CN206481298U - Multi-functional 4 close 1 transceiving chip - Google Patents

Multi-functional 4 close 1 transceiving chip Download PDF

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Publication number
CN206481298U
CN206481298U CN201720070519.6U CN201720070519U CN206481298U CN 206481298 U CN206481298 U CN 206481298U CN 201720070519 U CN201720070519 U CN 201720070519U CN 206481298 U CN206481298 U CN 206481298U
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circuit
radio
transmitting
receiving
frequency
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章圣长
吴沁阳
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Chengdu Rdw Tech Co Ltd
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Chengdu Rdw Tech Co Ltd
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Abstract

The utility model is related to a kind of microwave/millimeter wave integrated circuit, specifically, be be related to it is a kind of can realize four-way microwave/millimeter wave transmitting-receiving, with phase shift, attenuation function it is multi-functional 4 close 1 transceiving chip, including radio frequency part, control section and power unit, the radio frequency part includes the radio-frequency receiving-transmitting passage and one point of four power splitter of four tunnel independences, and each passage includes transmitting-receiving switching circuit, driving amplifier circuit, power amplifier circuit, amplifier circuit in low noise, six bit phase shifter circuits and six attenuator circuits;The control section includes digital control circuit;The power unit includes power control circuit, temperature sensing circuit.The application is fully integrated in same chip by a variety of functions.Integrated level height, small volume, low cost, full-digital control, using simple etc..The a variety of functions of being commonly used in phased array system are fully integrated into a chip by the application, and conventional multiple chips are replaced by a chips, so as to significantly reduce volume and reduce cost, while realizing full-digital control.

Description

Multi-functional 4 close 1 transceiving chip
Technical field
The utility model is related to a kind of microwave/millimeter wave integrated circuit, specifically, is to be related to one kind to realize four-way Microwave/millimeter wave transmitting-receiving, 1 transceiving chip of multi-functional 4 conjunction with phase shift, attenuation function.
Background technology
Microwave/millimeter wave circuit is from the waveguide separate component circuit of 1940s, and the plane to 1960s is mixed Integrated circuit, then monolithic integrated circuit, multi-chip module hydrid integrated circuit to 1970s are closed, 21 century is progressively developed into The multifunction module of integrated a variety of monolithic functions, system further develops towards miniaturization, chip direction.Highly integrated many work( Energy chip is the inexorable trend of electronic technology and system compact development, miniaturization, multi-functional, high integration microwave/millimeter Wave circuit will play an increasingly important role in the development of the national economy and national defense construction.
However, existing microwave/millimeter wave integrated circuit not yet controls the transmitting-receiving of multichannel, phase shift, decay and numeral Function processed is integrated in same chip circuit.
Existing patent such as number of patent application is CN200710177851.3, and the applying date is 2007.11.21, entitled " one The patent of invention of millimeter wave miniaturized multichannel transmitting-receiving subassembly device and its phase compensating method ", its technical scheme is:The present invention A millimeter wave miniaturized multichannel transmitting-receiving subassembly device and its phase compensating method are provided, transmitting-receiving subassembly device includes transmitting branch Road, receiving branch, switch, power-devided circuit and metal case, belong to radar component technical field.Transmitting-receiving subassembly device is with MMIC What the millimeter wave whole plane integrated circuit based on (millimeter wave monolithic integrated circuit) technology was realized, and do not have inside transmitting-receiving subassembly Active phase shifting devices.Inter-channel phase compensation method is to load high dielectric using the microstrip line for playing cascade in transmitting-receiving subassembly The medium of constant.By choosing, different loaded mediums can realize the phase error compensation in the range of 0-360 degree, and not shadow Ring amplitude coincidence.
Transmitting-receiving subassembly device is built by multiple chips and circuit in documents, there is that size is big, integrated level is low The problem of;Phase compensation function in documents in transmitting-receiving subassembly device is only to carry out disposable compensation to phase error, is mended Do not have the function of phase shift after repaying;Phase compensation function in documents in transmitting-receiving subassembly device must by test, calculate, Phase error could be adjusted accurate by iterating for the steps such as debugging, there is that debugging speed is slow, debugging step is cumbersome, phase is mended Repay scope and the defect such as limited by real space.
