CN206387773U - A kind of dimension of ultrasonic wave 2 face battle array welding spot detector device - Google Patents

A kind of dimension of ultrasonic wave 2 face battle array welding spot detector device Download PDF

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Publication number
CN206387773U
CN206387773U CN201720023179.1U CN201720023179U CN206387773U CN 206387773 U CN206387773 U CN 206387773U CN 201720023179 U CN201720023179 U CN 201720023179U CN 206387773 U CN206387773 U CN 206387773U
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China
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ultrasonic
ultrasonic wave
battle array
dimension
detector device
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CN201720023179.1U
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Chinese (zh)
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张瑞
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Eintec Technology (Shanghai) Co.,Ltd.
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Ain Dick Test Technology (shanghai) Ltd By Share Ltd
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Abstract

The utility model discloses a kind of ultrasonic wave 2 dimension face battle array welding spot detector device, including programmable logic chip, ultrasonic transmitter, probe connector, ultrasonic receiver and low-voltage simulation switch, programmable logic chip is connected with ultrasonic transmitter and ultrasonic receiver respectively, ultrasonic transmitter and ultrasonic receiver are connected with probe connector respectively, probe connector is connected with ultrasonic probe, and low-voltage simulation switch is connected with ultrasonic receiver.Advantage and beneficial effect of the present utility model are:Reduce manufacturing cost and use power consumption;Avoid the ultrasound examination scheme of existing face battle array multichannel bandwidth it is not high the problem of, improve the applicability and matching degree between the dimension face of ultrasonic wave 2 battle array welding spot detector device and high-frequency ultrasonic probe;Improve radiating circuit and ability is excited to ultrasonic probe, reduce power consumption and manufacture use cost;Adapt to move and use under the complex working conditions such as workshop.

