CN206412350U - The change nickel plating projection cube structure of wafer weld pad - Google Patents
The change nickel plating projection cube structure of wafer weld pad Download PDFInfo
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- CN206412350U CN206412350U CN201220325325.3U CN201220325325U CN206412350U CN 206412350 U CN206412350 U CN 206412350U CN 201220325325 U CN201220325325 U CN 201220325325U CN 206412350 U CN206412350 U CN 206412350U
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Abstract
A kind of change nickel plating projection cube structure of wafer weld pad, including：One wafer, is located at surface comprising a surface, multiple weld pads and a protective layer is formed on surface and is provided with multiple openings and appears multiple weld pads for correspondence；Multiple catalyst layers, a catalyst layer is formed using under-bump metallization or zinc impregnation processing with each on the surface of multiple weld pads；Multipleization nickel plating projection, in the state of provided with photoresistance, the projection that a preset height is constituted with electroless nickel is formed using electroless nickel mode with each on catalyst layer；And multiple outer jackets, using in changing golden manufacturing process, changing the group of silver-colored manufacturing process two be fabricated separately process or same manufacturing process, with the top surface of multiple projections and ring side separately or simultaneously each outer jacket that formed with the exposed surface of complete claddingization nickel plating projection；Thus improve and reduction nickel plating projection top surface hardness, it is to avoid change the side wall of nickel plating projection and short-circuit shortcoming between projection easily caused the problem of easily aoxidize or because of electron transfer.
Description
Technical field
The utility model is related to a kind of change nickel plating projection cube structure of wafer weld pad, espespecially a kind of to be made using selected from change gold
Two are fabricated separately process or same manufacturing process in journey, the group of the silver-colored manufacturing process of change, with the plurality ofization nickel plating projection
Top surface and ring side separately or simultaneously form an outer jacket, to improve and reduce the hardness of the change nickel plating projection, and avoid
The problem of side wall for changing nickel plating projection easily aoxidizes and the short circuit of projection is easily caused because of electron transfer, reaches manufacturing process letter
Effect of change, cost of manufacture reduction and stay in grade.
Background technology
In the link (such as weld pad projection) about semiconductor wafer or wafer, encapsulation (package) or its relative production mistake
In the technical field of journey, current existing a variety of prior arts, such as：TaiWan, China M397591, M352128, M412460,
M412576, M410659, I306638, I320588, I255538, I459362, I253733, I273651, I288447,
I295498、I241658、I259572、I472371、I242866、I269461、I329917、I282132、I328266、
I284949；And U.S. Utility Patent US8,030,767, US7,981,725, US7,969,003, US7,960,214,
US7,847,414、US7,749,806、US7,651,886、US7,538,020、US7,750,467、US7,364,944、US7,
019,406、US6,507,120、US7,999,387、US7,993,967、US7,868,470、US7,868,449、US7,972,
902nd, US7,960,825, US7,952,187, US7,944,043, US7,934,313, US7,906,855 etc..Above-mentioned existing skill
Art almost belongs to the small improvement in its technical field.As can be seen here, the link about semiconductor wafer or wafer,
In the technical field of encapsulation or its relative production process, the space of its technology development is fairly limited, therefore in the development of this technology
In the limited field in space (in the field of the crowded art), if technically having small improvement, also
It must be considered as with progressive.
The change nickel plating projection cube structure of wafer weld pad of the present utility model, is in the technical field of projection cube structure, to propose one
Planting has effects that simplified manufacturing process and reduction cost of manufacture, and is further able to effectively improve and reduce formed change nickel plating
The hardness of projection with the then requirement of formula in manufacturing process after meeting, and avoiding nickel plating projection side wall easily oxidation and because
Electron transfer (migration) and the utility model of shortcoming short-circuit between easily causing projection.Because above-mentioned prior art is in shape
It must be existed before into the plurality of projection with projection underlying metal (Under Bump Metallization, UBM) manufacturing process
A metal level is initially formed on the plurality of weld pad, then in the way of metal plating or printing silver paste on the metal level of the plurality of weld pad
The plurality of projection is formed, therefore, not only cost is higher and making degree of difficulty is also higher for the manufacturing process of prior art, relatively makes
Relatively complicated and yield reduction into manufacturing process, also the plurality of projection need to use more precious metal material.
In addition, for the projection formed with elargol, the hardness range of elargol projection is larger, that is, hardness can be changed by softer
Fade to harder, can be adjusted using baking condition；However, for of the present utility modelization nickel plating projection, changing nickel plating projection
Hardness range is smaller, that is, change nickel plating projection case hardness it is excessive and can not be adjusted using baking condition therefore unfavorable
In the then formula of rear manufacturing process.
