CN206415886U - A kind of topping machanism for Mo wafer - Google Patents
A kind of topping machanism for Mo wafer Download PDFInfo
- Publication number
- CN206415886U CN206415886U CN201720052421.8U CN201720052421U CN206415886U CN 206415886 U CN206415886 U CN 206415886U CN 201720052421 U CN201720052421 U CN 201720052421U CN 206415886 U CN206415886 U CN 206415886U
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- China
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- grinding disc
- wafer
- bar
- bite
- expansion link
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Abstract
The utility model discloses a kind of topping machanism for Mo wafer, including fixed plate, baffle plate, fixing groove, grinding disc, under casing, start button, control button, control panel, tuning bar, mobile bar, nut bore, fixed block, runner, motion bar, bite, expansion link and motor.The beneficial effects of the utility model are：By setting baffle plate in the fixed plate both sides of device so that device can effectively prevent Mo wafer chip from sputtering when cutting Mo wafer.By installing several grinding disc inside device, so that Mo wafer can continue to polish using grinding disc after the completion of cutting, make the Mo wafer surface after processing smooth, and grinding disc both sides installation activity bar, cutter are installed between motion bar so that motion bar can drive bite to adjust cutting direction, bite is arranged on inside expansion link, so that bite can be collapsed into inside expansion link when not in use, and it is polished piece and blocks so that device is safer when in use.
Description
Technical field
The utility model is related to a kind of topping machanism, specially a kind of topping machanism for Mo wafer, belong to industry plus
Construction equipment field.
Background technology
Molybdenum is a kind of metallic element, and molybdenum has resistant to elevated temperatures characteristic, and molybdenum element is added in steel alloy can improve metal
Elastic limit, corrosion resistance and keep permanent magnetism etc., therefore, be mainly used in steel and iron industry, major part therein
It is to be directly used in steel-making or cast iron after industrial molybdenum oxide briquetting, and to be smelted into after molybdenum-iron, molybdenum foil and be used further to steel-making, few portion
Divide the production for being also employed for semiconductor power electronic device.Wherein, the encapsulation of super high power IGCT, using pressure eliminant work
Skill, high voltage, the chip of big current semiconductor device support the use alloy Mo wafer, and the technology connect using total head, envelope
In ceramic cartridge.Therefore using preceding needing to carry out a series of working process to Mo wafer, including to Mo wafer
Machining.
But, existing to be used to still suffer from certain defect when in use to the device of Mo wafer machining, device is used
Security performance is not high, there is chip sputtering during cutting, and bite fails to deposit when not in use, there is certain danger, and
And due to after the completion of cutting otch it is unsmooth, in addition it is also necessary to other equipment carries out grinding process, more wastes time and energy.Therefore, pin
A kind of topping machanism for Mo wafer is proposed to above mentioned problem.
Utility model content
The purpose of this utility model is that provides a kind of topping machanism for Mo wafer to solve the above problems.
The utility model is achieved through the following technical solutions above-mentioned purpose, a kind of topping machanism for Mo wafer, bag
Under casing is included, the under casing side sets control panel, and the control panel side is set under start button, the start button
Side sets several control buttons, and the under casing bottom is installed and several grinding disc are installed inside motor, and the under casing, described
It is fixedly connected between grinding disc by runner, the grinding disc both sides set tuning bar, described tuning bar one end connects motion bar,
And installation bite inside expansion link, the expansion link is installed between the motion bar, the tuning bar side sets mobile bar,
And the mobile bar is fixedly connected in fixed plate, the fixed plate by fixed block and sets fixing groove.
It is preferred that, in order that Mo wafer in the fixed plate chip in cutting can not be sputtered away, using more pacifying
Entirely, the fixed plate both sides are respectively mounted baffle plate.
It is preferred that, in order that connection more stable between the fixed plate and the fixed block, the fixed block and institute
State and be fixedly connected by nut bore between fixed plate.
It is preferred that, in order that there are enough power sources during plant running, the motor and the control panel, described cut
Sharpener, the expansion link, the grinding disc, the tuning bar, the mobile bar, the runner are electrically connected.
It is preferred that, in order that the bite can be changed by the movement of tuning bar with Mo wafer together movement
Cut direction, the bite is movably connected by the expansion link with the grinding disc.
It is preferred that, in order that the fixed plate can by the stretching of the mobile bar, wave the mobile Mo wafer position of regulation
Put, convenient cutting, polishing, the fixed plate are movably connected by the mobile bar with the grinding disc.
The beneficial effects of the utility model are：By setting baffle plate in the fixed plate both sides of device so that device is in cutting
It can effectively prevent Mo wafer chip from sputtering during Mo wafer.By installing several grinding disc inside device so that Mo wafer
It can continue to polish using grinding disc after the completion of cutting, make the Mo wafer surface after processing smooth, and grinding disc both sides are pacified
Motion bar is filled, cutter are installed between motion bar so that motion bar can drive bite to adjust cutting direction, bite peace
Inside expansion link so that bite can be collapsed into inside expansion link when not in use, and it is polished piece and blocks so that dress
Put safer when in use.Device has security performance performance higher, the characteristics of practicality is stronger.
Brief description of the drawings
Fig. 1 is the utility model overall structure diagram.
Fig. 2 is the utility model internal structure schematic diagram.
Fig. 3 is the utility model grinding disc structural representation.