The content of the invention
In view of the above-mentioned problems existing in the prior art, specifically now propose that microwave/millimeter wave is received and dispatched in multi-functional 4 conjunction 1 integrated Circuit chip, the transmitting-receiving of 4 tunnels, switch, amplification, phase shift, decay and digital control, temperature-compensating and power control function is whole It is integrated in a piece of chip circuit, solves the miniaturization integration problem of phased-array radar.
Technical solutions of the utility model are as follows:
Multi-functional 4 close 1 transceiving chip, it is characterised in that:It is described to penetrate including radio frequency part, control section and power unit Frequency part includes radio-frequency receiving-transmitting passage one, radio-frequency receiving-transmitting passage two, radio-frequency receiving-transmitting passage three, the radio-frequency receiving-transmitting passage of four tunnel independences Four and one point of four power splitter, each passage comprising transmitting-receiving switching circuit, driving amplifier circuit, power amplifier circuit, Amplifier circuit in low noise, six bit phase shifter circuits and six attenuator circuits;The control section includes digital control circuit; The power unit includes power control circuit, temperature sensing circuit.
Each circuit in the radio frequency part constitutes two parts of receives link and transmitting chain, wherein transmitting chain Annexation is ordered as by signal transmission direction:Switching circuit link transmitting driving amplifier circuit is received and dispatched, launches drive amplification Device circuit is followed by launching six bit phase shifter circuits, and six bit phase shifter circuits of transmitting are followed by power amplifier circuit;Receives link connects Relation is connect to be ordered as by signal transmission direction:Connection receives six bit phase shifter circuits after amplifier circuit in low noise, receives six Connection after six attenuator circuits, six attenuator circuits is connected after phase shifter circuit and receives driving amplifier circuit, receives and drives Connection transmitting-receiving switching circuit after dynamic amplifier circuit;Transmitting-receiving switching circuit will be received and two links of transmitting are merged.
The transmitting input and reception output end of each radio-frequency receiving-transmitting passage synthesize one by a single-pole double-throw switch (SPDT) circuit Individual common radio-frequency port, and radio-frequency receiving-transmitting switching is carried out by on-off circuit.
The common radio-frequency port of four radio-frequency receiving-transmitting passages is by one point of four power divider circuit synthesis all the way as chip Common radio-frequency port.The emission interface of radio-frequency receiving-transmitting passage one is respectively arranged with each single radio-frequency receiving-transmitting passage, penetrated Receiving interface, the emission interface of radio-frequency receiving-transmitting passage two, the receiving interface of radio-frequency receiving-transmitting passage two, radio frequency of frequency transceiver channel one Emission interface, the receiving interface of radio-frequency receiving-transmitting passage three, the emission interface and radio frequency of radio-frequency receiving-transmitting passage four of transceiver channel three The receiving interface of transceiver channel four.
The transmitting-receiving working condition of chip is digital control when chip operation is in emission state by digital control circuit control The single-pole double-throw switch (SPDT) circuit for controlling four passages is switched to transmitting radio frequency path by circuit, while digital control circuit will be controlled Power control circuit is powered off to all amplifiers of receiving channel;When chip operation is in reception state, digital control circuit will The single-pole double-throw switch (SPDT) circuit of four passages of control is switched to reception radio frequency path, while digital control circuit will control power supply control Circuit processed is powered off to all amplifiers of transmission channel.
There is feedback circuit, temperature sensing circuit will pass through feedback between the temperature sensing circuit and power control circuit Circuit controls bias state of the power control circuit to adjust amplifier, reaches the effect of temperature-compensating.
The working condition of each amplifier, phase shifter and attenuator is digitally controlled circuit control.
The digital control circuit is communicated using SPI communications protocol with chip exterior.
The beneficial effect produced using above-mentioned technical proposal:
1st, the application is fully integrated in same chip by a variety of functions.Integrated level height, small volume, cost are low, digital Change control, using simple etc..The a variety of functions of being commonly used in phased array system are fully integrated into a chip by the application, by one Chips replace conventional multiple chips, so as to significantly reduce volume and reduce cost, while realizing full-digital control.
