CN105571197B - Temperature regulating device - Google Patents

Temperature regulating device Download PDF

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Publication number
CN105571197B
CN105571197B CN201610097666.2A CN201610097666A CN105571197B CN 105571197 B CN105571197 B CN 105571197B CN 201610097666 A CN201610097666 A CN 201610097666A CN 105571197 B CN105571197 B CN 105571197B
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China
Prior art keywords
heat
babinet
temperature regulating
regulating device
exchanging chamber
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CN201610097666.2A
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Chinese (zh)
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CN105571197A (en
Inventor
朱久涛
罗胜
杨蓉
梁宁波
范兴发
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Gree Electric Appliances Inc of Zhuhai
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Gree Electric Appliances Inc of Zhuhai
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Priority to CN201610097666.2A priority Critical patent/CN105571197B/en
Publication of CN105571197A publication Critical patent/CN105571197A/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00Arrangement or mounting of control or safety devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/003Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

The present invention provides a kind of temperature regulating devices, including:Babinet, babinet have the opening for article disengaging babinet;Semiconductor device, semiconductor device is arranged in babinet and the inner space of babinet is divided into the first heat exchanging chamber and the second heat exchanging chamber, first heat-exchange end of semiconductor device is located in the first heat exchanging chamber, and the second heat-exchange end of semiconductor device is located in the second heat exchanging chamber, and opening is connected to the first heat exchanging chamber;Control circuit;Power supply, power supply are powered by control circuit to semiconductor device.Temperature regulating device in the present invention solves the problems, such as to be not easy to carry out heat preservation cold insulation to article in the prior art.

Description

Temperature regulating device
Technical field
The present invention relates to technical field of semiconductors, in particular to a kind of temperature regulating device.
Background technology
With the increasingly raising of living standard, electric equipment products bring a lot of convenience to people’s lives.Semiconductor skill Art is also increasingly used in electric equipment products.But people are also increasingly stronger to the dependence of electric equipment products.
By taking heating mouse pad as an example.The people of mouse is used for a long time, a same problem is all suffered from cold winter, Mouse is used at low ambient temperatures, and feeling for human hand is very uncomfortable, and activity is also not freely.And heating mouse The appearance of pad, with regard to having well solved this problem.But in the summer of high temperature, after mouse is used for a long time, human hand can perspire, When the hand operation mouse of perspiration, it can skid, also easy to produce bacterium, and feel can be made one and feel very uncomfortable, can also influence To study and office efficiency.
By taking bottled milk and packed meal as an example.Many people have the custom for having milk and eating packed meal, but bottled milk is typically cool , packed meal is also cool, eats and easily causes digestive discomfort.Thus need before edible, to bottled milk and packed meal into Row heating.Of course, it is possible to using micro-wave oven to bottled milk and packed meal, but not all family and company are equipped with micro-wave oven, because And there are still the inconvenient problems of heating.
Invention content
The main purpose of the present invention is to provide a kind of temperature regulating devices, to solve to be not easy in the prior art to carry out article The problem of keeping the temperature cold insulation.
To achieve the goals above, the present invention provides a kind of temperature regulating devices, including:Babinet, babinet, which has, is used for article Pass in and out the opening of babinet;Semiconductor device, semiconductor device are arranged in babinet and the inner space of babinet are divided into first First heat-exchange end of heat exchanging chamber and the second heat exchanging chamber, semiconductor device is located in the first heat exchanging chamber, and the second of semiconductor device changes Hot junction is located in the second heat exchanging chamber, and opening is connected to the first heat exchanging chamber;Control circuit;Power supply, power supply pass through control circuit It powers to semiconductor device.
Further, temperature regulating device includes thermal insulation board, and thermal insulation board is arranged in babinet and separates the inner space of babinet For the first heat exchanging chamber and the second heat exchanging chamber, semiconductor device is embedded on thermal insulation board, and the first heat-exchange end of semiconductor device and Second heat-exchange end respectively exchanges heat to the space of the both sides of thermal insulation board.
Further, temperature regulating device further includes adiabatic mounting plate, and semiconductor device is fixed on heat-insulated by adiabatic mounting plate On plate.