If in addition, failing to set up side wall outer jacket on the change nickel plating projection of formation, the change nickel plating projection has easy oxygen
The problem of change, while also because electron transfer (migration) is acted on, and easily cause short-circuit shortcoming between projection.Part is existing
Though there is technology to have revealed that the structure of side wall outer jacket or the correlation technique of preparation method, such as TaiWan, China M410659, US2011/
0260300 and TaiWan, China M397591 etc., but the structure and preparation method of disclosed side wall outer jacket are all more complicated, that is, make
Process not enough simplifies, and cost of manufacture is relative to be reduced, therefore is unfavorable for mass production；Also, the change nickel plating projection one of prior art
As be that, to be formed without photoresistance mode, though there is side wall outer jacket, the height for changing nickel plating projection is relatively low such as 2-10 microns (μm) and convex
The spacing of block can not accomplish smaller, cause projection not become more meticulous, it is impossible to meet the actual demand of current the art.
From the foregoing, it will be observed that the demand when projection cube structure and its manufacturing process of prior art are difficult to meet actual use, therefore
In the projection cube structure of wafer weld pad and its technical field of preparation method, develop and design a kind of manufacturing process simplification, cost of manufacture
Reduction, the case hardness of projection meet the then formula requirement of rear manufacturing process and the projection cube structure of setting tool side wall outer jacket, really
There is its desirability in fact.
Utility model content
The utility model main purpose is the change nickel plating projection cube structure for providing a kind of wafer weld pad, and it is provided with photoresistance
In the state of, form a tool preset height using electroless nickel mode with each on the catalyst layer on the surface of the plurality of wafer weld pad
The projection constituted with electroless nickel, recycle in changing golden manufacturing process, changing the group of silver-colored manufacturing process two separately systems
Make process or same manufacturing process, separately or simultaneously respectively to form an outer jacket in the top surface of the plurality of projection and ring side
To be coated on completely on the exposed surface of the change nickel plating projection, and the outer jacket is set to be selected from leaching gold comprising an at least protective layer
(IG) a kind of material in layer, the group of silver-colored (ES) layer of change is constituted, and to improve and reduce the hardness of the change nickel plating projection, and is kept away
The problem of side wall of exempting from nickel plating projection easily aoxidizes and the short circuit of projection is easily caused because of electron transfer, reaches manufacturing process letter
Effect of change, cost of manufacture reduction and stay in grade.
To reach above-mentioned purpose, the utility model provides a kind of change nickel plating projection cube structure of wafer weld pad, it is characterised in that
Including：
One wafer, it is included：One surface；Multiple weld pads are set on a surface；And one protective layer be formed on the surface simultaneously
Appear the plurality of weld pad for correspondence provided with multiple openings；
Multiple catalyst layers, it handles manufacturing process to form a catalyst respectively on the surface of the plurality of weld pad using zinc impregnation
Layer；
Multipleization nickel plating projection, it utilizes electroless nickel mode, and is combined with photoresistance mode, with the plurality of catalyst layer
Surface forms one respectively has the change nickel plating projection of preset height；
Multiple top surface outer jackets, it is respectively provided on the top surface of the plurality ofization nickel plating projection, wherein each top surface outer jacket bag
Containing at least one leaching layer gold or change the protective layer that is constituted of material of silver layer, using change golden manufacturing process or change silver-colored manufacturing process with
The top surface formation top surface outer jacket of the plurality ofization nickel plating projection；And
Multiple side wall outer jackets, it is respectively provided on the ring side of the plurality ofization nickel plating projection, wherein each side wall outer jacket
The protective layer that material comprising at least one leaching layer gold or change silver layer is constituted is using the golden manufacturing process of change or changes silver manufacturing process
To form side wall outer jacket respectively on the ring side of the plurality ofization nickel plating projection；
The top surface outer jacket that wherein eachization nickel plating projection is formed on its top face and the side formed on its ring side
Wall outer jacket is snugly coated on the outer surface of eachization nickel plating projection completely, to form a complete outer jacket.
The change nickel plating projection cube structure of described wafer weld pad, wherein, formed and protected outside the top surface of the change nickel plating projection top surface
Single layer structure, a bilayer being made up of the leaching layer gold in internal layer and the thick layer gold in outer layer that layer is made up of by one leaching layer gold
Pair that structure, a single layer structure being made up of change silver layer or one are made up of the change silver layer in internal layer and the leaching layer gold in outer layer
Rotating fields are formed.In further technical scheme, the thickness of the change nickel plating projection is 2~14 microns, the leaching layer gold
Thickness is 0.01~0.05 micron, and the thickness of the thick layer gold is 0.5~2.0 micron, and the thickness of the change silver layer is micro- for 0.5~2.0
Rice.
The change nickel plating projection cube structure of described wafer weld pad, wherein, form the side wall in the change nickel plating projection ring side
Outer jacket be by one be made up of leaching layer gold single layer structure, one be made up of the leaching layer gold in internal layer and the thick layer gold in outer layer
Double-decker, a single layer structure being made up of change silver layer or one is in internal layer by changing silver layer and the leaching layer gold institute structure in outer layer
Into double-decker formed.