2nd, compared with documents, the Single-Chip Integration size of the application is small, integrated level is high, and phase shift function is to lead to Cross and digital control phase is changed at any time;The phase compensation function of the application is without passing through the steps such as test, calculating, debugging Iterate and phase error could be adjusted accurate, so debugging speed is fast, debugging step simplifies, phase compensation scope not by The advantages of real space is limited.
Brief description of the drawings
Fig. 1 is theory diagram of the present utility model.
Fig. 2 is circuit framework of the present utility model and function description figure.
Fig. 3 is chip outline drawing of the present utility model.
In accompanying drawing:Radio frequency part 1, control section 2, power unit 3, radio-frequency receiving-transmitting passage 1, radio-frequency receiving-transmitting passage 25, Radio-frequency receiving-transmitting passage 36, radio-frequency receiving-transmitting passage 47, one point of four power splitter 8, transmitting-receiving switching circuit 9, driving amplifier circuit 10, Power amplifier circuit 11, amplifier circuit in low noise 12, six bit phase shifter circuits 13, six attenuator circuits 14 are public to penetrate Frequency port 15, the emission interface 16 of radio-frequency receiving-transmitting passage one, the receiving interface 17 of radio-frequency receiving-transmitting passage one, radio-frequency receiving-transmitting passage two Emission interface 18, the receiving interface 19 of radio-frequency receiving-transmitting passage two, the emission interface 20 of radio-frequency receiving-transmitting passage three, radio-frequency receiving-transmitting lead to The receiving interface 21 in road three, the emission interface 22 of radio-frequency receiving-transmitting passage four, the receiving interface 23 of radio-frequency receiving-transmitting passage four.
Embodiment
Embodiment 1
Multi-functional 4, which close 1 transceiving chip, includes radio frequency part 1, control section 2 and power unit 3, and the radio frequency part 1 is wrapped Radio-frequency receiving-transmitting passage 1, radio-frequency receiving-transmitting passage 25, radio-frequency receiving-transmitting passage 36, the and of radio-frequency receiving-transmitting passage 47 containing four tunnel independences One point of four power splitter 8, each passage includes transmitting-receiving switching circuit 9, driving amplifier circuit 10, power amplifier circuit 11st, amplifier circuit in low noise 12, six bit phase shifter circuits 13 and six attenuator circuits 14;The control section 2 includes number Word control circuit;The power unit 3 includes power control circuit, temperature sensing circuit.The application is fully integrated by a variety of functions In same chip.Integrated level height, small volume, low cost, full-digital control, using simple etc..The application is by phased array The a variety of functions of being commonly used in system are fully integrated into a chip, conventional multiple chips are replaced by a chips, so that greatly Amplitude reduces volume and reduces cost, while realizing full-digital control.
Embodiment 2
Multi-functional 4 close 1 transceiving chip, it is characterised in that:It is described including radio frequency part 1, control section 2 and power unit 3 Radio-frequency receiving-transmitting passage one 4 of the radio frequency part 1 comprising four tunnel independences, radio-frequency receiving-transmitting passage 25, radio-frequency receiving-transmitting passage 36, radio frequency are received Passage 47 and one point of four power splitter 8 are sent out, each passage includes transmitting-receiving switching circuit 9, driving amplifier circuit 10, power Amplifier circuit 11, amplifier circuit in low noise 12, six bit phase shifter circuits 13 and six attenuator circuits 14;The control unit 2 are divided to include digital control circuit;The power unit 3 includes power control circuit, temperature sensing circuit.
Each circuit in the radio frequency part 1 constitutes two parts of receives link and transmitting chain, wherein transmitting chain Road annexation is ordered as by signal transmission direction:Receive and dispatch the link transmitting driving amplifier of switching circuit 9 circuit 10, transmitting driving Amplifier circuit 10 is followed by launching six bit phase shifter circuits 13, and six bit phase shifter circuits 13 of transmitting are followed by power amplifier circuit 11;Receives link annexation is ordered as by signal transmission direction:Connection receives six displacement phases after amplifier circuit in low noise 12 Device circuit 13, receives and is connect after connecting six attenuator circuits 14, six attenuator circuits 14 after six bit phase shifter circuits 13 Driving amplifier circuit 10 is received, connection transmitting-receiving switching circuit 9 after driving amplifier circuit 10 is received;Transmitting-receiving switching circuit 9 will connect Receive and two links of transmitting are merged.
