CN206490095U - A kind of display panel and display device - Google Patents
A kind of display panel and display device Download PDFInfo
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- CN206490095U CN206490095U CN201720030720.1U CN201720030720U CN206490095U CN 206490095 U CN206490095 U CN 206490095U CN 201720030720 U CN201720030720 U CN 201720030720U CN 206490095 U CN206490095 U CN 206490095U
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Abstract
The utility model describes a kind of display panel and display device.The display panel includes：Substrate；Organic luminescent device, is arranged on the substrate；Thin-film encapsulation layer, is arranged at the side that the organic luminescent device deviates from the substrate, the thin-film encapsulation layer includes the laminated film formed by least one inorganic layer and at least one organic layer of alternately laminated setting, and the laminated film does not have interface layer.In the thin-film encapsulation layer of the display panel, macroscopically from the point of view of whole laminated film be exactly in theory an entirety and in the absence of macroscopic interface, the thin-film encapsulation layer of formation has less stress.
Description
Technical field
The utility model is related to display technology field, more particularly to a kind of display panel and includes the display panel
Display device.
Background technology
With continuing to develop for Display Technique, display panel manufacturing technology also tends to maturation, and existing display panel is main
Including organic EL display panel (Organic Light Emitting Diode, OLED), liquid crystal display panel
(Liquid Crystal Display, LCD), Plasmia indicating panel (Plasma Display Panel, PDP) etc..It is flexible
Display panel is a kind of deformable, the flexible display panel being made by base material of the material such as polyimides or polyester film,
Compared with conventional display panels, flexible display panels have the advantages that small volume, low in energy consumption, flexible, flexible, are that one kind has
The display panel of broad prospect of application.
The display element that existing flexible display panels are generally pointed on flexible base board using thin film encapsulation technology is carried out
Encapsulation.Thin-film encapsulation layer is general to pass through plasma enhanced chemical vapor deposition method (PECVD), atomic layer deposition method (ALD), rotation
The methods such as coating (Spin-Coating), print process (Printering) are made, compared with other method, and ALD film layer is (by ALD
Film layer prepared by method) there is the ability of preferably barrier water oxygen in the case of thinner.
The problem of existing ALD film layer is present is that its stress is larger, for example, the 50nm prepared by ALD Al2O3 stress
In 300Mpa or so.
Utility model content
In view of this, the utility model provides a kind of display panel and the display device comprising the display panel.
In a first aspect, the utility model provides a kind of display panel, including：
Substrate；
Organic luminescent device, is arranged on the substrate；
Thin-film encapsulation layer, is arranged at the side that the organic luminescent device deviates from the substrate, the thin-film encapsulation layer bag
The laminated film formed containing at least one inorganic layer by alternately laminated setting and at least one organic layer, and the laminated film
There is no interface layer.
Second aspect, the utility model additionally provides a kind of display device, including the display panel described in first aspect.
The utility model embodiment provides a kind of display panel and display device, by deviating from substrate in organic luminescent device
Side thin-film encapsulation layer is set, the wherein thin-film encapsulation layer includes at least inorganic layer and at least by alternately laminated setting
The laminated film of one organic layer formation, and the laminated film does not have interface layer, to be effectively improved encapsulated layer due to interface layer
Presence the problem of be easily peeled off and produce stress concentration.
Brief description of the drawings
Fig. 1 is the schematic cross-section of the display panel of the utility model one embodiment；
Fig. 2 is the schematic cross-section of the thin-film encapsulation layer of the utility model one embodiment；
Fig. 3 is the preparation flow figure of the thin-film encapsulation layer of the utility model one embodiment；
Fig. 4 is the schematic cross-section prepared after luminescent device of the utility model one embodiment；
Fig. 5 is the preparation process schematic diagram of the inorganic layer of the utility model one embodiment；
Fig. 6 is the preparation flow figure of first inorganic layer of the utility model one embodiment；
Fig. 7 is the preparation flow figure of second inorganic layer of the utility model one embodiment；
Fig. 8 is the display device schematic diagram of the utility model one embodiment.