The change nickel plating projection cube structure of described wafer weld pad, wherein, formed and protected outside the top surface of the change nickel plating projection top surface
Layer and formed side wall outer jacket in the ring side of the change nickel plating projection be by be made up of selected from one leaching layer gold single layer structure,
One double-decker being made up of the leaching layer gold in internal layer and the thick layer gold in outer layer, an individual layer knot being made up of change silver layer
A kind of structure institute shape in structure, the group of a double-decker being made up of the change silver layer in internal layer and the leaching layer gold in outer layer
Into.In further technical scheme, the thickness of the change nickel plating projection is 2~14 microns, and the thickness of the leaching layer gold is 0.01
~0.05 micron, the thickness of the thick layer gold is 0.5~2.0 micron, and the thickness of the change silver layer is 0.5~2.0 micron.
The beneficial effects of the utility model are：Improve and reduce the hardness of the change nickel plating projection, and avoiding nickel plating projection
The easily oxidation and the problem of the short circuit of projection is easily caused because of electron transfer of side wall, reach manufacturing process simplify, cost of manufacture
Reduction and effect of stay in grade.
Brief description of the drawings
Fig. 1 is the schematic cross-section of the first embodiment of the change nickel plating projection cube structure of wafer weld pad of the present utility model；
Fig. 2 is the schematic cross-section of the second embodiment of the change nickel plating projection cube structure of wafer weld pad of the present utility model；
Fig. 3 is the schematic cross-section of the 3rd embodiment of the change nickel plating projection cube structure of wafer weld pad of the present utility model；
Fig. 4 is the schematic cross-section of the fourth embodiment of the change nickel plating projection cube structure of wafer weld pad of the present utility model；
Fig. 5 A- Fig. 5 G are the manufacturing process first embodiment of the change nickel plating projection cube structure of wafer weld pad of the present utility model
The schematic cross-section of (being formed separately with two separated manufacturing process)；
Fig. 6 A- Fig. 6 F are the manufacturing process second embodiment of the change nickel plating projection cube structure of wafer weld pad of the present utility model
The schematic cross-section of (being formed simultaneously with same manufacturing process).
Description of reference numerals：1-ization nickel plating projection cube structure；10- wafers；11- surfaces；12- weld pads；13- protective layers；14- is opened
Mouthful；20- catalyst layers；30-ization nickel plating projection；40- top surface outer jackets；Golden (IG) layer of 40a- leachings；40b- thickness layer gold；40c-ization silver
Layer；40d-ization silver layer；40e- soaks layer gold；50- photoresist layers；51- is open；60- sides wall outer jacket；60a- soaks layer gold；The thick gold of 60b-
Layer；60c-ization silver layer；60d-ization silver layer；60e- soaks layer gold.
Embodiment
To make the utility model definitely full and accurate, structure of the present utility model, technical characteristic and its manufacturer's enamel are matched somebody with somebody
Drawings below is closed to be described in detail as after：
With reference to shown in Fig. 1-Fig. 4, its be respectively the change four of nickel plating projection cube structure of wafer weld pad of the present utility model not
The schematic cross-section of be the same as Example.The change nickel plating projection cube structure 1 of wafer weld pad of the present utility model includes：It is one wafer 10, multiple
Protected outside catalyst layer 20, multipleization nickel plating (electroless nickel) projection 30, multiple top surface outer jackets 40 and multiple side walls
Layer 60.
The wafer 10 is included：One surface 11；Multiple weld pads (die pad) 12, it is located on the surface 11；And one first protect
Sheath 13, it is formed on the surface 11 and appears the plurality of weld pad 12 for correspondence provided with multiple openings 14.The wafer 10 is general
It is to be provided by wafer fabrication, the layout (layout) that plurality of weld pad 12 is located on the surface 11 is not intended to limit, can be with visitor
Family needs and is designed as the arrangement mode of various arrays.Wherein first protective layer 13 is generally nitride material.
The plurality of catalyst layer 20 is using selected from under-bump metallization (under bump metallization, UBM), zinc impregnation
Handle a manufacturing process in the group of (zincating) and form a catalyst layer 20 with each on the surface of the plurality of weld pad.This is touched
Matchmaker's layer 20 handles the catalyst layer that (zincating) is constituted using under-bump metallization (UBM) or zinc impregnation, and its major function is
To connect the plurality of weld pad 12, and simultaneously as the deposition medium layer when carrying out follow-up electroless metal mode, with shape
Into a projection 30 constituted with electroless nickel.In a preferred embodiment of the present utility model, the catalyst layer 20 is to use weight hundred
Point specific concentration is 15~30% zinc salt solution, and 10~60 seconds elapsed time (sec) are with shape in 20~35 DEG C of solution temperature
Into a catalyst layer constituted with zinc, but the present embodiment and it is not used to limit catalyst layer 20 of the present utility model.