The transmitting input and reception output end of each radio-frequency receiving-transmitting passage synthesize one by a single-pole double-throw switch (SPDT) circuit Individual common radio-frequency port 15, and radio-frequency receiving-transmitting switching is carried out by on-off circuit.
The common radio-frequency port 15 of four radio-frequency receiving-transmitting passages chip is used as by one point of four circuit of power splitter 8 synthesis all the way Common radio-frequency port 15.The emission interface of radio-frequency receiving-transmitting passage one is respectively arranged with each single radio-frequency receiving-transmitting passage 16th, the receiving interface 17 of radio-frequency receiving-transmitting passage one, the emission interface 18 of radio-frequency receiving-transmitting passage two, the reception of radio-frequency receiving-transmitting passage two Interface 19, the emission interface 20 of radio-frequency receiving-transmitting passage three, the receiving interface 21 of radio-frequency receiving-transmitting passage three, radio-frequency receiving-transmitting passage four The receiving interface 23 of emission interface 22 and radio-frequency receiving-transmitting passage four.
The transmitting-receiving working condition of chip is digital control when chip operation is in emission state by digital control circuit control The single-pole double-throw switch (SPDT) circuit for controlling four passages is switched to transmitting radio frequency path by circuit, while digital control circuit will be controlled Power control circuit is powered off to all amplifiers of receiving channel;When chip operation is in reception state, digital control circuit will The single-pole double-throw switch (SPDT) circuit of four passages of control is switched to reception radio frequency path, while digital control circuit will control power supply control Circuit processed is powered off to all amplifiers of transmission channel.
There is feedback circuit, temperature sensing circuit will pass through feedback between the temperature sensing circuit and power control circuit Circuit controls bias state of the power control circuit to adjust amplifier, reaches the effect of temperature-compensating.
The working condition of each amplifier, phase shifter and attenuator is digitally controlled circuit control.
The digital control circuit is communicated using SPI communications protocol with chip exterior.
Describe of the present utility model multi-functional 4 in detail below in conjunction with the accompanying drawings and close 1 transceiving chip.
As shown in figure 1, closing 1 transceiving chip the utility model proposes one kind multi-functional 4, chip is mainly by digital control electricity Road, the radio-frequency channel circuit of 4 passages, power control circuit, one point of four part of 8 circuit of power splitter 4 composition.In the chip Four passages of radio-frequency channel circuit are realized using same design, are included in each radio-frequency channel circuit:On-off circuit, drive Dynamic amplifier circuit 10, power amplifier circuit 11, amplifier circuit in low noise 12, six bit phase shifter circuits 13, six decay Device circuit 14.As shown in Fig. 2 power control circuit in the chip comprising amplifier bias circuit, temperature-compensation circuit and DC translation circuits.
As shown in figure 1, the utility model proposes it is multi-functional 4 close 1 transceiving chip in digital control circuit and chip in Each on-off circuit, amplifier circuit, phase shifter circuit, attenuator circuit and power control circuit be connected, it is and controllable Make the working condition of each on-off circuit, amplifier circuit, phase shifter circuit, attenuator circuit and power control circuit.
As shown in figure 1, the common radio-frequency end of one point of four circuit of power splitter 8 in this chip connects as the common radio-frequency of chip Mouthful, realize that common radio-frequency end radiofrequency signal, will to the radio-frequency power quartering function of four radio-frequency heads under transmitting working condition Radio signal transmission gives four radio-frequency channels.The radiofrequency signal for transmitting four radio-frequency heads in the case where receiving working condition is carried out Power combing, and by common radio-frequency end will synthesize after radiofrequency signal export.
