CN206403514U - A kind of sping mattress of utilization electronic cooling - Google Patents
A kind of sping mattress of utilization electronic cooling Download PDFInfo
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- CN206403514U CN206403514U CN201620995967.2U CN201620995967U CN206403514U CN 206403514 U CN206403514 U CN 206403514U CN 201620995967 U CN201620995967 U CN 201620995967U CN 206403514 U CN206403514 U CN 206403514U
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- electronic cooling
- heat conducting
- mattress
- conducting fiber
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Abstract
The utility model is related to a kind of sping mattress of utilization electronic cooling, including mattress body（1）, the mattress body is sequentially provided with spongy layer from top to bottom（2）, spring layer（6）With lower spongy layer（8）, upper spongy layer（2）With spring layer（6）Between be sequentially provided with from top to bottom heat conducting fiber layer（3）, electronic cooling layer（4）With upper Anti-trap cushion（5）；Spring layer（6）With lower spongy layer（8）Between be provided with lower Anti-trap cushion（7）；Mattress body（1）Also include heat conducting fiber silk cluster（9）, heat conducting fiber silk cluster（9）Through spring layer（6）With lower Anti-trap cushion（7）.Heat conducting fiber layer（3）It is used as heat transmission medium, it is to avoid metallic plate heat-conducting medium hardness is big, the dielectric structure disadvantages such as empty gas and water, makes mattress i.e. soft comfortable, natural permeable ensures good cold and hot transfer performance again, and design structure is simple；Electronic cooling layer（4）By storage battery power supply, electric current is stable, safe and reliable.
Description
Technical field
The utility model is related to the technical field of sping mattress, in particular to a kind of spring mattress bed of utilization electronic cooling
Pad.
Background technology
Refrigerating mattress is a kind of health care, cools to relieve summer heat and use function mattress.Such function mattress according to refrigeration principle not
Together, it is divided into electronic cooling, compression-type refrigeration and absorption refrigeration mattress.Wherein electronic cooling mattress makes because of its work fast
With long lifespan, work noiseless, easy to adjust easy to control, the advantages of without using refrigerant No leakage, deep blue or green by businessman and user
Look at.Sheet metal, gas cabinet, water that existing electronic cooling mattress is typically close to by using the cold and hot end of semiconductor refrigerating element to it
The medium coolings such as case with radiating, realize mattress refrigerating function, but make originally conveniently electronic cooling mode because of heat-conducting medium
Property and structure it is complicated.
Such as Authorization Notice No. is the U of CN 202161020 Chinese utility model patent, and it discloses one kind is refrigeration bed
Pad, including mattress body, mattress are divided into three layers, and surface layer is first layer, and the lower end of surface layer is refrigerating layer, in the lower end of refrigerating layer
As bottom, refrigerating layer is constituted with the cooling piece connection in series-parallel of semiconductor, and refrigerating layer is to be connected by plug with power supply, is being inserted
Head controls the refrigerating capacity of refrigerating layer with the circuit of refrigerating layer provided with controlling switch.The mattress can make people's meeting of overlieing
It is very nice and cool, and more effectively improve people and no longer worry technical problem extremely hot to rest in hot summer.Should
Refrigerating mattress is connected what power supply was operated with power supply by plug, it may appear that the danger of electric leakage；Voltage when summer electricity consumption is excessive
It is too low to work.
In another example the U of Authorization Notice No. CN 201996011 Chinese utility model patent, its open thermoelectric cooling bed mattress,
Thermoelectric module is equipped with inside mattress.Switch on power when using, at summer, thermoelectric cooling bed mattress can freeze, by changing electricity
Source polarity, in winter thermoelectric cooling bed mattress can heat again.It is easy to use, it can freeze and can heat.The refrigerating mattress
It is operated by switching on power, it may appear that the danger of electric leakage；Brownout be able to not can work when summer electricity consumption is excessive.