Embodiment
Example embodiment is described more fully with referring now to accompanying drawing.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, thesing embodiments are provided so that this practicality is new
The design of example embodiment more comprehensively and completely, and is comprehensively conveyed to those skilled in the art by type.It is identical in figure
Reference represent same or similar structure, thus repetition thereof will be omitted.
The word of expression position and direction described in the utility model, is the explanation carried out by taking accompanying drawing as an example, but root
According to needing to make a change, make change and be all contained in the utility model protection domain.Accompanying drawing of the present utility model is only
For illustrating relative position relation, the thickness at some positions employs the plotting mode lavished praise on oneself in order to understand, the layer in accompanying drawing
Thickness does not represent the proportionate relationship of actual thickness.
Fig. 1 is the schematic cross-section of the display panel of the utility model one embodiment, and Fig. 2 is one reality of the utility model
The schematic cross-section of the laminated film stacked structure of example is applied, with reference to Fig. 1 and Fig. 2, display panel 100 of the present utility model includes：
Substrate 10, organic luminescent device 40 and thin-film encapsulation layer 50.
Substrate 10 is optionally flexible base board, and flexible base board is engaged shape with organic luminescent device 40, thin-film encapsulation layer 50
Into flexible display panels.Material the utility model of flexible base board is not limited, and is optionally organic polymer, as an example, having
Machine polymer can be polyimides (PI), polyamide (PA), makrolon (PC), Poly-s 179 (PES), poly terephthalic acid
Glycol ester (PET), PEN (PEN), polymethyl methacrylate (PMMA), cyclic olefine copolymer
(COC) one kind in.
Organic luminescent device 40 is arranged on substrate 10, at least including the anode layer 41 on substrate 10, luminescent layer 42
With cathode layer 43, and hole injection layer, hole transmission layer, electronic barrier layer, hole blocking layer, electronics may further include
One or more layers in transport layer, electron injecting layer.Organic luminescent device 40 can also include pixel defining layer 44, and the pixel is determined
Organic luminescent device 40 is limited multiple subpixel areas by adopted layer 44.The structure and material of organic luminescent device 40 can be using
Know technology, will not be described here.
Further, it is further provided between organic luminescent device 40 and substrate 10 as the film crystal needed for realizing display
Tube layer 20, a plurality of data lines and multi-strip scanning line (not shown).Wherein, tft layer 20 at least include active layer, source electrode,
Drain electrode, grid, insulating barrier, the drain electrode of tft layer 20 are electrically connected with the anode layer 41 of organic luminescent device 40；It is a plurality of
Data wire and multi-strip scanning line are intersected with each other, wherein, the source electrode of data line electrical connection to tft layer 20, scan line electricity
Property is connected to the grid of tft layer 20.During work, scan line controls each sub- picture by the grid of tft layer 20
The switch of element, data wire is electrically connected with by the source electrode of tft layer 20 with the anode layer 41 of organic luminescent device 40,
When the corresponding thin film transistor (TFT) of each sub-pixel is opened, data-signal, the display of each sub-pixel of control are provided for each sub-pixel.Film
The concrete structure of transistor layer 20 can use known technology, will not be described here.
Further, planarization layer 30, the anode layer 41 of organic luminescent device 40 are additionally provided with tft layer 20
Electrically connect on the planarization layer 30, and by the drain electrode of the via in planarization layer 30 and tft layer 20
Connect.
Thin-film encapsulation layer 50 is arranged at organic luminescent device 40 and deviates from the side of substrate 10, and covers organic luminescent device
40, for organic luminescent device 40 to be isolated with surrounding environment, prevent steam, oxygen from passing through and corrode in organic luminescent device 40
Organic substance.
Inventor to existing thin-film encapsulation layer 50 by carrying out research discovery, the thin-film encapsulation layer 50 with stepped construction
In, when having interface between adjacent two film layer, the stress between two film layers is significantly greater than between two film layers stress during without interface.Though
In the right existing multilayer inorganic layer with alternatively layered structure, the thickness of single-layer inorganic layer can be down to 5~50nm, but the phase
Obvious interface and stress are still had between adjacent two layers of inorganic layer, as thin-film encapsulation layer 50, in use, is still deposited
In division, the risk peeled off.
