CN206501287U - The compound groove guide whee of silicon rod slicing machine - Google Patents
The compound groove guide whee of silicon rod slicing machine Download PDFInfo
- Publication number
- CN206501287U CN206501287U CN201720181623.2U CN201720181623U CN206501287U CN 206501287 U CN206501287 U CN 206501287U CN 201720181623 U CN201720181623 U CN 201720181623U CN 206501287 U CN206501287 U CN 206501287U
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- groove
- section
- silicon rod
- steel wire
- slicing machine
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Abstract
The utility model is related to a kind of compound groove guide whee of silicon rod slicing machine, it is characterized in that including roll body and the polyurethane clad being coated on outside the roll body, some grooves for being used to bypass section steel wire are offered in the polyurethane cover surface, the groove is made up of the first V-groove section and the second V-groove section, two sides of the first V-groove section of the groove and two sides of the second V-groove section are tangent with section steel wire respectively, the V-groove angle of the first V-groove section of the groove is between 80 ~ 100 °, the V-groove angle of the second V-groove section of the groove is between 15 ~ 25 °.The utility model is simple and compact for structure, and manufacturing cost is low, delays the abrasion of guide wheel, extends the service life of guide wheel, reduces production cost, it is ensured that the wafer thickness cut out is uniform, it is ensured that product quality.
Description
Technical field
The utility model is related to a kind of silicon rod slicing machine, more particularly, to a kind of compound groove guide whee of silicon rod slicing machine.
Background technology
, it is necessary to which silicon rod gone out into a piece of wafer by silicon rod slicing machine-cut in solar wafer production process, and silicon rod
Exactly section steel wire winding is cut on silicon rod slicing machine guide wheel to silicon rod in slicer, wherein silicon rod slicing machine guide wheel
Including roll body and the polyurethane clad being coated on the outside of roll body, for ease of section steel wire winding on silicon rod slicing machine guide wheel,
Some steel wire grooves are provided with polyurethane clad, at present, the steel wire groove opened up on polyurethane clad is generally used and cut
The V-shaped groove in face, the rounded steel wire in section only has two-point contact, contact area in theory with the V-shaped groove in section
Small, after silicon rod slicing machine guide wheel uses the regular hour, steel wire easily produces abrasion to steel wire groove, is cut to silicon rod
When cutting, the phenomenon swung occurs in steel wire, causes the wafer thickness cut out uneven, influences product quality, meanwhile, guide wheel
Service life it is shorter, it is necessary to will roll body surface polyurethane clad remove after coat a strata urethane clad again again,
Then open up steel wire groove again again, increase production cost.
Utility model content
The problem of the applicant is directed to above-mentioned, has carried out Improvement there is provided a kind of compound groove guide whee of silicon rod slicing machine,
Simple and compact for structure, manufacturing cost is low, delays the abrasion of guide wheel, extends the service life of guide wheel, reduces production cost, it is ensured that cut
The wafer thickness cut out is uniform, it is ensured that product quality.
In order to solve the above-mentioned technical problem, the utility model is adopted the following technical scheme that：
A kind of compound groove guide whee of silicon rod slicing machine, including roll body and the polyurethane clad that is coated on outside the roll body,
Some grooves for being used to bypass section steel wire are offered in the polyurethane cover surface, the groove is by the first V-groove section
And second V-groove section constitute, two sides of the first V-groove of groove section and two sides of the second V-groove section are respectively
Tangent with section steel wire, the V-groove angle of the first V-groove section of the groove is between 80 ~ 100 °, the 2nd V of the groove
The V-groove angle of type groove section is between 15 ~ 25 °.
Further：
The V-groove angle of the first V-groove section of the groove is 90 °.
The V-groove angle of the second V-groove section of the groove is between 19 °.
It is of the present utility model to have technical effect that：
A kind of compound groove guide whee of silicon rod slicing machine disclosed in the utility model, simple and compact for structure, manufacturing cost is low, prolongs
The abrasion of slow guide wheel, extends the service life of guide wheel, reduces production cost, it is ensured that the wafer thickness cut out is uniform, it is ensured that production
Quality.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is partial enlarged drawing at Fig. 1 A.