Utility model content
In order to solve the above-mentioned technological deficiency of prior art presence, the purpose of this utility model is to provide a kind of using electric
The sping mattress of son refrigeration, the problem of structure is complex when solving to use semiconductor refrigerating element in the prior art.
In order to realize above-mentioned purpose of design, the scheme that the utility model is used is as follows：
A kind of sping mattress of utilization electronic cooling, including mattress body, the mattress body are sequentially provided with from top to bottom
Spongy layer, spring layer and lower spongy layer, are sequentially provided with heat conducting fiber layer, electricity from top to bottom between the upper spongy layer and spring layer
Sub- refrigerating layer and upper Anti-trap cushion, heat conducting fiber layer are used as heat transmission medium；Electronic cooling layer is uniformly gone here and there by semiconductor refrigerating element
Connection distribution composition, and by storage battery power supply.Heat conducting fiber layer is used as heat transmission medium, it is to avoid metallic plate heat-conducting medium hardness is big,
The dielectric structure disadvantages such as empty gas and water, make mattress i.e. soft comfortable, and natural permeable ensures good cold and hot transfer performance again,
And design structure is simple；Electronic cooling layer is by storage battery power supply, and electric current is stable, safe and reliable.
Preferably, lower Anti-trap cushion is provided between the spring layer and lower spongy layer.
In any of the above-described scheme preferably, the mattress body also includes heat conducting fiber silk cluster, heat conducting fiber silk cluster
Anti-trap cushion, spring layer and lower Anti-trap cushion are sequentially passed through from top to bottom.
In any of the above-described scheme preferably, the heat conducting fiber layer forms cloth-like by heat conducting fiber silk by knitting
Layer, the heat conducting fiber silk is from heat superconducting carbon fiber, graphite-based heat conducting fiber or metallic fiber.
In any of the above-described scheme preferably, the electronic cooling layer carries cold end and radiating end, and cold end is close to heat conduction
Fibrous layer；Radiating end connection heat conducting fiber silk cluster, so as to increase heat-dissipating space and efficiency.
In any of the above-described scheme preferably, the upper Anti-trap cushion selects hollow metal alloy rectangle agllutination with holes
Structure, heat conducting fiber silk cluster is placed in the hollow hole of metal alloy rectangular block architecture, so as to increase heat-dissipating space and efficiency.
In any of the above-described scheme preferably, the lower Anti-trap cushion selects hollow metal alloy rectangle agllutination with holes
Structure, heat conducting fiber silk cluster is placed in the hollow hole of metal alloy rectangular block architecture, so as to increase heat-dissipating space and efficiency.
In any of the above-described scheme preferably, the upper spongy layer and lower spongy layer are from silica-gel sponge layer, and it is former
Because being that silica-gel sponge has stronger gas permeability and thermal conductivity.
In any of the above-described scheme preferably, the outer wrap cotton layer mattress cover of the mattress body, so as to mattress
Body is protected.
Drawing reference numeral explanation
Mattress body 1, upper spongy layer 2, heat conducting fiber layer 3, electronic cooling layer 4, upper Anti-trap cushion 5, spring layer 6 is lower anti-sunken
Layer 7, lower spongy layer 8, heat conducting fiber silk cluster 9.
Brief description of the drawings
Fig. 1 is the structural representation of a preferred embodiment of the sping mattress according to utilization electronic cooling of the present utility model
Figure.
Embodiment
It is that the following description is substantially merely exemplary and be not intended to limitation the disclosure, using or purposes.Below
The utility model is further described using the embodiment of the sping mattress of electronic cooling with reference to Figure of description.
As shown in figure 1, the structure of the preferred embodiment according to the sping mattress of utilization electronic cooling of the present utility model
Schematic diagram.