The plurality of projection 30 utilizes the electroless metal mode of electroless nickel (electroless nickel), and is combined with
Photoresistance mode, has preset height and with without electricity respectively to form one on the surface of the plurality of catalyst layer 20 on the plurality of surface of weld pad 12
The projection (bump) 30 that nickel is constituted is solved, is also known as changes nickel plating (electroless nickel) projection 30 herein.In the present embodiment
In, the formation thickness of the plurality of projection 30 is generated by electroless (changing plating) nickel deposition, but is formed because being combined with photoresistance mode, therefore
The height of the plurality of projection 30 can reach and meet the desired height of former design.Nickel salt material used in the present embodiment
In, the nickel material such as nickel phosphate using phosphoric acid is optimal, because nickel phosphate has the action function of self catalytic reaction, can effectively be carried
The high thickness (height) for changing nickel plating projection 30 that generation is deposited with electroless nickel, with the thickness for the projection 30 for reaching design
Degree.In the present embodiment, it is the plurality of using the projection 30 that electroless nickel is constituted be the nickel that uses concentration as 4-6.5g/L (gram/liter)
Saline solution, elapsed time 30-75 point (min) to be formed with depositing in 75-100 DEG C of solution temperature, but the present embodiment is not used
To limit projection 30 of the present utility model.
The plurality of top surface outer jacket 40 is respectively provided on the top surface of the plurality ofization nickel plating projection 30, wherein each top surface outer jacket
40 groups for being selected from golden (IG, the Immersion Gold) layer of leaching comprising at least one, changing silver-colored (ES, Electroless Silver) layer
The protective layer that a kind of middle material is constituted, it (is repeated) in the state of being provided with or removing patterning photoresist layer (50) after appearance, profit
With in changing golden manufacturing process, changing the group of silver-colored manufacturing process a manufacturing process with the top surface of the plurality ofization nickel plating projection 30
It is each to form a top surface outer jacket 40.
The plurality of side wall outer jacket 60, it is respectively provided on the ring side of the plurality ofization nickel plating projection 30, wherein each side wall
Outer jacket 60 is comprising at least one selected from golden (IG, the Immersion Gold) layer of leaching, silver-colored (ES, the Electroless Silver) layer of change
Group in a kind of protective layer that is constituted of material, it (is repeated) in the state of patterning photoresist layer (50) is removed after appearance, profit
With in changing golden manufacturing process, changing the group of silver-colored manufacturing process a manufacturing process with the ring side of the plurality ofization nickel plating projection 30
Side wall outer jacket 60 is formed on face respectively.Wherein, the side wall outer jacket formed on the ring side of eachization nickel plating projection 30
The 60 top surface outer jacket 40 with being formed on the top surface of eachization nickel plating projection 30 is snugly coated on eachization nickel plating projection completely
On 30 exposed surface, to form a complete and closely sealed outer jacket.
Top surface outer jacket 40 of the present utility model and side wall outer jacket 60 are each respectively comprising following four kinds of different structural types
State；And in practical application, foundation selects and utilized different manufacturing process (being repeated after appearance), four kinds of the top surface outer jacket 40
Arbitrarily mutually it can be selected and combine between different structure kenel and four kinds of different structure kenels of side wall outer jacket 60, such as selection should
Any structure kenel (such as the first structure kenel) of top surface outer jacket 40 is with any structure with the side wall outer jacket 60
Kenel (such as second structure kenel) collocation uses (as shown in Figure 1), therefore can produce 16 kinds of different structure kenel (i.e. 4x4=
16 kinds of permutation and combination)；Hereby illustrate that four kinds of different structure kenels are as follows：
The first structure kenel：It is one by one internal layer golden (IG, the Immersion Gold) layer and one of leaching in outer layer
The double-decker that is constituted of golden (EG, the Electroless Gold) layer of thickness.The top surface outer jacket 40 (40a as shown in Figure 1,
40b) and the side wall outer jacket 60 (60a, 60b as shown in Figure 2), be one by one internal layer leaching gold (IG, Immersion
Gold) the double-decker that layer 40a/60a and one is constituted in thickness gold (EG, Electroless Gold) layer 40b/60b of outer layer,
Its utilizationization gold manufacturing process is golden to be initially formed a leaching on the exposed surface of the change nickel plating projection 30 (such as top surface and ring side)
(IG) layer 40a/60a, re-forms thick golden (EG) layer 40b/60b on golden (IG) the layer 40a/60a of leaching outer surface；Herein
In the first structure kenel, the thickness of the change nickel plating projection 30 is about 2~14 microns (μm), leaching gold (IG) layer 40a/60a's
Thickness is about 0.01~0.05 micron (μm), and thickness gold (EG) layer 40b/60b thickness is about 0.5~2.0 micron (μm).