Embodiment
Embodiment of the present utility model is described in further detail below in conjunction with the accompanying drawings.
As shown in Figure 1, 2, the utility model includes roll body 1 and the polyurethane clad 2 being coated on outside roll body 1, in poly- ammonia
The surface of ester clad 2 offers some grooves 3 for being used to bypass section steel wire, and groove 3 is by the first V-groove section 31 and the 2nd V
The composite slot that type groove section 32 is constituted, two sides of the first V-groove section 31 of groove 3 and two sides of the second V-groove section 32
Tangent with section steel wire 4 respectively, the V-groove angle B of the first V-groove section 31 of groove 3 is between 80 ~ 100 °, and the second of groove 3
The V-groove angle C of V-groove section 32 is between 15 ~ 25 °, in the present embodiment, the V-groove angle of the first V-groove section 31 of groove 3
It is 90 ° to spend B, and the V-groove angle C of the second V-groove section 32 of groove 3 is 19 °.
As seen from Figure 2, due to groove 3 the first V-groove section 31 two sides and the second V-groove section two of 32
Side is tangent with section steel wire 4 respectively, and when steel wire 4 of cutting into slices bypasses groove 3, the rounded section steel wire 4 in section exists with groove 3
Four point contacts, increase contact area to share pressure of the section steel wire 4 to the surface of groove 3, reduce the mill to the surface of groove 3
Damage, extend the service life of guide wheel.In actual use, the first V-groove section 31 of groove 3 undertakes most steel wire pressure,
Faster, and the second V-groove of groove 3 section 32 undertakes less steel wire pressure to surface abrasion, weares and teares slower, as the first V of groove 3
When a certain degree of abrasion occurs in type groove section 31, swinging for steel wire appearance is limited by the second V-groove section 32, so that it is guaranteed that cutting
The wafer thickness cut out is uniform, it is ensured that product quality.
Claims (3)
1. a kind of compound groove guide whee of silicon rod slicing machine, it is characterised in that：Including roll body and the poly- ammonia being coated on outside the roll body
Ester clad, offers some grooves for being used to bypass section steel wire, the groove is by the in the polyurethane cover surface
One V-groove section and the second V-groove section are constituted, two sides of the first V-groove of groove section and two of the second V-groove section
Side is tangent with section steel wire respectively, and the V-groove angle of the first V-groove section of the groove is between 80 ~ 100 °, the groove
The second V-groove section V-groove angle between 15 ~ 25 °.
2. according to the compound groove guide whee of the silicon rod slicing machine described in claim 1, it is characterised in that：First V-type of the groove
The V-groove angle of groove section is 90 °.
3. according to the compound groove guide whee of the silicon rod slicing machine described in claim 1, it is characterised in that：Second V-type of the groove
The V-groove angle of groove section is between 19 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720181623.2U CN206501287U (en) | 2017-02-28 | 2017-02-28 | The compound groove guide whee of silicon rod slicing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720181623.2U CN206501287U (en) | 2017-02-28 | 2017-02-28 | The compound groove guide whee of silicon rod slicing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206501287U true CN206501287U (en) | 2017-09-19 |
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ID=59840753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720181623.2U Active CN206501287U (en) | 2017-02-28 | 2017-02-28 | The compound groove guide whee of silicon rod slicing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206501287U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115647756A (en) * | 2022-12-06 | 2023-01-31 | 江苏聚成金刚石科技股份有限公司 | Equipment for producing diamond wire and manufacturing and application methods thereof |
-
2017
- 2017-02-28 CN CN201720181623.2U patent/CN206501287U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115647756A (en) * | 2022-12-06 | 2023-01-31 | 江苏聚成金刚石科技股份有限公司 | Equipment for producing diamond wire and manufacturing and application methods thereof |
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