Further, temperature regulating device further includes Ji Wenbu, and collection temperature portion is mounted on adiabatic installation after being connect with semiconductor device On plate, semiconductor device is exchanged heat by collecting temperature portion with the first heat exchanging chamber.
Further, temperature regulating device further includes plenum partitions, and plenum partitions have an aeration structure, and plenum partitions setting is the It is divided into holding area and semiconductor region in one heat exchanging chamber and by the first heat exchanging chamber, opening is connected to holding area, semiconductor device First heat-exchange end is located in semiconductor region.
Further, also there is babinet heat emission hole, heat emission hole to be connected to the second heat exchanging chamber.
Further, temperature regulating device further includes at least one radiating part, and radiating part is arranged to be changed the first of semiconductor device Hot junction and/or the second heat-exchange end.
Further, radiating part includes:Cooling fin, cooling fin are attached on semiconductor device;Draft fan, draft fan is to dissipating The heat of backing radiates.
Further, also there is babinet cable-through hole, cable-through hole to be connected to the first heat exchanging chamber.
Further, temperature regulating device further includes the door curtain for blocking or opening opening, and door curtain is movably arranged on babinet.
Further, door curtain has unfolded state and receiving state, and when door curtain is in unfolded state, door curtain blocks out Mouthful, when door curtain is in receiving state, door curtain evacuation opening.
Further, temperature regulating device further includes:First locking piece, the first locking piece are arranged on door curtain;Second locking piece, Second locking piece is arranged on babinet, and door curtain keeps blocking the state of opening after the first locking piece and the locking of the second locking piece.
Further, temperature regulating device further includes door curtain control unit, and door curtain control unit drives door curtain action to block or open There is door curtain operating parts, door curtain operating parts to be arranged on babinet for opening, door curtain control unit.
Further, there is control circuit the heat exchange operation part of the current direction of control switching circuit, heat exchange operation part to set It sets on babinet.
Further, the temperature adjustment operating parts of the control circuit also size of current with adjusting control circuit, temperature adjustment operating parts It is arranged on babinet.
Further, the interior surface of babinet lays protective layer.
It applies the technical scheme of the present invention, by the way that semiconductor device is arranged in babinet, so that the inner space quilt of babinet It is divided into the first heat exchanging chamber and the second heat exchanging chamber, the first heat-exchange end of semiconductor device is located in the first heat exchanging chamber, semiconductor portion Second heat-exchange end of part is located in the second heat exchanging chamber, and power supply is powered by control circuit to semiconductor device, to ensure first There are temperature differences for heat exchanging chamber and the second heat exchanging chamber.By on babinet be arranged opening, in order to place an article in babinet or by It is taken out in babinet.When the first heat-exchange end of semiconductor device is cold end, the temperature of the first heat exchanging chamber is less than the second heat exchanging chamber Temperature, article, which is placed in the first heat exchanging chamber, has the effect of cooling, cold insulation.When the first heat-exchange end of semiconductor device is hot junction When, the temperature of the first heat exchanging chamber is higher than the temperature of the second heat exchanging chamber, and article is placed in the first heat exchanging chamber the effect with heating, thermal protection Fruit.By applying semiconductor technology in above-mentioned temperature regulating device, temperature regulating device is made to have the effect of freezing and/or heat, To meet the routine use demand of people, the comfort of user is improved.Temperature regulating device in the present invention, relative to micro-wave oven For, have the advantages that simple in structure, easy to use, safe, people's use suitable for each ages.
Description of the drawings
The accompanying drawings which form a part of this application are used to provide further understanding of the present invention, and of the invention shows Meaning property embodiment and its explanation are not constituted improper limitations of the present invention for explaining the present invention.In the accompanying drawings:
Fig. 1 shows the structural schematic diagram of the temperature regulating device of an alternative embodiment according to the present invention;
Fig. 2 shows the internal structure schematic diagrams of the temperature regulating device in Fig. 1;
Fig. 3 shows the schematic view of the mounting position of radiating part in Fig. 2, semiconductor device and thermal insulation board;And
Fig. 4 shows the control circuit of the temperature regulating device in Fig. 1 and the connection relationship diagram of semiconductor device.
