CN206383407U - Mould for manufacturing notebook computer upper cover - Google Patents
Mould for manufacturing notebook computer upper cover Download PDFInfo
- Publication number
- CN206383407U CN206383407U CN201621308932.3U CN201621308932U CN206383407U CN 206383407 U CN206383407 U CN 206383407U CN 201621308932 U CN201621308932 U CN 201621308932U CN 206383407 U CN206383407 U CN 206383407U
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- CN
- China
- Prior art keywords
- master mold
- glue
- oblique top
- enter glue
- mould
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a kind of mould for being used to manufacture notebook computer upper cover, including：Enter glue component, male molding member, master mold component and ejection assembly；Male molding member coordinates with master mold component completes open/close mould；Entering glue component is included into glue head；Master mold component has the accommodating chamber for housing ejection assembly, and ejection assembly includes：Liftout plate, ejection cylinder, enter glue tilted footstock and enter glue oblique top pin；Ejection cylinder and liftout plate are installed in accommodating chamber, and ejection cylinder driving liftout plate is moved back and forth in the first direction；Tilted footstock is arranged on liftout plate, and the one end for entering glue oblique top pin is slidably connected with the T-slot composition for entering glue tilted footstock, the other end ejects for contact product and downwards it；First direction is parallel to open/close mould direction.The utility model has the advantage that：Avoid joint line from producing by the way of upside-down mounting mould, improve product surface quality.
Description
Technical field
The utility model belongs to injection molding technology field, and in particular to a kind of mould for being used to manufacture notebook computer upper cover.
Background technology
The upper lid of notebook computer is notebook main external appearance face, and surface quality requirements are high, it is impossible to obvious injection occur
It is molded Poor structure（Such as shrink, joint line, warpage）, and cast gate can not influence outward appearance and the assembling of product, upper lid forming surface
Product is big, single cast gate be difficult to fill and cause it is short penetrate or shrink, surface obvious joint line is occurred, influence the surface matter of product
Amount.
Utility model content
The purpose of this utility model is to overcome deficiency of the prior art to be used to manufacture notebook computer there is provided one kind
The mould of lid, avoids joint line from producing by the way of upside-down mounting mould, improves product surface quality.
To solve prior art problem, the utility model discloses a kind of mould for being used to manufacture notebook computer upper cover,
Including：Enter glue component, male molding member, master mold component and ejection assembly；Male molding member coordinates with master mold component completes open/close mould；
Entering glue component is included into glue head；Master mold component has the accommodating chamber for housing ejection assembly, and ejection assembly includes：Liftout plate, ejection
Oil cylinder, enter glue tilted footstock and enter glue oblique top pin；Ejection cylinder and liftout plate are installed in accommodating chamber, ejection cylinder driving liftout plate
Move back and forth in the first direction；
Enter glue tilted footstock to be installed on liftout plate, enter one end of glue oblique top pin by enter the T-slot of glue tilted footstock end with
Its composition is slidably connected, the other end is used for contact product and ejects it downwards；Enter and runner, the one of runner are opened up in glue oblique top pin
End extend on glue oblique top pin for ejecting product one end so as to formed import be used for connected with die cavity, the other end is extended to
Entering the side wall of glue thimble is used to connect with entering glue head；Stream is molded by runner into die cavity during matched moulds, and glue is entered during die sinking
Oblique top pin ejecting product；First direction is parallel to open/close mould direction.
Further, male molding member includes：Lower thermal insulation board, bottom plate, male template and male die core；Bottom plate is connected to
The top of lower thermal insulation board, male template is connected to the top of bottom plate, and male die core is arranged in male template.
Further, master mold component includes：Upper thermal insulation board, upper mounted plate, master mold pin, master mold board, caster and master mold
Benevolence；Upper mounted plate is connected to the lower section of thermal insulation board, and master mold pin is connected to the lower section of upper mounted plate, and master mold board is connected to master mold
The lower section of pin, caster is connected to the lower section of master mold board, and mother module core is arranged in caster；Upper mounted plate and master mold board it
Between form accommodating chamber.
Further, ejection assembly also includes：Inclined top guide block, inclined top guide block is arranged in caster, and with entering glue
Oblique top pin is constituted and is slidably connected.
Further, ejection assembly also includes：Common tilted footstock and common oblique top pin；Common tilted footstock is installed on liftout plate
On, one end of common oblique top pin be made up of the T-slot of common tilted footstock end with it be slidably connected, the other end be used for contact production
Product jointly eject downwards product with entering glue oblique top pin.
Further, liftout plate includes the upper ejector plate and lower liftout plate being connected with each other, and common tilted footstock and enters glue oblique top
Seat is mounted on upper ejector plate.
The utility model has the advantage that：Avoid joint line from producing by the way of upside-down mounting mould, improve product surface
Quality.