Second of structure kenel：It is the single layer structure being made up of golden (IG, the Immersion Gold) layer of a leaching.The top
Face outer jacket 40 (40a as shown in Figure 3) and the side wall outer jacket 60 (60a as shown in Figure 3), be one by one leaching gold (IG,
Immersion Gold) single layer structures that are constituted of layer 40a/60a, it is using changing golden manufacturing process with the change nickel plating projection
Golden (IG) the layer 40a/60a of a leaching is formed on 30 exposed surface (such as top surface and ring side)；, should in this second of structure kenel
The thickness for changing nickel plating projection 30 is about 2~14 microns (μm), and leaching gold (IG) layer 40a/60a thickness is about 0.01~0.05 micro-
Rice (μm).
The third structure kenel：It is to change the single layer structure that silver-colored (ES, Electroless Silver) layer is constituted by one.
The top surface outer jacket 40 (40c as shown in Figure 3) and the side wall outer jacket 60 (60c as shown in Figure 3) are one by a change silver
The single layer structure that (ES, Electroless Silver) layer 40c/60c is constituted, it is with the change using the silver-colored manufacturing process of change
Silver-colored (ES) the layer 40c/60c of a change is formed respectively on the exposed surface (such as top surface and ring side) of nickel plating projection 30；Herein the third
In structure kenel, the thickness of the change nickel plating projection 30 is about 2~14 microns (μm), and change silver (ES) layer 40c/60c thickness is about
For 0.5~2.0 micron (μm).
4th kind of structure kenel：It is one by one internal layer silver-colored (ES) layer of change and one outer layer golden (IG) layer institute structure of leaching
Into double-decker.As shown in figure 4, the top surface outer jacket 40 (40d, 40e as shown in Figure 4) and the side wall outer jacket 60 are (such as
60d, 60e shown in Fig. 4), be one by one internal layer change silver (ES) layer 40d/60d and one outer layer golden (IG) the layer 40e/ of leaching
The double-decker that 60e is constituted, it is with exposed surface (such as top surface of the change nickel plating projection 30 using the silver-colored manufacturing process of change
And ring side) on be initially formed change silver (ES) layer 40d/60d, re-formed on change silver (ES) layer 40d/60d outer surface
Golden (IG) the layer 40e/60e of one leaching；In this 4th kind of structure kenel, the thickness of the change nickel plating projection 30 is about 2~14 microns of (μ
M), silver-colored (ES) the layer 40d/60d of change thickness is about 0.5~2.0 micron (μm), and leaching gold (IG) layer 40e/60e thickness is about
For 0.01~0.05 micron (μm).
From the foregoing, it will be observed that with reference to shown in Fig. 1, its select the first structure kenel of the top surface outer jacket 40 with outside the side wall
Second of structure kenel collocation of sheath 60 is used.With reference to shown in Fig. 2, it selects second of structural type of the top surface outer jacket 40
State is used with being arranged in pairs or groups with second of structure kenel of the side wall outer jacket 60.With reference to shown in Fig. 3, it selects the top surface outer jacket 40
Second or the third structure kenel with second with the side wall outer jacket 60 or the third structure kenel collocation use, wherein,
Side wall outer jacket 60a (is re-formed after top surface outer jacket 40c (the third structure kenel) is initially formed in manufacturing process
Two kinds of structure kenels) when, perhaps can be on the top surface outer jacket 40c outer surface while side wall outer jacket 60a is formed
It is another to re-form golden (IG) layer of a leaching and such as the 4th kind of structure kenel (not shown), but still be considered as and reach the top surface outer jacket 40
Expection effect；With reference to shown in Fig. 4, its select the 4th kind of structure kenel of the top surface outer jacket 40 with the side wall outer jacket 60
The 4th kind of structure kenel collocation use.But Fig. 1~Fig. 4 is only to represent between the top surface outer jacket 40 and side wall outer jacket 60
Four kinds of different selections and combination, and be not used to limit the utility model.
With reference to shown in Fig. 5 A~Fig. 5 G, it is that the manufacture method one of various projection cube structures 1 shown in Fig. 1~Fig. 4 is preferable to carry out
The schematic cross-section of example；The producing lug process of the present embodiment is comprised the steps of：
There is provided a wafer 10 with reference to shown in Fig. 5 A, the wafer 10 has a surface 11；Multiple weld pads 12 are located at the surface 11
On；And one first protective layer 13 be formed on the surface 11 and provided with it is multiple opening 14 for correspondence appear the plurality of weld pad 12, its
In the distance between the plurality of opening be less than or equal to 16 μm (microns, 10-6m)。
With reference to shown in Fig. 5 B, re-form a photoresist layer 50 on first protective layer and pattern the photoresist layer 50, with
There are the photoresist layer 50 patterned multiple openings 51 to appear a part of around each weld pad 12 and each weld pad 12 for corresponding to respectively
The first protective layer 13.