Wherein, above-mentioned attached drawing includes the following drawings label:
10, babinet;11, it is open;12, the first heat exchanging chamber;121, holding area;122, semiconductor region;13, the second heat exchanging chamber; 14, heat emission hole;20, semiconductor device;30, thermal insulation board;40, adiabatic mounting plate;50, plenum partitions;60, radiating part;61, it radiates Piece;62, draft fan;70, door curtain;80, the second locking piece;90, door curtain operating parts;100, heat exchange operation part;110, temperature adjustment operates Part;120, Ji Wenbu.
Specific implementation mode
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase Mutually combination.The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
It is noted that following detailed description is all illustrative, it is intended to provide further instruction to the application.Unless another It indicates, all technical and scientific terms used herein has usual with the application person of an ordinary skill in the technical field The identical meanings of understanding.
In the present invention, in the absence of explanation to the contrary, the noun of locality used such as " inside and outside " refers to relative to each portion The profile of part itself it is inside and outside, but the above-mentioned noun of locality is not intended to restrict the invention.
In order to solve the problems, such as to be not easy in the prior art to carry out heat preservation cold insulation to article, the present invention provides a kind of temperature controls Device.
As shown in Figures 1 to 4, temperature regulating device includes babinet 10, semiconductor device 20, control circuit and power supply, babinet 10 there is the opening 11 for article disengaging babinet 10, semiconductor device 20 to be arranged interior in babinet 10 and the inside of babinet 10 is empty Between be divided into the first heat exchanging chamber 12 and the second heat exchanging chamber 13, the first heat-exchange end of semiconductor device 20 is located at the first heat exchanging chamber 12 Interior, the second heat-exchange end of semiconductor device 20 is located in the second heat exchanging chamber 13, and opening 11 is connected to the first heat exchanging chamber 12, power supply It is powered to semiconductor device 20 by control circuit.
By the way that opening 11 is arranged on babinet, in order to place an article in babinet 10 or by being taken out in babinet 10.When half When first heat-exchange end of conductor part 20 is cold end, the temperature of the first heat exchanging chamber 12 is less than the temperature of the second heat exchanging chamber 13, article Being placed in the first heat exchanging chamber 12 has the effect of cooling, cold insulation.When the first heat-exchange end of semiconductor device 20 is hot junction, first The temperature of heat exchanging chamber 12 is higher than the temperature of the second heat exchanging chamber 13, and article is placed in the effect with heating, thermal protection in the first heat exchanging chamber 12 Fruit.By applying semiconductor technology in above-mentioned temperature regulating device, temperature regulating device is made to have the effect of freezing and/or heat, To meet the routine use demand of people, the comfort of user is improved.Temperature regulating device in the present invention, relative to micro-wave oven For, have the advantages that simple in structure, easy to use, safe, people's use suitable for each ages.
As shown in Figure 1, the lower portion of opening 11 is straight.Certainly, 11 lower portion of being open can also be round.
Optionally, be open 11 height be less than or equal to babinet 10 height.
Optionally, be open 11 edge is passivated processing.In this way, when body part can be effectively prevent to pass in and out babinet 10 It scratches.
Still optionally further, be open 11 edge can with external flexible materials, protect wrist when passing in and out babinet 10 It is not hurt.For example, can be in the edge of opening 11 package sponge, cotton, paper etc..
Optionally, the interior surface of babinet 10 lays protective layer.Still optionally further, protective layer is made of flexible material 's.In such manner, it is possible to sense of touch when effectively improving body contact babinet 10, and safety accident is reduced, improve the use of temperature regulating device Comfort.Further optionally, protective layer is cotton, sponge, rubber layer etc..
As shown in Fig. 2, temperature regulating device includes thermal insulation board 30, thermal insulation board 30 is arranged in babinet 10 and by the inside of babinet 10 Space is divided into the first heat exchanging chamber 12 and the second heat exchanging chamber 13, and semiconductor device 20 is embedded on thermal insulation board 30, and semiconductor portion The first heat-exchange end and the second heat-exchange end of part 20 respectively exchange heat to the space of the both sides of thermal insulation board 30.In such manner, it is possible to make One heat exchanging chamber 12 and the second heat exchanging chamber 13 are heat-insulated, ensure the temperature difference of the two, improve the stability of temperature in the first heat exchanging chamber 12, Improve lifting temp effect of the temperature regulating device to article.