Description

A kind of dimension of ultrasonic wave 2 face battle array welding spot detector device
Technical field
The utility model is related to detection field, the more particularly to a kind of dimension of ultrasonic wave 2 face battle array welding spot detector device.
Background technology
Spot welding is a kind of high speed, economic connection method, and airtight, thickness can not be required using overlap joint, joint suitable for manufacture Punching press of the degree less than 3mm, the thin-plate element of rolling, are the welding that indivedual spot weldings of the weldment on the contact surface of joint are got up Mode.
It is many that a few issue reception is switched to using multichannel high-voltage switch gear in the ultrasound examination scheme of existing face battle array multichannel The pattern of passage, such as 16:64 or 32:128 etc., carry out spot welding detection;The program is often led to when carrying out spot welding detection Power consumption and cost are too high;Simultaneously as the high-frequency ultrasonic probe for needing to be equipped with 15M-20M during spot welding detection is carried out, and it is existing High-voltage switch gear switching technical scheme bandwidth it is relatively low, and be easy to influence ultrasonic wave transmitting circuit excitation energy power, cause It excites ability to decline;Generally external using usb instrument, mobile and limited reliability is not suitable with the detection in workshop.
Utility model content
In order to solve the above problems, the utility model provides a kind of dimension of ultrasonic wave 2 face battle array welding spot detector device.This technology side Case by it is following some solve problem encountered in the prior art:
1st, the connection between low-voltage simulation switch conduction or cut-out ultrasonic receiver and probe connector is utilized, it is to avoid The ultrasound examination scheme of existing face battle array multichannel using multichannel high-voltage switch gear due to switching to a few issue receiving channel Pattern, causes power consumption and use cost to improve, and influences the problem of exciting ability, being dropped to ultrasonic probe for ultrasonic transmitter The low dimension face of ultrasonic wave 2 battle array welding spot detector device manufacturing cost and use power consumption;
2nd, because low-voltage simulation switch has higher bandwidth in itself, therefore ultrasonic pulse bandwidth can be improved, it is to avoid The problem of bandwidth of the ultrasound examination scheme of existing face battle array multichannel is not high;Again because spot welding detection needs 15M-20M's High-frequency ultrasonic is popped one's head in, therefore improves being applicable between the dimension face of ultrasonic wave 2 battle array welding spot detector device and high-frequency ultrasonic probe Property and matching degree;
3rd, because radiating circuit has multiple transmission channels, preferably transmitting driving force is obtained, transmitting is more beneficial for Circuit excitation ultrasound ripple probe produces detection ultrasonic wave;Simultaneously as receiving channel quantity only is reduced with a receiving channel, And then reduce power consumption and manufacture use cost;
4th, using USB chips and USB interface, industrial computer and programmable logic chip, ultrasonic transmitter, probe are connected Device, ultrasonic receiver and power module is connect to become one so that the dimension face of ultrasonic wave 2 battle array welding spot detector device be easy to carry and Use, adapt to move and use under the complex working conditions such as workshop.
The dimension of a kind of ultrasonic wave 2 face battle array welding spot detector device in the utility model, is connected with ultrasonic probe, for launching Or ultrasonic wave is received, the dimension of the ultrasonic wave 2 face battle array welding spot detector device includes programmable logic chip, ultrasonic transmitter, spy Head connector, ultrasonic receiver and low-voltage simulation switch, the programmable logic chip respectively with the ultrasonic transmitter With ultrasonic receiver connection, the ultrasonic transmitter and ultrasonic receiver are connected with the probe connector respectively, institute State probe connector to be connected with the ultrasonic probe, the low-voltage simulation switch is connected with ultrasonic receiver.
In such scheme, the ultrasonic transmitter includes the radiating circuit with multiple transmission channels.
In such scheme, the ultrasonic receiver includes passage amplifying circuit, analog-digital converter and clamp circuit, described Clamp circuit is connected with the probe connector, low-voltage simulation switch respectively with the passage amplifying circuit and clamp circuit Connection, the passage amplifying circuit is connected with the analog-digital converter, the analog-digital converter and the programmable logic chip Connection.
In such scheme, the passage amplifying circuit has receiving channel.
In such scheme, in addition to USB chips, the USB chips are connected with the programmable logic chip.
In such scheme, in addition to industrial computer, the industrial computer is connected with the USB chips.
In such scheme, the industrial computer has USB interface, and the USB interface is connected with the USB chips.
In such scheme, in addition to power module, the power module respectively with the programmable logic chip, ultrasonic wave Transmitter, probe connector or ultrasonic receiver connection.
Advantage and beneficial effect of the present utility model are:The utility model provides a kind of dimension of ultrasonic wave 2 face battle array solder joint inspection Survey instrument, it is to avoid the ultrasound examination scheme of existing face battle array multichannel using multichannel high-voltage switch gear due to switching to a small number of hairs The pattern of receiving channel is penetrated, causes power consumption and use cost to improve, influences being excited to ultrasonic probe for ultrasonic transmitter The problem of ability;Avoid the ultrasound examination scheme of existing face battle array multichannel bandwidth it is not high the problem of, improve ultrasound Applicability and matching degree between the dimension of ripple 2 face battle array welding spot detector device and high-frequency ultrasonic probe;Radiating circuit is improved to super Sonic probe excites ability, reduces power consumption and manufacture use cost;Adapt to move and make under the complex working conditions such as workshop With.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art Or the accompanying drawing used required in description of the prior art is briefly described, it should be apparent that, drawings in the following description are only It is some embodiments of the present utility model, for those of ordinary skill in the art, before creative labor is not paid Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of structural schematic block diagram of the dimension of ultrasonic wave 2 face battle array welding spot detector device of the utility model.
In figure:1st, programmable logic chip 2, ultrasonic transmitter 3, probe connector
4th, ultrasonic receiver 5, low-voltage simulation switch 6, USB chips
7th, industrial computer 8, power module 21, radiating circuit
41st, passage amplifying circuit 42, analog-digital converter 43, clamp circuit
