CN206480623U - 一种高色温的高显色性发光二极管 - Google Patents
一种高色温的高显色性发光二极管 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
本实用新型公开了一种高色温的高显色性发光二极管，其特征在于一个塑胶壳碗杯中，其中有两个金属块，放置有一蓝光LED芯片和红光LED芯片，红光芯片的负极通过金属丝和蓝光LED芯片的正极相连，蓝光LED的负极通过金属丝和放置蓝光芯片的金属块相连。塑胶碗杯中，放置有荧光粉。通电后，发出蓝光、蓝光激发荧光粉发出的绿光和红光，其光线比例为1.5:6:2.5，该光线混合后，成为高色温高显色性的白光。
Description
技术领域
本实用新型涉及LED封装技术领域，具体的说，涉及一种高色温的高显色性发光二极管。
背景技术
白光LED以光效高、寿命长、无污染和功耗低等的优点，在普通照明市场上逐渐取代荧光灯作为新一代的光源。但是，针对专业领域的照明，LED产品的渗透率依然不高，特别是一些对色彩还原性较高的场所。
LED白光是由蓝光芯片激发荧光粉，荧光粉发出黄光，然后和剩余的蓝光叠加而成。所以其不是连续性的光谱，对色彩的还原性较差。有鉴于此，人们采用添加红色芯片，和加重荧光粉的分量的方法，实现了低色温高显色性的白光。但是超市、卖场、餐厅等的场所，需要高色温的光源照明，如何满足要求。成为一大难题。
发明内容
为了解决上述问题，本实用新型提供了一种高色温的高显色性发光二极管。
本实用新型为解决其技术问题所采用的技术方案是：
一种高色温的高显色性发光二极管，其特征在于：有一塑胶壳，塑胶壳中有一碗杯，在碗杯的底部有两块金属块，从塑胶壳中间的两边延伸出来，然后弯曲向下，包裹塑胶壳的下部。
其中，碗杯底部有两块大小相仿的金属块，分别放置一红光LED芯片和蓝光LED芯片。
其中，所述的红光LED芯片用银浆固定，蓝光LED芯片用绝缘胶固定。
其中，所述的红光LED芯片和蓝光LED芯片的正极，通过金属丝相连，蓝光芯片的负极，通过金属丝和放置蓝光LED芯片的金属块相连。
其中，所述的碗杯中，涂覆有混有荧光粉的硅胶。
本实用新型的有益效果是：蓝光激发荧光粉后，发出峰值波长为505nm的绿光，红光LED芯片通电后正常发光。剩余的蓝光、荧光粉激发的绿光和红光按1.5:2.6:6混合叠加后，成为高色温的白光；该白光和普通LED白光相比，其光谱的连续性更强更完整，使其对色彩的还原性更高，另外，该白光还能通过微调蓝光、荧光粉激发绿光和红光在光线中的比例，调整白光色温，以满足各种特殊场合照明要求。
附图说明
图1为本实用新型的一种实施例结构示意图。
图2、为本实用新重点区域局部意图。
具体实施方式
下面结合附图和具体实施例对本实用新型作进一步说明：
参照图1本实用新型公开了一种高色温的高显色性发光二极管，包括一塑胶壳1，塑料壳上有一碗杯11，所述的碗杯底部有金属片2和金属片3，分别从塑料壳3两边中间部分伸展出来，然后向下弯曲，包裹塑料壳下部。
其中，所述的碗杯11底部有两片大小相仿的金属片21和金属片31。
其中，所述的金属片21上放置有一颗红光LED芯片4，用银浆高温烘烤后固定。
其中，所述的金属片31上放置有一颗蓝光LED芯片5，用绝缘胶高温烘烤后固定。
其中，所述的红光LED芯片4，通过金属丝6和蓝光LED芯片5的正极相连，蓝光LED芯片的负电极通过金属丝7和放置蓝光LED芯片的金属块31相连。
其中，所述的碗杯11涂覆混有荧光粉的硅胶8。
进一步，所述的荧光粉经蓝光激发后，发射出峰值波长为505nm的光线。
进一步，所述的红光LED芯片通电后，发出峰值波长650～6700nm的光线。
进一步，所述的蓝光LED芯片通电后，发出峰值波长440～450nm的光线。
进一步，所述的三种光线的比例为6：2.5:1.5。
以上是对本实用新型的较佳实施进行了具体说明，但本发明创造并不限于所述实施例，熟悉本领域的技术人员在不违背本实用新型精神的前提下还可作出种种的等同变形或替换，但这些相应的改变和变形都应属于本实用新型的权利要求保护范围。
Claims (5)
1.一种高色温的高显色性发光二极管，其特征在于：包括一塑胶壳，塑料壳上有一碗杯，所述的碗杯底部有两块金属片，分别从塑料壳两边中间部分伸展出来，然后向下弯曲，包裹塑料壳下部，所述的其中一个金属片上放置有一颗发红光LED芯片，用银浆固定；所述的另外一个金属片上面放置一颗发蓝光的LED芯片，用绝缘胶固定。
2.根据权利要求1所述的一种高色温的高显色性发光二极管，其特征在于红光LED芯片的电极和蓝光LED芯片的正极通过金属丝相连，蓝光芯片的负电极通过金属丝和放置蓝光LED芯片的金属块相连。
3.根据权利要求1所述的一种高色温的高显色性发光二极管，其特征在于支架碗杯中涂覆混有荧光粉的硅胶，该荧光粉被蓝光激发后，发射出峰值波长为505nm的光。
4.根据权利要求1所述的一种高色温的高显色性发光二极管，其特征在于红光芯片通电后，发出峰值波长650～670nm波长的光。
5.根据权利要求1所述的一种高色温的高显色性发光二极管，其特征在于蓝光芯片通电后，发出峰值波长440～450nm波长的光。
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Effective date of registration: 20170912 Address after: 528478 Guangdong city of Zhongshan Province town Henglan Maohui Industrial Zone (3) Yi Hui Road No. 58 Tongxing Industrial Park B Building 5 floor of Patentee after: Zhongshan aiyinte photoelectric Co Ltd Address before: 528478 Guangdong city of Zhongshan Province town Henglan Maohui Industrial Zone (3) Yi Hui Road No. 58 Tongxing Industrial Park B Building 5 floor of the Zhongshan aiyinte photoelectric Co Ltd Patentee before: Jiang Zuhui |
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Granted publication date: 20170908 Termination date: 20191231 |