In figure：1st, fixed plate, 2, baffle plate, 3, fixing groove, 4, grinding disc, 5, under casing, 6, start button, 7, control button,
8th, control panel, 9, tuning bar, 10, mobile bar, 11, nut bore, 12, fixed block, 13, runner, 14, motion bar, 15, cutting
Knife, 16, expansion link, 17, motor.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Refer to shown in Fig. 1-3, a kind of topping machanism for Mo wafer, including under casing 5, the side of under casing 5 sets control
Panel 8, and the side of control panel 8 sets start button 6, the lower section of start button 6 sets several control buttons 7, the bottom of under casing 5
Motor 17 is installed, and the inside of under casing 5 is installed and is fixedly connected between several grinding disc 4, grinding disc 4 by runner 13, grinding disc 4
Both sides set tuning bar 9, are installed between the connection of the one end of tuning bar 9 motion bar 14, and motion bar 14 in expansion link 16, expansion link 16
Bite 15 is installed in portion, and the side of tuning bar 9 sets mobile bar 10, and mobile bar 10 is fixedly connected with fixed plate 1 by fixed block 12,
Fixing groove 3 is set in fixed plate 1.
As a kind of technical optimization scheme of the present utility model, the both sides of fixed plate 1 are respectively mounted baffle plate 2.
It is solid by nut bore 11 between fixed block 12 and fixed plate 1 as a kind of technical optimization scheme of the present utility model
Fixed connection.
As a kind of technical optimization scheme of the present utility model, motor 17 and control panel 8, bite 15, expansion link 16,
Grinding disc 4, tuning bar 9, mobile bar 10, runner 13 are electrically connected.
As a kind of technical optimization scheme of the present utility model, bite 15 is by expansion link 16 and grinding disc 4 in activity
Connection.
As a kind of technical optimization scheme of the present utility model, fixed plate 1 is connected by mobile bar 10 and grinding disc 4 in activity
Connect.
When in use, first, device is fixedly mounted for the utility model, then Mo wafer is fixedly mounted in fixing groove 3
Portion, and fixed plate 1 is fixedly connected with mobile bar 10, secondly, by the starter of start button 6, expansion link 16 is flexible to be taken out of
Bite 15, runner 13 drives grinding disc 4 to rotate, so that drive bite 15 to cut Mo wafer, and mobile bar 10 can pass through
Telescopic oscillating adjusts cutting direction, and finally, mobile bar 10 is shunk after the completion of cutting so that Mo wafer is contacted with grinding disc 4, profit
With the rotation of grinding disc 4, grinding process is carried out to otch, after the completion of processing, expansion link 16, which shrinks, withdraws bite 15, this
When, pass through the shutoff device of start button 6.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and
And in the case of without departing substantially from spirit or essential attributes of the present utility model, can realize that this practicality is new in other specific forms
Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new
The scope of type limits by appended claims rather than described above, it is intended that the equivalency fallen in claim is contained
All changes in justice and scope are included in the utility model.Any reference in claim should not be considered as limitation
Involved claim.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It may be appreciated other embodiment.
Claims (6)
1. a kind of topping machanism for Mo wafer, including under casing（5）, it is characterised in that：The under casing（5）Side sets control
Panel（8）, and the control panel（8）Side sets start button（6）, the start button（6）Lower section sets several to control
Button processed（7）, the under casing（5）Bottom is installed by motor（17）, and the under casing（5）Inside is installed by several grinding disc（4）, institute
State grinding disc（4）Between pass through runner（13）It is fixedly connected, the grinding disc（4）Both sides set tuning bar（9）, the tuning bar
（9）One end connects motion bar（14）, and the motion bar（14）Between expansion link is installed（16）, the expansion link（16）Inside peace
Fill bite（15）, the tuning bar（9）Side sets mobile bar（10）, and the mobile bar（10）Pass through fixed block（12）Gu
Surely be connected plate（1）, the fixed plate（1）Upper setting fixing groove（3）.
2. a kind of topping machanism for Mo wafer according to claim 1, it is characterised in that：The fixed plate（1）Two
Side is respectively mounted baffle plate（2）.
3. according to a kind of topping machanism for Mo wafer described in claim 1, it is characterised in that：The fixed block（12）With institute
State fixed plate（1）Between pass through nut bore（11）It is fixedly connected.
4. a kind of topping machanism for Mo wafer according to claim 1, it is characterised in that：The motor（17）With institute
State control panel（8）, the bite（15）, the expansion link（16）, the grinding disc（4）, the tuning bar（9）, it is described
Mobile bar（10）, the runner（13）Electrically connect.
5. a kind of topping machanism for Mo wafer according to claim 1, it is characterised in that：The bite（15）It is logical
Cross the expansion link（16）With the grinding disc（4）It is movably connected.
6. a kind of topping machanism for Mo wafer according to claim 1, it is characterised in that：The fixed plate（1）It is logical
Cross the mobile bar（10）With the grinding disc（4）It is movably connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720052421.8U CN206415886U (en) | 2017-01-17 | 2017-01-17 | A kind of topping machanism for Mo wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720052421.8U CN206415886U (en) | 2017-01-17 | 2017-01-17 | A kind of topping machanism for Mo wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206415886U true CN206415886U (en) | 2017-08-18 |
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ID=59571337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720052421.8U Active CN206415886U (en) | 2017-01-17 | 2017-01-17 | A kind of topping machanism for Mo wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206415886U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106736588A (en) * | 2017-01-17 | 2017-05-31 | 宜兴市科兴合金材料有限公司 | A kind of topping machanism for Mo wafer |
-
2017
- 2017-01-17 CN CN201720052421.8U patent/CN206415886U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106736588A (en) * | 2017-01-17 | 2017-05-31 | 宜兴市科兴合金材料有限公司 | A kind of topping machanism for Mo wafer |
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