CN206433253U - A kind of circuit board - Google Patents
A kind of circuit board Download PDFInfo
- Publication number
- CN206433253U CN206433253U CN201621153818.8U CN201621153818U CN206433253U CN 206433253 U CN206433253 U CN 206433253U CN 201621153818 U CN201621153818 U CN 201621153818U CN 206433253 U CN206433253 U CN 206433253U
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- China
- Prior art keywords
- circuit board
- layer
- solder mask
- plate bodys
- board according
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Abstract
A kind of circuit board, including PP plate bodys, the both sides of PP plate bodys are respectively equipped with routing layer, the one side of the remote PP plate bodys of each routing layer is equipped with solder mask, the one side of the remote PP plate bodys of each solder mask is equipped with the element character layer for marking component symbol, in one side of each solder mask away from the PP plate bodys covered with heat-resisting hardened layer, by covering heat-resisting hardened layer in one side of each solder mask away from the PP plate bodys, so as to harder compared with prior art, more difficult deformation, in the case of using identical thin wire, pcb board of the present utility model it is more difficult compared with prior art by deformation so that being pulled off.
Description
Technical field
The utility model is related to a kind of circuit board.
Background technology
In recent ten years, printed circuit board (abbreviation pcb board) manufacturing of China is quickly grown, and has become the whole world most
Important printed circuit board production base, printed circuit board manufacturing technology development trend is to high density, height in performance
The directions such as precision, fine pore, thin wire, small spacing, highly reliable, multiple stratification, high-speed transfer are developed.Also can band but wire is more thin
Carry out problem, be more easily pulled off as wire is thinner, as long as therefore slightly larger deformation, internal thin wire possibility occur for circuit board
Can output fracture.But if without using thin wire, it is necessary to increase several layers of line layers, cause cost to uprise.
The content of the invention
The purpose of this utility model is to solve weak point of the prior art there is provided a kind of circuit board, thin to solve
Wire is easily by deformation so that the problem of being pulled off.
The purpose of this utility model is achieved through the following technical solutions：
There is provided a kind of circuit board, including PP plate bodys, the both sides of PP plate bodys are respectively equipped with routing layer, each routing layer it is remote
The one side of the PP plate bodys is equipped with solder mask, and the one side of the remote PP plate bodys of each solder mask is equipped with for marking member
The element character layer of part symbol, in one side of each solder mask away from the PP plate bodys covered with heat-resisting hardened layer.
Wherein, the heat-resisting hardened layer and element character layer are realized in same layer.
Wherein, the heat-resisting hardened layer and element character layer are of uniform thickness.
Wherein, the heat-resisting hardened layer is non-conductive.
Wherein, the heat-resisting hardened layer is polyetherimide amine layer.
Wherein, bonded between routing layer and the solder mask by adhesive layer.
Wherein, the adhesive layer is AD glue.
Wherein, the solder mask is PI film layers.
Wherein, the circuit board is provided with error-proof structure.
Wherein, the error-proof structure includes four rounded fool proof holes, and four fool proof holes are separately positioned on circuit board
Four ends, and be that end points connects the figure to be formed as parallelogram using four fool proof holes.
The beneficial effects of the utility model：
A kind of circuit board of the present utility model, by covering heat-resisting hard in one side of each solder mask away from the PP plate bodys
Change layer, thus, more difficult deformation harder compared with prior art, in the case of using identical thin wire, electricity of the present utility model
Road plate it is more difficult compared with prior art by deformation so that being pulled off.
Brief description of the drawings
Utility model is described further using accompanying drawing, but the embodiment in accompanying drawing is not constituted to of the present utility model
What is limited, on the premise of not paying creative work, can also be according to the following drawings for one of ordinary skill in the art
Obtain other accompanying drawings.
Fig. 1 is a kind of cross section structure diagram of circuit board of the present utility model.
Fig. 2 is a kind of structural representation of circuit board of the present utility model.
Reference：1 --- --- --- solder mask, 4 --- element character layer, 5 --- are resistance to for routing layer, 3 for PP plate bodys, 2
Thermmohardening layer, 6 --- adhesive layer, 7 --- error-proof structures.