Brief description of the drawings
Fig. 1 is the structural representation of one preferred embodiment of the utility model；
Fig. 2 is embodiment illustrated in fig. 1 operation principle schematic diagram；
Fig. 3 is the structure top view of male molding member in embodiment illustrated in fig. 1；
Fig. 4 is the structure top view of master mold component in embodiment illustrated in fig. 1.
Reference：
10 male molding members；101 times thermal insulation boards；102 bottom plates；103 male templates；104 male die cores；
20 master mold components；Thermal insulation board on 201；202 upper mounted plates；203 master mold pin；204 master mold boards；205 casters；
206 mother module cores；
30 ejection assemblies；301 liftout plates；302 enter glue tilted footstock；303 enter glue oblique top pin；303a runners；303b imports；
304 inclined top guide blocks；305 ejection cylinders；306 common tilted footstocks；307 common oblique top pins；
40 enter glue component；401 enter glue head；
100 products.
Embodiment
The utility model is further described below in conjunction with the accompanying drawings.Following examples are only used for clearly illustrating this
The technical scheme of utility model, and protection domain of the present utility model can not be limited with this.
As shown in Figures 1 to 4, a kind of mould for being used to manufacture notebook computer upper cover, including：Enter glue component 40, male model group
Part 10, master mold component 20 and ejection assembly 30.Male molding member 10 coordinates with master mold component 20 completes open/close mould.Enter glue component 40
Including entering glue first 401.Master mold component 20 has the accommodating chamber for housing ejection assembly, and ejection assembly 30 includes：Liftout plate 301, top
Go out oil cylinder 305, enter glue tilted footstock 302 and enter glue oblique top pin 303.Ejection cylinder 305 and liftout plate 301 are installed in accommodating chamber,
The driving liftout plate 301 of ejection cylinder 305 is moved back and forth in the first direction.Enter glue tilted footstock 302 to be installed on liftout plate 301, enter
One end of glue oblique top pin 303 by enter the T-slot of glue tilted footstock end constituted with it be slidably connected, the other end be used for contact product
100 and by its downwards eject.Enter and runner 303a is opened up in glue oblique top pin 303, runner 303a one end is extended into glue oblique top pin
Upper one end for ejecting product is used to connecting with die cavity so as to form import 303b, the other end extends to side wall into glue thimble
For being connected with entering glue first 401.Stream is molded by runner into die cavity during matched moulds, and glue oblique top pin 303 is entered during die sinking and is pushed up
Go out product 100.First direction is parallel to open/close mould direction.
Carried out after die frame mould by the running gate system of injection machine to the filling of product 100, cooling, pressurize, completion shaping
Afterwards, the strength of injection machine drives male molding member 10 and master mold component 20 to mold, and separates male and female die, passes through ejection cylinder 305
Inside drive liftout plate 301 eject, and liftout plate 301 then drive into glue oblique top pin 303 complete eject, enter glue oblique top pin 303 by
It can complete to depart from product 100 in the gradient of itself and ejection effect, finally take out product 100.Due to the special knot of product 100
The demand of structure or the outward appearance of product 100, causes into glue with ejection in the same side of product 100, such mould structure is called down
It is die-filling.And just it is die-filling enter glue and ejection in not the same side, inventor draws by many experiments and research, common running gate system
Joint line is easily produced, causes product 100 to reach appearance requirement, and uses upside-down mounting mould, then can avoid the production of joint line
It is raw, die cost is substantially reduced, product 100 is without post-processing, and efficiency high, outward appearance is good, meets design requirement.
Preferably, male molding member 10 includes：Lower thermal insulation board 101, bottom plate 102, male template 103 and male die core
104.Bottom plate 102 is connected to the top of lower thermal insulation board 101, and male template 103 is connected to the top of bottom plate 102, male model
Benevolence 104 is arranged in male template 103.This have the advantage that, can prevent heat to injection machine miscellaneous part transmission so as to
Reduce thermal loss.
Preferably, master mold component 20 includes：Upper thermal insulation board 201, upper mounted plate 202, master mold pin 203, master mold are held
Plate 204, caster 205 and mother module core 206.Upper mounted plate 202 is connected to the lower section of thermal insulation board 201, and master mold pin 203 is connected to
The lower section of upper mounted plate 202, master mold board 204 is connected to the lower section of master mold pin 203, and caster 205 is connected to master mold board 204
Lower section, mother module core 206 be arranged on caster 205 in.Accommodating chamber is formed between upper mounted plate 202 and master mold board 204.So
Do and be advantageous in that, enough spaces can be provided for the upside-down mounting of ejection assembly 30, be easy to the installation and dismounting of ejection assembly 30.
Preferably, ejection assembly also includes：Inclined top guide block 304, inclined top guide block is arranged in caster, and
It is slidably connected with entering glue oblique top pin composition.This have the advantage that, glue oblique top pin can be entered using 304 pairs of inclined top guide block
303 carry out guiding constraint, it is ensured that enter the movement locus of glue oblique top pin 303.
