding assembly 100 and the press assembly 400 are located between the base 201 and the sealing plate 300.

The press-fit assembly 400 is connected to a side of the sealing plate 300 adjacent to the bottom plate 201. The press assembly 400 includes a press head 401 and a press plate 402. One side of the ram 401 is connected to the sealing plate 300. The other side of the ram 401 is connected to a platen 402. The molding assembly 100 is located between the platen 402 and the base plate 201. The orthographic projection of the encapsulation compound 30 in the encapsulation compound assembly 100 on the carrier 101 is within the orthographic projection range of the platen 402 on the carrier 101. In the process of pressing the encapsulation compound 30 and the to-be-encapsulated compound 20, the above arrangement makes the force applied by the pressing plate 402 to the encapsulation compound 30 more uniform, so as to avoid the influence of the encapsulation compound 30 on the encapsulation effect due to overlarge local stress.

The working procedure of the sealing device 10 provided by the present application is described with reference to fig. 1, 6 and 7. When the glue sealing device 10 presses the glue sealing piece 20 and the packaging glue 30, the method specifically comprises the following steps:

step B701: and placing the sealing component in which the to-be-sealed glue piece and the sealing glue are placed in a sealing device.

In the present embodiment, the substrate to which the led chip is connected is taken as the to-be-sealed member 20, and the thermal adhesive is taken as the packaging adhesive 30.

Specifically, the substrate connected with the light emitting diode chip is placed in the limiting member 102, and the hot-pressing glue is placed in the glue sealing mold 103. The placed substrate and the glue assembly 100 of the hot press glue are placed in the glue sealing apparatus 10.

Step B702: and pressing the sealing glue assembly through the pressing assembly so as to enable the sealing glue to be in contact with the piece to be sealed.

The sealing plate 300 is moved in a direction approaching the carrier plate 101. The distance between the sealing plate 300 and the bottom plate 201 is shortened until the pressing plate 402 contacts the cover plate 104 of the package assembly. The platen 402 presses the molding compound assembly 100. The hot-pressing glue in the glue sealing assembly 100 is stressed to deform, so that the glue sealing of the LED chip by the hot-pressing glue is realized.

It will be appreciated that in some embodiments, the hot press glue may need to be pressed within a certain temperature range. Therefore, in the embodiment of the present application, a temperature control assembly may be disposed at one side of the pressing assembly 400, so that the pressing head 401 and the pressing plate 402 reach a preset temperature. During the lamination of the thermal adhesive and the substrate, the heat of the lamination assembly 400 is transferred to the sealing device 10. And the hot-pressing glue reaches a preset temperature, so that the glue sealing of the light-emitting diode chip is realized.

It is understood that the temperature control assembly of the present application may be disposed at one side of the vacuum chamber 200, and the temperature of the hot-pressing glue reaches a preset temperature by adjusting the temperature in the receiving chamber 200a.

It is understood that the temperature of the hot-pressing glue is related to the material of the hot-pressing glue and the property of the to-be-sealed glue piece 20, and the preset temperature is not particularly limited in the present application.

Step B703: air in the vacuum chamber is extracted to make the vacuum degree of the accommodating chamber reach a preset vacuum degree.

Specifically, air of the accommodating chamber 200a is pumped by a vacuum pump to make the vacuum degree of the accommodating chamber 200a reach a preset value. In step 702, the thermo-compression adhesive and the substrate connected with the led chip are pressed under the condition of atmospheric pressure, so that the pressing of the thermo-compression adhesive to the led chip is easy to generate bubbles, thereby affecting the sealing effect of the thermo-compression adhesive to the led chip. The vacuum degree of the accommodating cavity 200a reaches a preset value, so that air bubbles among the hot-pressing adhesives are discharged, and the sealing effect of the hot-pressing adhesives on the light-emitting diode chips is improved.

It is understood that the preset vacuum degree may be set according to an actual production process, and the present application is not limited thereto.

Fig. 8 is a schematic structural diagram of a second embodiment of the sealing device 10 according to the present application.

The sealant device 10 according to the second embodiment of the present application differs from the sealant device 10 according to the first embodiment in that: the encapsulation device 10 also includes a seal 500. Seal 500 is located at an end of sidewall 202 remote from floor 201. One end of the seal 500 contacts one end of the sidewall 202, and the other end of the seal 500 contacts an edge of the sealing plate 300. The vacuum chamber 200, the sealing member 500 and the sealing plate 300 are disposed around to form a closed space. The seal 500 has variability. When the sealing device 10 is pressed, the sealing element 500 can deform, so that the normal pressing process is ensured. In step B703, the sealing member 500, the vacuum chamber 200 and the sealing plate 300 form a closed space, which prevents the entry of external air and ensures that the vacuum degree of the accommodating chamber 200a can reach a preset vacuum degree.

Other components of the sealing device 10 of the second embodiment are the same as those of the sealing device 10 of the first embodiment, and will not be described again here.

The application provides a glue sealing device, wherein a glue overflow hole is arranged in a glue sealing component in the glue sealing device. When the to-be-sealed glue piece is pressed with the packaging glue, the glue overflow hole provides an accommodating space for the redundant packaging glue, so that the influence on the glue sealing effect of the to-be-sealed glue piece caused by the fact that the redundant packaging glue directly overflows to the glue sealing component can be avoided. In addition, the sealing device sets the vacuum degree in the accommodating cavity at a preset value in the process of pressing the packaging adhesive and the to-be-sealed adhesive piece, so that air bubbles between the packaging adhesive and the to-be-sealed adhesive piece are discharged, and the sealing effect of the hot-pressing adhesive on the light-emitting diode chip is improved.