As shown in figure 1, the utility model proposes it is multi-functional 4 conjunction 1 transceiving chip be operated in emission state when, radiofrequency signal Enter from the public port of one point of four circuit of power splitter 8, radiofrequency signal is divided into behind four tunnels by power splitter will be penetrated by four points of ports Frequency signal is input in four radio-frequency channels, by on-off circuit, driving amplifier circuit 10, phase shifter circuit, power amplification After device, exported from the emission port of each radio-frequency channel.Chip is in reception state, and radiofrequency signal is by each radio-frequency channel Receiving interface is inputted, and by amplifier circuit in low noise 12, phase shifter circuit, attenuator circuit, driving amplifier circuit 10, is opened After powered-down road, four points of ports of 1 point of 4 power splitter are sent to, power splitter is exported after 4 road signals are synthesized by public port.
As shown in Fig. 2 the utility model proposes it is multi-functional 4 conjunction 1 transceiving chip functions be largely divided into three parts, radio frequency Part 1 mainly completes transmitting-receiving, amplification, phase shift and the attenuation function of radiofrequency signal;Power unit 3 completes the break-make of each passage Electricity, temperature-compensating and DC mapping functions;Control section 2 is controlled to the working condition of radio frequency part 1 and power unit 3, complete The caching function of switching and the control, transmitting-receiving power supply SECO and control data of paired phase shift and decay working condition.
The utility model proposes it is multi-functional 4 close 1 transceiving chip external interfaces be laid out as shown in figure 3, four radio frequencies connect Mouth is distributed in the chip left and right sides, and radio frequency public port is in bottom, and control and power interface are at top.

Claims (7)

1. multi-functional 4 close 1 transceiving chip, it is characterised in that:Including radio frequency part(1), control section(2)And power unit(3), The radio frequency part(1)Include the radio-frequency receiving-transmitting passage one of four tunnel independences(4), radio-frequency receiving-transmitting passage two(5), radio-frequency receiving-transmitting passage Three(6), radio-frequency receiving-transmitting passage four(7)With one point of four power splitter(8), each passage, which is included, receives and dispatches switching circuit(9), driving Amplifier circuit(10), power amplifier circuit(11), amplifier circuit in low noise(12), six bit phase shifter circuits(13)With six Position attenuator circuit(14);The control section(2)Including digital control circuit;The power unit(3)Including power supply Circuit, temperature sensing circuit.
2. according to claim 1 multi-functional 4 close 1 transceiving chip, it is characterised in that:The radio frequency part(1)In it is each Individual circuit constitutes two parts of receives link and transmitting chain, and wherein transmitting chain annexation sorts by signal transmission direction For:Receive and dispatch switching circuit(9)Link transmitting driving amplifier circuit(10), launch driving amplifier circuit(10)It is followed by transmitting six Bit phase shifter circuit(13), launch six bit phase shifter circuits(13)It is followed by power amplifier circuit(11);Receives link connection is closed System is ordered as by signal transmission direction:Amplifier circuit in low noise(12)Connection receives six bit phase shifter circuits afterwards(13), receive Six bit phase shifter circuits(13)Six attenuator circuits are connected afterwards(14), six attenuator circuits(14)Connection receives driving and put afterwards Big device circuit(10), receive driving amplifier circuit(10)Switching circuit is received and dispatched in connection afterwards(9);Receive and dispatch switching circuit(9)It will connect Receive and two links of transmitting are merged.
3. according to claim 2 multi-functional 4 close 1 transceiving chip, it is characterised in that:The transmitting of each radio-frequency receiving-transmitting passage Input and reception output end synthesize a common radio-frequency port by a single-pole double-throw switch (SPDT) circuit(15), and by on-off circuit Carry out radio-frequency receiving-transmitting switching.