Preferably, ejection assembly also includes：Common tilted footstock 306 and common oblique top pin 307；Common tilted footstock peace
Loaded on liftout plate, one end of common oblique top pin be made up of the T-slot of common tilted footstock end with it be slidably connected, the other end
Product is ejected downwards jointly with entering glue oblique top pin for contact product.This have the advantage that, common oblique top pin can be made
Quick ejection is completed so as to completely disengage from the hook portion of product with glue oblique top pin collective effect is entered, ejection efficiency is improved.
Preferably, liftout plate includes the upper ejector plate and lower liftout plate being connected with each other, and common tilted footstock and enters glue
Tilted footstock is mounted on upper ejector plate.
Described above is only preferred embodiment of the present utility model, it is noted that for the common skill of the art
For art personnel, on the premise of the utility model technical principle is not departed from, some improvement and deformation can also be made, these change
Enter and deform and also should be regarded as protection domain of the present utility model.
Claims (6)
1. the mould for manufacturing notebook computer upper cover, including：Enter glue component, male molding member, master mold component and ejection assembly；
The male molding member coordinates with the master mold component completes open/close mould；It is described enter glue component include into glue head；It is characterized in that：
The master mold component has the accommodating chamber for housing the ejection assembly, and the ejection assembly includes：Liftout plate, ejection cylinder, enter
Glue tilted footstock and enter glue oblique top pin；The ejection cylinder and the liftout plate are installed in the accommodating chamber, the ejection cylinder
The liftout plate is driven to move back and forth in the first direction；
It is described enter glue tilted footstock be installed on the liftout plate, it is described enter glue oblique top pin one end by it is described enter glue tilted footstock end
The T-slot in portion constituted with it be slidably connected, the other end be used for contact product and by its downwards eject；It is described enter glue oblique top pin in open
If runner, one end of the runner extend to it is described enter glue oblique top pin on be used for one end of ejecting product and be used for so as to form import
Connected with die cavity, the other end extend to it is described enter glue thimble side wall be used for it is described enter glue head connect；Stream passes through during matched moulds
The runner is molded into die cavity, and glue oblique top pin ejecting product is entered described in during die sinking；The first direction is parallel to open/close
Mould direction.
2. mould according to claim 1, it is characterised in that：The male molding member includes：Lower thermal insulation board, bottom plate,
Male template and male die core；The bottom plate is connected to the top of the lower thermal insulation board, and the male template is connected to described lower solid
The top of fixed board, the male die core is arranged in the male template.
3. mould according to claim 2, it is characterised in that：The master mold component includes：Upper thermal insulation board, upper mounted plate,
Master mold pin, master mold board, caster and mother module core；Fixed plate is connected to the lower section of the upper thermal insulation board, the master mold
Pin is connected to the lower section of fixed plate, and the master mold board is connected to the lower section of the master mold pin, the caster connection
In the lower section of the master mold board, the mother module core is arranged in the caster；Fixed plate and the master mold board
Between form the accommodating chamber.
4. mould according to claim 3, it is characterised in that：The ejection assembly also includes：Inclined top guide block is described oblique
Push up guide pad be arranged on the caster in, and with it is described enter glue oblique top pin constitute be slidably connected.
5. mould according to claim 4, it is characterised in that：The ejection assembly also includes：Common tilted footstock and common
Oblique top pin；The common tilted footstock is installed on the liftout plate, and one end of the common oblique top pin passes through the common oblique top
Seat end T-slot constituted with it be slidably connected, the other end be used for contact product with it is described enter glue oblique top pin jointly by product to
Lower ejection.
6. mould according to claim 5, it is characterised in that：The liftout plate includes the upper ejector plate being connected with each other with
Liftout plate, the common tilted footstock and enters glue tilted footstock and is mounted on the upper ejector plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621308932.3U CN206383407U (en) | 2016-12-01 | 2016-12-01 | Mould for manufacturing notebook computer upper cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621308932.3U CN206383407U (en) | 2016-12-01 | 2016-12-01 | Mould for manufacturing notebook computer upper cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206383407U true CN206383407U (en) | 2017-08-08 |
Family
ID=59489138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621308932.3U Expired - Fee Related CN206383407U (en) | 2016-12-01 | 2016-12-01 | Mould for manufacturing notebook computer upper cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206383407U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109093948A (en) * | 2018-08-03 | 2018-12-28 | 昆山弘正电子科技有限公司 | LED panel injection forming mold and the Shooting Technique for manufacturing LED panel |
-
2016
- 2016-12-01 CN CN201621308932.3U patent/CN206383407U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109093948A (en) * | 2018-08-03 | 2018-12-28 | 昆山弘正电子科技有限公司 | LED panel injection forming mold and the Shooting Technique for manufacturing LED panel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170808 Termination date: 20171201 |