In order to improve the heat-proof quality of the first heat exchanging chamber 12 and the second heat exchanging chamber 13 and improve the installation of semiconductor device 20 Stability, the temperature regulating device in the present invention further includes adiabatic mounting plate 40, and semiconductor device 20, which passes through adiabatic mounting plate 40, to be fixed On thermal insulation board 30.
In specific implementation mode shown in Fig. 2, temperature regulating device further includes collection temperature portion 120, collection temperature portion 120 and semiconductor portion Part 20 is mounted on after connecting on adiabatic mounting plate 40, and semiconductor device 20 is connected to by collecting temperature portion 120 with the first heat exchanging chamber 12.By In being provided with collection temperature portion 120, thus collection temperature portion 120 can be by the heat of 12 side of the first heat exchanging chamber of direction of semiconductor device 20 It collects, heating and cooling processing is carried out to the first heat exchanging chamber 12 in order to concentrate.In order to improve the safety in utilization of temperature regulating device, Temperature regulating device further includes plenum partitions 50, and there is plenum partitions 50 aeration structure, plenum partitions 50 to be arranged in the first heat exchanging chamber 12 Interior and the first heat exchanging chamber 12 is divided into holding area 121 and semiconductor region 122, opening 11 is connected to holding area 121, semiconductor portion First heat-exchange end of part 20 is located in semiconductor region 122.In this way, when article is sent into the first heat exchanging chamber 12 by human hand, due to Plenum partitions 50 detach holding area 121 and semiconductor region 122, in this way, human hand would not be made accidentally to touch semiconductor device 20, avoid Unexpected safety accident.
It should be noted that the presence of adiabatic mounting plate 40 is to stop the mutual shadow of hot and cold side temperature of semiconductor device 20 It rings, therefore collection temperature portion 120 need to be increased in adiabatic mounting plate 40, and collect the effect that temperature portion 120 also functions to stable internal chamber temperature. Do not increase collection temperature portion 120 to compare, the temperature in babinet 10 after stabilization can be more steady.Optionally, collection temperature portion 120 is aluminum Made of material.Still optionally further, the model 6063 of aluminum material.
In order to improve ventilation, the heat dissipation performance of the second heat exchanging chamber 13, babinet 10 also has a heat emission hole 14, heat emission hole 14 and the Two heat exchanging chambers 13 exchange heat.
As shown in Figures 2 and 3, temperature regulating device further includes at least one radiating part 60, and radiating part 60 is arranged in semiconductor portion The first heat-exchange end and/or the second heat-exchange end of part 20.Radiating part 60 can effectively improve the radiating efficiency of semiconductor device 20, excellent Change the lifting temp effect of the first heat exchanging chamber 12 and/or the second heat exchanging chamber 13.
Specifically, radiating part 60 includes cooling fin 61 and draft fan 62, cooling fin 61 is attached on semiconductor device 20; Draft fan 62 radiates to the heat of cooling fin 61.By the way that cooling fin 61 is arranged, be conducive to improve dissipating for semiconductor device 20 The thermal efficiency optimizes the lifting temp effect of the first heat exchanging chamber 12 and/or the second heat exchanging chamber 13.By the way that draft fan 62, Ke Yijin is arranged One step improves the radiating efficiency of semiconductor device 20.By controlling the rotating speed of draft fan 62, it can make temperature regulating device that there is energy consumption It is low, the good advantage of comfort.
Optionally, cooling fin 61 selects aluminum material, cheap and thermal coefficient moderate.
It should be noted that draft fan 62 is located at the side of opening 11, it can be to avoid the draft fan in the first heat exchanging chamber 12 62 blow-throughs are imported and exported.In addition, when being open 11 positioned at the surface of babinet 10, the draft fan 62 in the second heat exchanging chamber 13 will not Because of the change of the placement position of babinet 10, opening 11 is interfered, 14 outlet air of heat emission hole will not be interfered, temperature regulating device is made to have There are many put and use state.
