CN206451454U - Chip - Google Patents
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- Publication number
- CN206451454U CN206451454U CN201621346593.8U CN201621346593U CN206451454U CN 206451454 U CN206451454 U CN 206451454U CN 201621346593 U CN201621346593 U CN 201621346593U CN 206451454 U CN206451454 U CN 206451454U
- Authority
- CN
- China
- Prior art keywords
- chip
- chip body
- bonding die
- substrate
- indicator board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
Abstract
The utility model discloses a kind of chip, its drip irrigation device is to include being used to sense the chip body registered, the indicator board for fixed chip main body, it is characterised in that：The chip body includes the substrate for being used for installation elements, the connection strap being connected with substrate for wire between support element, the connection strap holds line portion including what is be in contact with wire, described one end for holding line portion is fixedly connected on substrate, the other end is fixedly connected on the bonding die being affixed in chip body, and the bonding die is connected away from the one side of chip body with wall.Be arranged such, when needing to tear chip body, because chip body is provided with bonding die, bonding die is connected with wall, so tear chip body when, chip body is separated with bonding die.Because the two ends for holding line portion are connected with substrate and bonding die respectively, then during tearing, hold after the fracture of line portion, the related wire fracture held in line portion, wire fracture, cause the circuit on chip unavailable, make wafer damage.
Description
Technical field
The utility model is related to Data recording technique field, more particularly to a kind of chip.
Background technology
Chip is a kind of facility for recording the data such as number of times, upper work situation of turning out for work.Chip be broadly divided into register manually,
Electronics is swiped the card two ways of registering.
At present, on the market frequently with one kind mode of registering swipe the card and register for electronic chip main body.This mode institute of registering
The chip body used is mothballed in significant plate, when registering, and is possible to prove the certificate of identity in plate
On seal up for safekeeping and sense at the sensing of chip body after, chip body is by data storage, it was demonstrated that this person has registered.
In the higher workplace of the danger coefficients such as chemical plant, it is necessary to have staff's tour often, to ensure building ring
The security in border.Staff often makes an inspection tour once, is required to register once.But there is no accident for a long time, staff can produce
Raw tired out mood, chip is taken off and taken back in office, is registered once in daily tour time, pretends to have gone to make an inspection tour.
Utility model content
The purpose of this utility model is to provide a kind of chip, and it has can be when chip be torn from wall by chip
Damage, reduction workman takes away chip the advantage for pretending to be the possibility registered.
Above-mentioned technical purpose of the present utility model technical scheme is that：
A kind of chip, including for sensing the chip body registered, the indicator board for fixed chip main body, its feature exists
In：The chip body includes the substrate for being used for installation elements, the connection strap being connected with substrate for wire between support element,
The connection strap holds line portion including what is be in contact with wire, and described one end for holding line portion is fixedly connected on substrate, and the other end is solid
Surely it is connected on the bonding die being affixed in chip body, the bonding die is connected away from the one side of chip body with wall.
It is arranged such, when needing to tear chip body, because chip body is provided with bonding die, bonding die and wall phase
Even, so tear chip body when, chip body is separated with bonding die.Due to hold the two ends in line portion respectively with substrate and bonding die phase
Even, then during tearing, hold after the fracture of line portion, the related wire fracture held in line portion, wire fracture, cause the line on chip
Road is unavailable, makes wafer damage.
Further set：The bonding die is provided with away from the one side of chip body to be used to paste adhesive tape on the wall.
It is arranged such, adhesive tape is used to fix bonding die, for making bonding die compared to chip body, it more difficult to be torn from wall.
Further set：The bonding die is provided with fixed ear, the fixed ear and is equipped with for chip body to be fixed
In the pilot nail on wall.
Be arranged such, the bonding strength of pilot nail is higher, it is possible to increase bonding die on the wall cement degree, when raising is torn
The possibility that line portion is broken will be held.
Further set：The pilot nail is extended within the walls after indicator board, fixed ear.
It is arranged such, after indicator board, indicator board is difficult to be torn, even if indicator board is torn, indicator board is damaged
Possibility it is big, the possibility of related damage chip body is big.
Further set：The indicator board is sticked for the pad pasting for covering pilot nail away from the one side of chip body.
It is arranged such, the possibility for removing pilot nail from indicator board one side can be reduced so that when tearing indicator board,
The possibility for damaging indicator board is bigger.
Further set：The chip body includes circular substrate, and the substrate is straight with chip body provided with some
The folding groove of footpath collinearly.
It is arranged such, when chip body stress is pullled, the intensity at folding groove place is less than bulk strength, is more easy to be rolled over
It is disconnected, improve the possibility for damaging chip body.
Further set：The indicator board is sticked at chip body and is set to openwork part, and the hollow part is sticked and had
To the pad pasting of protective effect.
It is arranged such, hollow out, which is set, can reduce influence degree of the indicator board to chip sensitivity, and pad pasting is then to chip master
Body plays a protective role.
Further set：The indicator board is provided with glue surface, and the glue surface is sticked away from the side of indicator board to be had in storage
When keep glue surface sticky protecting film.
It is arranged such, protecting film can keep the viscosity of glue surface for a long time.
Further set：The one side that the glue surface is used to be sticked on wall is set to zigzag.
It is arranged such, glue surface is when being attached on wall, and the space between sawtooth is on the premise of being stressed towards wall
Pressing, pressure extrudes the air in space, plays the effect for evacuating pressurization, improves the adhesion being attached on wall.
In summary, the utility model has the advantages that：Graphic Panel once pulls off wall, will be broken off or
Person, which scratches, to scrap, and can effectively prevent Graphic Panel from pretending to be after being torn to register, and improves the authenticity that workman makes an inspection tour workplace,
Ensure the safety of workplace.