With reference to shown in Fig. 5 C, recycle and be selected from under-bump metallization (under bumpmetallization, UBM), zinc impregnation
Handle a manufacturing process in the group of (zincating) and form a catalyst layer 20 with each on the surface of the plurality of weld pad 12；
In one preferred embodiment, the catalyst layer 20 be use weight percent concentration for 15~30% zinc salt solution, in solution temperature
10~60 seconds elapsed time (sec) are to form a catalyst layer 20 constituted with zinc in 20~35 DEG C of degree.
With reference to shown in Fig. 5 D, electroless nickel mode is recycled, to form one respectively in the plurality of opening 51 with electroless
The change nickel plating projection 30 that nickel is constituted；In the present embodiment, the thickness of the plurality ofization nickel plating projection 30 be more than or equal to 6 μm (micron,
10-6M) (i.e. thickness >=6 μm).By the present embodiment change nickel plating projection 30 have been provided with patterning photoresist layer 50 in the state of institute
Formed, therefore the height of the change nickel plating projection 30 of the present embodiment is generally higher than the projection formed in the state of photoresist layer is not set
Height；In the present embodiment, the plurality ofization nickel plating projection 30 is to use concentration water-soluble for 4-6.5g/L (gram/liter) nickel salt
Liquid, elapsed time 30-75 point (min) to be formed with depositing in 75-100 DEG C of solution temperature.Again in the present embodiment, the plurality ofization plating
The thickness of nickel projection 30 is 2-15 μm of (micron, 10-6m)。
With reference to shown in Fig. 5 E, then at being still provided with the state of patterning photoresist layer 50 as shown in Figure 5 D, using selected from change gold
A manufacturing process in manufacturing process, the group of the silver-colored manufacturing process of change, to distinguish on the top surface of the plurality ofization nickel plating projection 30
Form a top surface outer jacket 40；Wherein each top surface outer jacket 40 include an at least protective layer, as shown in Figure 1, Figure 2 shown in 40a, 40b
Or 40a, 40c or as shown in Figure 4 40d, 40e as shown in Figure 3.The top surface protective layer is selected from golden (IG) layer of leaching, changed silver-colored (ES)
A kind of material in the group of layer is constituted；It is, the top surface outer jacket 40 of the present utility model can comprising it is above-mentioned the first
It is respectively the first structure kenel (40a, 40b), such as Fig. 3 as shown in Figure 1, 2 to the different structure kenel of the 4th kind of four kinds of grade
Shown second or the third structure kenel (40a/40c) and the 4th kind of structure kenel (40d, 40e) as shown in Figure 4.
Top surface outer jacket 40 (40a, 40b) shown in Fig. 5 E, 5F is to illustrate by taking the first structure kenel shown in Fig. 1,2 as an example but do not limit
System.
With reference to shown in Fig. 5 F, then remove the photoresist layer 50, it is convex to appear the plurality of top surface outer jacket 40, the plurality ofization nickel plating
First protective layer 13 beyond block 30 and the plurality of underbump.The photoresist layer 50 is removed again, to appear the plurality of outer jacket
40th, first protective layer 13 beyond the plurality ofization nickel plating projection 30 and the plurality of underbump.
(in the present embodiment, Fig. 5 G are equal to Fig. 1) recycles selected from the golden manufacturing process of change, changes silvery with reference to shown in Fig. 5 G
Make the manufacturing process in the group of process, side wall outer jacket is formed with each on the ring side of the plurality ofization nickel plating projection 30
60, wherein each side wall outer jacket 60 includes an at least protective layer, it is selected from a kind of material institute soaked in layer gold, the group for changing silver layer
Constitute, that is, complete the manufacturing process for changing nickel plating projection cube structure 1 of wafer weld pad of the present utility model.Wherein, each side wall outer jacket
60 include an at least protective layer, 60a or as shown in Figure 2 60a, 60b or 60c or such as Fig. 4 as shown in Figure 3 as shown in fig. 1
Shown in 60d, 60e.A kind of material that the side wall protective layer is selected from golden (IG) layer of leaching, the group for changing silver-colored (ES) layer is constituted；
It is, the side wall outer jacket 60 of the present utility model can comprising it is above-mentioned the first to four kinds of different structural types of the 4th kind of grade
State, second of structure kenel (60a) respectively as shown in Figure 1, the first structure kenel (60a, 60b) as shown in Figure 2, such as
The third structure kenel (60c) and the 4th kind of structure kenel (60d, 60e) as shown in Figure 4 shown in Fig. 3.Shown in Fig. 5 G
Side wall outer jacket 60 (60a) is to illustrate by taking second of structure kenel shown in Fig. 1 as an example but do not limit.