In order to improve the heat-insulating property of the first heat exchanging chamber 12, temperature regulating device further includes the door curtain for blocking or opening opening 11 70, door curtain 70 is movably arranged on babinet 10.It is provided with door curtain 70 at the opening 11 of babinet 10, improves the first heat exchanging chamber 12 Heat insulation effect, reduce hot/cold amount loss.
Optionally, door curtain 70 has unfolded state and receiving state, and when door curtain 70 is in unfolded state, door curtain 70 blocks Opening 11, when door curtain 70 is in receiving state, the evacuation of door curtain 70 opening 11.That is, door curtain 70 here is in contraction type Opening and closing structure.
In specific implementation mode shown in Fig. 1, door curtain 70 is in the opening and closing structure of " pull-down ".Heap due to contraction of door curtain 70 Product, convenient for storage or expansion.
As depicted in figs. 1 and 2, temperature regulating device further includes the first locking piece and the second locking piece 80, the setting of the first locking piece On door curtain 70, the second locking piece 80 is arranged on babinet 10, and door curtain 70 is protected after the first locking piece and the locking of the second locking piece 80 Hold the state for blocking opening 11.Door curtain 70 is set to block opening 11 by the cooperation of the first locking piece and the second locking piece 80, it can be with Ensure the heat-insulating property in the first heat exchanging chamber 12.Optionally, the first locking piece is the clamping protrusion being arranged on babinet 10.Second Locking piece 80 is the snap ring on door curtain 70, and snap ring can be engaged by clamping with clamping protrusion.
It can make its expansion by human hand direct pull door curtain 70.It is of course also possible to pass through Electronic control.
As shown in Figure 1, temperature regulating device further includes door curtain control unit, door curtain control unit drives the action of door curtain 70 to block or beat There is door curtain operating parts 90, door curtain operating parts 90 to be arranged on babinet 10 for opening 11, door curtain control unit.Door curtain control unit also has It, to instruct, is actuator driving driving member action to actuator to have actuator and driving member, door curtain operating parts 90, and driving member drives Door curtain 70 is unfolded or packs up, and can realize that the contraction of door curtain 70 is piled up in top or opening 11 is blocked in expansion, have operation letter Single advantage.Optionally, actuator is small type stepping motor, controls the up and down motion of door curtain 70.
Optionally, door curtain operating parts 90 is button or knob.
As shown in Figure 1, control circuit has the heat exchange operation part 100 of the current direction of control switching circuit, heat exchange operation Part 100 is arranged on babinet 10.Temperature regulating device in the present invention can pass through the 100 switching electric current side of heat exchange operation part of peripheral hardware To realization temperature regulating device can freeze but also heat, and be the integrated application of semiconductor refrigerating/thermal technology.
Optionally, heat exchange operation part 100 is button.
As shown in Figure 1, the temperature adjustment operating parts 110 of the control circuit also size of current with adjusting control circuit, temperature adjustment behaviour Workpiece 110 is arranged on babinet 10.Optionally, temperature adjustment operating parts 110 is button or knob.Operating temperature adjustment operating parts 110 can be with Set the temperature value in temperature regulating device, free regulating and controlling temperature value.
Optionally, also there is babinet 10 cable-through hole, cable-through hole to be connected to the first heat exchanging chamber 12.When in the first heat exchanging chamber 12 After placing mouse, mouse lines can be pierced by babinet 10 by cable-through hole.If being only used as warm hand use, cable-through hole can be filled out Plug, prevents the leakage of cold or heat.
Optionally, the internal or external of babinet 10 can add hiding handle, be convenient for user's carrying or mobile control in this way Warm device improves property easy to use.
Optionally, power supply has multiple choices.Directly computer USB interface can be used to power, alternating current confession can also be used Electricity is converted to direct current semiconductor supply component and draft fan 62 through power panel.Meanwhile can develop can charge and discharge accumulator production Product improve the scope of application of product.