Brief description of the drawings
Fig. 1 is to be used in embodiment 1 embody the structural representation that indicator board carries chip body；
Fig. 2 is the structural representation for being used in embodiment 1 embody connection strap；
Fig. 3 is structure of the A portions enlarged drawing for embodying connection strap in embodiment 1；
Fig. 4 is the structural representation for being used in embodiment 1 embody openwork part and protecting film.
In figure, 1, chip body；2nd, indicator board；3rd, substrate；31st, connection strap；32nd, line portion is held；4th, bonding die；5th, adhesive tape；6、
Fixed ear；7th, pilot nail；8th, pad pasting；9th, groove is rolled over；10th, glue surface；11st, marker slip；12nd, protecting film；13rd, openwork part.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
Embodiment 1：A kind of chip, as shown in figure 1, including chip body 1, chip body 1 is sticked on indicator board 2.
Chip body 1 is provided in round sheet, and indicator board 2 is set to rectangular cardboard.Indicator board 2 is significantly greater than chip body 1.
As shown in figure 1, place is provided with glue surface 10 where two long sides of indicator board 2, glue surface 10 is set to double faced adhesive tape, chip
Main body 1 is sticked between the double faced adhesive tape of both sides.Double faced adhesive tape is set to the zigzag arrangement of adhesive tape 5 and formed.
As shown in Figures 2 and 3, chip body 1 is provided with bonding die 4 away from the side of indicator board 2, and bonding die 4 is used to paste on the wall
Adhesive tape 5 is simultaneously provided with, to be fixed on wall.
As shown in figure 3, the bonding strength in order to improve bonding die 4 and wall, fixed ear 6, both sides are provided with the both sides of bonding die 4
Fixed ear 6 is located at the same of circular bonding die 4 diametrically.Pilot nail 7 is equipped with fixed ear 6, pilot nail 7 sequentially passes through instruction
Wall is penetrated after plate 2, fixed ear 6, indicator board 2 and bonding die 4 are fixed on wall.
As shown in figure 3, chip body 1 includes setting each class component used in chip on circular substrate 3, substrate 3, in base
Connection strap 31 is additionally provided with plate 3, connection strap 31 is set to fine strip shape part.Wherein one end of connection strap 31 is fixedly connected on substrate
On 3, the other end is fixedly connected on bonding die 4.The stage casing part of connection strap 31 is to be used to circuit on support chip hold line portion
32。
As shown in figure 3, also having dug some folding grooves 9 on the substrate 3 of chip body 1, folding groove 9 is located at chip body 1
Some diameters where on straight line.
As shown in figure 4, in order to reduce influence of the indicator board 2 to the induction sensitivity of chip body 1, being provided with indicator board 2
Circular openwork part 13 has been dug at chip body 1.After indicator board 2 with chip body 1 is attached on wall, in indicator board
2, which deviate from the pad pasting 8 that is sticked in the one side of wall, plays a protective role.
The above embodiments are only to explain of the present utility model, and it is not to limitation of the present utility model, ability
Field technique personnel can make the modification without creative contribution to the present embodiment as needed after this specification is read, but
As long as all being protected in right of the present utility model by Patent Law.
Claims (9)
1. a kind of chip, including for sensing the chip body registered（1）, for fixed chip main body（1）Indicator board（2）,
It is characterized in that：The chip body（1）Including the substrate for installation elements（3）With substrate（3）It is connected for support element
Between wire connection strap（31）, the connection strap（31）Line portion is held including what is be in contact with wire（32）, it is described to hold line portion
（32）One end be fixedly connected on substrate（3）On, the other end, which is fixedly connected on, is affixed on chip body（1）On bonding die（4）On, institute
State bonding die（4）Away from chip body（1）One side be connected with wall.
2. chip according to claim 1, it is characterised in that：The bonding die（4）Away from chip body（1）One side on set
There is the adhesive tape for being pasted onto on wall（5）.
3. chip according to claim 1, it is characterised in that：The bonding die（4）Provided with fixed ear（6）, the fixation
Ear（6）Inside being equipped with is used for chip body（1）The pilot nail being fixed on wall（7）.
4. chip according to claim 3, it is characterised in that：The pilot nail（7）Through indicator board（2）, fixed ear（6）
After extend within the walls.
5. chip according to claim 4, it is characterised in that：The indicator board（2）Away from chip body（1）One side patch
Provided with for covering pilot nail（7）Pad pasting（8）.
6. chip according to claim 1, it is characterised in that：The chip body（1）Including circular substrate（3）, it is described
Substrate（3）It is provided with some and chip body（1）The folding groove of diameter collinearly（9）.
7. chip according to claim 6, it is characterised in that：The indicator board（2）Be sticked chip body（1）Place is set to
Openwork part（13）, the openwork part（13）Be sticked the pad pasting played a protective role（8）.
8. chip according to claim 1, it is characterised in that：The indicator board（2）It is provided with glue surface（10）, the glue surface
（10）Away from indicator board（2）Side be sticked storage when keep glue surface（10）Sticky protecting film（12）.
9. chip according to claim 8, it is characterised in that：The glue surface（10）One side for being sticked on wall is set
It is set to zigzag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621346593.8U CN206451454U (en) | 2016-12-08 | 2016-12-08 | Chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621346593.8U CN206451454U (en) | 2016-12-08 | 2016-12-08 | Chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206451454U true CN206451454U (en) | 2017-08-29 |
Family
ID=59661661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621346593.8U Expired - Fee Related CN206451454U (en) | 2016-12-08 | 2016-12-08 | Chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206451454U (en) |
-
2016
- 2016-12-08 CN CN201621346593.8U patent/CN206451454U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170829 Termination date: 20191208 |