In the utility model, thin-film encapsulation layer 50 is including at least one inorganic layer 511 by alternately laminated setting and at least
The laminated film 51 of one formation of organic layer 512, and the laminated film 51 is without interface layer, the inorganic layer 511 and organic layer
It is bonded between 512 by atomic force, makes do not have interface between inorganic layer 511 and organic layer 512.Although laminated film 51 is by alternately
The inorganic layer 511 and organic layer 512 of stacking are constituted, but due to being bonded between inorganic layer 511 and organic layer 512 by atomic force,
Between the two without interface, macroscopically from the point of view of whole laminated film 51 be exactly in theory an entirety and macroscopic interface be not present,
And the laminated film is at least one inorganic layer 511 and at least one organic layer 512, organic layer by alternately laminated setting
512 can effectively alleviate the stress of inorganic layer 511, therefore, and the laminated film 51 of formation is substantially unstressed or with minimum stress.
After testing, water oxygen obstructing capacity of the laminated film of the present utility model under the conditions of 40 DEG C/90%RH can reach：WVTR≤
1E-4g/ (m2day), meets encapsulation and requires.
In one embodiment, laminated film 51 is formed by atomic deposition technique, and atomic deposition is by by vaporous precursors
Pulse be alternately passed through reactor and on depositing base chemisorbed and react form deposition film.Pass through checker presoma
Atomic deposition can accurately control thickness, form atomic layer level thickness film.Alternatively, inorganic layer 511 is included in the utility model
10 to 100 sub- inorganic layers, and organic layer 512 includes 10 to 100 sub- organic layers, wherein, sub- inorganic layer and son are organic
Layer is individual layer atomic layer, and the thickness per straton inorganic layer isThe thickness of inorganic layer is 30~100nm, organic layer
Thickness is 1~20 μm.The film layer of inorganic layer 511 is dense, primarily serves the effect for the oxygen that blocks water, the thickness of inorganic layer 511 is too
Film layer compactness not enough, does not reach the requirement of encapsulation, and the thickness of inorganic layer 511 is too thick to be unfavorable for Flexible Displays, and extends multiple
Close the Production Time of film, cost of manufacture rises.Alternatively, inorganic layer 511 includes 10 to 100 sub- nothings in the utility model
Machine layer, the thickness of inorganic layer is 30~100nm.Alternatively, it is per the thickness of straton inorganic layerThe thickness and atom are straight
The size in footpath is on the same order of magnitude so that adjacent sub inorganic bed boundary is limited in the aspect of atom, and two layers of lattice is poor
It is different smaller, macroscopically from the point of view of whole inorganic layer 511 be exactly in theory an entirety and in the absence of macroscopic interface, therefore, formation
Inorganic layer 511 is substantially unstressed or with minimum stress.The film layer of organic layer is relatively more loose, primarily serves alleviation inorganic layer
Stress effect, organic layer thickness is too thin not to have the effect for alleviating inorganic ply stress, and organic layer is too thick, neutral surface can be made inclined
Move, crooked process radius is become big, be unfavorable for flexible bending.Alternatively, in the utility model, organic layer 512 includes 10 to 100
Sub- organic layer, the thickness of organic layer is 1~20 μm.
In yet another embodiment, alternatively, the material of inorganic layer 511 includes alundum (Al2O3) (Al2O3), titanium dioxide
(TiO2), at least one of gallic oxide (Ga2O3), silicon nitride, silica, silicon oxide carbide, the material of the organic layer
Include at least one of organosiloxane, polyacrylic resin, epoxy resin.Alternatively, inorganic layer 511 and organic layer 512
Between adhesion be 104~106J/mol, due to the stress between adjacent two film layer be mostly derived from two film layers material category,
The difference of lattice, this species diversity is bigger, and interface is more obvious, and stress is accordingly bigger, and above-mentioned adhesion makes what is be made up of different material
Combination between inorganic layer 511 and organic layer 512 is limited in the aspect combined between atom, can effectively reduce and be drawn by crystal lattice difference
The interfacial stress risen.