Embodiment
A kind of circular circuit board as shown in Figure 2, its a diameter of 440mm, thickness is 6.3mm, as shown in figure 1, the circuit
Plate includes PP plate bodys 1, and the both sides of PP plate bodys 1 are respectively equipped with routing layer 2, the one side of the remote PP plate bodys 1 of each routing layer 2
Solder mask 3 is equipped with, the one side of the remote PP plate bodys 1 of each solder mask 3 is equipped with the element for marking component symbol
Character layer 4, in one side of each solder mask 3 away from the PP plate bodys covered with heat-resisting hardened layer 5, so that circuit board is more existing
There is technology harder, more difficult deformation, in the case of using identical thin wire, the circuit board of the present embodiment is compared with prior art more
It is not easy to be pulled off because of deforming upon.Wherein, the heat-resisting hardened layer 5 is non-conductive, further, and heat-resisting hardened layer can be with
Made of PEI, form polyetherimide amine layer (PEI), PEI can strengthen the mechanical performance of circuit board, radiation-resistant property,
High-low temperature resistant and anti-wear performance.Further, PEI and element character layer 4 are realized in same layer, be may be such that with Rotating fields normal
Circuit board manufacture craft in need not increase processing step, only need to be printed while printed element 4 technique of character layer it is resistance to
It is that can be achieved at thermmohardening layer 5 to solder mask 3, so as to reduce production cost.Further, the thickness of PEI and element character layer 4
Equally, make circuit board surface flat, electronic device grafting is more convenient.
Further, the outer surface of the routing layer 2 is provided with adhesive layer 6, and adhesive layer 6 is AD glue, and the outer surface of routing layer 2 leads to
Cross AD glue to bond with the solder mask 3, relatively reliable laminating between realizing layer by layer.Wherein, the wiring number of plies of the routing layer 2 is
48 layers, solder mask 3 is PI film layers.
Further, with reference to Fig. 2, the circuit board is provided with error-proof structure 7, sets error-proof structure 7 to prevent circuit board
In processing, direction is misplaced, causes situation about scrapping to occur.Wherein, the error-proof structure 7 includes four rounded fool proofs
Hole, four fool proof holes are separately positioned on four ends of circuit board, and the figure to be formed is connected as end points using four fool proof holes are
Parallelogram.Four fool proof holes are connected the figure to be formed for parallelogram to avoid left and right directions from inverting.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than to present invention guarantor
The limitation of scope is protected, although being explained with reference to preferred embodiment to the present invention, one of ordinary skill in the art should
Work as understanding, technical scheme can be modified or equivalent substitution, without departing from the reality of technical solution of the present invention
Matter and scope.
Claims (10)
1. a kind of circuit board, including PP plate bodys, the both sides of PP plate bodys are respectively equipped with routing layer, the remote PP of each routing layer
The one side of plate body is equipped with solder mask, and the one side of the remote PP plate bodys of each solder mask is equipped with for marking component symbol
Element character layer, it is characterised in that：In one side of each solder mask away from the PP plate bodys covered with heat-resisting hardened layer.
2. a kind of circuit board according to claim 1, it is characterised in that：The heat-resisting hardened layer and element character layer are same
One layer of realization.
3. a kind of circuit board according to claim 2, it is characterised in that：The thickness of the heat-resisting hardened layer and element character layer
Degree is the same.
4. a kind of circuit board according to claim 1 or 2, it is characterised in that：The heat-resisting hardened layer is non-conductive.
5. a kind of circuit board according to claim 4, it is characterised in that：The heat-resisting hardened layer is polyetherimide amine layer.
6. a kind of circuit board according to claim 1, it is characterised in that：Pass through bonding between routing layer and the solder mask
Layer bonding.
7. a kind of circuit board according to claim 6, it is characterised in that：The adhesive layer is AD glue.
8. a kind of circuit board according to claim 1 or 6, it is characterised in that：The solder mask is PI film layers.
9. a kind of circuit board according to claim 1, it is characterised in that：The circuit board is provided with error-proof structure.
10. a kind of circuit board according to claim 9, it is characterised in that：The error-proof structure include four it is rounded
Fool proof hole, four fool proof holes are separately positioned on four ends of circuit board, and the figure to be formed is connected as end points using four fool proof holes
Shape is parallelogram.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621153818.8U CN206433253U (en) | 2016-10-31 | 2016-10-31 | A kind of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621153818.8U CN206433253U (en) | 2016-10-31 | 2016-10-31 | A kind of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206433253U true CN206433253U (en) | 2017-08-22 |
Family
ID=59589678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621153818.8U Active CN206433253U (en) | 2016-10-31 | 2016-10-31 | A kind of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206433253U (en) |
-
2016
- 2016-10-31 CN CN201621153818.8U patent/CN206433253U/en active Active
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| GR01 | Patent grant |