Correspondingly, the application also provides a glue sealing method. As shown in fig. 9 and 10, fig. 9 is a flowchart of the sealing method provided by the present application. Fig. 10 is a schematic structural diagram of a part to be sealed in steps B10 to B30 of the sealing method according to the present application. The sealing method specifically comprises the following steps:

step B10: and attaching a protective film to the non-sealing area of the to-be-sealed glue piece.

As shown in the structure (a) of fig. 10, the region where the light emitting diode chip is disposed is a sealing region 20a. The remainder being non-sealing areas 20b. In the prior art, the non-molding area 20b is typically used to provide traces. And the lighting of the LED chip is realized. In an embodiment of the present application, the non-sealing region 20b is disposed around the edge of the sealing region 20a.

The non-molding region does not need to be bonded with the molding compound 30, and therefore, the protective film 105 in the molding compound 100 is bonded to the non-molding region 20b. The structure of the to-be-sealed member 20 after the protective film 105 is attached is as shown in fig. 10 (b). The protective film 105 covers the non-sealing region 20b. The protective film 105 is disposed around the edge of the sealing region 20a.

Step B20: and packaging the to-be-sealed piece by using the sealing component.

Specifically, the to-be-sealed member 20 to which the protective film 105 is attached is placed in the sealing assembly 100. The substrate connected with the light emitting diode chip in the sealing assembly 100 is pressed with the hot-pressing glue through the sealing device 10, so that the sealing of the light emitting diode chip by the hot-pressing glue is realized.

After the encapsulation of the led chip is completed, the cover plate 104, the encapsulation mold 103, the limiting member 102 and the carrier plate 101 in the encapsulation component 100 are removed, and the resulting structure is as shown in fig. 10 (c).

Step B30: and removing the protective film.

After removing the cover plate 104, the sealing mold 103, the stopper 102 and the carrier plate 101, the protective film 105 located in the non-sealing area 20b is torn off, and the resulting structure is as in (d) of fig. 10.

Step B40: and curing the glue piece to be sealed.

After the protective film 105 is torn off, the thermocompression bonding after the lamination may also be subjected to a curing treatment. Specifically, the substrate to which the hot-pressing glue is attached is subjected to heat treatment to realize solidification of the hot-pressing glue.

It is understood that the curing temperature and curing time of the thermocompression bonding glue are related to the material of the thermocompression bonding glue, the thickness of the thermocompression bonding glue and the size of the substrate, and the curing temperature and curing time of the thermocompression bonding glue are not limited in the application.

The application provides a sealing method. The sealing method provided by the application adopts the sealing component to press the to-be-sealed piece and the sealing glue. According to the glue sealing method provided by the application, the glue overflow hole is arranged in the glue sealing component. When the to-be-sealed glue piece is pressed with the packaging glue, the glue overflow hole provides an accommodating space for the redundant packaging glue, so that the influence on the glue sealing effect of the to-be-sealed glue piece caused by the fact that the redundant packaging glue directly overflows to the glue sealing component can be avoided. The sealing method provided by the application can improve the sealing effect of the to-be-sealed piece. Meanwhile, the sealing method provided by the application covers the protective film on the non-sealing area, protects the non-sealing area of the piece to be sealed, and avoids the influence on the performance of the sealing glue caused by the fact that the sealing glue presses the non-sealing area of the piece to be sealed.

In summary, although the detailed description of the embodiments of the present application is given above, the above embodiments are not intended to limit the present application, and those skilled in the art will understand that: the technical scheme described in the foregoing embodiments can be modified or some of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the technical solutions according to the embodiments of the present application.

Claims

1. A glue assembly, comprising:

a carrier plate;

the cover plate is positioned at one side of the sealing mold far away from the limiting piece, and the cover plate and the carrier plate are oppositely arranged;

the sealing assembly further comprises a protective film, wherein the protective film is positioned between the to-be-sealed glue piece and the sealing mould, and the protective film covers a non-sealing glue area of the to-be-sealed glue piece.

2. The glue assembly of claim 1, wherein the glue die comprises a plurality of glue overflow holes disposed along an edge of the second opening.

3. The glue assembly of claim 2, wherein the plurality of glue overflow holes are evenly distributed along the circumference of the second opening.

4. The glue assembly of claim 1, wherein the glue overflow aperture is located on a side of the non-glue sealing area of the piece to be sealed.

5. The encapsulant assembly of claim 1, wherein a gap is provided between the encapsulant and an inner wall of the second opening.

6. The glue assembly of claim 1, further comprising a release film positioned between the glue mold and the cover plate, the release film covering the second opening and the glue overflow aperture.

7. The molding assembly of claim 1, further comprising a connector through which the carrier plate, the retainer, the molding die, and the cover plate are detachably connected.

8. A sealing device comprising the sealing assembly of any one of claims 1 to 7, the sealing device further comprising:

a sealing plate, an edge of which is in contact with the sidewall;

9. The seal of claim 8, further comprising a seal having one end in contact with an end of the sidewall distal from the base plate and another end in contact with a side of the seal plate proximal to the seal assembly.

10. A sealing method, characterized in that the sealing is performed by using the sealing assembly according to any one of claims 1 to 7, the sealing method comprising:

sealing the to-be-sealed piece by using the sealing component;

removing the protective film;

and curing the to-be-sealed glue piece.