71st, USB interface
Embodiment
With reference to the accompanying drawings and examples, embodiment of the present utility model is further described.Implement below Example is only used for clearly illustrating the technical solution of the utility model, and protection model of the present utility model can not be limited with this Enclose.
As shown in figure 1, the utility model is a kind of dimension face of ultrasonic wave 2 battle array welding spot detector device, with ultrasonic probe (in figure It is not shown) connection, for launching or receiving ultrasonic wave, the dimension of ultrasonic wave 2 face battle array welding spot detector device includes programmable logic chip 1st, ultrasonic transmitter 2, probe connector 3, ultrasonic receiver 4 and low-voltage simulation switch 5, programmable logic chip 1 is distinguished It is connected with ultrasonic transmitter 2 and ultrasonic receiver 4, ultrasonic transmitter 2 and ultrasonic receiver 4 are connected with probe respectively Device 3 is connected, and probe connector 3 is connected with ultrasonic probe, and low-voltage simulation switch 5 is connected with ultrasonic receiver 4.
The operation principle of above-mentioned technical proposal is:Programmable logic chip 1 controls ultrasonic transmitter 2 to be connected by popping one's head in The excitation ultrasound ripple of device 3 probe produces detection ultrasonic wave, and detection ultrasonic wave will be exported to solder joint;Detection ultrasonic wave is launched to solder joint simultaneously Rebounded by solder joint, form resilience ultrasonic wave, ultrasonic probe receives resilience ultrasonic waveform into resilience signal, and is sent to ultrasonic wave Resilience ultrasonic wave is converted into data signal and is sent to programmable logic chip 1, low-voltage simulation by receiver 4, ultrasonic receiver 4 Switch 5 is additionally operable to the bandwidth for controlling the excitation ultrasound ripple of ultrasonic transmitter 2 probe to produce detection ultrasonic wave;
Meanwhile, the connection between 5 on or off ultrasonic receivers 4 and probe connector 3 is switched using low-voltage simulation, The connection between ultrasonic probe and ultrasonic receiver 4 is isolated from the outside, eliminate detection ultrasonic wave to resilience ultrasonic wave Influence, improve the dimension face of ultrasonic wave 2 battle array welding spot detector device accuracy of detection.
Further, switched using low-voltage simulation between 5 on or off ultrasonic receivers 4 and probe connector 3 Connection, it is to avoid the ultrasound examination scheme of existing face battle array multichannel using multichannel high-voltage switch gear due to switching to a few issue The pattern of receiving channel, causes power consumption and use cost to improve, influences the excitation energy to ultrasonic probe of ultrasonic transmitter 2 The problem of power, reduce the dimension face of ultrasonic wave 2 battle array welding spot detector device manufacturing cost and use power consumption;
Simultaneously as low-voltage simulation switch 5 itself has higher bandwidth, therefore the pulse band of detection ultrasonic wave can be improved It is wide, it is to avoid the problem of bandwidth of the ultrasound examination scheme of existing face battle array multichannel is not high;Needed again because spot welding is detected 15M-20M high-frequency ultrasonic probe, therefore further improve the dimension face of ultrasonic wave 2 battle array welding spot detector device and high frequency ultrasound Applicability and matching degree between ripple probe.
It is preferred that, ultrasonic transmitter 2 includes the radiating circuit 21 with multiple transmission channels, and radiating circuit 21 utilizes many Individual transmission channel;Because radiating circuit 21 has multiple transmission channels, preferably transmitting driving force is obtained, hair is more beneficial for The excitation ultrasound ripple of transmit-receive radio road 21 probe produces detection ultrasonic wave.
It is preferred that, radiating circuit 21 is with 52 transmission channels.
Specifically, ultrasonic receiver 4 includes passage amplifying circuit 41, analog-digital converter 42 and clamp circuit 43, clamp Circuit 43 is connected with probe connector 3, and low-voltage simulation switch 5 is connected with passage amplifying circuit 41 and clamp circuit 43 respectively, is led to Road amplifying circuit 41 is connected with analog-digital converter 42, and analog-digital converter 42 is connected with programmable logic chip 1;
Wherein, clamp circuit 43 receives resilience signal and is sent to low-voltage simulation switch 5, and low-voltage simulation switchs 5 by resilience Signal is sent to passage amplifying circuit 41, and passage amplifying circuit 41 is sent to analog-digital converter 42, mould after resilience signal is amplified Resilience signal is converted into data signal and is sent to programmable logic chip 1 by number converter 42.
Further, passage amplifying circuit 41 has receiving channel, and the receiving channel of passage amplifying circuit 41 receives resilience It is allowed to keep phase on signal, multiple resilience Signal averagings that clamp circuit 43 receives passage amplifying circuit 41 to a certain level To it is constant, to protect passage amplifying circuit 41 and low-voltage simulation to switch 5.
It is preferred that, passage amplifying circuit 41 has a receiving channel;Wherein, only reception is reduced with a receiving channel Number of channels, and then reduce power consumption and manufacture use cost.
It is preferred that, the dimension of ultrasonic wave 2 face battle array welding spot detector device also includes USB chips 6, USB chips 6 and FPGA core Piece 1 is connected.
It is preferred that, the dimension of ultrasonic wave 2 face battle array welding spot detector device also includes industrial computer 7, and industrial computer 7 and USB chips 6 connect Connect.
Further, industrial computer 7 has USB interface 71, and USB interface 71 is connected with USB chips 6, FPGA core Data signal successively through USB chips 6 and USB interface 71, is sent to industrial computer 7, industrial computer 7 is by analyzing numeral by piece 1 Signal, determines whether the solder joint is qualified.
It is preferred that, the dimension of ultrasonic wave 2 face battle array welding spot detector device also includes power module 8, and power module 8 is respectively with may be programmed Logic chip 1, ultrasonic transmitter 2, probe connector 3 or ultrasonic receiver 4 are connected;It is programmable that power module 8, which is used for, Logic chip 1, ultrasonic transmitter 2, probe connector 3 or ultrasonic receiver 4 provide power supply.
Optionally, by using USB chips 6 and USB interface 71, by industrial computer 7 and programmable logic chip 1, ultrasound Wave launcher 2, probe connector 3, ultrasonic receiver 4 and power module 8 become one so that the battle array weldering of the dimension of ultrasonic wave 2 face Point tester device is easy to carry and used, and adapts to move and use under the complex working conditions such as workshop.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model Within the spirit and principle of utility model, any modification, equivalent substitution and improvements made etc. should be included in the utility model Protection domain within.