It may further include in reference picture 2, thin-film encapsulation layer 50 of the present utility model alternately laminated with laminated film 51
At least one organic encapsulation layer 52, organic encapsulation layer 52 be used for further reduce the stress that may be present of laminated film 51, subtract
Small division, the risk peeled off.The utility model does not limit the material of organic encapsulation layer 52, as an example, organic encapsulation layer 52
Material includes but is not limited to be polyethylene terephthalate (PET), PEN (PEN), makrolon
(PC), polyimides (PI), polyvinyl chloride (PVC), polystyrene (PS), polymethyl methacrylate (PMMA), poly- to benzene two
It is formic acid butanediol ester (PBT), polysulfones (PSO), poly- to benzene diethyl sulfone (PES), polyethylene (PE), polypropylene (PP), poly- silica
Alkane, polyamide (PA), polyacrylonitrile (PAN), polyvinyl acetate (PVAC), polytetrafluoroethylene (PTFE) (PTFE), epoxy resin
(epoxy resin), organosiloxane.
Organic encapsulation layer 52 can be made up of methods such as spin-coating method, print process, printings, obtained organic encapsulation layer 52
Thickness can be 1~20 μm.In the present embodiment, thin-film encapsulation layer 50 includes 2 laminated films 51, respectively the first laminated film
With the second laminated film, and 1 organic encapsulation layer 52 between 2 laminated films 51, in other embodiments, film
Encapsulated layer 50 can include 2 to 3 laminated films 51, wherein, the superiors of the thin-film encapsulation layer 50 and orlop are multiple
Film 51 is closed, further, thin-film encapsulation layer 50 includes 1 to 2 organic encapsulation layer 52, the organic encapsulation layer 52 and THIN COMPOSITE
Film 51 is alternately laminated to be set.Because laminated film has finer and close structure, by being set to be combined in the superiors and orlop
Film, it is ensured that display panel preferably blocks water oxygen performance, by setting the stepped construction of laminated film and organic encapsulation layer,
The stress of inorganic interlayer is effectively improved, reduces division, the risk peeled off.By laminated film 51 and organic encapsulation layer 52 constitute it is thin
Film encapsulated layer 50 can be 5~20 μm, and the thin-film encapsulation layer 50 of the thickness has good barrier steam, the property of oxygen infiltration
Can, meanwhile, with preferable light transmission rate, the light extraction of organic luminescent device 40 is not influenceed.The utility model also provides a kind of aobvious
Show the preparation method of panel 100, reference picture 3 comprises the following steps：
S1：One substrate 10 is provided.
It should be noted that substrate 10 when being flexible base board, it is necessary to form flexible base board on a rigid carrier, the rigidity
Carrier can be glass substrate or quartz base plate, and flexibility is prepared by methods such as spin-coating methods on the glass substrate or quartz base plate
Substrate.
S2：Organic luminescent device 40 is prepared on the substrate 10, alternatively, including is sequentially prepared anode layer on the substrate 10
41st, luminescent layer 42 and cathode layer 43, and hole injection layer, hole transport can be prepared between anode layer 41 and luminescent layer 42
Layer, one or more layers in electronic barrier layer, prepare hole blocking layer, electric transmission between luminescent layer 42 and cathode layer 43
Layer, one or more layers in electron injecting layer, prepare the structure of organic luminescent device 40 referring to Fig. 4.
S3：Organic luminescent device 40 away from substrate 10 side prepare thin-film encapsulation layer 50, concrete structure referring to Fig. 1,
Wherein, thin-film encapsulation layer 50 is included is formed by least one inorganic layer 511 and at least one organic layer 512 of alternately laminated setting
Laminated film, and the laminated film does not have interface layer.The laminated film is prepared using the method for atomic deposition.
Fig. 5 is the preparation process schematic diagram of the laminated film 51 of the utility model one embodiment, with reference to Fig. 5, inorganic layer
511 are prepared by the first deposition cycle (C1) of atomic layer deposition system, organic layer 512 pass through atomic layer deposition system second
Prepared by deposition cycle (C2), laminated film 51 is replaced by the first deposition cycle of atomic layer deposition system and the second deposition cycle
Prepare and formed, is bonded between the inorganic layer 511 and organic layer 512 of preparation by atomic force, the laminated film 51 does not have interlayer circle
Face, and the laminated film 51 formed is substantially unstressed or with minimum stress.