4. according to claim 3 multi-functional 4 close 1 transceiving chip, it is characterised in that:Four radio-frequency receiving-transmitting passages it is public Prevention at radio-frequency port(15)Pass through one point of four power splitter(8)Circuit synthesis is all the way as the common radio-frequency port of chip(15);
The emission interface of radio-frequency receiving-transmitting passage one is respectively arranged with each single radio-frequency receiving-transmitting passage(16), radio-frequency receiving-transmitting The receiving interface of passage one(17), radio-frequency receiving-transmitting passage two emission interface(18), radio-frequency receiving-transmitting passage two receiving interface (19), the emission interface of radio-frequency receiving-transmitting passage three(20), radio-frequency receiving-transmitting passage three receiving interface(21), radio-frequency receiving-transmitting passage four Emission interface(22)With the receiving interface of radio-frequency receiving-transmitting passage four(23).
5. according to claim 4 multi-functional 4 close 1 transceiving chip, it is characterised in that:The temperature sensing circuit and power supply Control that there is feedback circuit between circuit, temperature sensing circuit will control power control circuit to be put to adjust by feedback circuit The bias state of big device, reaches the effect of temperature-compensating.
6. according to claim 5 multi-functional 4 close 1 transceiving chip, it is characterised in that:Each amplifier, phase shifter and The working condition of attenuator is all digitally controlled circuit control.
7. according to claim 6 multi-functional 4 close 1 transceiving chip, it is characterised in that:The digital control circuit is used SPI communications protocol is communicated with chip exterior.
CN201720070519.6U 2017-01-20 2017-01-20 Multi-functional 4 close 1 transceiving chip Active CN206481298U (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107505601A (en) * 2017-09-30 2017-12-22 天津中科海高微波技术有限公司 Wide-band microwave width phase control applied to phased array system receives and dispatches multifunction chip
CN108767423A (en) * 2018-04-27 2018-11-06 西南电子技术研究所(中国电子科技集团公司第十研究所) The expansible chip architecture of tile style TR component millimeter waves
CN109474296A (en) * 2018-12-27 2019-03-15 复旦大学 Four-way phased array transceiver applied to 5G millimeter wave base station
CN110068800A (en) * 2019-05-23 2019-07-30 无锡国芯微电子系统有限公司 Millimeter wave Multi-channel multifunctional SOC chip
CN110501703A (en) * 2019-08-28 2019-11-26 南京德睿智芯电子科技有限公司 A kind of small-sized imaging radar RF receiving and transmission module
CN111048911A (en) * 2019-12-02 2020-04-21 成都瑞迪威科技有限公司 Phased array antenna capable of realizing random polarization switching
CN113872632A (en) * 2021-08-24 2021-12-31 中电国基南方集团有限公司 Single positive pressure controlled full-transceiving integrated monolithic circuit and transceiving control method thereof
CN113938138A (en) * 2021-08-26 2022-01-14 北京遥测技术研究所 X-frequency band 8-channel receiving chip of monolithic integrated switch network

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107505601A (en) * 2017-09-30 2017-12-22 天津中科海高微波技术有限公司 Wide-band microwave width phase control applied to phased array system receives and dispatches multifunction chip
CN108767423A (en) * 2018-04-27 2018-11-06 西南电子技术研究所(中国电子科技集团公司第十研究所) The expansible chip architecture of tile style TR component millimeter waves
CN109474296A (en) * 2018-12-27 2019-03-15 复旦大学 Four-way phased array transceiver applied to 5G millimeter wave base station
CN110068800A (en) * 2019-05-23 2019-07-30 无锡国芯微电子系统有限公司 Millimeter wave Multi-channel multifunctional SOC chip
CN110501703A (en) * 2019-08-28 2019-11-26 南京德睿智芯电子科技有限公司 A kind of small-sized imaging radar RF receiving and transmission module
CN111048911A (en) * 2019-12-02 2020-04-21 成都瑞迪威科技有限公司 Phased array antenna capable of realizing random polarization switching
CN113872632A (en) * 2021-08-24 2021-12-31 中电国基南方集团有限公司 Single positive pressure controlled full-transceiving integrated monolithic circuit and transceiving control method thereof
CN113872632B (en) * 2021-08-24 2023-01-24 中电国基南方集团有限公司 Single positive pressure controlled full-transceiving integrated monolithic circuit and transceiving control method thereof
CN113938138A (en) * 2021-08-26 2022-01-14 北京遥测技术研究所 X-frequency band 8-channel receiving chip of monolithic integrated switch network

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