In Fig. 1 to specific implementation mode shown in Fig. 3, draft fan 62 is connect by screw with cooling fin 61.Semiconductor Thermal grease is smeared between cooling fin 61 in component 20 and the second heat exchanging chamber 13, is fitted closely.Collect temperature portion 120 and semiconductor It smears thermal grease among the another side of component 20 to be fitted closely later, collection temperature portion 120 is mounted on exhausted with semiconductor device 20 It in the mounting hole of hot mounting plate 40, is thermally isolated, prevents the hot and cold side heat of semiconductor device 20 from influencing each other, so as to cause The reduction of refrigeration or heating effect.It is carried out after smearing thermal grease between cooling fin 61 in collection temperature portion 120 and the first heat exchanging chamber 12 Fit closely installation.Cooling fin 61 in first heat exchanging chamber 12 and dissipating in the mounting means and the second heat exchanging chamber 13 of draft fan 62 Backing 61 is identical as the mounting means of draft fan 62.First heat exchanging chamber 12 and the second heat exchanging chamber 13 are thermally isolated thermal insulation board 30, lead to Wind partition board 50 separates the radiating part in the first heat exchanging chamber 12 with holding area 121, plays a protective role, avoids draft fan 62 and people The possibility of hand contact, prevents the generation injured unexpectedly.Meanwhile the aeration structure of plenum partitions 50 is densely covered aperture, favorably In the circulation and diffusion of heat or cold in the first heat exchanging chamber 12.
The course of work of temperature regulating device in the present invention:After semiconductor device 20 leads to direct current, due to paltie effect, Semiconductor device 20 works, and one end is cold end, and other end is hot junction, at this time can be certainly by heat exchange operation part 100 By selection refrigeration or heating mode;Draft fan 62 brings into operation at once, difference two in the first heat exchanging chamber 12 and the second heat exchanging chamber 13 Freeze or heat respectively in side.By taking cooling in the first heat exchanging chamber 12 as an example, in fig. 2, the left side of semiconductor device 20 is cold end, the right side Side is hot junction, and the hot junction heat transfer of semiconductor device 20 is at the cooling fin 61 in the second heat exchanging chamber 13 at this time, the second heat exchange Draft fan 62 in chamber 13 reinforces heat exchange, and the heat of generation is scattered and disappeared away rapidly.The cold end of semiconductor device 20 is by generation Cold is transmitted to collection temperature portion 120, and the cooling fin 61 that cold is transmitted to by collecting temperature portion 120 in the first heat exchanging chamber 12 again is changed by first 62 augmentation of heat transfer of draft fan in hot chamber 12, rapidly blows out cold, makes to cool down rapidly in the first heat exchanging chamber 12.
Temperature regulating device application paltie effect in the present invention only passes through external heat exchange using semiconductor chip cooling/heating Operating parts switching electric current direction can realize cold and hot switching.Temperature adjustment operating parts 110 meets different people by adjusting heating and cooling amplitude The use demand of group ensures human body comfort.Temperature regulating device has the characteristics that modular, and easy for installation, device volume is small, heat dissipation Portion can reinforce heat transfer effect.The temperature control regulative mode of smart linear ratio, the heat or cold for making full use of semiconductor to generate.
Temperature regulating device in the present invention serves many purposes, and can freeze to body temperature lowering, can also give beverage or cup In water heat preservation or refrigeration cool-down.That is, the temperature regulating device in the present invention is the expanded application of environmental-protection refrigeration technology, have Have a wide range of application, the feature that applicable surface is strong, practicability is good.
Temperature regulating device in the present invention can well solve people and learn and the trick that encounters of working is ice-cold, comfort Difference, the problem of needing to heat article or cooled down.
Purposes one:For office worker and student family, when for operating mouse warm hand, line was offered on babinet 10 Hole can be connected mouse connecting line across babinet by cable-through hole with computer;If using wireless mouse, connecting line is avoided The problem of, use is more convenient.The appearance of babinet 10 can be further improved according to the demand of user, to meet different crowd Hobby.The use scope of temperature regulating device can be expanded, the sealing Bottle & Can such as beverage can be kept the temperature or be added in babinet 10 Heat.