Alternatively, the adhesion between the inorganic layer 511 and organic layer 512 of preparation is 104~106J/mol, the adhesion
The combination between the inorganic layer 511 and organic layer 512 that are made up of different material is set to be limited in the aspect combined between atom, Neng Gouyou
Effect reduces the interfacial stress as caused by crystal lattice difference.
In one embodiment, in above-mentioned steps S3, when preparing thin-film encapsulation layer 50, it is additionally included in form laminated film 51
Afterwards, laminated film 51 away from substrate 10 side formed organic encapsulation layer 52, organic encapsulation layer 52 can by spin-coating method,
The methods such as print process, impact system are made, and the utility model does not limit the preparation method of organic encapsulation layer 52.Further, formed
Thin-film encapsulation layer 50 be to include an at least organic encapsulation layer 52 and at least stepped construction of a laminated film 51, alternatively,
Organic luminescent device is disposed with the first laminated film, the laminated film of organic encapsulation layer 52 and second away from the side of substrate.
As an example, reference picture 5, the first deposition cycle (C1) of atomic layer deposition system comprises the following steps：
S11：The first presoma (Precursor) is heated to gaseous state, gaseous first presoma enters ald system
In the reaction chamber of system and adsorb on substrate.
Wherein, when inorganic layer 511 is alundum (Al2O3) layer, the first presoma can be made using trimethyl aluminium (Al (CH3) 3)
For presoma.
S12：The reaction of atomic layer deposition system is purged with inert gas (Purge gas, such as high pure nitrogen, argon gas)
Chamber, reaction chamber is discharged by the first presoma not to be adsorbed and accessory substance.
S13：Reacting gas (Reaction gas) is passed through into the reaction chamber of atomic layer deposition system, inorganic layer is generated
511.Inorganic layer 511 be alundum (Al2O3) layer and by trimethyl aluminium as the first presoma when, reacting gas is oxidation source, can be with
It is oxygen or steam.
S14：With the reaction chamber of inert gas purge atomic layer deposition system, reacting gas and the reaction of reaction will be had neither part nor lot in
Accessory substance discharges reaction chamber.
As an example, reference picture 7, the second deposition cycle (C2) of atomic layer deposition system comprises the following steps：
S21：The second presoma (Precursor) is heated to gaseous state, gaseous second presoma enters ald system
In the reaction chamber of system and adsorb on substrate.
Wherein, the material of organic layer 512 can be at least one in organosiloxane, polyacrylic resin, epoxy resin
Kind.
S22：The reaction chamber of atomic layer deposition system is purged with inert gas (Purge gas, such as high pure nitrogen), will not
The second adsorbed presoma and accessory substance discharge reaction chamber.
S23：Reacting gas (Reaction gas) is passed through into the reaction chamber of atomic layer deposition system, organic layer is generated
512。
S24：With the reaction chamber of inert gas purge atomic layer deposition system, reacting gas and the reaction of reaction will be had neither part nor lot in
Accessory substance discharges reaction chamber.
Repeated using atomic layer deposition system and alternately above-mentioned first deposition cycle and the second deposition cycle, be made multiple
Close in film 51, the present embodiment, the material of inorganic layer 511 includes alundum (Al2O3) layer, titanium dioxide, three oxygen in laminated film 51
Change two galliums, silicon nitride, silica, silicon oxide carbide at least one of, the material of organic layer 512 includes organosiloxane, poly-
One kind in acrylic resin, epoxy resin, laminated film 51 is without interface layer, and organic layer 512 can effectively alleviate nothing
The stress of machine layer, the laminated film 51 has superior block water oxygen effect and flexibility simultaneously.Alternatively, obtained laminated film 51
Including 5 to 100 inorganic layers 511 and 5 to 100 organic layers, in the case where ensureing to have barrier water oxygen behavior pattern enough, its
Production Time and cost are relatively low, suitable for large-scale production.Alternatively, alternately laminated inorganic layer 511 and organic layer 512 is made,
And inorganic layer 511 and organic layer 512 are unimolecule film layer so that the interface between adjacent inorganic layer 511 and organic layer 512
The aspect for being limited in atom is ensure that, further reduces the stress of the laminated film 51 formed.