Embodiment one
The sping mattress of utilization electronic cooling of the present utility model, including mattress body 1, the mattress body from top to bottom according to
It is secondary to be provided with upper spongy layer 2, spring layer 6 and lower spongy layer 8, it is sequentially provided with from top to bottom between the upper spongy layer 2 and spring layer 6
Heat conducting fiber layer 3, electronic cooling layer 4 and upper Anti-trap cushion 5, heat conducting fiber layer 3 are used as heat transmission medium；Electronic cooling layer 4 is by half
The uniform series arrangement composition of conductor cooling module；Semiconductor refrigerating element passes through 12V, 40Ah storage battery power supplies.Heat conducting fiber layer 3
It is used as heat transmission medium, it is to avoid metallic plate heat-conducting medium hardness is big, and the dielectric structure disadvantages such as empty gas and water make mattress i.e. soft
Soft comfortable, natural permeable ensures good cold and hot transfer performance again, and design structure is simple；Electronic cooling layer 4 passes through battery
Power supply, electric current is stable, safe and reliable.
In the present embodiment, lower Anti-trap cushion 7 is provided between the spring layer 6 and lower spongy layer 8.
In the present embodiment, the mattress body 1 also include heat conducting fiber silk cluster 9, heat conducting fiber silk cluster 9 from top to bottom according to
It is secondary to pass through upper Anti-trap cushion 5, spring layer 6 and lower Anti-trap cushion 7.
In the present embodiment, the heat conducting fiber layer 3 forms cloth-like layer by heat conducting fiber silk by knitting, and the heat conduction is fine
Tie up silk and select heat superconducting carbon fiber.
In the present embodiment, the electronic cooling layer 4 carries cold end and radiating end, and cold end is close to heat conducting fiber layer 3；Radiating
End connection heat conducting fiber silk cluster 9, so as to increase heat-dissipating space and efficiency.
In the present embodiment, the upper Anti-trap cushion 5 selects hollow metal alloy rectangular block architecture with holes, heat conducting fiber silk
Cluster 9 is placed in the hollow hole of metal alloy rectangular block architecture, so as to increase heat-dissipating space and efficiency.
In the present embodiment, the lower Anti-trap cushion 7 selects hollow metal alloy rectangular block architecture with holes, heat conducting fiber silk
Cluster 9 is placed in the hollow hole of metal alloy rectangular block architecture, so as to increase heat-dissipating space and efficiency.
In the present embodiment, the upper spongy layer 2 and lower spongy layer 8 are from silica-gel sponge layer, and its reason is silica gel sea
Silk floss has stronger gas permeability and thermal conductivity.
In the present embodiment, the outer wrap cotton layer mattress cover of the mattress body 1, so as to be protected to mattress body 1
Shield.
Embodiment two
Mattress body is sequentially provided with spongy layer 2, spring layer 6 and lower spongy layer 8 from top to bottom, the upper spongy layer 2 with
Heat conducting fiber layer 3, electronic cooling layer 4 and upper Anti-trap cushion 5, heat conducting fiber 3 conduct of layer are sequentially provided between spring layer 6 from top to bottom
Heat transmission medium；Electronic cooling layer 4 is made up of the uniform series arrangement of semiconductor refrigerating element；Semiconductor refrigerating element by 12V,
40Ah storage battery power supplies.Heat conducting fiber layer 3 is used as heat transmission medium, it is to avoid metallic plate heat-conducting medium hardness is big, and empty gas and water etc. is situated between
The complicated shortcoming of matter, makes mattress i.e. soft comfortable, and natural permeable ensures good cold and hot transfer performance, and design structure again
Simply；Electronic cooling layer 4 is by storage battery power supply, and electric current is stable, safe and reliable.
In the present embodiment, lower Anti-trap cushion 7 is provided between the spring layer 6 and lower spongy layer 8.
In the present embodiment, the mattress body 1 also include heat conducting fiber silk cluster 9, heat conducting fiber silk cluster 9 from top to bottom according to
It is secondary to pass through upper Anti-trap cushion 5, spring layer 6 and lower Anti-trap cushion 7.