In the manufacture method embodiment shown in Fig. 5 A~Fig. 5 G, protected outside the plurality of top surface outer jacket 40 and the plurality of side wall
Layer 60 is formed with two separated manufacturing process, wherein the plurality of top surface outer jacket 40 is to utilize selected from the golden manufacturing process of change, change
A manufacturing process is removing the photoresistance to be initially formed on the top surface of the plurality ofization nickel plating projection 30 in the group of silver-colored manufacturing process
Rear (as illustrated in figure 5f) of layer 50, a manufacturing process in the golden manufacturing process of change, the group of the silver-colored manufacturing process of change is recycled, with
Side wall outer jacket 60 is respectively re-formed on the ring side for making eachization nickel plating projection 30.With the manufacture method shown in Fig. 5 A~Fig. 5 G
Speech, because the plurality of top surface outer jacket 40 and the plurality of side wall outer jacket 60 are formed with two separated manufacturing process, therefore
The structure kenel of the side wall outer jacket 60 might not be same as the structure kenel of the top surface outer jacket 40 as shown in figure 1, wherein
Again using the collocation situation shown in Fig. 1 as preferred embodiment, because the plurality of side wall outer jacket 60 uses second of structure kenel, i.e.,
The single layer structure that golden (IG, Immersion Gold) layer is constituted is soaked by one for one, therefore saves material cost relatively, and is not influenceed
The finished goods quality of the change nickel plating projection cube structure of wafer weld pad of the present utility model.
In addition, referring again to shown in Fig. 6 A~Fig. 6 F, its be various projection cube structures 1 shown in Fig. 2~Fig. 4 manufacture method it is another
The schematic cross-section of preferred embodiment；The producing lug process of the present embodiment is comprised the steps of, and is comprised the steps of：
With reference to shown in Fig. 6 A~Fig. 6 D, in the present embodiment, the step shown in Fig. 6 A~Fig. 6 D is equal to shown in Fig. 5 A-5D
The step of.
With reference to shown in Fig. 6 E, then the photoresist layer 50 is removed, to appear the plurality ofization nickel plating projection 30, i.e., including the plurality ofization
Top surface and the ring side of nickel plating projection 30, and first protective layer 13 beyond the lower section of the plurality ofization nickel plating projection 30.
With reference to shown in Fig. 6 F, using selected from the manufacturing process changed in golden manufacturing process, the group for changing silver-colored manufacturing process, with
It is simultaneously each on the top surface of the plurality ofization nickel plating projection 30 and ring side to form an outer jacket (40,60), i.e., the plurality of top surface
Outer jacket 40 and the plurality of side wall outer jacket 60 form and are snugly coated on the exposed table of the plurality ofization nickel plating projection 30 simultaneously
On face (including top surface and ring side), wherein each outer jacket (40,60) is comprising an at least protective layer, it is selected from leaching layer gold, changes silver layer
Group in a kind of material constituted.
In the manufacture method embodiment shown in Fig. 6 A~Fig. 6 F, protected outside the plurality of top surface outer jacket 40 and the plurality of side wall
Layer 60 is formed with same manufacturing process, that is, the plurality of top surface outer jacket 40 and the plurality of side wall outer jacket 60 are using selected from change
A manufacturing process is formed simultaneously in golden manufacturing process, the group of the silver-colored manufacturing process of change pushes up in including for the plurality ofization nickel plating projection 30
On the exposed surface of face and ring side.Therefore with the manufacture method shown in Fig. 5 A~Fig. 5 G for, due to outside the plurality of top surface protect
Layer 40 and the plurality of side wall outer jacket 60 are formed with same manufacturing process, and the structure kenel of the side wall outer jacket 60 is same as the top
The structure kenel of face outer jacket 40 is as shown in Figure 2 to 4.Because the plurality of side wall outer jacket 60 is to use to protect with the plurality of top surface
40 identical structure kenel of layer, and the plurality of top surface sheath 40 is usually to use the first structure kenel, as one including one
Golden (IG) layer of the leaching of layer and a double-decker constituted in golden (EG) layer of thickness of outer layer, therefore compared with embodiment illustrated in fig. 1, phase
To material cost can not be saved, but have no effect on the finished goods product of the change nickel plating projection cube structure of wafer weld pad of the present utility model
Matter.
Illustrated above is only preferred embodiment of the present utility model, is merely illustrative for the utility model, rather than
Restricted.Have usual knowledge personnel in this professional skill field to understand, the spirit limited in the utility model claim
With many changes can be carried out in scope to it, change, or even equivalent change, but fall within protection domain of the present utility model
It is interior.