The utility model also provides a kind of display device, the knot for the display device that Fig. 8 provides for the utility model embodiment
Structure schematic diagram.As shown in figure 8, display device includes the display panel 100 in above-mentioned any embodiment.Alternatively, this practicality is new
The display device that type embodiment is provided can be organic light-emitting display device.The display device bag that the utility model embodiment is provided
The display panel in above-described embodiment is included, therefore the display device that the utility model embodiment is provided also possesses in above-described embodiment
Described beneficial effect, here is omitted.
Above content is to combine specific preferred embodiment further detailed description of the utility model, it is impossible to
Assert that specific implementation of the present utility model is confined to these explanations.For the ordinary skill of the utility model art
For personnel, without departing from the concept of the premise utility, some simple deduction or replace can also be made, should all be regarded
To belong to protection domain of the present utility model.
Claims (9)
1. a kind of display panel, it is characterised in that including：
Substrate；
Organic luminescent device, is arranged on the substrate；
Thin-film encapsulation layer, be arranged at the organic luminescent device deviate from the substrate side, the thin-film encapsulation layer include by
At least one inorganic layer of alternately laminated setting and the laminated film of at least one organic layer formation, and the laminated film do not have
Interface layer.
2. display panel according to claim 1, it is characterised in that the laminated film uses atomic deposition technique shape
Into.
3. display panel according to claim 2, it is characterised in that the inorganic layer is inorganic comprising 10 to 100 sons
Layer, and the organic layer includes 10 to 100 sub- organic layers.
4. display panel according to claim 3, it is characterised in that the sub- inorganic layer and the sub- organic layer are individual layer
Atomic layer.
5. display panel according to claim 3, it is characterised in that the thickness of every layer of sub- inorganic layer is
The thickness of the inorganic layer is 30~100nm.
6. display panel according to claim 2, it is characterised in that the thickness of the organic layer is 1~20 μm.
7. display panel according to claim 1, it is characterised in that described organic also including an at least organic encapsulation layer
Encapsulated layer and the alternately laminated setting of the laminated film.
8. display panel according to claim 7, it is characterised in that the organic luminescent device deviates from the one of the substrate
Side is disposed with the first laminated film, organic encapsulation layer and the second laminated film.
9. a kind of display device, includes the display panel described in claim 1-8 any one.
Priority Applications (1)
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| CN201720030720.1U CN206490095U (en) | 2017-01-11 | 2017-01-11 | A kind of display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720030720.1U CN206490095U (en) | 2017-01-11 | 2017-01-11 | A kind of display panel and display device |
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Family
ID=59766268
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037478A (en) * | 2018-07-27 | 2018-12-18 | 京东方科技集团股份有限公司 | OLED encapsulating structure, OLED encapsulation method and display panel |
| WO2019019263A1 (en) * | 2017-07-25 | 2019-01-31 | 武汉华星光电半导体显示技术有限公司 | Oled flexible display panel and manufacturing method therefor |
-
2017
- 2017-01-11 CN CN201720030720.1U patent/CN206490095U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019019263A1 (en) * | 2017-07-25 | 2019-01-31 | 武汉华星光电半导体显示技术有限公司 | Oled flexible display panel and manufacturing method therefor |
| CN109037478A (en) * | 2018-07-27 | 2018-12-18 | 京东方科技集团股份有限公司 | OLED encapsulating structure, OLED encapsulation method and display panel |
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| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211111 Address after: 430205 No. 8, liufangyuanheng Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: Wuhan Tianma Microelectronics Co., Ltd Patentee after: Wuhan Tianma Microelectronics Co., Ltd. Shanghai Branch Address before: 200120 room 509, building 1, No. 6111, Longdong Avenue, Pudong New Area, Shanghai Patentee before: Shanghai Tianma organic light emitting display technology Co., Ltd |
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