In the present embodiment, the heat conducting fiber layer 3 forms cloth-like layer by heat conducting fiber silk by knitting, and the heat conduction is fine
Tie up silk and select graphite-based heat conducting fiber.
In the present embodiment, the electronic cooling layer 4 carries cold end and radiating end, and cold end is close to heat conducting fiber layer 3；Radiating
End connection heat conducting fiber silk cluster 9, so as to increase heat-dissipating space and efficiency.
In the present embodiment, the upper Anti-trap cushion 5 selects hollow metal alloy rectangular block architecture with holes, heat conducting fiber silk
Cluster 9 is placed in the hollow hole of metal alloy rectangular block architecture, so as to increase heat-dissipating space and efficiency.
In the present embodiment, the lower Anti-trap cushion 7 selects hollow metal alloy rectangular block architecture with holes, heat conducting fiber silk
Cluster 9 is placed in the hollow hole of metal alloy rectangular block architecture, so as to increase heat-dissipating space and efficiency.
In the present embodiment, the upper spongy layer 2 and lower spongy layer 8 are from silica-gel sponge layer, and its reason is silica gel sea
Silk floss has stronger gas permeability and thermal conductivity.
In the present embodiment, the outer wrap cotton layer mattress cover of the mattress body 1, so as to be protected to mattress body 1
Shield.
Embodiment three
Mattress body is sequentially provided with spongy layer 2, spring layer 6 and lower spongy layer 8 from top to bottom, the upper spongy layer 2 with
Heat conducting fiber layer 3, electronic cooling layer 4 and upper Anti-trap cushion 5, heat conducting fiber 3 conduct of layer are sequentially provided between spring layer 6 from top to bottom
Heat transmission medium；Electronic cooling layer 4 is made up of the uniform series arrangement of semiconductor refrigerating element；Semiconductor refrigerating element by 12V,
40Ah storage battery power supplies.Heat conducting fiber layer 3 is used as heat transmission medium, it is to avoid metallic plate heat-conducting medium hardness is big, and empty gas and water etc. is situated between
The complicated shortcoming of matter, makes mattress i.e. soft comfortable, and natural permeable ensures good cold and hot transfer performance, and design structure again
Simply；Electronic cooling layer 4 is by storage battery power supply, and electric current is stable, safe and reliable.
In the present embodiment, lower Anti-trap cushion 7 is provided between the spring layer 6 and lower spongy layer 8.
In the present embodiment, the mattress body 1 also include heat conducting fiber silk cluster 9, heat conducting fiber silk cluster 9 from top to bottom according to
It is secondary to pass through upper Anti-trap cushion 5, spring layer 6 and lower Anti-trap cushion 7.
In the present embodiment, the heat conducting fiber layer 3 forms cloth-like layer by heat conducting fiber silk by knitting, and the heat conduction is fine
Tie up silk and mix tissue layer with copper fiber from heat superconducting carbon fiber.
In the present embodiment, the electronic cooling layer 4 carries cold end and radiating end, and cold end is close to heat conducting fiber layer 3；Radiating
End connection heat conducting fiber silk cluster 9, so as to increase heat-dissipating space and efficiency.
In the present embodiment, the upper Anti-trap cushion 5 selects hollow metal alloy rectangular block architecture with holes, heat conducting fiber silk
Cluster 9 is placed in the hollow hole of metal alloy rectangular block architecture, so as to increase heat-dissipating space and efficiency.
In the present embodiment, the lower Anti-trap cushion 7 selects hollow metal alloy rectangular block architecture with holes, heat conducting fiber silk
Cluster 9 is placed in the hollow hole of metal alloy rectangular block architecture, so as to increase heat-dissipating space and efficiency.
In the present embodiment, the upper spongy layer 2 and lower spongy layer 8 are from silica-gel sponge layer, and its reason is silica gel sea
Silk floss has stronger gas permeability and thermal conductivity.