Purposes two:It uses, personalized can improve, volume can be improved more exquisite, be convenient for for the elderly's warm hand It is mobile to carry and put, so that it is used in daily life unrestricted.It can be hidden in the internal or external installation of babinet 10 Handle is easy to use by users.If using battery form, use occasion is more unrestricted, as long as not stopping heat emission hole 14, position can arbitrarily be put.
Control circuit is as shown in figure 4, two functions of freezing and heat may be implemented in temperature regulating device.It is only needed between two patterns Want switching electric current direction.The switching of current direction can be realized by Fig. 4.Wherein, K1, K2, K3, K4 are coordinated signals, are write from memory Recognize state K2, K3 is closed, and K1, K4 are disconnected, and the first heat exchanging chamber 12 is to cool down when the state that control circuit be in Fig. 4.At this point, Become soaking condition to the first heat exchanging chamber 12, needs to control heat exchange operation part 100, so that K2, K3 are disconnected, K1, K4 are closed, this When to semiconductor device 20 supply electric current commutate, that is, realize refrigeration and heating switching.
If if refrigeration mode is switched to heating, switch button is pressed, at this time K2, K3 is disconnected, and K1, K4 are closed.It is negative Carrying (semiconductor) electric current can commutate.Realize the switching of refrigeration and heating.
It can be seen from the above description that the above embodiments of the present invention realize following technique effect:
1. the temperature regulating device in the present invention can realize the effect of heat preservation cold insulation, the utilization rate of product is improved;
2. the opening of babinet is provided with door curtain, the heat insulation effect of First Heat Exchanger is improved, reduces the damage of hot/cold amount It loses, and ensures the comfort of human body contact site;
3. the temperature regulating device in the present invention has the advantages that energy consumption is low, heat exchange efficiency is high, low noise.
4. it is various that the temperature regulating device in the present invention also has the characteristics that small, good appearance, contour structures can change.
It should be noted that term used herein above is merely to describe specific implementation mode, and be not intended to restricted root According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative It is also intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet Include " when, indicate existing characteristics, step, work, device, component and/or combination thereof.
It should be noted that term " first " in the description and claims of this application and above-mentioned attached drawing, " Two " etc. be for distinguishing similar object, without being used to describe specific sequence or precedence.It should be appreciated that using in this way Data can be interchanged in the appropriate case, so that presently filed embodiment described herein can be in addition to illustrating herein Or the sequence other than those of description is implemented.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.

Claims (13)

1. a kind of temperature regulating device, which is characterized in that including:
Babinet (10), the babinet (10) have the opening (11) that the babinet (10) is passed in and out for article;
Semiconductor device (20), the semiconductor device (20) setting is in the babinet (10) and by the interior of the babinet (10) Portion space is divided into the first heat exchanging chamber (12) and the second heat exchanging chamber (13), and the first heat-exchange end of the semiconductor device (20) is located at In first heat exchanging chamber (12), the second heat-exchange end of the semiconductor device (20) is located in second heat exchanging chamber (13), The opening (11) is connected to first heat exchanging chamber (12), and the babinet (10) also has heat emission hole (14), the heat emission hole (14) it is connected to second heat exchanging chamber (13);
Control circuit;
Power supply, the power supply are powered by the control circuit to the semiconductor device (20);
Thermal insulation board (30), thermal insulation board (30) setting divide in the babinet (10) and by the inner space of the babinet (10) It is divided into first heat exchanging chamber (12) and second heat exchanging chamber (13), the semiconductor device (20) is embedded in the thermal insulation board (30) on, and first heat-exchange end of the semiconductor device (20) and second heat-exchange end are respectively to the thermal insulation board (30) space of both sides exchanges heat;
Adiabatic mounting plate (40), the semiconductor device (20) are fixed on the thermal insulation board by the adiabatic mounting plate (40) (30) on.
2. temperature regulating device according to claim 1, which is characterized in that the temperature regulating device further includes (120) Ji Wenbu, institute It states and is mounted on after Ji Wenbu (120) is connect with the semiconductor device (20) on the adiabatic mounting plate (40), the semiconductor Component (20) is exchanged heat by the collection temperature portion (120) and first heat exchanging chamber (12).
3. temperature regulating device according to claim 1, which is characterized in that the temperature regulating device further includes plenum partitions (50), The plenum partitions (50) have an aeration structure, and the plenum partitions (50) setting is in first heat exchanging chamber (12) and by institute It states the first heat exchanging chamber (12) and is divided into holding area (121) and semiconductor region (122), the opening (11) and the holding area (121) it is connected to, first heat-exchange end of the semiconductor device (20) is located in the semiconductor region (122).
4. temperature regulating device according to claim 1, which is characterized in that the temperature regulating device further includes at least one radiating part (60), first heat-exchange end and/or second heat exchange of radiating part (60) setting in the semiconductor device (20) End.
5. temperature regulating device according to claim 4, which is characterized in that the radiating part (60) includes:
Cooling fin (61), the cooling fin (61) are attached on the semiconductor device (20);
Draft fan (62), the draft fan (62) radiate to the heat of the cooling fin (61).
6. temperature regulating device according to claim 1, which is characterized in that the babinet (10) also has cable-through hole, the mistake String holes is connected to first heat exchanging chamber (12).
7. temperature regulating device according to claim 1, which is characterized in that the temperature regulating device further include block or open described in The door curtain (70) of opening (11), the door curtain (70) are movably arranged on the babinet (10).
8. temperature regulating device according to claim 7, which is characterized in that the door curtain (70) has unfolded state and storage shape State, when the door curtain (70) is in the unfolded state, the door curtain (70) blocks the opening (11), when the door curtain (70) when being in receiving state, the door curtain (70) avoids the opening (11).
9. temperature regulating device according to claim 7, which is characterized in that the temperature regulating device further includes:
First locking piece, first locking piece are arranged on the door curtain (70);
Second locking piece (80), second locking piece (80) are arranged on the babinet (10), first locking piece and institute State the state that the door curtain (70) after the second locking piece (80) locks keeps blocking the opening (11).
10. temperature regulating device according to claim 7, which is characterized in that the temperature regulating device further includes door curtain control unit, institute Stating door curtain control unit drives door curtain (70) action to block or open the opening (11), and the door curtain control unit has door Curtain operating parts (90), the door curtain operating parts (90) are arranged on the babinet (10).
11. temperature regulating device according to any one of claim 1 to 10, which is characterized in that the control circuit, which has, cuts The heat exchange operation part (100) of the current direction of the control circuit is changed, the heat exchange operation part (100) is arranged in the babinet (10) on.
12. temperature regulating device according to any one of claim 1 to 10, which is characterized in that the control circuit also has The temperature adjustment operating parts (110) of the size of current of the control circuit is adjusted, the temperature adjustment operating parts (110) is arranged in the babinet (10) on.
13. temperature regulating device according to any one of claim 1 to 10, which is characterized in that the inside of the babinet (10) Protective layer is laid on surface.
CN201610097666.2A 2016-02-22 2016-02-22 Temperature regulating device Active CN105571197B (en)

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CN106419616B (en) * 2016-08-31 2019-06-28 宁波方太厨具有限公司 A kind of oven with cold storing and fresh-keeping function
CN107632645B (en) * 2017-10-26 2019-11-29 合肥超越电器有限责任公司 It is a kind of with the integrated temperature controller for setting line cooling mechanism
CN114010054A (en) * 2021-08-09 2022-02-08 嘉兴君和三维技术有限公司 Electric rice cooker

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CN2413235Y (en) * 2000-01-12 2001-01-03 陈旭夫 Semiconductor refrigerating and heating multi-functional box
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CN203848545U (en) * 2014-01-24 2014-09-24 赛伦(厦门)新材料科技有限公司 Semiconductor liquid recirculating water cooling machine
CN205403242U (en) * 2016-02-22 2016-07-27 珠海格力电器股份有限公司 Temperature control device

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FR2744794A1 (en) * 1996-02-14 1997-08-14 Pinal Patrick Heating and cooling module using Peltier effect
CN2413235Y (en) * 2000-01-12 2001-01-03 陈旭夫 Semiconductor refrigerating and heating multi-functional box
CN2470763Y (en) * 2001-03-09 2002-01-09 上海纽福克斯汽车配件有限公司 Mini-size cooling-warming box
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