Claims (6)
1. a kind of change nickel plating projection cube structure of wafer weld pad, it is characterised in that including：
One wafer, it is included：One surface；Multiple weld pads are set on a surface；And one protective layer be formed on the surface and be provided with
Multiple openings appear the plurality of weld pad for correspondence；
Multiple catalyst layers, it handles manufacturing process to form a catalyst layer respectively on the surface of the plurality of weld pad using zinc impregnation；
Multipleization nickel plating projection, it utilizes electroless nickel mode, and is combined with photoresistance mode, with the surface of the plurality of catalyst layer
Forming one respectively has the change nickel plating projection of preset height；
Multiple top surface outer jackets, it is respectively provided on the top surface of the plurality ofization nickel plating projection, wherein each top surface outer jacket is comprising extremely
The protective layer that the material of a leaching layer gold or change silver layer is constituted less, using the golden manufacturing process of change or the silver-colored manufacturing process of change with many at this
The top surface formation top surface outer jacket of individualization nickel plating projection；And
Multiple side wall outer jackets, it is respectively provided on the ring side of the plurality ofization nickel plating projection, wherein each side wall outer jacket is included
At least one leaching layer gold or the protective layer that is constituted of material for changing silver layer, be using change golden manufacturing process or change silver-colored manufacturing process with
Side wall outer jacket is formed on the ring side of the plurality ofization nickel plating projection respectively；
Outside top surface outer jacket that wherein eachization nickel plating projection is formed on its top face and the side wall formed on its ring side
Sheath is snugly coated on the outer surface of eachization nickel plating projection completely, to form a complete outer jacket.
2. the change nickel plating projection cube structure of wafer weld pad as claimed in claim 1, it is characterised in that formed in the change nickel plating projection
The top surface outer jacket of top surface by one be made up of leaching layer gold single layer structure, one by the leaching layer gold in internal layer and outer layer thickness gold
Double-decker that layer is constituted, a single layer structure being made up of change silver layer or one in internal layer by changing silver layer and the leaching in outer layer
The double-decker that layer gold is constituted is formed.
3. the change nickel plating projection cube structure of wafer weld pad as claimed in claim 2, it is characterised in that formed in the change nickel plating projection
The side wall outer jacket of ring side be by one be made up of leaching layer gold single layer structure, one by the leaching layer gold in internal layer and in outer layer
Thick layer gold constituted double-decker, a single layer structure being made up of change silver layer or one by the change silver layer in internal layer and outside
The double-decker that the leaching layer gold of layer is constituted is formed.
4. the change nickel plating projection cube structure of wafer weld pad as claimed in claim 2, it is characterised in that the thickness of the change nickel plating projection
For 2~14 microns, the thickness of the leaching layer gold is 0.01~0.05 micron, and the thickness of the thick layer gold is 0.5~2.0 micron, the change
The thickness of silver layer is 0.5~2.0 micron.
5. the change nickel plating projection cube structure of wafer weld pad as claimed in claim 1, it is characterised in that formed in the change nickel plating projection
The top surface outer jacket of top surface and the side wall outer jacket formed in the ring side of the change nickel plating projection be by selected from one by leaching layer gold institute
The single layer structure of composition, a double-decker being made up of the leaching layer gold in internal layer and the thick layer gold in outer layer, one are by change silver layer
In the single layer structure that is constituted, the group of a double-decker being made up of the change silver layer in internal layer and the leaching layer gold in outer layer
A kind of structure is formed.
6. the change nickel plating projection cube structure of wafer weld pad as claimed in claim 5, it is characterised in that the thickness of the change nickel plating projection
For 2~14 microns, the thickness of the leaching layer gold is 0.01~0.05 micron, and the thickness of the thick layer gold is 0.5~2.0 micron, the change
The thickness of silver layer is 0.5~2.0 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220325325.3U CN206412350U (en) | 2012-07-05 | 2012-07-05 | The change nickel plating projection cube structure of wafer weld pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220325325.3U CN206412350U (en) | 2012-07-05 | 2012-07-05 | The change nickel plating projection cube structure of wafer weld pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206412350U true CN206412350U (en) | 2017-08-15 |
Family
ID=59547471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220325325.3U Expired - Lifetime CN206412350U (en) | 2012-07-05 | 2012-07-05 | The change nickel plating projection cube structure of wafer weld pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206412350U (en) |
-
2012
- 2012-07-05 CN CN201220325325.3U patent/CN206412350U/en not_active Expired - Lifetime
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Effective date of registration: 20191203 Address after: 11, Lane 17, section 3, Nanshan Road, Luzhu Township, Taoyuan County, Taiwan, China Co-patentee after: XIAMEN MSSB TECHNOLOGY CO.,LTD. Patentee after: MAO BANG ELECTRONIC CO.,LTD. Address before: Taoyuan County, Taiwan, China Patentee before: MAO BANG ELECTRONIC CO.,LTD. |
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Effective date of registration: 20210721 Address after: 361101 room e502b, Taiwan Science and technology enterprise cultivation center, Xiamen Torch hi tech Zone (Xiang'an) Industrial Zone, Fujian Province Patentee after: XIAMEN MSSB TECHNOLOGY Co.,Ltd. Address before: 11, Lane 17, section 3, Nanshan Road, Luzhu Township, Taoyuan County, Taiwan, China Patentee before: MAO BANG ELECTRONIC Co.,Ltd. Patentee before: XIAMEN MSSB TECHNOLOGY Co.,Ltd. |
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