Claims (8)

1. a kind of dimension of ultrasonic wave 2 face battle array welding spot detector device, is connected with ultrasonic probe, for launching or receiving ultrasonic wave, its It is characterised by, the dimension of the ultrasonic wave 2 face battle array welding spot detector device includes programmable logic chip, ultrasonic transmitter, probe and connected Connect device, ultrasonic receiver and low-voltage simulation switch, the programmable logic chip respectively with the ultrasonic transmitter and surpass Acoustic receiver is connected, and the ultrasonic transmitter and ultrasonic receiver are connected with the probe connector respectively, described to visit Head connector is connected with the ultrasonic probe, and the low-voltage simulation switch is connected with ultrasonic receiver.
2. a kind of dimension of ultrasonic wave 2 face battle array welding spot detector device according to claim 1, it is characterised in that the ultrasonic wave Transmitter includes the radiating circuit with multiple transmission channels.
3. a kind of dimension of ultrasonic wave 2 face battle array welding spot detector device according to claim 1, it is characterised in that the ultrasonic wave Receiver includes passage amplifying circuit, analog-digital converter and clamp circuit, and the clamp circuit is connected with the probe connector, The low-voltage simulation switch is connected with the passage amplifying circuit and clamp circuit respectively, the passage amplifying circuit and the mould Number converter is connected, and the analog-digital converter is connected with the programmable logic chip.
4. the dimension of a kind of ultrasonic wave 2 face battle array welding spot detector device according to claim 3, it is characterised in that the passage is put Big circuit has receiving channel.
5. the dimension of a kind of ultrasonic wave 2 face battle array welding spot detector device according to claim 1, it is characterised in that also including USB cores Piece, the USB chips are connected with the programmable logic chip.
6. the dimension of a kind of ultrasonic wave 2 face battle array welding spot detector device according to claim 5, it is characterised in that also including industry Computer, the industrial computer is connected with the USB chips.
7. a kind of dimension of ultrasonic wave 2 face battle array welding spot detector device according to claim 6, it is characterised in that the industrial electro Brain has USB interface, and the USB interface is connected with the USB chips.
8. the dimension of a kind of ultrasonic wave 2 face battle array welding spot detector device according to claim 1, it is characterised in that also including power supply Module, the power module is received with the programmable logic chip, ultrasonic transmitter, probe connector or ultrasonic wave respectively Device is connected.
CN201720023179.1U 2017-01-09 2017-01-09 A kind of dimension of ultrasonic wave 2 face battle array welding spot detector device Active CN206387773U (en)

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Application Number Priority Date Filing Date Title
CN201720023179.1U CN206387773U (en) 2017-01-09 2017-01-09 A kind of dimension of ultrasonic wave 2 face battle array welding spot detector device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720023179.1U CN206387773U (en) 2017-01-09 2017-01-09 A kind of dimension of ultrasonic wave 2 face battle array welding spot detector device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107966495A (en) * 2017-12-29 2018-04-27 潮峰钢构集团有限公司 A kind of steel construction solder joint self-test overall analysis system and analysis method based on big data

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107966495A (en) * 2017-12-29 2018-04-27 潮峰钢构集团有限公司 A kind of steel construction solder joint self-test overall analysis system and analysis method based on big data

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Address after: 6 / F, No. 17, Lane 1555, Jinsha Jiangxi Road, Jiading District, Shanghai, 201803

Patentee after: Eintec Technology (Shanghai) Co.,Ltd.

Address before: 6 / F, No. 17, Lane 1555, Jinsha Jiangxi Road, Jiading District, Shanghai, 201803

Patentee before: NDT DETECTION TECHNOLOGY (SHANGHAI) CO.,LTD.

CP01 Change in the name or title of a patent holder