In the present embodiment, the outer wrap cotton layer mattress cover of the mattress body 1, so as to be protected to mattress body 1
Shield.
It will be apparent to those skilled in the art that the sping mattress of utilization electronic cooling of the present utility model includes this specification
Any combination of middle each several part.As space is limited and in order that specification is concise, these combinations are not discussed in detail one by one herein,
But see after this specification, the scope of the present utility model that any combination of each several part being made up of this specification is constituted is not
Speech is self-evident.
Claims (9)
1. a kind of sping mattress of utilization electronic cooling, including mattress body（1）, the mattress body is sequentially provided with from top to bottom
Spongy layer（2）, spring layer（6）With lower spongy layer（8）, it is characterised in that：Upper spongy layer（2）With spring layer（6）Between on to
Under be sequentially provided with heat conducting fiber layer（3）, electronic cooling layer（4）With upper Anti-trap cushion（5）, heat conducting fiber layer（3）It is situated between as heat transfer
Matter；Electronic cooling layer（4）It is made up of the uniform series arrangement of semiconductor refrigerating element, and by storage battery power supply.
2. the sping mattress of electronic cooling is utilized as claimed in claim 1, it is characterised in that：Spring layer（6）With lower spongy layer
（8）Between be provided with lower Anti-trap cushion（7）.
3. the sping mattress of electronic cooling is utilized as claimed in claim 1, it is characterised in that：Mattress body（1）Also include leading
Thermal fiber silk cluster（9）, heat conducting fiber silk cluster（9）Anti-trap cushion is sequentially passed through from top to bottom（5）, spring layer（6）With lower Anti-trap cushion
（7）.
4. the sping mattress of electronic cooling is utilized as claimed in claim 1, it is characterised in that：Heat conducting fiber layer（3）By heat conduction
Filament forms cloth-like layer by knitting, and the heat conducting fiber silk is from heat superconducting carbon fiber, graphite-based heat conducting fiber or metal
Fiber.
5. the sping mattress of electronic cooling is utilized as claimed in claim 1, it is characterised in that：Electronic cooling layer（4）With cold
End and radiating end, cold end are close to heat conducting fiber layer（3）；Radiating end connection heat conducting fiber silk cluster（9）.
6. the sping mattress of the utilization electronic cooling as described in claim 1 or 3, it is characterised in that：Upper Anti-trap cushion（5）From in
The metal alloy rectangular block architecture in blanking bar hole.
7. the sping mattress of electronic cooling is utilized as claimed in claim 2 or claim 3, it is characterised in that：Lower Anti-trap cushion（7）From in
The metal alloy rectangular block architecture in blanking bar hole.
8. the sping mattress of electronic cooling is utilized as claimed in claim 1, it is characterised in that：Upper spongy layer（2）With lower sponge
Layer（8）From silica-gel sponge layer.
9. the sping mattress of electronic cooling is utilized as claimed in claim 1, it is characterised in that：Mattress body（1）Outside bag
Wrap up in cotton layer mattress cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620995967.2U CN206403514U (en) | 2016-08-31 | 2016-08-31 | A kind of sping mattress of utilization electronic cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620995967.2U CN206403514U (en) | 2016-08-31 | 2016-08-31 | A kind of sping mattress of utilization electronic cooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206403514U true CN206403514U (en) | 2017-08-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620995967.2U Expired - Fee Related CN206403514U (en) | 2016-08-31 | 2016-08-31 | A kind of sping mattress of utilization electronic cooling |
Country Status (1)
| Country | Link |
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| CN (1) | CN206403514U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107933390A (en) * | 2017-11-20 | 2018-04-20 | 胡仟惠尹 | A kind of easy-to-mount automotive seat cushion |
-
2016
- 2016-08-31 CN CN201620995967.2U patent/CN206403514U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107933390A (en) * | 2017-11-20 | 2018-04-20 | 胡仟惠尹 | A kind of easy-to-mount automotive seat cushion |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170815 Termination date: 20190831 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |